CN101996985B - Light-emitting diode packaging structure capable of positioning thermally conductive adhesive material and manufacturing method thereof - Google Patents

Abstract

A light emitting diode package structure capable of positioning a thermally conductive adhesive material, comprising: a substrate unit, a heat conduction adhesion unit, a light emitting unit, a conductive unit and a packaging unit; the substrate unit is provided with a substrate body and at least one concave space formed on the upper surface of the substrate body; the heat conduction adhesion unit is provided with at least one heat conduction adhesion layer which is positioned in the concave space of the substrate unit; the light-emitting unit is provided with a plurality of light-emitting diode crystal grains which are arranged on the heat-conducting adhesion layer and accommodated in the at least one concave space; the conductive unit is provided with a plurality of leads for electrically connecting the LED crystal grains to the substrate unit respectively; the packaging unit is provided with a light-transmitting packaging colloid which is formed on the upper surface of the substrate body and covers the light-emitting diode crystal grains and the leads. The LED crystal grain can not only obtain better positioning effect, but also achieve better heat dissipation effect.

Description

Light-emitting diode packaging structure capable of positioning thermally conductive adhesive material and manufacturing method thereof

technical field

The invention relates to a light-emitting diode packaging structure and a manufacturing method thereof, in particular to a light-emitting diode packaging structure capable of positioning heat-conducting adhesive materials and a manufacturing method thereof. the

Background technique

The invention of electric light can be said to have completely changed the way of life of all human beings. If we live without electric light, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age. the

Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten filament lamps, and even the energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to recycle. Furthermore, traditional fluorescent lamps have poor color rendering, so pale light is not popular. In addition, due to the principle of light emission, the rapid flow of electrons in the diode of the lamp tube 120 times per second, it is easy to be unsteady when it is just turned on and the current is unstable. This phenomenon is generally considered to be the culprit of the high myopia rate in China. However, this problem can be solved by modifying the lamp tube with a "high-frequency electronic ballast". The high-frequency electronic ballast can not only The power consumption of traditional fluorescent lamps is further reduced by 20%, and because the output light waves are very stable when the high-frequency lighting is instantaneous, there is almost no flicker, and when the power supply voltage changes or the lamp is at low temperature, flicker is less likely to occur. This helps protect eyesight. However, the ballasts of general energy-saving light bulbs and energy-saving lamp tubes are fixed. If you want to replace the old ones with new ones, you have to discard them together with the ballasts. Moreover, no matter how energy-saving the fluorescent tubes are, because they contain mercury After coating, it still inevitably causes serious pollution to the environment after being discarded. Therefore, in order to solve the above-mentioned problems, LED light bulbs or LED tubes have been developed accordingly. the

Contents of the invention

The technical problem to be solved by the present invention is to provide a light-emitting diode packaging structure capable of positioning heat-conducting adhesive materials and a manufacturing method thereof. Through the use of the recessed space, the LED die of the present invention can not only obtain a better positioning effect, but also through the use of the thermally conductive adhesive layer, the LED die of the present invention can achieve a better heat dissipation effect. the

In order to solve the above technical problems, according to one solution of the present invention, a light emitting diode packaging structure capable of positioning thermally conductive adhesive materials is provided, which includes: a substrate unit, a thermally conductive adhesive unit, a light emitting unit, a conductive unit and a packaging unit. Wherein, the substrate unit has a substrate body, at least one recessed space formed on the upper surface of the substrate body, a plurality of positive electrode conductive pads exposed on the upper surface of the substrate body, and a plurality of negative electrodes exposed on the upper surface of the substrate body Conductive welding pads, wherein the substrate body has a circuit substrate, a heat dissipation layer disposed on the bottom of the circuit substrate, and a layer disposed on the upper surface of the circuit substrate and used to expose the positive conductive pads and the negative conductive pads Reflective insulation. The thermally conductive adhesive unit has at least one thermally conductive adhesive layer located in the recessed space of the substrate unit and disposed on the circuit substrate, wherein the at least one thermally conductive adhesive layer and the heat dissipation layer are separated from each other. The light-emitting unit has a plurality of light-emitting diode crystal grains arranged on the heat-conducting adhesive layer and accommodated in the above-mentioned at least one recessed space, wherein each light-emitting diode crystal grain has a positive terminal and a negative terminal. The conductive unit has a plurality of wires, wherein each two wires are respectively electrically connected between the positive end of each LED chip and each positive conductive pad and electrically connected to each LED chip between the negative terminal and each negative conductive pad. The encapsulation unit has a light-transmitting encapsulant formed on the upper surface of the substrate body to cover the LED chips and the wires. the

