KR20140118466A - Light emitting device and lighting device including the same - Google Patents

Abstract

A light emitting device includes a substrate, an LED mounted on one surface of the substrate, a phosphor layer formed on one surface of the substrate to cover the LED, and a heat dissipation hole formed in the substrate and spaced apart from the outside of the phosphor layer, And a lighting apparatus including the light emitting device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device and a lighting apparatus including the light emitting device. More particularly, the present invention relates to a light emitting device and a lighting apparatus including the light emitting device.

A light emitting device (hereinafter, referred to as 'LED') is a semiconductor device used as a light source and emitting light when an electric current flows. Due to its long lifetime, low power consumption, fast response time, and excellent initial driving characteristics, the LED has been widely applied to lighting devices, automobile headlights and interior lights, electric sign boards, backlights of display devices, .

In recent years, as demand for high-power, high-brightness LEDs has increased, studies for improving the performance and reliability of light emitting devices including LEDs have been actively conducted.

In order to improve the performance of LED products, it is necessary to simultaneously extract LEDs with excellent light efficiency, efficiently extract light, and provide LED light source modules having excellent color purity and uniform characteristics among products.

The LED may be fabricated as an LED package by mounting an LED chip on a lead frame and a ceramic substrate and then applying a phosphor suitable for a desired application and applying the LED to form a lens. Thereafter, the LED package cut in a unit package is mounted on a PCB (Printed Circuit Board) to be modularized. However, the structure of the light emitting device has a limitation in downsizing the module.

Therefore, recently, a COB (Chip On Board) type light emitting device in which LEDs are directly mounted on a substrate without being manufactured in the form of a package is also produced. In the COB method, a wire bonding for electrical connection between the LED and the module substrate is not used, and a flip chip on module (FCOM) in which an LED is mounted on a substrate in the form of a flip chip can be realized. As described above, the light-emitting device of the FCOM structure can mount LEDs on the substrate at a high density compared to the light-emitting device of the LED package structure, thereby having an advantage that the module size can be reduced.

On the other hand, it is very important that the above-described light emitting device has an efficient heat radiation performance with respect to the heat generated from the LED in relation to the lifetime of the light emitting device or the lighting device including the same.

In a related art related to a light emitting device including an LED, a structure in which a heat dissipation hole is formed around a region on a substrate on which an LED is mounted is proposed as means for improving the heat dissipation efficiency of the light emitting device. In this structure, the heat generated from the LED is effectively discharged through the heat dissipation holes, thereby enhancing heat dissipation efficiency. Further, the heat dissipation efficiency is further improved by filling the heat dissipation hole with a material having a high thermal conductivity.

However, a conventional light emitting device in which a heat dissipating hole is formed on a substrate has a problem that optical characteristics are deteriorated. Specifically, the surface of the substrate on which the heat dissipation hole is formed is deformed into a curved surface without being maintained in an even horizontal plane in the course of the heat dissipation hole forming process. Such a curved surface may be formed to extend not only to the heat dissipating hole but also to the substrate portion around the heat dissipating hole. The light emitting device may further include a phosphor layer formed on the substrate to cover the LED and a lens portion disposed on the substrate so as to cover the phosphor layer, wherein the phosphor layer functions to realize white light, Function can be performed. In this case, among the light emitted from the LED, the light directed to the bottom surface of the substrate around the LED through the phosphor layer can be reflected to the bottom surface of the substrate when the bottom surface of the substrate to reach is a uniform horizontal surface, However, when a heat dissipating hole is formed on the bottom surface of the substrate around the LED, the bottom surface portion of the substrate on which the heat dissipating hole is formed can be deformed into a curved surface, and light directed toward the curved surface is reflected It may not be absorbed by the phosphor layer and may not move toward the lens portion. Therefore, the conventional light emitting device has a problem that dark portions are generated in the light emitting region.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art and provides a light emitting device including a substrate having a heat dissipating hole formed therein to improve heat dissipation efficiency, .

The present invention also provides a light emitting device and a lighting apparatus including the light emitting device, wherein the heat dissipating hole formed on the substrate has a diameter and an arrangement structure corresponding to the heat emitted from the LED.

