CN102330900A - Light source module - Google Patents

Abstract

The present invention relates to semiconductor packaging technologies, and in particular, to a light source module. The light source module comprises an LED wafer and a heat dissipation column, the heat dissipation column is arranged in a glue shell, the heat dissipation column is provided with an upper end face and a lower end face, the LED wafer is arranged on the upper end face of the heat dissipation column, the glue shell is provided with an electrode, the upper end of the electrode is close to the LED wafer, the lower end of the electrode is arranged on the lower surface of the glue shell, the LED wafer is electrically connected with the upper end of the electrode, the light source module further comprises a circuit board and a second heat dissipation column, the circuit board is provided with a through hole, the lower end face of the heat dissipation column is arranged in a penetrating mode through the through hole, the second heat. The invention provides a thermoelectric separated light source module.

Description

A light source module

technical field

The invention relates to semiconductor packaging technology, in particular to a light source module.

Background technique

LED lights have the characteristics of long life and power saving, and are more and more widely used in the field of lighting.

In the prior art, most of the LED packaging modules adopt the aluminum substrate technology, and the aluminum substrate is not only a circuit board but also a heat dissipation plate. For example, a LED light source module disclosed in Chinese patent document CN201448627U on May 5, 2010, includes an aluminum substrate and a single particle LED chip arranged on the aluminum substrate, and the LED light source module is evenly arranged on the Single-particle LED chips on the aluminum substrate are packaged into a sheet-like whole. The light-transmitting package includes a four-sided plastic frame. The bottom surface of the opening of the four-sided plastic frame is placed on the aluminum substrate, and the single-particle LED chips evenly arranged on the aluminum substrate are covered in the frame. The top surface of the opening of the four-sided plastic frame is sealed by an epoxy resin layer. . In order to facilitate heat dissipation, there is a heat conduction groove on the aluminum substrate to conduct the heat of the LED. The integrated light source module is easy to install in lighting fixtures and has a wide range of applications. The high-power LED module light source can satisfy the power from 1W to 90W, and the light emitted by it can be concentrated to form a certain direction of illumination, and the illumination uniformity is good, which can avoid the formation of spots, black shadows and double images on the illuminated surface.

Like the aforementioned patented technology, the heat dissipation of the aluminum substrate is limited by the mounting structure, the thermal interference between adjacent chips is serious, and the actual heat dissipation effect is not good. On the other hand, the use of aluminum substrates to lay out circuits generally only goes through a single layer, and the cost is very high.

Contents of the invention

The purpose of the present invention is to overcome the disadvantages of the above-mentioned prior art and provide a thermoelectric separation light source module.

The purpose of the present invention can be achieved through the following technical solutions:

A light source module, including an LED chip, is characterized in that: it also includes a heat dissipation column, the heat dissipation column is arranged in a plastic shell, the heat dissipation column has an upper end surface and a lower end surface, the LED chip is arranged on the upper end surface of the heat dissipation column, and the plastic shell has electrodes, The upper end of the electrode is set close to the LED chip, the lower end of the electrode is set on the lower surface of the plastic shell, and the LED chip is electrically connected to the upper end of the electrode. The light source module also includes a circuit board and a second heat dissipation column. The circuit board has a through hole. The lower end surface is pierced through the through hole, and is butted with the second heat dissipation column to form a thermal connection, and the lower end of the electrode is electrically connected to the circuit board.

The light source module is characterized in that: the second heat dissipation column also forms a heat conduction connection with the heat dissipation component.

The light source module is characterized in that: the heat conduction component is a heat dissipation ring sleeved on the second heat dissipation column, or when there are multiple light source modules, each second heat dissipation column is replaced by a heat dissipation plate or a heat dissipation ring.

The light source module is characterized in that: the plastic case further includes a sealant, the sealant is arranged on the light emitting surface of the LED chip, and the sealant contains fluorescent powder.

The light source module is characterized in that: the plastic shell also includes a sealing glue, the sealing glue is arranged on the light-emitting surface of the LED chip, the surface of the light-emitting side of the sealing glue has a thin film, and the thin film has a sandwich structure, and the interlayer is provided with Phosphor, the outer film that constitutes the interlayer has a pyramidal microstructure.

The light source module is characterized in that: the heat dissipation column has a stepped structure, and the upper end surface is smaller than the lower end surface.

The light source module is characterized in that: the heat dissipation column is made of metal heat conducting material.

The light source module is characterized in that: the heat dissipation column is graphite.

The light source module is characterized in that: the plastic shell also includes a sealing glue, the sealing glue is arranged on the light-emitting surface of the LED chip, the sealing glue contains fluorescent powder, the heat dissipation column has a stepped structure, and the upper end surface Smaller than the lower end surface, the heat dissipation column is a copper column.

The purpose of the present invention can also be achieved through the following technical master schemes:

A light source, comprising an LED illuminant, characterized in that it includes a circuit board and a heat conduction plate respectively arranged, the circuit board provides a power supply path for the LED illuminant, the LED illuminant passes through the circuit board through a heat dissipation column, and is connected to the heat conduction plate to form an LED The heat dissipation path of the illuminant, where the circuit board is a poor conductor of heat.