In order to solve the above technical problems, according to one solution of the present invention, a light emitting diode packaging structure capable of positioning thermally conductive adhesive materials is provided, which includes: a substrate unit, a thermally conductive adhesive unit, a light emitting unit, a conductive unit and a packaging unit. Wherein, the substrate unit has a substrate body, a plurality of recessed spaces formed on the upper surface of the substrate body, a plurality of positive electrode conductive pads exposed on the upper surface of the substrate body, and a plurality of negative electrodes exposed on the upper surface of the substrate body Conductive welding pads, wherein the substrate body has a circuit substrate, a heat dissipation layer disposed on the bottom of the circuit substrate, and a layer disposed on the upper surface of the circuit substrate and used to expose the positive conductive pads and the negative conductive pads Reflective insulation. The thermally conductive adhesive unit has a plurality of thermally conductive adhesive layers respectively positioned in the recessed spaces of the substrate unit and disposed on the circuit substrate, wherein the plurality of thermally conductive adhesive layers are separated from the heat dissipation layer. The light-emitting unit has a plurality of light-emitting diode crystal grains respectively arranged on the heat-conducting adhesive layer and accommodated in the recessed spaces, wherein each light-emitting diode grain has a positive terminal and a negative terminal. The conductive unit has a plurality of wires, wherein each two wires are respectively electrically connected between the positive end of each LED chip and each positive conductive pad and electrically connected to each LED chip between the negative terminal and each negative conductive pad. The encapsulation unit has a light-transmitting encapsulant formed on the upper surface of the substrate body to cover the LED chips and the wires. the

In order to solve the above-mentioned technical problems, according to one solution of the present invention, a method for manufacturing a light-emitting diode packaging structure capable of positioning thermally conductive adhesive materials is provided, which includes the following steps: firstly, providing a substrate unit, which has a substrate body, At least one recessed space formed on the upper surface of the substrate body, a plurality of positive electrode conductive pads exposed on the upper surface of the substrate body, and a plurality of negative electrode conductive pads exposed on the upper surface of the substrate body, wherein the substrate body has a A circuit substrate, a heat dissipation layer disposed on the bottom of the circuit substrate, and a reflective insulating layer disposed on the upper surface of the circuit substrate and used to expose the positive conductive pads and the negative conductive pads; next, a plurality of The thermally conductive adhesive balls are placed in the recessed space and arranged on the circuit substrate, wherein a plurality of the thermally conductive adhesive balls are separated from the heat dissipation layer; then, a plurality of light emitting diode crystal grains are respectively arranged on the thermally conductive adhesive balls , wherein each light-emitting diode die has a positive end and a negative end; then, through a tin furnace (reflow), so that these heat-conducting adhesive balls form a positioning of these light-emitting diode dies on the substrate unit The thermally conductive adhesive layer in the recessed space; next, through a plurality of wires, each LED chip is electrically connected between each positive conductive pad and each negative conductive pad, wherein each two Wires are respectively electrically connected between the positive end of each light emitting diode crystal grain and each positive electrode conductive pad, and are electrically connected between the negative end of each light emitting diode crystal grain and each negative electrode conductive pad; Finally, a light-transmitting encapsulant is formed on the upper surface of the substrate body to cover the LED chips and the wires. the

Therefore, the beneficial effect of the present invention is that: the present invention designs one or more recessed spaces on the substrate body to accommodate a plurality of heat-conducting adhesive layers (such as solder balls or solder paste) and accommodate multiple LED die on some thermally conductive adhesive layers. Therefore, through the use of the recessed space, not only the better positioning effect of the LED chips can be obtained, but also the better positioning of the LED chips can be achieved through the use of the thermally conductive adhesive layer. heat radiation. the

In order to further understand the technology, means and effects that the present invention adopts to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the purpose, characteristics and characteristics of the present invention can be obtained from this For specific understanding, however, the drawings are provided for reference and illustration only, and are not intended to limit the present invention. the

Description of drawings

Fig. 1 is the flowchart of the first embodiment of the preparation method of the present invention;

1A to 1J are schematic diagrams of the partial production process of the first embodiment of the light emitting diode packaging structure of the present invention;

Figure 1K is a schematic cross-sectional view of the first embodiment of the light emitting diode packaging structure of the present invention;

2 is a schematic cross-sectional view of a second embodiment of a light-emitting diode packaging structure of the present invention;