A light emitting device according to an embodiment of the present invention includes a printed circuit board, an LED mounted on one surface of the substrate, a phosphor layer formed on one surface of the substrate to cover the LED, And at least one heat dissipating hole spaced apart from the outside of the heat dissipating unit.

The light emitting device according to an embodiment of the present invention may further include a lens unit disposed on one surface of the substrate so as to cover the phosphor layer and having a space for accommodating the phosphor layer on a side facing one side of the substrate .

In the light emitting device according to an embodiment of the present invention, the inner surface of the space portion may be spaced apart from the outer surface of the phosphor layer.

In the light emitting device according to an embodiment of the present invention, the heat dissipation hole may be formed in the substrate region not facing the space portion.

In the light emitting device according to an embodiment of the present invention, the heat dissipation hole may be formed near the outermost portion of the substrate portion facing the space portion.

In the light emitting device according to an embodiment of the present invention, the distance between the heat dissipation holes may be longer than the height of the phosphor layer with respect to one surface of the substrate.

In the light emitting device according to an embodiment of the present invention, the spacing distance of the heat dissipation hole may be a distance selected from a range of 1 to 3 times the height of the phosphor layer.

A printed circuit board according to an embodiment of the present invention includes a mounting region in which semiconductor devices are arranged, a first electrode layer and a second electrode layer spaced apart from each other to be electrically insulated from each other in the mounting region, At least one first heat-dissipating hole formed at a distance from the second electrode layer, and at least one second heat-dissipating hole spaced apart from the outer side of the second electrode layer by a second distance.

In the printed circuit board according to an embodiment of the present invention, the first heat dissipating hole and the second heat dissipating hole may be formed outside the mounting region.

In the printed circuit board according to an embodiment of the present invention, the first electrode layer and the second electrode layer have the same area, and the first heat dissipating hole and the second heat dissipating hole may have the same diameter.

In the printed circuit board according to an embodiment of the present invention, the first electrode layer is formed to have a larger area than the second electrode layer, and the first heat dissipating hole is formed to have a larger diameter than the second heat dissipating hole .

In the printed circuit board according to an embodiment of the present invention, the first distance and the second distance may be the same.

The printed circuit board according to an embodiment of the present invention may include at least one third heat dissipating hole spaced apart from the outside of the first electrode layer by a third distance that is longer than the first distance, And a fourth distance that is longer than the second distance from the first distance and the second distance. In the printed circuit board according to an embodiment of the present invention, 4 distances can be the same.

In the printed circuit board according to an embodiment of the present invention, the third heat dissipating hole may have a smaller diameter than the first heat dissipating hole.

In the printed circuit board according to an embodiment of the present invention, the fourth heat-dissipating hole may have a smaller diameter than the second heat-dissipating hole.

In the printed circuit board according to an embodiment of the present invention, the first heat-dissipating holes and the third heat-dissipating holes are the same in diameter, and the plurality of the first heat-dissipating-hole- It may be shorter than the distance.

In the printed circuit board according to an embodiment of the present invention, the second heat dissipating holes and the fourth heat dissipating holes are the same in diameter, and the plurality of second heat dissipating holes are spaced apart from the plurality of fourth heat dissipating holes It may be shorter than the distance.

A printed circuit board according to a different embodiment of the present invention includes a mounting region where semiconductor elements are arranged, an electrode layer formed outside the mounting region, a first heat dissipating hole formed closer to the mounting region than the electrode layer, And a second heat dissipation hole formed close to the electrode layer.

In the printed circuit board according to another embodiment of the present invention, the electrode layer may be electrically connected to the semiconductor element by wire bonding.

In the printed circuit board according to another embodiment of the present invention, the first heat radiation hole may have a diameter larger than that of the second heat radiation hole.

A lighting apparatus according to another embodiment of the present invention may include a light emitting device or a printed circuit board according to the above-described embodiment.

According to the present invention, since the heat dissipating holes formed on the substrate are formed to be spaced apart from the phosphor layer by a predetermined distance, the bottom surface of the substrate having a uniform horizontal surface which is not bent is present between the phosphor layer and the heat dissipating hole, Light is reflected on the even horizontal surface and stably moves to the lens portion. As a result, the light emitting device can obtain the effect that the dark portion is not generated in the light emitting region.

