CN102403297A - Shock resistant lead frame and packaging body - Google Patents

Abstract

The invention relates to an impact-resistant lead frame and package body. The impact-resistant lead frame includes a chip mounting part and a plurality of pins, the pins are arranged around the chip mounting part and are in the same plane, and the chip mounting part further includes a protrusion, and the protrusion The output part is arranged on the side of the chip mounting part, and is in the same plane as the chip mounting part and the pins. The advantage of the present invention is that the protruding part is used on the side of the chip mounting part to form a symmetrical fixing method, which improves the firmness of the chip mounting part in the wiring process, so that the impact of the packaging process on the lead frame can be improved, and the Product yield.

Description

A shock-resistant lead frame and package

technical field

The invention relates to the field of packaging and testing of semiconductor devices, in particular to an impact-resistant lead frame and a packaging body.

Background technique

Electronic products are becoming cheaper and cheaper. For packaging factories, how to improve product yield and replace expensive materials with cheap materials has become a top priority. For example, copper wires are used in the market to replace gold Wire.

However, compared with gold wires, one of the problems with copper wires is that the copper wire process requires greater force to fix the wire on the lead frame, so the external force applied to the lead frame in the process is greater than that of the gold wire process, resulting in The lead frame deformation is also greater. In the process of soldering chips and wires, it is easy to cause warping and deformation of the substrate, which affects process stability and reduces product yield.

FIG. 1A is a top view of a package in the prior art, including a chip 10 , a chip mounting portion 11 , and five pins, namely pins 121 - 125 . The chip 10 is electrically connected to the corresponding pins through the metal leads 131-135, and the pins on both sides are pressed against the table on which the package is placed by using the pressing pieces 191 and 192 during the packaging process to prevent the package from sliding. It is not difficult to see from FIG. 1A that the chip attaching portion 11 of this package is only pressed by the pressing piece 192 through the pin 123, so it is easy to warp and deform during the wiring process.

FIG. 1B is a top view of another package in the prior art, including a chip 10 , a chip mounting portion 11 , and six pins, namely pins 141 - 146 . The chip 10 is electrically connected to corresponding pins through metal leads 151 - 155 . Similar to FIG. 1A , the chip attaching portion 11 of the package is pressed by the pressing sheet 192 only through the pins 143 , so it is easy to warp and deform during the wiring process.

Contents of the invention

The technical problem to be solved by the present invention is to provide an impact-resistant lead frame and package, which can improve the strength of the lead frame, thereby improving the yield of the package.

In order to solve the above problems, the present invention provides an impact-resistant lead frame, which includes a chip mounting part and a plurality of pins, the pins are arranged around the chip mounting part and are in the same plane, and the chip mounting part The part further includes a protruding part, and the protruding part is arranged on the side of the chip attaching part and is in the same plane as the chip attaching part and the pins.

As an optional technical solution, the number of the pins is an odd number, the chip mounting part is rectangular, the pins are arranged on opposite sides of the chip mounting part, and the number of the two sides differs by one, and the protruding part It is arranged on the side of the chip mounting part correspondingly provided with less number of pins.

As an optional technical solution, the number of the pins is an even number, the chip mounting part is rectangular, the pins are arranged on opposite sides of the chip mounting part, and the numbers on both sides are equal, and the protruding part is Two, symmetrically arranged on the two sides of the pins that are not correspondingly arranged in the chip mounting part.

The present invention further provides a package body, including a lead frame, a plurality of metal leads, a chip and a plastic package, the lead frame includes a chip mounting part and a plurality of pins, and the pins are arranged around the chip mounting part, And the electrical pads of the chip in the same plane are electrically connected to the corresponding pins through the metal leads, the plastic package wraps the chip mounting part, a plurality of metal leads and the chip, and the chip mounting part further includes The protruding part is arranged on the side of the chip attaching part and is in the same plane as the chip attaching part and the pins.

As an optional technical solution, the number of the pins is an odd number, the chip mounting part is rectangular, the pins are arranged on both sides of the chip mounting part oppositely, and the number of the two sides differs by one, and the protruding part is set Correspondingly, the side with fewer pins is arranged on the chip mounting part.

As an optional technical solution, the number of pins is an even number, the chip mounting part is rectangular, the pins are arranged on both sides of the chip mounting part, and the numbers on both sides are equal, and the protruding parts are two one, symmetrically arranged on the two sides of the pins not correspondingly arranged in the chip mounting part.

