CN1023853C - Ultraviolet enhanced inversion layer type photodiode - Google Patents
Ultraviolet enhanced inversion layer type photodiode Download PDFInfo
- Publication number
- CN1023853C CN1023853C CN 90100356 CN90100356A CN1023853C CN 1023853 C CN1023853 C CN 1023853C CN 90100356 CN90100356 CN 90100356 CN 90100356 A CN90100356 A CN 90100356A CN 1023853 C CN1023853 C CN 1023853C
- Authority
- CN
- China
- Prior art keywords
- inversion layer
- district
- layer type
- type photodiode
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
An improved ultraviolet-enhanced inversion layer type photodiode is prepared by combining an inversion layer structure with N+The diffusion ring combines the structures that the leakage current outside the working area is led away and does not enter a current loop of the working area, so that the ultraviolet enhancement effect is good, the leakage current is small, the breakdown voltage is high, the performance is stable, the manufacturing process is simple and convenient, and the yield is high.
Description
The invention belongs to the structure of optical semiconductor sensing device.
For surveying ultraviolet light, existing polytype silicon photo-detector is as Schottky barrier type, shallow diffused junction type, transoid stratotype, N
+-N-P type, shallow arsenic diffusion type or the like.Transoid stratotype device is to make like this: heat growth layer of silicon dioxide film on P type silicon chip, utilize in silicon dioxide-system on silicon, the induction effect that has fixed positive charge in the thin layer scope near the surface in the silicon dioxide layer, inducing the negative electrical charge of equivalent at P type silicon face, only is the inversion layer of tens dusts to the hundreds of dust and form thickness.On the regional area of this inversion layer (being N type district), make strip or point-like N again with the method that expands N type impurity
+The district is as the extraction electrode of inversion layer (being N type district).And make ohmic contact in the p type island region territory, as the extraction electrode of p type island region.Thereby make a photodiode.But because the zone beyond the service area also can form inversion layer, and extends to the silicon chip border always, breakdown potential is forced down so above-mentioned device has, reverse leakage current is big, shortcomings such as poor reliability.
In order to overcome this shortcoming, before the present invention, people adopted following two class ways.One class way is, beyond the service area, the diffusion of high concentration p type impurity is implemented on the surface of P type substrate, though making has positive charge to exist, and can not induce inversion layer in addition in the service area, another kind of way is, beyond the service area, remove and contain the many silicon dioxide layers of positive charge, make one deck again and contain positive charge silicon dioxide layer seldom, thereby make and not generate inversion layer beyond can be in the service area.Practice shows, implements above-mentioned way, and technology is more tired, and effect repeatability is relatively poor, and performance is not quite stable.
Purpose of the present invention is that the structure to transoid stratotype silicon photo-detector makes improvements, and specifically, is also to have inversion layer beyond allowing the service area, but makes the existence of this inversion layer, does not influence the work of service area.
Task of the present invention is finished in the following manner: on the limit, service area, form an annular strip N around the sealing of service area by diffusion N type impurity
+ 1The district, as the extraction electrode of service area, the zone that this ring is enclosed is the service area, at N
+ 1Beyond the ring, form one by diffusion N type impurity again and surround N
+ 1The ring, but not with N
+ 1The annular strip N of the sealing that ring is connected
+ 2The district.During use, P type substrate connects power cathode, N
+ 1Receive positive source, N again by load resistance
+ 2The district then directly links to each other with positive source.Under this operating position, N
+ 1District and N
+ 2Zone between the district will present high impedance, service area and N
+ 2Nonclient area beyond the district is kept apart, and the leakage current of nonclient area can not enter the service area current circuit.Thereby, both made the service area that extremely shallow induced junction is arranged, little leakage current and high stability are arranged again.And it is simple for production.
Accompanying drawing 1 is the front view of tube core structure.
Accompanying drawing 2 is profiles of tube core structure.
Embodiment.Adopting resistivity is that the above P type silicon single crystal of 1 ohmcm is as substrate.Routinely planar technique polish, thermal growth oxide layer, about 4000 dusts of thickness make the N as accompanying drawing 1 by lithography
+ 1And N
2And N
+ 2The district carves fairlead, evaporation of aluminum, photoetching, formation N then
+ 1District, N
+ 2District and P district bottom surface ohmic contact have just been finished die making.Again with the tube core sintering on base, and respectively from N
+ 1District, N
+ 2Totally three lead-out wires are drawn in district and bottom surface P district, put on the pipe cap of the good optical transmission window of ultraviolet light performance at last.
Claims (1)
1, a kind of ultraviolet strengthens transoid stratotype photodiode, heat growth layer of silicon dioxide film on P type silicon chip, with the silicon chip of this film with one side on annular strip N is set
+ 1The district is characterized in that, an encirclement N is being set
+ 1Ring, but not in N
+ 1The closed ring strip N that ring connects
+ 2The district.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 90100356 CN1023853C (en) | 1990-01-20 | 1990-01-20 | Ultraviolet enhanced inversion layer type photodiode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 90100356 CN1023853C (en) | 1990-01-20 | 1990-01-20 | Ultraviolet enhanced inversion layer type photodiode |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1053512A CN1053512A (en) | 1991-07-31 |
CN1023853C true CN1023853C (en) | 1994-02-16 |
Family
ID=4876618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 90100356 Expired - Fee Related CN1023853C (en) | 1990-01-20 | 1990-01-20 | Ultraviolet enhanced inversion layer type photodiode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1023853C (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI127794B (en) * | 2017-02-15 | 2019-02-28 | Aalto Korkeakoulusaeaetioe | Semiconductor structures and their preparation |
-
1990
- 1990-01-20 CN CN 90100356 patent/CN1023853C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1053512A (en) | 1991-07-31 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |