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CN102655727B - 导风件 - Google Patents

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Publication number
CN102655727B
CN102655727B CN201110048548.XA CN201110048548A CN102655727B CN 102655727 B CN102655727 B CN 102655727B CN 201110048548 A CN201110048548 A CN 201110048548A CN 102655727 B CN102655727 B CN 102655727B
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CN
China
Prior art keywords
air
air guide
air guiding
wall
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201110048548.XA
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English (en)
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CN102655727A (zh
Inventor
曹福凯
李悦
付晓
赵良君
张潇
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North China University of Science and Technology
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North China University of Science and Technology
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Publication date
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Priority to CN201110048548.XA priority Critical patent/CN102655727B/zh
Priority to TW100106984A priority patent/TW201237343A/zh
Priority to US13/111,979 priority patent/US8477495B2/en
Publication of CN102655727A publication Critical patent/CN102655727A/zh
Application granted granted Critical
Publication of CN102655727B publication Critical patent/CN102655727B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种导风件，包括一导风部及若干挡片，该导风部包括一长形的底壁及由该底壁的前侧向上并向后倾斜延伸的一长形的导风壁，该导风壁开设有若干通风槽，每一挡片的前端由下向上并向后倾斜形成一斜面，这些挡片的设有斜面的一端可选择地插入该导风壁的对应通风槽。该导风件能够调节风流，提高风流的利用率。