In addition, the heat dissipation holes are formed in a diameter corresponding to the heat emitted from the LEDs or have an arrangement structure, thereby further improving the heat radiation efficiency of the printed circuit board.

1 is a side view of a light emitting device according to a first embodiment of the present invention;
Fig. 2 is a front view of the substrate and the LED shown in Fig. 1; Fig.
3 is a cross-sectional view of the light emitting device shown in Fig.
4 is a cross-sectional view of a light emitting device according to a second embodiment of the present invention;
5 to 8 are front views illustrating a printed circuit board according to an embodiment of the present invention.
9 is a front view of a printed circuit board according to another embodiment of the present invention;

Hereinafter, a light emitting device according to an embodiment of the present invention and a printed circuit board included therein will be described in detail with reference to the accompanying drawings.

Fig. 1 is a side view of a light emitting device according to a first embodiment of the present invention, Fig. 2 is a front view showing the substrate and LED shown in Fig. 1, and Fig. 3 is a sectional view of the light emitting device shown in Fig.

As shown in the figure, the light emitting device according to the first embodiment of the present invention includes a printed circuit board 10, an LED 20 mounted on one side of the substrate 10, The phosphor layer 30 may be formed on one surface of the phosphor layer 10 and at least one or more heat holes 11 formed in the substrate 10 and spaced apart from the outer side of the phosphor layer 30.

An electrode layer (not shown) electrically connected to the LED 20 may be formed on the substrate 10 so that the LED 20 may be mounted on the substrate 10 and the LED 20 may be supplied with power. The substrate 10 may be made of a metal having excellent heat radiation characteristics, or silicon or ceramic.

A semiconductor element, for example, an LED 20 is mounted on one surface of the substrate 10. The LED 20 may be an ultraviolet LED or a blue LED. The LED 20 may be manufactured as a flip chip and mounted on the substrate 10 by a flip chip bonding method. Solder may be used for flip chip bonding, or a conductive adhesive may be used. Or the LED 20 may be mounted on the substrate 10 by a die bonding method.

If the LED 20 is implemented as a FCOM that is mounted on the substrate 10 in such a flip chip form, the LED 20 can be mounted on the substrate 10 at a high density, thereby reducing the size of the light emitting device have.

The phosphor layer 30 is formed on one surface of the substrate 10 so as to cover the LED 20. The light emitted from the LED 20 passes through the phosphor layer 30 to the lens unit 40 to be described later. The phosphor layer 30 may include a host material and an active material, for example, a cerium (Ce) active material in a host material of yttrium aluminum garnet (YAG). Alternatively, the phosphor layer 30 may use an europium (Eu) active material as a silicate host material. However, the present invention is not limited to these materials.

The phosphor layer 30 may function to realize light emitted from the light emitting device as white light. For example, when the LED 20 is a blue LED, the blue light emitted from the blue LED is partially absorbed by the phosphor of the phosphor layer 30 to excite the phosphor, and the excited phosphor emits light of a wide wavelength band of the yellow system. Here, white light is realized as blue light not absorbed by some phosphors is added. When the LED 20 is an ultraviolet LED, white light can be realized by using a three primary color phosphor.

The phosphor layer 30 may be formed to have a uniform thickness outside the LED 20 so that the light passing through the phosphor layer 30 can be uniformly converted. May be uniformly dispersed.

The substrate 10 may be provided with a heat dissipating hole 11 spaced from the outer side of the phosphor layer 30. [ The heat dissipating holes 11 may be formed as a plurality of spaced apart from each other as shown in FIG. The heat dissipating hole (11) is formed to penetrate through the substrate (10). By forming the heat dissipating holes 11, heat generated from the LEDs 20 can be effectively dissipated through the heat dissipating holes 11. The heat dissipating hole 11 may be filled with a material having a high thermal conductivity so that the heat generated from the LED 20 can be dissipated more effectively.

