CN102064156A - Polycrystalline type light-emitting diode packaging structure for generating quasi-circular light-emitting effect - Google Patents

Abstract

A polycrystalline type light emitting diode packaging structure for generating a quasi-circular light emitting effect comprises: the substrate unit is provided with a substrate body and a plurality of conductive circuits which are separated from each other by a preset distance and are arranged on the substrate body, wherein each conductive circuit is provided with a plurality of extension parts, and the extension parts of every two conductive circuits are selectively adjacent to each other and are mutually and alternately arranged; the light-emitting unit is provided with a plurality of light-emitting diode crystal grains which are selectively and electrically arranged on the substrate unit, and the light-emitting diode crystal grains are arranged into a round shape; the packaging unit is provided with a light-transmitting packaging colloid which is formed on the upper surface of the substrate unit to cover the light-emitting diode crystal grains. The invention can achieve the purposes of stable current and long service life.

Description

Polycrystalline light-emitting diode packaging structure for producing quasi-circular luminous effect

technical field

The invention relates to a packaging structure of a polycrystalline light emitting diode, in particular to a packaging structure of a polycrystalline light emitting diode for producing a quasi-circular light emitting effect.

Background technique

The invention of electric light can be said to have completely changed the way of life of all human beings. If we live without electric light, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age.

Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten filament lamps, and even the energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to recycle. Furthermore, traditional fluorescent lamps have poor color rendering, so pale light is not popular. In addition, due to the principle of light emission, the rapid flow of electrons in the diode of the lamp tube 120 times per second, it is easy to be unsteady when it is just turned on and the current is unstable. This phenomenon is generally considered to be the culprit of the high myopia rate in China, but this problem can be solved by modifying the lamp tube with a "high-frequency electronic ballast". The power consumption of traditional fluorescent lamps is further reduced by 20%, and because of the high-frequency instantaneous lighting, the output light waves are very stable, so there is almost no flicker, and when the power supply voltage changes or the lamp is at low temperature, flicker is less likely to occur. Helps protect eyesight. However, the ballasts of general energy-saving light bulbs and energy-saving lamp tubes are fixed. If you want to replace the old ones with new ones, you have to discard them together with the ballasts. Moreover, no matter how energy-saving the fluorescent tubes are, because they contain mercury After coating, it still inevitably causes serious pollution to the environment after being discarded. Therefore, in order to solve the above-mentioned problems, LED light bulbs or LED tubes have been developed accordingly.

Contents of the invention

The technical problem to be solved by the present invention is to provide a polycrystalline light-emitting diode packaging structure for producing a quasi-circular light-emitting effect, which can achieve the purpose of stable current (stable voltage) and long service life.

In order to solve the above technical problems, according to one solution of the present invention, a polycrystalline light emitting diode packaging structure for producing a circular light emitting effect is provided, which includes: a substrate unit, a light emitting unit and a packaging unit. Wherein, the substrate unit has a substrate body, a first conductive circuit, a second conductive circuit and a third conductive circuit, and the first conductive circuit, the second conductive circuit and the third conductive circuit are separated from each other by a predetermined distance and arranged on the substrate body, wherein the first conductive circuit has a first base and a plurality of first upper extensions extending from the first base, the second conductive circuit has a second base, multiple A second upper extension extending from the second base, a plurality of second middle extensions extending from the second base and adjacent to and alternately arranged with the first upper extensions, and at least A second lower extension extending from the second base, the third conductive circuit has a third base, a plurality of second upper extensions extending from the third base and adjacent to and mutually adjacent to the second upper extensions Alternately arranged third upper extensions and at least one third lower extension extending from the third base and adjacent to the at least one second lower extension. The light-emitting unit has a plurality of light-emitting diode crystal grains selectively and electrically arranged on the substrate unit. The encapsulation unit has a light-transmitting encapsulant formed on the upper surface of the substrate unit to cover the LED chips.