As an optional technical solution, the metal leads are copper wires.

As an optional technical solution, the ends of the protrusions are exposed outside the plastic package.

As an optional technical solution, all the protruding parts are wrapped in the plastic package.

The advantage of the present invention is that the protruding part is used on the side of the chip mounting part to form a symmetrical fixing method, which improves the firmness of the chip mounting part in the lead process, so that the impact of the packaging process on the lead frame can be improved, and the Product yield.

Description of drawings

Accompanying drawing 1A is a top view of a package in the prior art;

Accompanying drawing 1B is the top view of another kind of package in the prior art;

Figure 2A is a schematic structural view of the package according to a specific embodiment of the present invention;

Accompanying drawing 2B is a structural schematic diagram of the package body shown in Fig. 2A after plastic sealing;

Figure 3A is a schematic structural view of the package according to another specific embodiment of the present invention;

FIG. 3B is a schematic structural view of the package shown in FIG. 3A after plastic sealing.

Detailed ways

The specific implementation manners of the impact-resistant lead frame and package body provided by the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 2A is a schematic structural view of the package according to a specific embodiment of the present invention, including a chip 10 , a chip mounting part 11 , and five pins, which are pins 221-225 respectively. The pins 221 - 225 are arranged around the chip attaching part 11 and are in the same plane. The die attach portion 11 and the leads 121 to 125 constitute a lead frame. The chip 10 is electrically connected to the corresponding pins through the metal leads 231-235, and the pins on both sides are pressed tightly on the table on which the package is placed by using the pressing pads 191 and 192 during the packaging process. In this specific embodiment, the die attaching part 11 further includes a protruding part 20, the protruding part 20 is arranged on the side of the die attaching part 11, and is connected with the die attaching part 11 and the pin 221 ~225 are in the same plane.

This specific implementation manner is a preferred implementation scheme for the case where the number of pins is odd. Continuing to refer to FIG. 2A , the number of pins in this embodiment is 5 (odd number), and the chip attaching part 11 is rectangular. Therefore, the pins 221 - 225 are arranged on opposite sides of the chip attaching part 11 , and the number of the two sides differs by one, 3 on one side and 2 on the other side. The protruding part 20 is arranged on the side of the chip mounting part 11 corresponding to the two pins, so as to cooperate with the pins 221-225 to form a substantially symmetrical arrangement on both sides of the chip mounting part 11. . During the packaging process, the pressing sheets 191 and 192 are used to press the pins 221 to 225 on both sides and the protruding part 20 tightly on the table on which the package is placed. Due to the use of the protruding portion 20 , one side of the chip attaching portion 11 is pressed by the pressing piece 192 through the pin 223 , while the opposite side is pressed by the pressing piece 191 through the protruding portion 20 . Such a symmetrical fixing method improves the firmness of the chip mounting part 11 during the wiring process, so the impact of the packaging process on the lead frame can be improved, and the product yield can be improved.

The metal lead is preferably a copper wire, because the lead process of the copper wire has a relatively large impact on the chip attaching portion 11 of the lead frame.

Referring to accompanying drawing 2B, it is a schematic diagram of the structure of the package shown in accompanying drawing 2A after being plastic-encapsulated. The plastic package 29 wraps the chip mounting part 11, the metal leads 231-235 and the chip 10, and wraps a part of the pins 221-225. The ends of the pins 221 - 225 are exposed outside the plastic package 29 to form an electrical connection with the outside. In this embodiment, the ends of the protrusions 20 are also exposed outside the plastic package. In other embodiments, the protruding portion 20 can also be completely wrapped in the plastic package 29 .

FIG. 3A is a schematic structural diagram of the package according to another specific embodiment of the present invention, including a chip 10 , a chip mounting part 11 , and six pins, which are pins 341 - 346 . The pins 341 - 346 are arranged around the chip attaching part 11 and are in the same plane. The die attach portion 11 and the leads 341 to 346 constitute a lead frame. The chip 10 is electrically connected to the corresponding pins through the metal leads 351-355, and the pins on both sides are pressed tightly on the table on which the package is placed by using the pressing pieces 191 and 192 during the packaging process. In this specific embodiment, the chip attaching part 11 further includes a first protruding part 31 and a second protruding part 32, and the first protruding part 31 and the second protruding part 32 are arranged on the chip attaching part. 11, and in the same plane as the chip attaching part 11 and the pins 341-346.