3 is a schematic cross-sectional view of a third embodiment of a light-emitting diode packaging structure of the present invention;

Fig. 4 is the flowchart of the fourth embodiment of the manufacturing method of light-emitting diode packaging structure of the present invention;

4A to 4J are schematic diagrams of part of the production process of the fourth embodiment of the light emitting diode packaging structure of the present invention; and

FIG. 4K is a schematic top view of the fourth embodiment of the light emitting diode packaging structure of the present invention. the

【Description of reference signs of main components】

Substrate unit 1 Substrate body 10

Circuit board 100

Heat dissipation layer 101

Reflective insulating layer 102

Recessed space 10a

Bottom 100a

Positive conductive pad 11a

Negative conductive pad 11b

Crystal placement area 11

Light-emitting unit 2 luminous diode grains 20

Positive extreme P

Negative pole N

Reflective unit 3   Wrap-around reflective colloid 30

Colloid limited space 300

Encapsulation unit 4  Light-transmitting encapsulant 40

Conductive unit W W Conductor Wa

Thermally Conductive Adhesive Ball B Thermally Conductive Adhesive Layer H

Nickel/Palladium/Gold layer M

Arc Tangent T

angle θ

height h

White Beam L

Detailed ways

Please refer to FIG. 1, the first embodiment of the present invention provides a method for manufacturing a light-emitting diode packaging structure capable of positioning thermally conductive adhesive materials, which includes: first, providing a substrate unit, which has a substrate body, at least one formed on The recessed space on the upper surface of the substrate body, a plurality of positive electrode conductive pads exposed on the upper surface of the substrate body, and a plurality of negative electrode conductive pads exposed on the upper surface of the substrate body; then, a plurality of thermally conductive adhesive balls (or heat-conducting adhesive paste) into the recessed space; then, a plurality of light-emitting diode crystal grains are respectively arranged on the heat-conducting adhesive balls, wherein each light-emitting diode grain has a positive terminal and a negative terminal; next, through the tin furnace (reflow), so that the thermally conductive adhesive balls form a thermally conductive adhesive layer that positions the light emitting diode dies in the recessed space of the substrate unit; then, through a plurality of wires, each Each LED chip is electrically connected between each positive electrode conductive pad and each negative electrode conductive pad, and each two wires are respectively electrically connected to the positive terminal of each LED chip and each positive electrode The conductive pads are electrically connected between the negative end of each LED chip and each negative conductive pad; finally, a light-transmitting encapsulant is formed on the upper surface of the substrate body to cover the light emitting diodes. The diode die and the wires. the

Please cooperate with FIG. 1 and refer to FIG. 1A to FIG. 1K , the following is a detailed description of the "method for manufacturing a light-emitting diode packaging structure with positionable heat-conducting adhesive material" disclosed in the first embodiment of the present invention:

Please cooperate with FIG. 1, FIG. 1A and FIG. 1B (FIG. 1B is a schematic side view sectional view of FIG. 1A), at first, a substrate unit 1 is provided, which has a substrate body 10, and at least one is formed on the upper surface of the substrate body 10. The recessed space 10a, a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10, and a plurality of negative electrode conductive pads 11b exposed on the upper surface of the substrate body 10 (step S100). Wherein, the at least one recessed space 10 a is a trapezoidal groove, and the substrate unit 1 has a crystal placement area 11 disposed on the upper surface of the substrate body 10 . the

In addition, the substrate body 10 has a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, and a heat dissipation layer 101 disposed on the upper surface of the circuit substrate 100 for exposing the positive conductive pads 11a, the negative conductive pads The pad 11b and a part of the reflective insulating layer 102 located on the bottom surface 100a in the recessed space 10a. Therefore, the heat dissipation layer 101 can be used to increase the heat dissipation performance of the circuit substrate 100, and the reflective insulating layers 102 can be used to expose only the positive conductive pads 11a and the negative conductive pads 11b and achieve Solder mask that confines the soldering area. However, the above definition of the substrate body 10 is not intended to limit the present invention, and any type of substrate is applicable to the scope of the present invention. For example, the substrate body 10 can be a printed circuit board, a flexible substrate, an aluminum substrate, a ceramic substrate or a copper substrate. the

1, 1C and 1D (FIG. 1D is a schematic side view of FIG. 1C), put a plurality of thermally conductive adhesive balls (or thermally conductive adhesive paste) B into the recessed space 10a (step S102). That is, the thermally conductive adhesive balls B are placed on the bottom surface 100a in the recessed space 10a, and each thermally conductive adhesive ball B can be a solder ball or solder paste. the