In order to solve the above technical problems, according to one solution of the present invention, a polycrystalline light emitting diode packaging structure for producing a circular light emitting effect is provided, which includes: a substrate unit, a light emitting unit and a packaging unit. The substrate unit has a substrate body and a plurality of conductive lines separated from each other by a predetermined distance and disposed on the substrate body, wherein each conductive line has a plurality of extensions, and the extensions of every two conductive lines are selectively adjacent to each other and arranged alternately. The light-emitting unit has a plurality of light-emitting diode grains selectively and electrically arranged on the substrate unit, and the light-emitting diode grains are arranged in a kind of circular shape. The encapsulation unit has a light-transmitting encapsulant formed on the upper surface of the substrate unit to cover the LED chips.

The beneficial effects of the present invention are:

1. The light-emitting diode dies of the present invention are electrically arranged on the substrate unit in an even-numbered series-connected and mostly-parallel-connected manner. Of course, the light emitting diode chips can also be electrically disposed on the substrate unit in a base series and mostly parallel manner. Therefore, the present invention has the advantages of stable current (stable voltage) and long service life.

2. In one of the embodiments, the anode and cathode of each light-emitting diode grain of the present invention correspond to at least two anode pads and at least two cathode pads respectively, so the anode of each light-emitting diode grain There are at least one spare positive electrode welding pad and at least one spare negative electrode welding pad respectively with the negative electrode, which are used to save the time of wire bonding (improving the efficiency of wire bonding) and increase the qualified rate of wire bonding.

3. The present invention forms a wrap-around reflective colloid (wrap-around white colloid) of any shape by means of coating, and through the wrap-around reflective colloid, the position of a light-transmitting encapsulating colloid (fluorescent colloid) is limited and adjusted The surface shape of the light-transmitting encapsulation colloid, therefore, the LED packaging structure of the present invention can "improve the luminous efficiency of the LED crystal grain" and "control the light emitting angle of the LED crystal grain".

In order to further understand the technology, means and effects that the present invention adopts to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the purpose, characteristics and characteristics of the present invention can be obtained from this For specific understanding, however, the accompanying drawings are only for reference and illustration, and are not intended to limit the present invention.

Description of drawings

1A to 1D are schematic diagrams of the manufacturing process of the first embodiment of the polycrystalline light-emitting diode packaging structure for producing a circular light-emitting effect according to the present invention;

2A to 2C are schematic diagrams of the manufacturing process of the second embodiment of the polycrystalline light emitting diode packaging structure for producing a circular light-emitting effect according to the present invention;

3A is an exploded schematic view of the first substrate unit of the polycrystalline light emitting diode packaging structure used to produce a circular light-emitting effect according to the present invention;

3B is a schematic diagram of the combination of the first substrate unit of the polycrystalline light emitting diode packaging structure used to produce a circular light-emitting effect according to the present invention;

Fig. 4A is a combined schematic diagram of the second substrate unit of the polycrystalline light-emitting diode package structure used to produce a quasi-circular light-emitting effect in the present invention; View schematic diagram.

[Description of reference signs of main components]

Polycrystalline light-emitting diode packaging structure P

Substrate unit 1 Substrate body 10

Conductive line C

                                                             

                                                                 

                                                                 

            No. 1 Middle Extension   11M

                                                                       

                                                                           

                                                                                               

                                                                                   

                                                                               

The second lower extension 12B

                                                                                  

                                                                                           

The third upper extension 13T

                                                                 

The fourth conductive line 14

Quadribasal 14A

The fourth upper extension 14T

                                                                 

The fourth lower extension 14B

The fifth conductive line 15

                                                                       

The fifth upper extension 15T

The fifth lower extension 15B

Conductive Pad 16

                                                            

Insulation layer 18

Light-emitting unit 2 LED grains 20

Reflective unit 3 Wrap-around reflective colloid 30

Colloid space 300

T

                                   

Height H

Encapsulation unit 4 Light-transmitting encapsulant 40

Blue Beam L1

White Beam L2

Detailed ways

Please refer to FIG. 1A to FIG. 1D , the following is a detailed description of the manufacturing method of the "polycrystalline light emitting diode packaging structure P for producing a quasi-circular light emitting effect" as an example of the first embodiment of the present invention ( Steps S100 to S108):

