CN202423265U - Lead wire framework and lead wire framework for discrete packaging - Google Patents
Lead wire framework and lead wire framework for discrete packaging Download PDFInfo
- Publication number
- CN202423265U CN202423265U CN 201120383653 CN201120383653U CN202423265U CN 202423265 U CN202423265 U CN 202423265U CN 201120383653 CN201120383653 CN 201120383653 CN 201120383653 U CN201120383653 U CN 201120383653U CN 202423265 U CN202423265 U CN 202423265U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip bonding
- bonding pad
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 5
- 238000000034 method Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model relates to a lead wire framework and a lead wire framework for discrete packaging. The lead wire framework comprises the components as following: a plurality of first chip pads; a plurality of second lead wires extending from the first chip pads; and a plurality of third connection members, each of the third connection members connects one first chip pad to another.
Description
Technical field
The utility model relates generally to semiconductor packages, and is specifically related to lead frame.
Background technology
Lead frame is also referred to as lead frame, and being used for the IC encapsulation is that chip provides mechanical support with the process at chip (being nude film) assembling becoming final products.Lead frame generally includes chip bonding pad and lead-in wire, and wherein, chip bonding pad is used to supply chip fixing on it, goes between as chip electricity is connected to the outside, for example the means of printed circuit board (PCB).Chip perhaps is connected to lead-in wire through tape automated bonding via metal wire through the gold thread bonding.
Yet, such situation possibly take place, fixed the chip bonding pad of chip and transferred to the process of another equipment, owing to the external force that is applied on the chip bonding pad loses correct orientation from an equipment.The result is that chip bonding pad must be reorientated, and need expend more operating time and energy.In addition, the line between lead-in wire and the chip is easy to damage when being stretched, and this will cause being electrically connected the rate of finished products that lost efficacy and reduced encapsulation.
Therefore, need a kind of lead frame that is not easy to change orientation or distortion.
The utility model content
A kind of lead frame is provided, has comprised: more than first chip bonding pad; More than second lead-in wire extends from said more than first chip bonding pad; And more than the 3rd Connection Element, each of said more than the 3rd Connection Element is connected to another with of said more than first chip bonding pad.
A kind of lead frame that is used for discrete package is provided, has comprised according to lead frame of the present invention.
Preceding text have been summarized but not have broadly been provided the characteristic of present disclosure.After this supplementary features of present disclosure will described, and it has formed the theme of the utility model claim.It will be appreciated by those skilled in the art that and easily to use disclosed design and embodiment, as the basis of revising and design other structures or process, so that carry out the purpose identical with the utility model.Those skilled in the art it is also understood that these equivalent structures do not break away from the purport and the scope of the utility model of putting down in writing in the appended claims.
Description of drawings
For more completely understand the disclosure with and advantage, combine now to describe below the referenced drawings, wherein:
Fig. 1 shows the partial plan view according to an embodiment of the lead frame of the one side of the utility model;
Fig. 2 shows the partial plan view according to another embodiment of the lead frame of the one side of the utility model;
Fig. 3 shows the flow chart of the exemplary method of using lead frame shown in Figure 1,
Only if indicate, otherwise the corresponding part of the general expression of respective markers in the different accompanying drawing and symbol.Drawing accompanying drawing is the parties concerned for the execution mode that is shown clearly in present disclosure, and may not be drawn to scale.In order more to be shown clearly in some execution mode, after Reference numeral, possibly follow letter, the distortion of its indication same structure, material or process steps.
Embodiment
Go through enforcement and the use of embodiment below.Yet, should be appreciated that the specific embodiment discussed only exemplarily explanation implement and use the ad hoc fashion of the utility model, and the scope of unrestricted the utility model.
In a embodiment according to the lead frame (Reference numeral is 20) of the utility model; Lead frame 20 comprises more than first chip bonding pad (process fixing and encapsulation will be described below) of fixed chip; More than second lead-in wires from this more than first chip bonding pad extension; And more than the 3rd Connection Element, each of more than the 3rd Connection Element is connected to another with of this more than first chip bonding pad.Fig. 1 is the partial plan view of lead frame 20, and it shows 21, six lead-in wires 23 of two chip bonding pads and a complete Connection Element 25 that is connected these two chip bonding pads 21.Those skilled in the art will appreciate that lead frame 20 can have the unit shown in Figure 1 that on one dimension or two-dimensional directional, repeats.
Because Connection Element 25, lead frame 20 also has the percent thermal shrinkage and the rate of curving of reduction.In a shrinkage test, traditional lead frame shows the average shrinkage ratio of about 40ppm, and lead frame 20 does not show any contraction.In a rate of curving test, traditional lead frame shows the rate of curving of about 200ppm, and lead frame 20 does not show any bending.In an excessive glue test, the encapsulating sheet of use conventional lead frame reveals the excessive glue of about 540ppm, and the encapsulating sheet of use lead frame 20 reveals the excessive glue of about 120ppm.
Should be noted that lead frame described herein is not limited to the structure shown in Fig. 1.According to transistorized type, integrated circuit or other devices that will encapsulate, each of a plurality of chip bonding pads 21 can be corresponding the lead-in wire 23 of two, four, five, seven or other numbers.In addition, a plurality of Connection Elements 25 can have different shapes, for example, bar shaped, polygon, etc.
Still with reference to figure 1, alternatively, lead frame 20 also comprises strip component 26, thereby it is connected to more than second a lead-in wire 23 and is convenient to lead frame 20 executable operations.