The present embodiment is characterized in that a lens portion 30 having a space portion 41 in which a phosphor layer 30 is accommodated is formed on one surface of a substrate 10 so as to cover the phosphor layer 30, (40). At this time, the inner surface of the space portion 41 and the outer surface of the phosphor layer 30 may be spaced from each other, and the space therebetween may be filled with air. The space filled with air can perform an insulating function to minimize the heat that is emitted from the LED 20 and transmitted to the lens unit 40. The performance of the function can prevent the lens unit 40 from being damaged by heat . The lens unit 40 may function to protect the LED 20 from the external environment and may include a light diffusing material so that light incident through the phosphor layer 30 is diffused and emitted to the outside Can be performed.

On the other hand, the surface on which the heat dissipating holes 11 of the substrate 10 are formed can be deformed into a curved surface without maintaining a uniform horizontal surface in the process of forming the heat dissipating holes 11. [ The light directed toward the bottom surface of the substrate 10 emitted from the LED 20 and passing through the phosphor layer 30 is emitted from the bottom surface of the substrate 10 deformed into the curved surface due to the formation of the heat dissipating hole 11 If it is reflected, it can not be directed to the lens portion 40, and dark portions can be generated in the light emitting region. All or most of the light emitted from the LED 20 and passing through the fluorescent layer 30 toward the bottom surface of the substrate 10 is reflected on the bottom surface of the substrate 10 having an even horizontal surface, It is necessary for the substrate 10 within the predetermined distance from the outside of the phosphor layer 30 to be made of an even horizontal surface on which the heat dissipating holes 11 are not formed have. The light emitting device according to the present embodiment has a spacing d of the heat dissipating holes 11 spaced apart from the outside of the phosphor layer 30 in order to satisfy such a requirement that the distance d between the phosphor layers 30) of the first and second hinge portions 32a, 32b. As a result of the experiment, if the distance d is equal to or shorter than the height h of the phosphor layer 30, the dark portion is still confirmed, and if the height h is longer than the height h of the phosphor layer 30, I could. However, when the spacing distance d is more than three times the height h of the phosphor layer 30, there is a problem that the dark portion is not confirmed but the heat dissipation performance is remarkably deteriorated. Therefore, it is preferable that the spacing distance d is set to a distance of more than 1 time and 3 times the height h of the phosphor layer 30. It is most preferable that the separation distance d is set to a distance of twice the height h of the phosphor layer 30 in consideration of both the heat radiation performance and the dark area reduction effect.

Hereinafter, a light emitting device according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the contents overlapping with the description of the first embodiment will be omitted in the following. 4 is a cross-sectional view of a light emitting device according to a second embodiment of the present invention.

As shown in the figure, the light emitting device according to the second embodiment of the present invention includes a substrate 10, an LED 20 mounted on one surface of the substrate 10, an LED (light emitting diode) A phosphor layer 30 formed on one surface of the substrate 10 so as to cover the phosphor layer 30 and a phosphor layer 30 disposed on one surface of the substrate 10 so as to cover the phosphor layer 30, A lens unit 40 having a space 41 in which the phosphor layer 30 is accommodated and a heat dissipation hole 11 formed in the substrate 10 and spaced apart from the outside of the phosphor layer 30 .

However, in this embodiment, the heat dissipating hole 11 is formed at a portion of the substrate 10 which does not face the space portion 41, unlike the heat dissipating hole 11 of the first embodiment. The heat dissipation hole 11 is not formed in the remaining portion a of the substrate 10 facing the space portion 41 except for the portion where the LED 20 and the phosphor layer 30 are formed. The light directed to the bottom surface of the substrate 10 after passing through the phosphor layer 30 can be entirely reflected on the bottom surface a having an even horizontal surface and the entire reflected light can be stably irradiated onto the lens portion 40, . ≪ / RTI >

It is preferable that the heat dissipating hole 11 is formed near the outermost portion of the substrate 10 facing the space portion 41 while being the portion of the substrate 10 which does not face the space portion 41. [ The heat dissipation performance may be deteriorated as the heat dissipating hole 11 is separated from the LED 20. Therefore, the heat dissipating hole needs to be formed as close as possible to the LED 20 within a range that the dark portion is not formed.