Please refer to FIG. 1A, firstly, a substrate unit 1 is provided, which has a substrate body 10, a plurality of conductive circuits C arranged on the upper surface of the substrate body 10, and a plurality of conductive circuits C arranged on the upper surface of the conductive circuits C. Electric pads 16, a heat dissipation layer 17 disposed on the bottom of the substrate body 10, an insulating layer 18 disposed on the upper surface of the substrate body 10 and used to cover part of the conductive lines C to expose the conductive pads 16 (step S100) . Therefore, the heat dissipation layer 17 can be used to increase the heat dissipation performance of the substrate unit 1, and the insulating layers 18 can be used to expose only the conductive pads 16 and the LED chip placement area and to limit the welding area. Solder mask. However, the above definition of the substrate unit 1 is not intended to limit the present invention, and any type of substrate is applicable to the scope of the present invention. For example: the substrate unit 1 can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate or a copper substrate.

Referring to FIG. 1B , a plurality of LED chips 20 are selectively and electrically disposed on the conductive lines C of the substrate unit 1 (step S102 ). Taking the example of the first embodiment of the present invention as an example, each light emitting diode chip 20 is electrically connected to two conductive pads 16 of every two conductive lines C through wire-bonding. between.

Please refer to FIG. 1C, first, apply liquid adhesive material (not shown) on the upper surface of the substrate unit 1 (step S104), wherein the liquid adhesive material can be arbitrarily surrounded into a predetermined shape (such as a circle) Shape), the thixotropic index of the liquid glue is between 4-6, the pressure of coating the liquid glue on the upper surface of the substrate unit 1 is between 350-450kpa, the liquid glue is coated The speed of the adhesive material on the upper surface of the substrate unit 1 is between 5-15mm/s, and the starting point and the ending point of the liquid adhesive material on the upper surface of the substrate unit 1 are coated at the same position; then, Then solidify the liquid glue to form a wrap-around reflective glue 30, and the wrap-around reflective glue 30 surrounds the LED dies 20 disposed on the substrate unit 1 to form a glue above the substrate unit 1 The limited space 300 (step S106 ), wherein the liquid adhesive material is hardened by baking, the temperature of the baking is between 120-140 degrees, and the baking time is between 20-40 minutes.

Furthermore, the upper surface of the wraparound reflective gel 30 may be in the shape of an arc, and the angle θ of the wraparound reflective glue 30 relative to the arc tangent T of the upper surface of the substrate unit 1 is between 40° and 50°. The height H of the top surface of the wrap-around reflective colloid 30 relative to the upper surface of the substrate unit 1 is between 0.3-0.7 mm, the width of the bottom of the wrap-around reflective colloid 30 is between 1.5-3 mm, and the wrap-around reflective The thixotropic index of colloid 30 is between 4-6.

Please refer to FIG. 1D , forming a light-transmitting encapsulant 40 on the upper surface of the substrate unit 1 to cover the LED dies 20 , wherein the light-transmissive encapsulant 40 is confined in the colloid-limited space 300 (Step S108 ), the wraparound reflective glue 30 can be a white thermosetting reflective glue (opaque glue) mixed with inorganic additives, and the upper surface of the transparent encapsulating glue 40 is a convex surface.

Taking the example given in the first embodiment of the present invention, each LED die 20 can be a blue LED die, and the light-transmitting encapsulant 40 can be a fluorescent gel, so the LED dies The blue light beam L1 projected by the chips 20 (the blue LED chips) can pass through the light-transmissive encapsulant 40 (the fluorescent colloid) to generate a white light beam L2 similar to a fluorescent light source.