In the light source module of the present invention, the LED chip is arranged on the upper end surface of the heat dissipation column, the circuit board has a through hole, the lower end surface of the heat dissipation column is penetrated through the through hole, and is connected with the second heat dissipation column to form a heat conduction connection. The lower end of the electrode is electrically connected with the circuit board. Compared with the aluminum substrate solution in the prior art, the method of separating the heat path and the electric path is adopted, and the heat dissipation is direct, and the circuit board can use an ordinary PCB board, which is easy to be made into a multi-layer board and has low cost.

Description of drawings

Fig. 1 is a schematic diagram of a first embodiment of the present invention.

Detailed ways

The present invention will be described in further detail below in conjunction with the accompanying drawings.

Referring to FIG. 1 , the first embodiment of the present invention is a light source module, which includes an LED chip 101 and a heat dissipation column 102. The heat dissipation column 102 is arranged in a plastic shell 106. The heat dissipation column 102 has an upper end surface and a lower end surface. The LED chip 101 is arranged on the upper surface of the heat dissipation column 102, the plastic shell 106 has an electrode 107, the upper end of the electrode 107 is arranged close to the LED chip 101, the lower end of the electrode 107 is set on the lower surface of the plastic shell 106, and the LED chip 101 is connected to the electrode 107 through a gold wire 108 The upper end of the light source module also includes a circuit board 104 and a second heat dissipation column 103, the circuit board 104 has a through hole, the lower end surface of the heat dissipation column 102 penetrates the through hole, and docks with the second heat dissipation column 103 A thermal connection is formed, and the lower end of the electrode 107 is connected to the circuit 105 on the circuit board. The second heat dissipation column 103 also forms a heat conduction connection with the heat dissipation component 110 . In this embodiment, the heat conduction component is a heat dissipation ring sleeved on the second heat dissipation column 103; as an alternative to combined application, when there are multiple light source modules, each second heat dissipation column 103 can use one Heat dissipation plate (when each light source module is straight-shaped) or heat dissipation ring (when each light source module is distributed in a circular shape) instead. The plastic case 106 also includes a sealant 109 disposed on the light emitting surface of the LED chip 101 , and the sealant contains fluorescent powder. As a simple variant of this embodiment, the heat dissipation column 102 may also have a stepped structure, and the upper end surface is smaller than the lower end surface. In this embodiment, the heat dissipation column 102 is made of metal heat conducting material, such as copper. As an alternative, the heat dissipation column 102 may also be made of graphite. The connection between the heat dissipation heat column 102 and the second heat dissipation column 103 and the connection between the heat dissipation heat column 102 and the LED chip 101 can both adopt nano-bonding technology, or AuSn eutectic welding. When the heat dissipation column 102 is made of graphite material, Ni or Ag is vacuum evaporated on the end surface of the graphite heat dissipation column 102 before bonding or welding.

The second embodiment of the present invention is also a light source module. The difference from the first embodiment of the present invention lies in the arrangement of the fluorescent powder. Sandwich structure, fluorescent powder is arranged in the interlayer, and the outer film constituting the interlayer has a pyramidal microscopic structure.

Claims (10)

1. A light source module, comprising an LED chip, is characterized in that: it also includes a cooling column, the cooling column is arranged in a plastic shell, the cooling column has an upper end surface and a lower end surface, the LED chip is arranged on the upper end surface of the cooling column, and the plastic casing has electrode, the upper end of the electrode is set close to the LED chip, the lower end of the electrode is set on the lower surface of the plastic shell, the LED chip is electrically connected to the upper end of the electrode, the light source module also includes a circuit board and a second heat dissipation column, the circuit board has a through hole, and the heat dissipation The lower end surface of the post is pierced through the through hole, and is butted with the second heat dissipation post to form a thermal connection, and the lower end of the electrode is electrically connected to the circuit board. 2. The light source module according to claim 1, characterized in that: the second heat dissipation column also forms a heat conduction connection with the heat dissipation component. 3. The light source module according to claim 2, characterized in that: the heat conduction member is a heat dissipation ring sleeved on the second heat dissipation column, or when there are multiple light source modules, each second heat dissipation column uses a heat dissipation ring plate or heatsink instead. 4 . The light source module according to claim 1 , wherein the plastic case further comprises a sealant disposed on the light-emitting surface of the LED chip, and the sealant contains fluorescent powder. 5. The light source module according to claim 1, wherein the plastic case further includes a sealant, the sealant is arranged on the light-emitting surface of the LED chip, and the surface of the light-emitting side of the sealant has a thin film, the sealant The thin film has a sandwich structure, phosphor powder is arranged in the sandwich, and the outer film constituting the sandwich has a pyramidal microscopic structure. 6. The light source module according to claim 1, wherein the heat dissipation column has a stepped structure, and the upper end surface is smaller than the lower end surface. 7. The light source module according to claim 1 or 6, wherein the heat dissipation column is made of metal heat conducting material. 8. The light source module according to claim 1 or 6, wherein the heat dissipation column is graphite. 9. The light source module according to claim 1, wherein the plastic case further includes a sealant, the sealant is arranged on the light-emitting surface of the LED chip, the sealant contains fluorescent powder, and the heat dissipation column has Stepped structure, and the upper end surface is smaller than the lower end surface, and the heat dissipation column is a copper column. 10. A light source, comprising an LED illuminant, characterized in that: it includes a circuit board and a heat conduction plate arranged separately, the circuit board provides a power supply path for the LED illuminant, and the LED illuminant passes through the circuit board through a heat dissipation column, and is connected to the heat conduction plate It constitutes the heat dissipation path of the LED illuminant, and the circuit board is a poor conductor of heat.

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