Hereinafter, a printed circuit board according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, duplicate description of the light emitting device according to the first and second embodiments will be omitted below. In the following description, "the heat dissipating hole is spaced apart from the outside of the electrode layer by a first, second, third, or fourth distance ", the first, second, third, The spacing distance is the 'shortest distance' from the heat dissipating hole to the electrode layer. 5 to 8 are front views showing a printed circuit board according to an embodiment of the present invention.

The printed circuit board 100 according to an embodiment of the present invention includes a mounting region 100a in which semiconductor elements are arranged; A first electrode layer 110 and a second electrode layer 120 spaced apart from each other to be electrically insulated in the mounting region; At least one first heat dissipating hole 101 spaced apart from the outer side of the first electrode layer 110 by a first distance D1 and at least one second heat dissipating hole 101 spaced apart from the outer side of the second electrode layer 120 by a second distance D2 And at least one second heat-dissipating hole 102 formed to be formed. A mounting region 100a on which a semiconductor element (for example, a flip chip type LED (not shown)) is mounted is provided on one surface of the substrate 100. [ The first electrode layer 110 and the second electrode layer 120 are formed in the mounting region 100a. In the illustrated embodiment, the first electrode layer 110 and the second electrode layer 120 are illustrated as having a rectangular shape, but the present invention is not limited thereto. The first electrode layer 110 and the second electrode layer 120 are electrically connected to electrodes formed on the LEDs so that external power can be supplied to the LEDs. The first electrode layer 110 may be connected to, for example, a P-type electrode among the electrodes formed on the LED. In this case, the second electrode layer 120 may be connected to the N-type electrode formed on the LED. The areas of the first electrode layer 110 and the second electrode layer 120 may be equal to each other, but they may be different. For example, as shown in FIGS. 6 to 8, the area of the first electrode layer 110 connected to the P-type electrode may be larger than the area of the second electrode layer 120 connected to the N-type electrode.

The first heat dissipation hole 101 formed around the first electrode layer 110 may be formed at a portion of the substrate 100 spaced apart from the outer side of the first electrode layer 110 by a first distance D1. The second heat dissipating holes 102 formed in the periphery of the second electrode layer 120 may be formed at a portion of the substrate 100 spaced apart from the outside of the second electrode layer 120 by a second distance D2. At this time, the first heat dissipating hole 101 and the second heat dissipating hole 102 may be formed outside the mounting region 100a. The first distance D1 is a distance between the first heat dissipating hole 101 and the second heat dissipating hole 101 so that the entire area including the LED mounting area 100a and the heat dissipating hole forming area can be minimized on the substrate 100. [ And the second distance D2, which is the distance between the first distance D2 and the second distance D2.

When the areas of the first electrode layer 110 and the second electrode layer 120 are the same as shown in FIG. 5, the diameters of the first heat dissipating hole 101 and the second heat dissipating hole 102 may be the same. The heat emitted from the LEDs is transmitted to the substrate 100 through the first electrode layer 110 and the second electrode layer 120 connected to the electrodes of the LEDs. The area of the first electrode layer 110 and the second electrode layer 120 And the heat transmitted through the first electrode layer 110 and the second electrode layer 120 are the same or substantially similar to each other, the diameters of the first heat dissipating hole 101 and the second heat dissipating hole 102 are the same . 6 and 7, when the area of the first electrode layer 110 is larger than the area of the second electrode layer 120, the area of the first electrode layer 110 is different from that of the second electrode layer 120, The diameter of the first heat dissipating hole 101 is larger than the diameter of the second heat dissipating hole 102 when the heat transmitted through the first electrode layer 110 is larger than the heat transmitted through the second electrode layer 120. [ It can be formed larger than that. The heat dissipation efficiency of the printed circuit board according to the present embodiment can be further improved by varying the surface area in the heat dissipating hole corresponding to the difference in heat transmitted from the LED.

The printed circuit board 100 according to the present embodiment has a third heat dissipation layer formed on a portion of the substrate 100 spaced apart from the outer side of the first electrode layer 110 by a third distance D3 longer than the first distance D1. And a fourth heat dissipation hole 104 formed in a portion of the substrate 100 that is spaced apart from the outer side of the second electrode layer 120 by a fourth distance D4 that is longer than the second distance D2 . Here, the third distance D3 and the fourth distance D4 may be the same distance, which is not longer than either one of the third distance D3 and the fourth distance D4.