In other words, through the use of the surrounding reflective adhesive 30, the light-transmitting encapsulant 40 is limited in the adhesive space 300, thereby controlling the "amount of use of the light-transmissive encapsulant 40"; Control the usage amount of the light-transmitting encapsulant 40 to adjust the surface shape and height of the light-transmissive encapsulant 40, and then control "the light-emitting angle of the white light beam L2 generated by the light-emitting diode chips 20"; in addition, the present invention It is also possible to use the surrounding reflective colloid 30 so that the white light beam L1 generated by the light-emitting diode crystal grains 20 is projected onto the inner wall of the surrounding reflective colloid 30 for reflection, thereby increasing the use of the present invention to produce similar The luminous efficiency of the polycrystalline light emitting diode packaging structure P with circular luminous effect.

Please refer to FIG. 2A to FIG. 2C , the following is a detailed description of the manufacturing method of the "polycrystalline light emitting diode packaging structure P for producing a quasi-circular light emitting effect" as an example of the second embodiment of the present invention ( Steps S200 to S208):

Please refer to FIG. 2A , first, a substrate unit 1 is provided, which has a substrate body 10, a plurality of conductive circuits C arranged on the upper surface of the substrate body 10, and a plurality of conductive circuits C arranged on the upper surface of the conductive circuits C. Electric pads 16, a heat dissipation layer 17 disposed on the bottom of the substrate body 10, an insulating layer 18 disposed on the upper surface of the substrate body 10 and used to cover part of the conductive lines C to expose the conductive pads 16 (step S200) . Therefore, the heat dissipation layer 17 can be used to increase the heat dissipation performance of the substrate unit 1, and the insulating layers 18 can be used to expose only the conductive pads 16 and the LED chip placement area and to limit the welding area. Solder mask. However, the above definition of the substrate unit 1 is not intended to limit the present invention, and any type of substrate is applicable to the scope of the present invention. For example: the substrate unit 1 can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate or a copper substrate.

Please refer to FIG. 2A. First, apply a liquid adhesive material (not shown) on the upper surface of the substrate unit 1 (step S202), wherein the liquid adhesive material can be randomly surrounded into a predetermined shape (such as a circle) Shape), the thixotropic index of the liquid glue is between 4-6, the pressure of coating the liquid glue on the upper surface of the substrate unit 1 is between 350-450kpa, the liquid glue is coated The speed of the adhesive material on the upper surface of the substrate unit 1 is between 5-15mm/s, and the starting point and the ending point of the liquid adhesive material on the upper surface of the substrate unit 1 are coated at the same position; then, Then solidify the liquid glue to form a wrap-around reflective glue 30 (step S204), wherein the liquid glue is hardened by baking, the temperature of baking is between 120-140 degrees, and the time of baking is between Between 20-40 minutes.

Furthermore, the upper surface of the wraparound reflective gel 30 may be in the shape of an arc, and the angle θ of the wraparound reflective glue 30 relative to the arc tangent T of the upper surface of the substrate unit 1 is between 40° and 50°. The height H of the top surface of the wrap-around reflective colloid 30 relative to the upper surface of the substrate unit 1 is between 0.3-0.7 mm, the width of the bottom of the wrap-around reflective colloid 30 is between 1.5-3 mm, and the wrap-around reflective The thixotropic index of colloid 30 is between 4-6.

Referring to FIG. 2B , a plurality of LED chips 20 are selectively and electrically disposed on the conductive lines C of the substrate unit 1 (step S206 ). Taking the example of the first embodiment of the present invention as an example, each light emitting diode chip 20 is electrically connected to two conductive pads 16 of every two conductive lines C through wire-bonding. between. Furthermore, the surrounding reflective glue 30 surrounds the LED dies 20 disposed on the substrate unit 1 to form a glue-limiting space 300 above the substrate unit 1 .

Please refer to FIG. 2C , forming a light-transmissive encapsulant 40 on the upper surface of the substrate unit 1 to cover the LED dies 20 , wherein the light-transmissive encapsulant 40 is confined in the colloid-limited space 300 (Step S208 ), the wrap-around reflective glue 30 can be a white thermosetting reflective glue (opaque glue) mixed with inorganic additives, and the upper surface of the transparent encapsulating glue 40 is a convex surface.