This specific implementation manner is a preferred implementation scheme for the case where the number of pins is an even number. Continuing to refer to FIG. 3A , the number of pins in this embodiment is 6 (odd number), and the chip attaching part 11 is rectangular. Therefore, the pins 341 - 346 are arranged on opposite sides of the chip attaching part 11 , and the number of the two sides is three. The protruding part 20 is arranged on the side of the chip mounting part 11 corresponding to the two pins, so as to cooperate with the pins 341-346 to form a substantially symmetrical arrangement on both sides of the chip mounting part 11. . During the packaging process, pressing sheets 191 and 192 are used to press the pins 341 to 346 on both sides on the table on which the package is placed, and pressing sheets 393 and 394 are further provided to connect the first protruding part 31 and the second protruding part. 32 is compressed on the table on which the package is placed. Due to the use of the first protruding portion 31 and the second protruding portion 32, one side of the chip mounting portion 11 is pressed by the pressing piece 393 through the first protruding portion 31, while the other side opposite to it is pressed by the first protruding portion 393. The two protrusions 32 are compressed by the pressing piece 394 . Such a symmetrical fixing method improves the firmness of the chip mounting part 11 during the wiring process, so it can increase the impact of the packaging process on the lead frame and improve the product yield.

Referring to FIG. 3B , it is a schematic diagram of the structure of the package shown in FIG. 3A after being plastic-encapsulated. The plastic package 39 wraps the chip mounting part 11, the metal leads 351-355 and the chip 10, and wraps a part of the pins 341-346. The ends of the pins 341-346 are exposed outside the plastic package 39 to form an electrical connection with the outside. In this embodiment, the ends of the first protruding portion 31 and the second protruding portion 32 are also exposed outside the plastic package. In other embodiments, the first protruding portion 31 and the second protruding portion 32 may also be completely wrapped in the plastic package 39 .

The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be considered Be the protection scope of the present invention.

Claims (9)

1. shock proof lead frame; Comprise chip attachment portion and a plurality of pin, said pin is provided with around chip attachment portion, and is in the same plane; It is characterized in that; Said chip attachment portion further comprises protuberance, and said protuberance is arranged on the side of chip attachment portion, and is in the same plane with chip attachment portion and pin.

2. shock proof lead frame according to claim 1; It is characterized in that; The number of said pin is an odd number, and chip attachment portion is a rectangle, and pin is relatively arranged on the relative both sides of chip attachment portion; And the number of both sides differs one, and said protuberance is arranged at chip attachment portion correspondence and is provided with on the side of less number of pins.

3. shock proof lead frame according to claim 1; It is characterized in that the number of said pin is an even number, chip attachment portion is a rectangle; Pin is relatively arranged on the relative both sides of chip attachment portion; And the number of both sides equates that said protuberance is two, be symmetricly set in chip attachment portion not correspondence be provided with on the pin dual-side.

4. packaging body; Comprise lead frame, a plurality of metal lead wire, chip and plastic-sealed body, said lead frame comprises chip attachment portion and a plurality of pin, and said pin is provided with around chip attachment portion; And the electricity pad that is in said chip in the same plane is connected to corresponding pin through metal lead wire electricity; Said plastic-sealed body wraps up said chip attachment portion, a plurality of metal lead wire and chip, it is characterized in that, said chip attachment portion further comprises protuberance; Said protuberance is arranged on the side of chip attachment portion, and is in the same plane with chip attachment portion and pin.

5. packaging body according to claim 4; It is characterized in that; The number of said pin is an odd number, and chip attachment portion is a rectangle, and pin is relatively arranged on the both sides of chip attachment portion; And the number of both sides differs one, and said protuberance is arranged at chip attachment portion correspondence and is provided with on the side of less number of pins.

6. packaging body according to claim 4; It is characterized in that the number of said pin is an even number, chip attachment portion is a rectangle; Pin is relatively arranged on the both sides of chip attachment portion; And the number of both sides equates that said protuberance is two, be symmetricly set in chip attachment portion not correspondence be provided with on the pin dual-side.

7. packaging body according to claim 4 is characterized in that, said metal lead wire is a copper cash.

8. packaging body according to claim 4 is characterized in that the ends exposed of said protuberance is outside said plastic-sealed body.

9. packaging body according to claim 4 is characterized in that said protuberance all is wrapped in the said plastic-sealed body.

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