The printed circuit board 100 according to this embodiment has the third heat dissipating hole 103 and the fourth heat dissipating hole 104 formed on the outer side of the first heat dissipating hole 101 and on the outer side of the second heat dissipating hole 102, ) Is further formed, so that the heat radiation efficiency can be further improved. At this time, the diameter of the third heat dissipating hole 103 may be smaller than that of the first heat dissipating hole 101. The diameter of the fourth heat-dissipating hole 104 may be smaller than that of the second heat-dissipating hole 102. That is, the diameters of the first heat dissipating hole 101 and the second heat dissipating hole 102 may be larger than the diameters of the third heat dissipating hole 103 and the fourth heat dissipating hole 104, respectively. This means that a heat dissipating hole having a relatively smaller distance between the heat dissipating holes around the electrode layer is formed so as to have a diameter larger than that of a relatively longer heat dissipating hole. This means that the heat transfer surface area of the heat dissipating hole, The heat radiation efficiency of the circuit board can be further improved.

Each of the first heat dissipating hole 101, the second heat dissipating hole 102, the third heat dissipating hole 103 and the fourth heat dissipating hole 104 has a first distance D1 , A second distance D2, a third distance D3, and a fourth distance D4, which are spaced apart from each other. 8, the first heat-dissipating hole 101 and the third heat-dissipating hole 103 have the same diameter, and the plurality of first heat-dissipating holes 101 are spaced apart from each other by a plurality of May be shorter than the distance D3 'between the third heat-dissipating holes 103. The second heat dissipating hole 102 and the fourth heat dissipating hole 104 are equal in diameter and the plurality of second heat dissipating holes 102 are spaced apart from each other by a plurality of fourth heat dissipating holes 104. [ May be shorter than the liver separation distance D4 '. The distances D 1 'and D 2' between the first heat dissipating holes 101 and the second heat dissipating holes 102 are set to be equal to the distance between the third heat dissipating holes 103 and the fourth heat dissipating holes 104 The first heat dissipating hole 101 and the second heat dissipating hole 102 are formed to be shorter than the third heat dissipating hole 103 in the same length on the substrate 100 as shown in FIG. The heat radiation surface area by the first heat dissipating hole 101 and the second heat dissipating hole 102 is larger than the third heat dissipating hole 103 and the fourth heat dissipating hole 102. [ And becomes wider than that by the hole 104. [

Hereinafter, a printed circuit board according to another embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, duplicate description of the light emitting device according to the first and second embodiments and the printed circuit board according to the embodiment will be omitted in the following. 9 is a front view showing a printed circuit board according to another embodiment of the present invention.

The printed circuit board 100 according to another embodiment of the present invention includes a mounting region 100b in which semiconductor devices are disposed, an electrode layer 130 formed outside the mounting region 100b, A first heat dissipating hole 105 formed closer to the mounting region 100b than the mounting region 100b and a second heat dissipating hole 106 formed closer to the electrode layer 130 than the mounting region 100b. In this embodiment, the LED (not shown), which is a semiconductor element mounted in the mounting region 100b, may be a package type LED other than a flip chip type. An electrode layer 130 that can be electrically connected to the LED package by a wire bonding method may be formed around the mounting region 100b of the substrate 100. [

The heat emitted from the LED package is transferred to the mounting region 100b of the substrate 100 in contact with the LED package so that the first heat dissipating hole 105 formed around the mounting region 100b of the substrate 100 is electrically connected to the electrode layer 130 may be larger in diameter than the second heat-dissipating holes 106 formed in the periphery. In this embodiment, the diameter of the first heat dissipating hole 105 is formed to be larger than the diameter of the second heat dissipating hole 106 corresponding to the place where the heat transfer is concentrated in the structure in which the LED package is mounted, have.

Meanwhile, the lighting device according to an embodiment of the present invention may include the light emitting device or the printed circuit board described above.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious that the modification or the modification is possible by the person.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: printed circuit board
11: heat dissipation hole 20: LED
30: phosphor layer 40: lens part
41: space part 100: printed circuit board
100a, 100b: mounting area 101: first heat dissipating hole
102: second heat dissipating hole 103: third heat dissipating hole
104: fourth heat dissipating hole 105: first heat dissipating hole
106: second heat dissipating hole 110: first electrode layer
120: second electrode layer 130: electrode layer

Claims (24)

Printed circuit board;
An LED mounted on one surface of the substrate;
A phosphor layer formed on one surface of the substrate to cover the LED; And
And at least one heat dissipating hole formed in the substrate and spaced apart from the outside of the phosphor layer.
The method according to claim 1,
And a lens unit disposed on one side of the substrate to cover the phosphor layer and having a space for receiving the phosphor layer on a side facing one side of the substrate.
The method of claim 2,
And the inner surface of the space portion is spaced apart from the outer surface of the phosphor layer.
The method of claim 3,
And the heat dissipation hole is formed in the substrate region that does not face the space portion.
The method of claim 4,
Wherein the heat dissipation hole is formed near the outermost portion of the substrate portion facing the space portion.
The method according to claim 1,
Wherein a distance between the heat dissipation holes is longer than a height of the phosphor layer with respect to a surface of the substrate.
The method of claim 6,
And the spacing distance of the heat dissipation hole is a distance selected from a range of 1 to 3 times the height of the phosphor layer.
A lighting device comprising the light-emitting device according to any one of claims 1 to 7.
A mounting region in which semiconductor elements are arranged;
A first electrode layer and a second electrode layer spaced apart from each other to be electrically insulated in the mounting region;
At least one first heat dissipation hole spaced apart from the outer side of the first electrode layer by a first distance; And
And at least one second heat dissipation hole spaced apart from the outside of the second electrode layer by a second distance.
The method of claim 9,
Wherein the first heat-dissipating hole and the second heat-dissipating hole are formed outside the mounting region.
The method of claim 9,
Wherein the first electrode layer and the second electrode layer have the same area,
Wherein the first heat-dissipating hole and the second heat-dissipating hole have the same diameter.
The method of claim 9,
Wherein the first electrode layer is formed to have a larger area than the second electrode layer,
Wherein the first heat-dissipating hole is formed larger in diameter than the second heat-dissipating hole.
The method of claim 9,
Wherein the first distance and the second distance are the same.
The method of claim 9,
At least one third heat dissipation hole spaced apart from the outer side of the first electrode layer by a third distance that is longer than the first distance; And
And at least one fourth heat dissipating hole spaced apart from the outer side of the second electrode layer by a fourth distance that is longer than the second distance.
15. The method of claim 14,
Wherein the third distance and the fourth distance are the same.
15. The method of claim 14,
And the third heat-dissipating hole has a smaller diameter than the first heat-dissipating hole.
15. The method of claim 14,
And the fourth heat-dissipating hole has a smaller diameter than the second heat-dissipating hole.
15. The method of claim 14,
Wherein the first heat-dissipating hole and the third heat-dissipating hole have the same diameter,
Wherein a distance between the plurality of first heat dissipation holes is shorter than a distance between the plurality of third heat dissipation holes.
15. The method of claim 14,
The second heat-dissipating hole and the fourth heat-dissipating hole have the same diameter,
And the spacing distance between the plurality of second heat dissipation holes is shorter than the spacing distance between the plurality of fourth heat dissipation holes.
A lighting device comprising a printed circuit board according to any one of claims 9 to 19.
A mounting region in which semiconductor elements are arranged;
An electrode layer formed outside the mounting region;
A first heat dissipating hole formed closer to the mounting region than the electrode layer; And
And a second heat dissipating hole formed closer to the electrode layer than the mounting region.
23. The method of claim 21,
Wherein the electrode layer is electrically connected to the semiconductor element by wire bonding.
23. The method of claim 21,
Wherein the first heat-dissipating hole is larger in diameter than the second heat-dissipating hole.
A lighting device comprising a printed circuit board according to any one of claims 21 to 23.

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