Taking the example given in the first embodiment of the present invention, each LED die 20 can be a blue LED die, and the light-transmitting encapsulant 40 can be a fluorescent gel, so the LED dies The blue light beam L1 projected by the chips 20 (the blue LED chips) can pass through the light-transmissive encapsulant 40 (the fluorescent colloid) to generate a white light beam L2 similar to a fluorescent light source.

In other words, through the use of the surrounding reflective adhesive 30, the light-transmitting encapsulant 40 is limited in the adhesive space 300, thereby controlling the "amount of use of the light-transmissive encapsulant 40"; Control the usage amount of the light-transmitting encapsulant 40 to adjust the surface shape and height of the light-transmissive encapsulant 40, and then control "the light-emitting angle of the white light beam L2 generated by the light-emitting diode chips 20"; in addition, the present invention It is also possible to use the surrounding reflective colloid 30 so that the white light beam L1 generated by the light-emitting diode crystal grains 20 is projected onto the inner wall of the surrounding reflective colloid 30 for reflection, thereby increasing the use of the present invention to produce similar The luminous efficiency of the polycrystalline light emitting diode packaging structure P with circular luminous effect.

Therefore, through the above manufacturing method, please refer to FIG. 1D and FIG. 2C, it can be seen that the present invention provides a polycrystalline light emitting diode packaging structure P for producing a quasi-circular light emitting effect, which includes: a substrate unit 1, a light emitting diode A unit 2 , a reflective unit 3 and a packaging unit 4 .

Wherein, the substrate unit 1 (please refer to FIG. 3A and FIG. 3B) has a substrate body 10, a first conductive circuit 11, a second conductive circuit 12, a third conductive circuit 13, and a fourth conductive circuit 14 and a fifth conductive circuit 15, and the first conductive circuit 11, the second conductive circuit 12 and the third conductive circuit 13, the fourth conductive circuit 14 and the fifth conductive circuit 15 are separated from each other by a predetermined distance and set on the substrate body 10 .

Moreover, the first conductive circuit 11 has a first base portion 11A, at least one first middle extension portion 11M extending from the first base portion 11A, and at least one first middle extension portion 11M extending downward from the middle extension portion 11M. And away from the first lower extending portion 11B of the first base portion 11A. In addition, the first upper extensions 11T and the at least one middle extension 11M both extend from the first base 11A in the same direction, and the at least one lower extension 11B passes from the turning point of the at least one middle extension 11M. Extend downward and bend.

In addition, the second conductive circuit 12 has a second base 12A, a plurality of second upper extensions 12T extending from the second base 12A, a plurality of second upper extensions 12T extending from the second base 12A and connecting with the first The upper extensions 11T are adjacent to each other and the second middle extensions 12M are arranged alternately, and at least one second lower extension 12B extends from the second base 12A. In addition, the second upper extensions 12T, the second middle extensions 12M, and the at least one second lower extension 12B all extend from the second base 12A toward the same direction.

In addition, the third conductive circuit 13 has a third base 13A, a plurality of third upper extensions 13T extending from the third base 13A and adjacent to the second upper extensions 12T and arranged alternately. And at least one third lower extension portion 13B extending from the third base portion 13A and adjacent to the at least one second lower extension portion 12B. In addition, the third upper extensions 13T extend from the inner side of the third base 13A, and the at least one third lower extension 13B extends from an end of the third base 13A.

Moreover, the fourth conductive circuit 14 has a fourth base portion 14A, at least one fourth upper extension portion 14T extending from the fourth base portion 14A and adjacent to the at least one first middle extension portion 11M, a plurality of A fourth middle extension 14M extending from the fourth base 14A, and at least one fourth lower extension 14B extending from the fourth base 14A. In addition, the at least one fourth upper extension 14T, the fourth middle extensions 14M and the at least one fourth lower extension 14B all extend from the fourth base 14A toward the same direction.

In addition, the fifth conductive circuit 15 has a fifth base 15A, a plurality of fifth upper extensions 15T extending from the fifth base 15A and adjacent to the fourth middle extensions 14M and arranged alternately. And at least one fifth lower extending portion 15B extending from the fifth base portion 15A and adjacent to the at least one fourth lower extending portion 14B. In addition, the fifth upper extensions 15T and the at least one fifth lower extension 15B both extend from the inner side of the fifth base 15A, and the end of the at least one first lower extension 11B is adjacent to and disposed on the above-mentioned Between at least one fourth lower extension portion 14B and the at least one fifth lower extension portion 15B.