Please cooperate with FIG. 1, FIG. 1E and FIG. 1F (FIG. 1F is a schematic side view cross-sectional view of FIG. 1E), a plurality of light-emitting diode chips 20 are respectively arranged on these heat-conducting adhesive balls B, and each light-emitting diode The die 20 has a positive terminal P and a negative terminal N (step S104 ). Wherein, the light emitting diode crystal grains 20 are electrically disposed on the crystal placement area 11 of the substrate unit 1, and the bottom of each light emitting diode grain 20 has a nickel/palladium/gold (Ni/Pd/Au) Layer M. the

Please cooperate with FIG. 1, FIG. 1G and FIG. 1H (FIG. 1H is a side view cross-sectional schematic diagram of FIG. 1G), pass through a tin furnace (reflow), so that these heat-conducting adhesive balls B form a pair of these light-emitting diode chips 20 Position the thermally conductive adhesive layer H in the recessed space 10a of the substrate unit 1 (step S106). Since the bottom of each light emitting diode grain 20 has a nickel/palladium/gold (Ni/Pd/Au) layer M, each nickel/palladium/gold layer M is formed on the thermally conductive adhesive layer H and each luminescent between the diode dies 20 . With the help of the nickel/palladium/gold layer M, a protective layer is formed between the LED chips 20 and the thermally conductive adhesive layer H, thereby ensuring the light emitting quality of the LED chips 20 . the

Please cooperate with FIG. 1, FIG. 1I and FIG. 1J (FIG. 1J is a schematic side view cross-sectional view of FIG. 1I), through a plurality of wires Wa, to electrically connect each light-emitting diode chip 20 to each anode conductor. between the electric pad 11a and each negative conductive pad 11b, wherein each two wires Wa are respectively electrically connected between the positive terminal P of each light-emitting diode chip 20 and each positive conductive pad 11a and electrically Connect between the negative terminal N of each LED chip 20 and each negative conductive pad 11b (step S108 ). the

Please cooperate with FIG. 1 and FIG. 1K to form a light-transmitting encapsulant 40 on the upper surface of the substrate body 10 to cover the LED chips 20 and the wires Wa (step S110 ). the

Taking the example given in the first embodiment of the present invention, each LED die 20 can be a blue LED die, and the light-transmitting encapsulant 40 can be a fluorescent gel, so the LED dies The blue light beams (not shown) projected by the chips 20 (the blue light-emitting diode chips) can directly pass through the light-transmitting encapsulation colloid 40 (the fluorescent colloid) or be reflected by the reflective insulating layers 102 and then Projected from the light-transmissive encapsulant 40 to generate a white light beam L similar to a fluorescent light source. the

Therefore, please refer to FIG. 1K again, the first embodiment of the present invention provides a light emitting diode packaging structure capable of positioning thermally conductive adhesive materials, which includes: a substrate unit 1, a thermally conductive adhesive unit, a light emitting unit 2, a conductive Unit W and a packaging unit 4. the

Wherein, the substrate unit 1 has a substrate body 10, at least one recessed space 10a formed on the upper surface of the substrate body 10, a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10, and a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10. The negative electrode conductive pad 11b on the upper surface of the substrate body 10 . In addition, the thermally conductive adhesive unit has at least a thermally conductive adhesive layer H located in the recessed space 10a of the substrate unit 1, and the thermally conductive adhesive layer H is a thermally conductive adhesive layer formed by passing a plurality of solder balls or solder paste through a tin furnace. Cloth layers (such as shown in FIG. 1F and FIG. 1H ). The light-emitting unit 2 has a plurality of LED chips 20 disposed on the heat-conducting adhesive layer H and accommodated in the at least one recessed space 10a, wherein each LED chip 20 has a positive terminal P and a negative terminal P. Extreme N. the

Furthermore, the conductive unit W has a plurality of wires Wa, wherein every two wires Wa are respectively electrically connected between the positive terminal P of each LED chip 20 and each positive conductive pad 11a and are electrically connected to each other. Between the negative terminal N of each LED chip 20 and each negative conductive pad 11b. In other words, the positive end P and the negative end N of each LED chip 20 are electrically connected to each positive conductive pad 11a and each negative conductive pad 11b respectively through every two wires Wa. In addition, the package unit 4 has a transparent encapsulant 40 formed on the upper surface of the substrate body 10 to cover the LED chips 20 and the wires Wa. the