Fig. 2 shows another embodiment according to the lead frame of an aspect of the utility model.Lead frame 30 comprises more than first chip bonding pad 31 of fixed chip; More than second lead-in wires 33 from these more than first chip bonding pad 31 extensions; And each of more than the 3rd Connection Element 35, the three many Connection Elements 35 is connected to another with of this more than first chip bonding pad 31.Lead frame 30 is that with the difference of lead frame 20 each of chip bonding pad 31 comprises the protuberance 32 of an end that is positioned at relative more than second lead-in wires 33, and it can be made of metal and can be fixed to heat dissipation equipment.Connection Element 35 is connected to another chip bonding pad 31 at each projection 32 with a chip bonding pad 31.
Because Connection Element 35, lead frame 30 also has the percent thermal shrinkage and the rate of curving of reduction.In a shrinkage test, traditional lead frame shows the average shrinkage ratio of about 40ppm, and lead frame 30 does not show any contraction.In a rate of curving test, traditional lead frame shows the rate of curving of about 200ppm, and lead frame 30 does not show any bending.In an excessive glue test, the encapsulating sheet of use conventional lead frame reveals the excessive glue of about 540ppm, and the encapsulating sheet of use lead frame 30 reveals the excessive glue of about 120ppm.
Should be noted that lead frame described herein is not limited to the structure shown in Fig. 2.According to transistorized type, integrated circuit or other devices that will encapsulate, each of a plurality of chip bonding pads 31 can be corresponding the lead-in wire 33 of two, four, five, seven or other numbers.In addition, a plurality of Connection Elements 35 can have different shapes, for example, bar shaped, polygon, etc.
Still with reference to figure 2, alternatively, lead frame 30 also comprises strip component 36, thereby it is connected to more than second a lead-in wire 33 and is convenient to lead frame 30 executable operations.
An aspect according to the utility model provides a kind of lead frame that is used for discrete package, and it comprises the embodiment 20 or 30 of lead frame described herein.
Fig. 3 shows the flow chart of the exemplary method of using lead frame shown in Figure 1.The step of this method is described below with reference to lead frame 20.
In step S41, lead frame 20 is provided.
In step S42, more than first chip is fixed to more than first chip bonding pad 21 of lead frame 20.Fixing mode can be through soldering paste, slicken solder or elargol, and it was applied on the chip bonding pad 21 before chip is attached, and followed by solder reflow process or curable epoxide process.
In step S43, for example an end of the metal wire of aluminium or gold is connected to more than first chip, and the other end is connected to more than first chip bonding pad 21, is electrically connected thereby between chip and chip bonding pad, form.
In step S44, use for example more than first chip of encapsulating material plastic packaging of resin and plastics.
In step S45, more than the 3rd Connection Element 25 excised, and the chip of this plastic packaging is separated and finishing.
Those skilled in the art will be understood that easily that also material and method can change, and still be within the scope of the utility model simultaneously.It will also be appreciated that except the concrete context that is provided to show execution mode, the utility model provides multiple applicable inventive concept.Therefore, accompanying claims is intended to these processes, machine, goods, composition, device, method or step are included within its scope.
Claims (7)
1. lead frame comprises:
More than first chip bonding pad;
More than second lead-in wire extends from said more than first chip bonding pad; And
More than the 3rd Connection Element, each of said more than the 3rd Connection Element is connected to another with of said more than first chip bonding pad.
2. lead frame according to claim 1 is characterized in that, each of said more than the 3rd Connection Element connects two adjacent chip bonding pads.
3. lead frame according to claim 1 is characterized in that, each of said more than first chip bonding pad comprises the protuberance that is positioned at said more than second relative ends that go between.
4. lead frame according to claim 3 is characterized in that, each of said more than the 3rd Connection Element is connected to another chip bonding pad at said protuberance with a chip bonding pad.
5. lead frame according to claim 1 is characterized in that, each of said more than the 3rd Connection Element is one with two chip bonding pads that are connected.
6. lead frame according to claim 1 is characterized in that, said lead frame also comprises the strip component that is connected to said more than second lead-in wires.
7. a lead frame that is used for discrete package comprises according to each described lead frame among the claim 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120383653 CN202423265U (en) | 2011-09-27 | 2011-09-27 | Lead wire framework and lead wire framework for discrete packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120383653 CN202423265U (en) | 2011-09-27 | 2011-09-27 | Lead wire framework and lead wire framework for discrete packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202423265U true CN202423265U (en) | 2012-09-05 |
Family
ID=46747997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120383653 Expired - Fee Related CN202423265U (en) | 2011-09-27 | 2011-09-27 | Lead wire framework and lead wire framework for discrete packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202423265U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103021991A (en) * | 2011-09-27 | 2013-04-03 | 意法半导体制造(深圳)有限公司 | Lead frame and encapsulation method |
-
2011
- 2011-09-27 CN CN 201120383653 patent/CN202423265U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103021991A (en) * | 2011-09-27 | 2013-04-03 | 意法半导体制造(深圳)有限公司 | Lead frame and encapsulation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ST SEMICONDUCTOR DESIGN AND APPLICATION CO., LTD. Free format text: FORMER OWNER: STMICROELECTRONICS MANUFACTURING (SHENZHEN) CO., LTD. Effective date: 20140801 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518116 SHENZHEN, GUANGDONG PROVINCE TO: 518057 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140801 Address after: 518057, a SKYWORTH building, South Zone, Nanshan District hi tech Zone, Shenzhen, Guangdong Patentee after: ST Microelectronics Research Development (Shenzhen) Co.,Ltd. Patentee after: ST Microelectronics SRL Address before: No. 12 Longgang District of Shenzhen City, Guangdong province 518116 Baolong Industrial City hi tech Avenue Patentee before: STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO.,LTD Patentee before: ST Microelectronics SRL |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20150927 |
|
| EXPY | Termination of patent right or utility model |