Moreover, as shown in FIG. 3B, the conductive pads 16 can be selectively disposed on the first conductive circuit 11, the second conductive circuit 12, the third conductive circuit 13, the fourth conductive circuit 14 and the on the fifth conductive line 15 . In other words, the substrate unit 1 has a substrate body 10 and a plurality of conductive lines C (like the above five conductive lines) separated from each other by a predetermined distance and disposed on the substrate body 10, wherein each conductive line C has a plurality of extensions (like the plurality of extensions described above), and the extensions of every two conductive lines C are selectively adjacent to each other and arranged alternately.

In addition, the light-emitting unit 2 has a plurality of LED chips 20 selectively electrically disposed on the substrate unit 1 (FIG. electrically connected between two conductive pads 16 ), and the LED dies 20 are arranged in a circular shape. Moreover, each LED chip 20 has a positive electrode and a negative electrode (for example, the positive electrode and the negative electrode are both arranged on the upper surface of each LED chip 20 ), and each LED chip The anode of the chip 20 corresponds to at least two conductive pads 16 , and the negative electrode of each LED chip 20 corresponds to at least two conductive pads 16 .

In addition, the LED grains 20 are arranged in multiple rows of LED grain groups parallel to each other, and the LED grain groups are separated from each other by the same distance, and the LED grains of each group of LED grain groups are 20 are separated from each other by the same distance, and the LED dies 20 are alternately arranged on the substrate unit 1 . It can be seen from FIG. 3B that the light emitting diode dies 20 are electrically disposed on the substrate unit 1 in a manner of even numbers being connected in series and most being connected in parallel. Of course, the light emitting diode chips 20 can also be electrically disposed on the substrate unit 1 in a base series and a majority parallel connection.

In addition, the reflective unit 3 has a surrounding reflective glue 30 formed on the upper surface of the substrate unit 1 by coating, wherein the surrounding reflective glue 30 surrounds the light-emitting elements arranged on the substrate unit 1 The diode die 20 is used to form a colloid-limited space 300 above the substrate unit 1 .

In addition, the encapsulation unit 4 has a transparent encapsulant 40 formed on the upper surface of the substrate unit 1 to cover the LED dies 20 , wherein the transparent encapsulant 40 is confined in the encapsulation space 300 .

Of course, the present invention can also omit the use of the reflective unit 3 , that is, the present invention can directly form the light-transmitting encapsulant 40 on the upper surface of the substrate unit 1 to cover the LED chips 20 .

Please refer to FIG. 4A and FIG. 4B, the present invention further includes: a wire unit with multiple wires W and a conductive unit with multiple conductors B, wherein the two electrodes of each light emitting diode chip 20 (20a, 20b) are respectively arranged on the upper surface and the lower surface of each LED crystal grain 20, and the two electrodes (20a, 20b) of each LED crystal grain 20 pass through each wire W and each conduction electrode respectively. The body B is electrically connected to two of the conductive pads 16 respectively.

To sum up, the polycrystalline light-emitting diode packaging structure used to produce a circular light-emitting effect according to the present invention has the following advantages:

1. The light-emitting diode dies of the present invention are electrically arranged on the substrate unit in an even-numbered series-connected and mostly-parallel-connected manner. Of course, the light emitting diode chips can also be electrically disposed on the substrate unit in a base series and mostly parallel manner. Therefore, the present invention has the advantages of stable current (stable voltage) and long service life.

