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CN102485940A - 壳体及其制造方法 - Google Patents

壳体及其制造方法 Download PDF

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Publication number
CN102485940A
CN102485940A CN2010105723992A CN201010572399A CN102485940A CN 102485940 A CN102485940 A CN 102485940A CN 2010105723992 A CN2010105723992 A CN 2010105723992A CN 201010572399 A CN201010572399 A CN 201010572399A CN 102485940 A CN102485940 A CN 102485940A
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corrosion
aluminum
layer
housing
alloy matrix
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张新倍
陈文荣
蒋焕梧
陈正士
陈晓强
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010105723992A priority Critical patent/CN102485940A/zh
Priority to US13/213,386 priority patent/US8709594B2/en
Publication of CN102485940A publication Critical patent/CN102485940A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C23C14/0652—Silicon nitride
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
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Abstract

本发明提供一种壳体，包括铝或铝合金基体、结合层、防腐蚀层，在该铝或铝合金基体上依次形成结合层、防腐蚀层。该结合层为硅层，该防腐蚀层为氮化硅层。本发明还提供了所述壳体的制造方法，包括以下步骤：提供铝或铝合金基体，于该铝或铝合金基体上依次磁控溅射形成结合层、防腐蚀层。所述壳体具有良好的耐腐蚀性及装饰性外观。

Description

壳体及其制造方法
技术领域
本发明涉及一种壳体及其制造方法。
背景技术
真空镀膜技术(PVD)是一种非常环保的成膜技术。以真空镀膜的方式所形成的膜层具有高硬度、高耐磨性、良好的化学稳定性、与基体结合牢固以及亮丽的金属外观等优点，因此真空镀膜在铝、铝合金及不锈钢等金属基材表面装饰性处理领域的应用越来越广。
然而，由于铝或铝合金的标准电极电位很低，与PVD镀层，如TiN层、TiN层或CrN层的电位差较大，且PVD镀层本身不可避免的会存在微小的孔隙，如针孔、裂纹，致使铝或铝合金基体易于发生微电池腐蚀。因此，直接于铝或铝合金基体表面镀覆所述TiN层、TiN层或CrN层并不能有效提高所述铝或铝合金基体的耐腐蚀性能，同时该PVD镀层本身也会发生异色、脱落等现象，难以维持良好的装饰外观。
发明内容
鉴于此，提供一种具有良好的耐腐蚀性及装饰性外观的壳体。
另外，还提供一种上述壳体的制造方法。
一种壳体，包括铝或铝合金基体、依次形成于铝或铝合金基体上的结合层、防腐蚀层，所述结合层为硅层，所述防腐蚀层为氮化硅层。
一种壳体的制造方法，包括以下步骤：
提供铝或铝合金基体；
在该铝或铝合金基体上磁控溅射形成结合层，该结合层为硅层；
在该结合层上磁控溅射形成防腐蚀层，该防腐蚀层为氮化硅层。
所述壳体的制造方法，通过磁控溅射法依次于铝或铝合金基体上形成结合层、防腐蚀层及具有装饰性的色彩层。该结合层为一硅层，其能很好地起到一个过渡结合作用，使该防腐蚀层与铝或铝合金基体更稳定地结合，该防腐蚀层为一氮化硅层，其以磁控溅射技术形成，具有更致密的超细微结构，其陶瓷材料的绝缘性能可减缓电偶腐蚀速率。另外，氮化硅膜层的抗震稳定性起到了缓解应力的作用，有利于色彩层附着力的改善，避免所述色彩层发生异色、脱落等失效现象，从而使该壳体经长时间使用后仍具有较好的装饰性外观。
附图说明
图1为本发明较佳实施例的壳体的剖视图。
主要元件符号说明
壳体             10
铝或铝合金基体   11
结合层           13
防腐蚀层         15
色彩层           17
具体实施方式
请参阅图1，本发明一较佳实施例的壳体10包括铝或铝合金基体11、依次形成于该铝或铝合金基体11上的结合层13、防腐蚀层15。该壳体10可以为3C电子产品的壳体，也可为工业、建筑用件及汽车等交通工具的零部件等。
所述结合层13为硅层，其厚度为0.1～0.2μm。
所述防腐蚀层15为氮化硅层，其厚度为0.5～1.0μm。
在所述的防腐蚀层15上还可以磁控溅射一色彩层，所述色彩层17为氮化钛层(Ti-N)，其厚度为1.0～3.0μm。
可以理解，所述色彩层17还可以为氮化铬层(Cr-N)或其他具有装饰性的色彩层。
所述结合层13、防腐蚀层15及色彩层17均可通过磁控溅射法形成。
本发明一较佳实施例的制造所述壳体10的方法主要包括如下步骤：
提供铝或铝合金基体11，并对铝或铝合金基体11依次进行研磨及电解抛光。电解抛光后，再依次用去离子水和无水乙醇对该铝或铝合金基体11表面进行擦拭。再将擦拭后的铝或铝合金基体11放入盛装有丙酮溶液的超声波清洗器中进行震动清洗，以除去铝或铝合金基体11表面的杂质和油污等。清洗完毕后吹干备用。
对经上述处理后的铝或铝合金基体11的表面进行氩气等离子清洗，进一步去除铝或铝合金基体11表面的油污，以改善铝或铝合金基体11表面与后续涂层的结合力。该等离子清洗的具体操作及工艺参数可为：将铝或铝合金基体11放入一磁控溅射镀膜机(图未示)的镀膜室内，对该镀膜室进行抽真空处理至真空度为1.0×10-3Pa，以250～500sccm(标准状态毫升/分钟)的流量向镀膜室中通入纯度为99.999％的氩气，于铝或铝合金基体11上施加-300～-800V的偏压，对铝或铝合金基体11表面进行等离子清洗，等离子清洗时间为3～10min。
在对铝或铝合金基体11进行等离子清洗后，于该铝或铝合金基体11上形成结合层13。该结合层13为一硅层，以氩气为工作气体，调节氩气流量为100～200sccm，设置占空比为30～80％，于铝或铝合金基体11上施加-50～-200V的偏压，并加热镀膜室至100～150，选择硅为靶材，设置其功率为2～8kw，沉积结合层13。沉积结合层13的时间为20～40min，结合层13的厚度为0.1～0.2μm。
形成所述结合层13后，于该结合层13上形成防腐蚀层15，所述防腐蚀层15为氮化硅层。形成该防腐蚀层15的具体操作及工艺参数如下：以氩气为工作气体，调节氩气流量为100～200sccm，以氮气为反应气体，调节氮气流量为50～100sccm，设置占空比为30％～50％，于铝或铝合金基体11上施加-50～-100V的偏压，并加热镀膜室至100～150，选择硅为靶材，设置其功率为2～8kw，沉积防腐蚀层15。沉积防腐蚀层15的时间为90～180min，防腐蚀层15的厚度为0.5～1.0μm。
形成所述防腐蚀层15后，还可于该防腐蚀层15上形成色彩层17，形成该色彩层17的具体操作及工艺参数如下：关闭所述硅靶的电源，开启已置于所述镀膜机内的一靶材电源，该靶材可为钛靶或铬靶，设置其功率为8～10kw，保持上述氩气的流量不变，并向镀膜室内通入流量为20～170sccm的反应气体氮气，沉积色彩层17。沉积色彩层的时间为20～30min，该色彩层17可为氮化钛层(Ti-N)或氮化铬层(Cr-N)，色彩层17的厚度为1.0～3.0μm。
所述壳体10的制造方法，通过磁控溅射法依次于铝或铝合金基体11上形成结合层13、防腐蚀层15及具有装饰性的色彩层17。该结合层13为一硅层，其能很好地起到一个过渡结合作用，使该防腐蚀层15与铝或铝合金基体11更稳定地结合。该防腐蚀层15为一氮化硅层，其陶瓷材料的绝缘性能可减缓电偶腐蚀速率。另外，氮化硅的抗震稳定性起到了缓解应力的作用，有利于色彩层17附着力的改善，避免所述色彩层17发生异色、脱落等失效现象，从而使该壳体10经长时间使用后仍具有较好的装饰性。