Description

导风件
技术领域
本发明涉及一种导风件。
背景技术
在电子装置，如服务器内，通常会装设有若干风扇，以给电路板上的发热电子元件进行散热。这些风扇吹出的风流的大部分会直接吹向电路板的上方，给发热电子元件散热；而还有一小部分的风流则会吹向电路板的下方，其散热效果一般，风流没有得到充分的利用。
发明内容
鉴于以上，有必要提供一种能够提高风流利用率的导风件。
一种导风件，包括一导风部及若干挡片，该导风部包括一长形的底壁及由该底壁的前侧向上并向后倾斜延伸的一长形的导风壁，该导风壁开设有若干通风槽，每一挡片的前端由下向上并向后倾斜形成一斜面，这些挡片的设有斜面的一端可选择地插入该导风壁的对应通风槽，该导风部还包括两由该导风壁朝向该底壁的一侧向后延伸出的具有弹性的卡脚，该两卡脚的中部相向弯折分别形成一弧形的卡扣部。
相较现有技术，该导风件可装设于一电子装置的电路板正对风扇的一侧，该导风件的导风壁及插入导风部的挡片的斜面可将风流拦住并向上导至电路板的上方，从而提高了风流的利用率及电子装置的散热效率；同时，使用者可根据不同的电路板上的发热电子元件的排布情况及散热需求选择性的将这些挡片插入该导风部的不同位置，使该导风部上的正对发热电子元件的通风槽不被插入挡片，从而将风流导向至发热电子元件的正下方，以保证发热电子元件下方的通风及散热。
附图说明
图1是本发明导风件的较佳实施方式装设于一电子装置内的立体图。
图2是图1的立体分解图。
图3是图2中的导风件的立体放大图。
图4是图3的另一方向视图。
主要元件符号说明
底板10
固定柱12
螺孔121
电路板20
穿孔23
发热电子元件25
风扇30
导风件40
导风部41
底壁42
导风壁43
通风槽431
凹槽44
卡槽442
卡脚45
卡扣部451
引导面453
防滑条455
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参照图1与图2，本发明导风件40的较佳实施方式，可用于一电子装置内。该电子装置包括一底板10、一电路板20及若干风扇30。这些风扇30装设于该底板10上。该底板10上凸设有若干具有螺孔121的固定柱12(图2中只显示最靠近风扇30的两固定柱12)。该电路板20对应该底板10上的这些固定柱12的螺孔121设有若干穿孔23(图中只显示两穿孔23)。若干螺丝分别穿过该电路板20上的穿孔23并锁入该底板10上的对应固定柱12的螺孔121，将该电路板20固定于该底板10上并位于这些风扇30的后方。该电路板20上装设有一发热电子元件25。
请参照图3与图4，该导风件40包括一导风部41及若干挡片47。
该导风部41包括一长形的底壁42、由该底壁42的前侧向上并向后倾斜延伸的一长形的导风壁43及两由该导风壁43朝向该底壁42的一侧向后延伸出的具有弹性的卡脚45。该导风壁43开设有若干沿其长度方向间隔的通风槽431。该底壁42于每一通风槽431的正下方，以及该导风壁43朝向该底壁42的一侧于每一通风槽431的正后方分别设有一贯穿至该底壁42的后侧与该导风壁43的后侧的长形的凹槽44。每一凹槽44于邻近后端处凹设有一弧形的卡槽442。该两卡脚45呈片状，分别由该导风壁43的邻近两端处向后延伸出。该两卡脚45的中部相向弯折分别形成一弧形的卡扣部451。该两卡扣部451之间的距离大致等于该电路板20上的邻近这些风扇30的两固定柱12之间的距离。该两卡脚45的末端相向弯折分别形成一倾斜的引导面453。每一卡脚45背向另一卡脚45的一侧于卡扣部451于引导面453之间凸设有若干防滑条455。
每一挡片47大致呈一梯形，其前端由下向上并向后倾斜形成一斜面471。该斜面471的倾斜角度等于该导风部41的导风壁43的倾斜角度。每一挡片47的顶部与底部分别于靠近后端处凸设一弧形的凸起473。每一挡片47的两侧分别于靠近后端处设有一便于使用者手指扣持的凹槽475。
这些挡片47可根据需要选择性地由该导风部41的后侧插入该导风部41内，使每一挡片47的顶部与底部分别插入该导风部41的底壁42与导风壁43的对应凹槽44内，且每一挡片47的顶部与底部的凸起473分别卡入对应凹槽44的卡槽442内。此时，每一挡片47的设有斜面471的一端插入该导风壁43的对应通风槽431，每一挡片47的斜面471与该导风壁43背向该底壁42的一侧位于同一平面。
请再次参照图1与图2，要将该导风件40装设于该电子装置内时，首先将该导风件40置于该底板10上并位于该电路板20与这些风扇30之间，使该导风件40的导风壁43面向这些风扇30，该导风件40的两卡脚45的引导面453分别正对该底板10上的邻近这些风扇30的两对应固定柱12。根据该电路板20上的发热电子元件25的位置调整这些挡片47，使该导风部41与该发热电子元件25正对的位置不装设挡片47，而其他位置则插入挡片47。从而，该导风部41位于该发热电子元件25正前方处的通风槽431保持畅通，而该导风部41位于该发热电子元件25两侧的通风槽431则被挡片47阻挡。向后推动该导风件40，使该导风件40的两卡脚45插入该电路板20的下方，该两卡脚45的引导面453分别抵接该底板10上的对应固定柱12，并逐渐滑过该两对应的固定柱12并带动该两卡脚45相向移动发生弹性变形。继续向后推动该导风件40，直至该两卡脚45的卡扣部451分别正对该两对应的固定柱12，该两卡脚45弹性恢复使该两卡扣部451分别卡置于该两对应的固定柱12。从而，该导风件40被固定于该底板10。此时，该导风件40的导风壁43的后侧边抵接于该电路板20的前侧。
该电子装置工作时，这些风扇30吹出的风流一部分直接吹向该电路板20的上方，一部分沿着该导风部41的导风壁43及挡片47前侧的斜面471由下向上吹至该电路板20的上方，这两部分风流均可流经该电路板20上的发热电子元件25及其它电子元件并对发热电子元件25及其它电子元件进行高效的散热。同时，这些风扇30吹出的风流还有一小部分穿过该导风部41的导风壁43上的未被挡片47阻挡的通风槽431而吹向该电路板20的发热电子元件25的下方，从而可以从底面给发热电子元件25及电路板20散热。由于该导风件40将大部分的本将要流向电路板20下方的风流拦住并导向电路板20的上方，从而提高了风流的利用率及电子装置的散热效率。同时，由于这些挡片47可拆卸，使用者可根据不同的电路板上的发热电子元件的排布情况及散热需求选择性的将这些挡片47插入该导风部41的不同位置。
要取出该导风件40时，只需相向按压该导风件40的两卡脚45的设有防滑条455处，使该两卡脚45的卡扣部451分别脱离对应的固定柱12，即可向前拔出该导风件40。
在其它实施方式中，该导风件40可省去该两卡脚45而通过其它方式固定于该底板10，如通过与底板10之间的卡扣或螺丝锁固等。
在其它实施方式中，该导风部41的底壁42及导风壁43上的凹槽44可以省去，这些挡片47的设有斜面471的一端可直接插入该导风壁43上的对应通风槽431，而依靠挡片47与对应通风槽431之间的摩擦力而将挡片47固定。

Claims (3)

1.一种导风件，包括一导风部及若干挡片，该导风部包括一长形的底壁及由该底壁的前侧向上并向后倾斜延伸的一长形的导风壁，该导风壁开设有若干通风槽，每一挡片的前端由下向上并向后倾斜形成一斜面，这些挡片的设有斜面的一端可选择地插入该导风壁的对应通风槽，该导风部还包括两由该导风壁朝向该底壁的一侧向后延伸出的具有弹性的卡脚，该两卡脚的中部相向弯折分别形成一弧形的卡扣部。
2.如权利要求1所述的导风件，其特征在于：该两卡脚的末端相向弯折分别形成一倾斜的引导面。
3.如权利要求1所述的导风件，其特征在于：每一挡片的两侧分别于靠近后端处设有一凹槽。
CN201110048548.XA 2011-03-01 2011-03-01 导风件 Expired - Fee Related CN102655727B (zh)

