CN102407479A - Ultralow temperature polishing device - Google Patents
Ultralow temperature polishing device Download PDFInfo
- Publication number
- CN102407479A CN102407479A CN201110373038XA CN201110373038A CN102407479A CN 102407479 A CN102407479 A CN 102407479A CN 201110373038X A CN201110373038X A CN 201110373038XA CN 201110373038 A CN201110373038 A CN 201110373038A CN 102407479 A CN102407479 A CN 102407479A
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- CN
- China
- Prior art keywords
- polishing
- housing
- polishing pad
- top cover
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000005498 polishing Methods 0.000 title claims abstract description 57
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 11
- 239000003082 abrasive agent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本发明提供一种超低温抛光装置，包括顶端敞口的壳体、电动机、带有锥套的抛光盘、抛光垫、试样固定器和顶盖，其中电动机固定在壳体内的底部，带有锥套的抛光盘位于工作区内，且固定安装在电动机的输出轴上，试样固定器设置在壳体的内壁、且位于抛光垫之上，顶盖扣合在壳体上，其特征在于：壳体由金属内壳、保温层和金属外壳组成，增设了温度传感器、液位传感器、玻璃观察孔和液氮容器，其中液氮容器的下端连通一设有电磁阀的导管，导管的出口位于抛光垫的上方，液位传感器设置在工作区内的底部，温度传感器和玻璃观察孔设置在壳体位于工作区的侧壁上，顶盖上设有贯穿的气孔。本发明抛光度高，同时提高了材料表面的抗划伤能力和减少亚表层损伤。
The invention provides an ultra-low temperature polishing device, which includes a shell with an open top, a motor, a polishing disc with a cone sleeve, a polishing pad, a sample holder and a top cover, wherein the motor is fixed at the bottom of the shell, with a cone The set of polishing discs is located in the working area and is fixedly installed on the output shaft of the motor. The sample holder is arranged on the inner wall of the housing and is located on the polishing pad. The top cover is fastened on the housing. It is characterized in that: The casing is composed of a metal inner shell, an insulation layer and a metal outer shell. A temperature sensor, a liquid level sensor, a glass observation hole and a liquid nitrogen container are added. The lower end of the liquid nitrogen container is connected to a conduit with a solenoid valve. The outlet of the conduit is located Above the polishing pad, the liquid level sensor is arranged at the bottom of the working area, the temperature sensor and the glass observation hole are arranged on the side wall of the housing where the working area is located, and the top cover is provided with through air holes. The invention has high polishing degree, simultaneously improves the anti-scratch ability of the material surface and reduces subsurface layer damage.
Description
Technical field
The present invention provides a kind of ultralow temperature burnishing device, belongs to the polissoir technical field.
Background technology
Machinery removal method is traditional finishing method, and it is that rely on polishing particles and finished surface direct contacts and rub and obtain super-smooth surface.The clearance of mechanical polishing method is bigger, also can access the surface roughness of inferior nanometer scale, but owing to be direct contact, makes the surface produce scuffing and internal stress etc. easily, also is difficult to avoid the damage of affected layer and subsurface stratum.Develop on this basis and the polishing without abrasive method.The polishing without abrasive method is to utilize the ice that condenses to polish, and must just can form below 0 ℃ owing to ice, so polishing without abrasive is cryogenic polishing again.Polishing without abrasive is an innovation greatly, and it has broken through traditional polishing or has ground the constraint that can not lack abrasive material.The polishing machine that no abrasive material cryogenic polishing is used is common grinder, and polishing disk is the ice pan that water is frozen into, because the effect of no abrasive material in the polishing reduced defectives such as surface scratch, affected layer, but polishing material is not under the low temperature environment.In order further to improve polishing effect; Reduce the surface and produce scuffing and internal stress, utilize material under low temperature environment, the atom vibrations diminish; The characteristic that hardness improves improves the scratch resistance ability of material and does not still have the research report with the ultralow temperature glossing that improves material polishing degree.
Summary of the invention
The purpose of this invention is to provide and a kind ofly can overcome the ultralow temperature burnishing device that above-mentioned defective, polishing degree are high, environment do not caused secondary pollution.Its technical scheme is:
Comprise the uncovered housing in top, motor, the polishing disk that has tapered sleeve, polishing pad, sample holder and top cover, wherein motor is fixed on the bottom in the housing, and the polishing disk that has tapered sleeve is positioned at the workspace; And be fixedly mounted on the output shaft of motor; Sample holder is arranged on the inwall of housing and is positioned on the polishing pad, and top cover is fastened on the housing, it is characterized in that: housing is made up of metal inner casing, heat-insulation layer and metal shell; Temperature sensor, liquid level sensor, glass peephole and liquid nitrogen container have been set up; Wherein the lower end of liquid nitrogen container connection one is provided with the conduit of magnetic valve, and the outlet of conduit is positioned at the top of polishing pad, and liquid level sensor is arranged on the bottom in the workspace; Temperature sensor and glass peephole are arranged on the sidewall that housing is positioned at the workspace, and top cover is provided with the pore that runs through.
Described ultralow temperature burnishing device, polishing pad adopt a kind of of water, colloidal alumina or colloidal zirconia to process.