Claims (9)

1.一种壳体，包括铝或铝合金基体、依次形成于铝或铝合金基体上的结合层、防腐蚀层，其特征在于：所述结合层为硅层，所述防腐蚀层为氮化硅层。
2.如权利要求1所述的壳体，其特征在于：该结合层的厚度为0.1～0.2μm。
3.如权利要求1所述的壳体，其特征在于：该防腐蚀层的厚度为0.5～1.0μm。
4.如权利要求1所述的壳体，其特征在于：所述防腐蚀层上磁控形成一色彩层，该色彩层为氮化钛层(Ti-N)或氮化铬层(Cr-N)。
5.一种壳体的制造方法，包括以下步骤：
提供铝或铝合金基体；
在该铝或铝合金基体上磁控溅射形成结合层，该结合层为硅层；
在该结合层上磁控溅射形成防腐蚀层，该防腐蚀层为氮化硅层。
6.如权利要求5所述的壳体的制造方法，其特征在于：磁控溅射所述结合层的工艺参数为：以氩气为工作气体，氩气流量为100～200sccm，设置占空比为30～80％，对铝或铝合金基体施加-50～-200V的偏压，镀膜室温度为100～150℃，以硅靶为靶材，设置其功率为2～8kw，沉积时间为20～40min。
7.如权利要求5所述的壳体的制造方法，其特征在于：磁控溅射所述防腐蚀层的工艺参数为：以氩气为工作气体，氩气流量为100～200sccm，以氮气为反应气体，氮气流量为50～100sccm，设置占空比为30％～50％，对铝或铝合金基体上施加-50～-100V的偏压，镀膜室温度为100～150，以硅靶为靶材，设置其功率为2～8kw，沉积时间为90～180min。
8.如权利要求5所述的壳体的制造方法，其特征在于：在该耐腐蚀层上磁控溅射形成一色彩层。
9.如权利要求8所述的壳体的制造方法，其特征在于：磁控溅射所述色彩层的工艺参数为：开启一钛靶或铬靶的电源，设置其功率8～10kw，设置氮气流量为20～170sccm，沉积时间为20～30min。
CN2010105723992A 2010-12-03 2010-12-03 壳体及其制造方法 Pending CN102485940A (zh)

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LIHUA YU等: "Microstructure and hardening mechanisms in a-Si3N4/nc-TiN nanostructructured multilayers", 《THIN SOLID FILMS》 *

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CN109727924A (zh) * 2018-12-27 2019-05-07 江苏省宜兴电子器件总厂有限公司 一种带AlN和Si过渡片陶瓷外壳封装结构

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