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CN201110048548.XA CN102655727B (zh) 2011-03-01 2011-03-01 导风件
TW100106984A TW201237343A (en) 2011-03-01 2011-03-02 Airflow guiding member
US13/111,979 US8477495B2 (en) 2011-03-01 2011-05-20 Airflow guide member and electronic device having the same

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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102651957B (zh) * 2011-02-25 2016-08-10 裕利年电子南通有限公司 电子装置
US9470720B2 (en) 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
US9655284B2 (en) * 2013-06-11 2017-05-16 Seagate Technology Llc Modular fan assembly
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
US9549457B2 (en) * 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9497889B2 (en) 2014-02-27 2016-11-15 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
US9458854B2 (en) 2014-11-21 2016-10-04 Arista Networks, Inc. Electrical connection mechanism for reversible fan module
US9433124B2 (en) * 2014-11-21 2016-08-30 Arista Networks, Inc. Reversible fan module
US10627877B2 (en) * 2017-03-31 2020-04-21 Hewlett Packard Enterprise Development Lp Air impeding structures with snap-in tabs
TWI774416B (zh) * 2021-06-10 2022-08-11 啟碁科技股份有限公司 電子裝置及其轉卡

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201097302Y (zh) * 2007-08-03 2008-08-06 鸿富锦精密工业（深圳）有限公司 机箱导风装置
CN101751093A (zh) * 2008-11-28 2010-06-23 佛山市顺德区顺达电脑厂有限公司 具有可独立组装的分隔板的导风罩模块

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB882788A (en) * 1958-07-05 1961-11-22 Reinold Hagen Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5297005A (en) * 1992-09-28 1994-03-22 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
US5597035A (en) * 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
JP3942248B2 (ja) * 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
JP3454707B2 (ja) * 1998-03-31 2003-10-06 山洋電気株式会社 電子部品冷却装置
US6198630B1 (en) * 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
CA2310358A1 (en) * 1999-06-01 2000-12-01 Showa Aluminum Corporation Heat sinks for cpus for use in personal computers
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
DE10063874A1 (de) * 2000-12-21 2002-06-27 Siemens Ag Vorrichtung zum Kühlen von Bauteilen
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
WO2002097881A2 (en) * 2001-05-30 2002-12-05 Ats Automation Tooling Systems Inc. Folded-fin heat sink assembly and method of manufacturing same
US6609561B2 (en) * 2001-12-21 2003-08-26 Intel Corporation Tunnel-phase change heat exchanger
US6711016B2 (en) * 2002-05-07 2004-03-23 Asustek Computer Inc. Side exhaust heat dissipation module
JP2006512691A (ja) * 2002-10-22 2006-04-13 アイシス テクノロジーズ 改善された熱放散特性を有する非周辺処理制御モジュール
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
US6707675B1 (en) * 2002-12-18 2004-03-16 Hewlett-Packard Development Company, L.P. EMI containment device and method
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location
US7372147B2 (en) * 2003-07-02 2008-05-13 Hewlett-Packard Development Company, L.P. Supporting a circuit package including a substrate having a solder column array
TWM244718U (en) * 2003-08-22 2004-09-21 Hon Hai Prec Ind Co Ltd Heat dissipating device employing air duct
US7002797B1 (en) * 2003-11-17 2006-02-21 Nvidia Corporation Noise-reducing blower structure
US20060181851A1 (en) * 2005-02-15 2006-08-17 Wang Frank Heatsink structure with an air duct
TWM275458U (en) * 2005-04-01 2005-09-11 Foxconn Tech Co Ltd Heat dissipation device
TWM286956U (en) * 2005-10-14 2006-02-01 Cooler Master Co Ltd Heat dissipation structure
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
US20070188993A1 (en) * 2006-02-14 2007-08-16 Gallina Mark J Quasi-radial heatsink with rectangular form factor and uniform fin length
US8179679B2 (en) * 2006-04-27 2012-05-15 Netapp, Inc. Airflow guides using silicon walls/creating channels for heat control
JP5231732B2 (ja) * 2006-10-26 2013-07-10 株式会社東芝 冷却装置、およびこれを備えた電子機器
US7701718B2 (en) * 2008-09-23 2010-04-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
JP2011034309A (ja) * 2009-07-31 2011-02-17 Toshiba Corp 電子機器
CN102651957B (zh) * 2011-02-25 2016-08-10 裕利年电子南通有限公司 电子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201097302Y (zh) * 2007-08-03 2008-08-06 鸿富锦精密工业（深圳）有限公司 机箱导风装置
CN101751093A (zh) * 2008-11-28 2010-06-23 佛山市顺德区顺达电脑厂有限公司 具有可独立组装的分隔板的导风罩模块

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