2. In one of the embodiments, the anode and cathode of each light-emitting diode grain of the present invention correspond to at least two anode pads and at least two cathode pads respectively, so the anode of each light-emitting diode grain There are at least one spare positive electrode welding pad and at least one spare negative electrode welding pad respectively with the negative electrode, which are used to save the time of wire bonding (improving the efficiency of wire bonding) and increase the qualified rate of wire bonding. Because the positive pole and the negative pole of each light-emitting diode grain have at least one spare positive pole welding pad and at least one spare negative pole welding pad respectively, so when one end of the wire is hit (welded) on one of the positive pole welding pads or the negative pole welding pad And when it fails (causing floating soldering, that is, there is no electrical connection between the wire and "the positive pad or the negative pad"), the manufacturer does not need to remove the welding slag on the surface of the positive pad that failed to wire. (or the welding slag on the surface of the negative electrode pad), one end of the wire can be hit on another positive electrode pad (or another negative electrode pad) to save the time of wire bonding (improve the efficiency of wire bonding) and increase The passing rate of the line.

3. The present invention forms a wrap-around reflective colloid (wrap-around white colloid) of any shape by means of coating, and through the wrap-around reflective colloid, the position of a light-transmitting encapsulating colloid (fluorescent colloid) is limited and adjusted The surface shape of the light-transmitting encapsulation colloid, therefore, the LED packaging structure of the present invention can "improve the luminous efficiency of the LED crystal grain" and "control the light emitting angle of the LED crystal grain". In other words, through the use of the surround-type reflective colloid, the light-transmitting packaging colloid is limited in the colloid-limiting space, and then the "use amount and position of the light-transmitting packaging colloid" can be controlled; furthermore, by controlling the The amount and position of the light-transmitting encapsulating colloid are used to adjust the surface shape and height of the light-transmitting encapsulating colloid, thereby controlling "the light-emitting angle of the white light beams generated by the light-emitting diode crystal grains"; in addition, the present invention can also use the The use of the surrounding reflective colloid enables the light beams generated by the LED crystal grains to project onto the inner wall of the surrounding reflective colloid for reflection, thereby increasing the "luminous efficiency of the LED packaging structure of the present invention".

However, the entire scope of the present invention should be based on the claims, and all embodiments that conform to the spirit of the claims of the present invention and similar changes thereof should be included in the scope of the present invention, and any person skilled in the art can easily think of Changes or modifications are all within the scope of the claims of the present invention.

Claims (10)

1. A polycrystalline light-emitting diode packaging structure for producing a quasi-circular luminous effect, characterized in that it comprises: A substrate unit, which has a substrate body, a first conductive circuit, a second conductive circuit and a third conductive circuit, and the first conductive circuit, the second conductive circuit and the third conductive circuit are separated from each other by a predetermined distance and arranged on the substrate body, wherein the first conductive circuit has a first base and a plurality of first upper extensions extending from the first base, the second conductive circuit has a second base, multiple A second upper extension extending from the second base, a plurality of second middle extensions extending from the second base and adjacent to and alternately arranged with the first upper extensions, and at least A second lower extension extending from the second base, the third conductive circuit has a third base, a plurality of second upper extensions extending from the third base and adjacent to and mutually adjacent to the second upper extensions alternately arranged third upper extensions, and at least one third lower extension extending from the third base and adjacent to the at least one second lower extension; A light-emitting unit, which has a plurality of light-emitting diode crystals selectively electrically disposed on the substrate unit; and An encapsulation unit has a light-transmitting encapsulation compound formed on the upper surface of the substrate unit to cover the LED chips. 2. The polycrystalline light-emitting diode packaging structure for producing a circular light emitting effect as claimed in claim 1, wherein the substrate unit has a fourth conductive circuit and a fifth conductive circuit, and the fourth conductive circuit The line and the fifth conductive line are separated from each other by a predetermined distance and disposed on the substrate body, the first conductive line has at least one first middle extending portion extending from the first base portion and at least one middle extending portion a first lower extending portion extending downward and away from the first base portion; the fourth conductive circuit has a fourth base portion, at least one extending from the fourth base portion and mutually with the at least one first middle extending portion Adjacent fourth upper extensions, a plurality of fourth middle extensions extending from the fourth base, and at least one fourth lower extension extending from the fourth base; the fifth conductive circuit has a The fifth base, a plurality of fifth upper extensions extending from the fifth base and adjacent to and alternately arranged with the fourth middle extensions, and at least one extending from the fifth base and connected to the above-mentioned The at least one fourth lower extension is adjacent to the fifth lower extension, and the end of the at least one first lower extension is adjacent to and disposed between the at least one fourth lower extension and the at least one fifth lower extension . 3. The polycrystalline light-emitting diode packaging structure for producing a quasi-circular light emitting effect as claimed in claim 2, wherein the substrate unit has a plurality of conductive pads, and these conductive pads are selectively arranged on On the first conductive circuit, the second conductive circuit, the third conductive circuit, the fourth conductive circuit and the fifth conductive circuit, each light-emitting diode crystal grain has a positive electrode and a negative electrode, and each LED emits light The anode of the diode crystal grain corresponds to at least two conductive pads, and the negative pole of each LED grain corresponds to at least two conductive pads. 4. The polycrystalline light-emitting diode packaging structure for producing a quasi-circular light-emitting effect as claimed in claim 3, further comprising: a wire unit having a plurality of wires, wherein each light-emitting diode The positive pole and the negative pole of the die are respectively electrically connected to two conductive pads through two wires. 5. The polycrystalline light-emitting diode packaging structure for producing a quasi-circular luminous effect as claimed in claim 3, further comprising: a wire unit with a plurality of wires and a wire unit with a plurality of conductors The conductive unit, wherein the two electrodes of each light-emitting diode chip are respectively electrically connected to two conductive pads through each wire and each conductor. 6. The polycrystalline light-emitting diode packaging structure for producing a quasi-circular light-emitting effect as claimed in claim 5, wherein the two electrodes of each light-emitting diode grain are respectively arranged on each light-emitting diode grain upper and lower surfaces. 7. The polycrystalline light-emitting diode packaging structure for producing a circular light-emitting effect as claimed in claim 1, wherein the light-emitting diode crystal grains are arranged in a circular shape, and the light-emitting diode crystal grains are arranged in a circular shape. Multiple rows of light-emitting diode grain groups parallel to each other, the light-emitting diode grain groups are separated from each other by the same distance, the light-emitting diode grains of each group of light-emitting diode grain groups are separated from each other by the same distance, and the light-emitting diode The crystal grains are alternately arranged on the substrate unit. 8. The polycrystalline light-emitting diode packaging structure for producing a circular light-emitting effect as claimed in claim 1, further comprising: a light-reflecting unit, which has a surrounding shape formed by coating The surrounding reflective glue on the upper surface of the substrate unit, wherein the surrounding reflective glue surrounds the light-emitting diode crystal grains arranged on the substrate unit to form a glue-limited space above the substrate unit, and the transparent The optical encapsulation colloid is confined in the colloid limiting space. 9. The polycrystalline light-emitting diode packaging structure for producing a quasi-circular luminous effect as claimed in claim 8, wherein the upper surface of the surrounding reflective colloid is in the shape of an arc, and the surrounding reflective colloid is opposite to The angle of the arc tangent on the upper surface of the substrate body is between 40 and 50 degrees, the height of the top surface of the wrap-around reflective colloid relative to the upper surface of the substrate body is between 0.3 and 0.7mm, and the wrap-around reflective The width of the bottom of the colloid is between 1.5mm and 3mm, the thixotropic index of the wrap-around reflective colloid is between 4-6, and the wrap-around reflective colloid is a white thermosetting reflective colloid mixed with inorganic additives. 10. A polycrystalline light-emitting diode packaging structure for producing a quasi-circular light emitting effect, characterized in that it comprises: A substrate unit, which has a substrate body and a plurality of conductive lines separated from each other by a predetermined distance and arranged on the substrate body, wherein each conductive line has a plurality of extensions, and the extensions of every two conductive lines Selectively adjacent to each other and alternately arranged with each other; A light-emitting unit, which has a plurality of light-emitting diode crystals selectively electrically disposed on the substrate unit; and An encapsulation unit has a light-transmitting encapsulation compound formed on the upper surface of the substrate unit to cover the LED chips.

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