Its operation principle is: because material hardness under low temperature environment is higher; Therefore use liquid nitrogen as polishing fluid; Sample is under the environment about subzero 180 degree polishes, the burnishing surface smoothness is further improved, improve material surface scratch resistance ability simultaneously and reduce the subsurface stratum damage.During polishing, unload polishing disk earlier, in polishing disk, add entry or colloidal alumina or colloidal zirconia and form ice, ice attitude aluminium oxide or the zirconic polishing pad of ice attitude in household freezer (subzero) refrigeration; Install polishing disk then, fix the polishing sample again, cover top cover; Make the workspace be in the environment about subzero 180 degree through the inflow of solenoid control liquid nitrogen,, close magnetic valve when liquid level is too high through the amount of liquid level sensor surveying work district liquid nitrogen; Through the Motor Control polishing velocity; After the polish end, observe in the liquid nitrogen container and do not have liquid nitrogen, the temperature through temperature sensor test job district is for above zero; Observe no liquid nitrogen through glass peephole, just can open top cover.
The present invention compared with prior art has following advantage:
1, material hardness under the environment about subzero 180 degree is higher, helps the raising of degree of polishing.
2, material hardness under the environment about subzero 180 degree is higher, the scratch resistance ability of material surface and the damage of minimizing subsurface stratum when having improved polishing.
3, subzero 180 degree in workspace make polishing pad combine closely with polishing disk.
4, environmental pollution of the present invention is little, adapts to the developing direction of green processing.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Among the figure: 1, motor 2, polishing disk 3, polishing pad 4, sample holder 5, top cover 6, workspace 7, output shaft 8, metal inner casing 9, heat-insulation layer 10, metal shell 11, temperature sensor 12, liquid level sensor 13, liquid nitrogen container 14, magnetic valve 15, conduit 16, glass peephole 17, pore 18, polishing material
The specific embodiment
In the embodiment shown in fig. 1: comprise the uncovered housing in top, motor 1, the polishing disk 2 that has tapered sleeve, polishing pad 3, sample holder 4 and top cover 5; Its middle shell is made up of metal inner casing 8, heat-insulation layer 9 and metal shell 10, and polishing pad 3 adopts ice to process, and motor 1 is fixed on the bottom in the housing; The polishing disk 2 that has tapered sleeve is positioned at workspace 6; And be fixedly mounted on the output shaft 7 of motor 1, sample holder 4 is arranged on the inwall of metal inner casing 8 and is positioned on the polishing pad 3, and top cover 5 is fastened on the housing; Temperature sensor 11, liquid level sensor 12, glass peephole 16 and liquid nitrogen container 13 have been set up; Wherein the lower end of liquid nitrogen container 13 connection one is provided with the conduit 15 of magnetic valve 14, and the outlet of conduit 15 is positioned at the top of polishing pad 3, and liquid level sensor 12 is arranged on the bottom in the workspace 6; Temperature sensor 11 and glass peephole 16 are arranged on the sidewall that housing is positioned at workspace 6, and top cover 5 is provided with the pore 17 that runs through.
Claims (2)
1. ultralow temperature burnishing device; Comprise the uncovered housing in top, motor (1), have polishing disk (2), polishing pad (3), sample holder (4) and the top cover (5) of tapered sleeve; Wherein motor (1) is fixed on the bottom in the housing; The polishing disk (2) that has a tapered sleeve is positioned at workspace (6) and is fixedly mounted on the output shaft (7) of motor (1); Sample holder (4) is arranged on the inwall of housing and is positioned on the polishing pad (3), and top cover (5) is fastened on the housing, it is characterized in that: housing is made up of metal inner casing (8), heat-insulation layer (9) and metal shell (10); Temperature sensor (11), liquid level sensor (12), glass peephole (16) and liquid nitrogen container (13) have been set up; Wherein the lower end of liquid nitrogen container (13) connection one is provided with the conduit (15) of magnetic valve (14), and the outlet of conduit (15) is positioned at the top of polishing pad (3), and liquid level sensor (12) is arranged on the bottom in the workspace (6); Temperature sensor (11) and glass peephole (16) are arranged on the sidewall that housing is positioned at workspace (6), and top cover (5) is provided with the pore (17) that runs through.
2. ultralow temperature burnishing device as claimed in claim 1 is characterized in that: polishing pad (3) adopts a kind of of water, colloidal alumina or colloidal zirconia to process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110373038XA CN102407479A (en) | 2011-11-22 | 2011-11-22 | Ultralow temperature polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110373038XA CN102407479A (en) | 2011-11-22 | 2011-11-22 | Ultralow temperature polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102407479A true CN102407479A (en) | 2012-04-11 |
Family
ID=45909987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110373038XA Pending CN102407479A (en) | 2011-11-22 | 2011-11-22 | Ultralow temperature polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102407479A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021169316A1 (en) * | 2020-02-27 | 2021-09-02 | 苏州大学 | Device and method for polishing intraocular lens by using electrorheological effect |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577506A (en) * | 2003-06-30 | 2005-02-09 | 信越化学工业株式会社 | Substrate for magnetic recording medium |
| CN101474590A (en) * | 2009-02-02 | 2009-07-08 | 刘高峰 | Ultra-low temperature pulverizer |
-
2011
- 2011-11-22 CN CN201110373038XA patent/CN102407479A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577506A (en) * | 2003-06-30 | 2005-02-09 | 信越化学工业株式会社 | Substrate for magnetic recording medium |
| CN101474590A (en) * | 2009-02-02 | 2009-07-08 | 刘高峰 | Ultra-low temperature pulverizer |
Non-Patent Citations (1)
| Title |
|---|
| 刘向阳等: "无磨料低温抛光的工艺方法研究", 《机械设计与制造》, no. 1, 31 January 2005 (2005-01-31), pages 71 - 73 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021169316A1 (en) * | 2020-02-27 | 2021-09-02 | 苏州大学 | Device and method for polishing intraocular lens by using electrorheological effect |
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Application publication date: 20120411 |