In addition, the first embodiment of the present invention further includes: a plurality of nickel/palladium/gold (Ni/Pd/Au) layers M respectively disposed on the bottoms of the LED grains 20, wherein each nickel/palladium/gold layer M is formed between the thermally conductive adhesive layer H and each LED die 20 . the

Please refer to Fig. 2, the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the reflective insulating layer 102 is not formed in the recessed space 10a, so the thermally conductive adhesive layer H And the LED dies 20 are just positioned at the bottom of the recessed space 10a. the

Please refer to FIG. 3, the biggest difference between the third embodiment of the present invention and the above-mentioned other embodiments is: in the third embodiment, before the step of forming a light-transmitting encapsulant 40 on the upper surface of the substrate body 10, Firstly, a surrounding reflective glue 30 (a reflective unit 3 ) is formed on the upper surface of the substrate body 10 . the

For example: on the upper surface of the substrate body 10 of each substrate unit 1, a surrounding reflective colloid 30 is formed around, wherein each surrounding reflective colloid 30 surrounds the crystal placement area (as shown in the figure) that is arranged on each substrate unit 1 The LED die 20 shown in 1A are placed on the die region 11 ) to form a plurality of colloidal space 300 above the substrate bodies 10 . In addition, the above-mentioned steps of forming the surrounding reflective glue 30 further include: coating a liquid glue material (not shown) around the upper surface of the substrate body 10 of each substrate unit 1 , the liquid glue material can be be arbitrarily surrounded into a predetermined shape (such as circle, square, rectangle, etc.), and then solidify the liquid glue to form the surrounding reflective glue 30, wherein the surrounding reflective glue 30 can be a mixture of inorganic additives white heat-hardening reflective gel. the

Wherein, the thixotropic index of the liquid glue is between 4-6, the pressure of coating the liquid glue on the upper surface of the substrate body 10 is between 350-450kpa, and the liquid glue is coated The speed of the material on the upper surface of the substrate body 10 is between 5-15mm/s, and the starting point and the end point of the upper surface of the substrate body 10 are coated with the liquid adhesive material at the same position, and the liquid adhesive material It is hardened by baking, the baking temperature is between 120-140 degrees, and the baking time is between 20-40 minutes. the

Furthermore, as can be seen from FIG. 3 , the upper surface of the wraparound reflective gel 30 may be in the shape of an arc, and the angle θ of the wraparound reflective glue 30 relative to the arc tangent T of the upper surface of the substrate body 10 is between 40° to 40°C. Between 50 degrees, the height h of the top surface of the wrap-around reflective colloid 30 relative to the upper surface of the substrate body 10 is between 0.3-0.7 mm, and the width of the bottom of the wrap-around reflective colloid 30 is between 1.5-3 mm. And the thixotropic index of the wrap-around reflective colloid 30 is between 4-6. the

Please refer to FIG. 4, the fourth embodiment of the present invention provides a method for manufacturing a light-emitting diode packaging structure capable of positioning thermally conductive adhesive materials, which includes: first, providing a substrate unit, which has a substrate body, a plurality of shaped In the recessed space on the upper surface of the substrate body, a plurality of positive electrode conductive pads exposed on the upper surface of the substrate body, and a plurality of negative electrode conductive pads exposed on the upper surface of the substrate body; then, a plurality of thermally conductive adhesive balls ( or heat-conducting adhesive paste) respectively into the recessed spaces; then, a plurality of light-emitting diode dies are respectively arranged on the heat-conducting adhesive balls, wherein each light-emitting diode die has a positive end and a negative end; Next, go through a tin furnace (reflow), so that the thermally conductive adhesive balls respectively form a plurality of thermally conductive adhesive layers that respectively position the light emitting diode crystal grains in the recessed spaces of the substrate unit; A plurality of wires are used to electrically connect each LED chip between each positive conductive pad and each negative conductive pad, wherein each two wires are respectively electrically connected to each LED chip between the positive terminal of each light-emitting diode chip and each positive conductive pad and between the negative terminal of each LED chip and each negative conductive pad; finally, a light-transmitting encapsulant is formed on the substrate body surface to cover the LED dies and the wires. the

Please cooperate with FIG. 4 and refer to FIG. 4A to FIG. 4K, the following is a detailed description of the "method for manufacturing a light-emitting diode packaging structure with positionable thermally conductive adhesive material" disclosed in the fourth embodiment of the present invention:

Please cooperate with FIG. 4, FIG. 4A and FIG. 4B (FIG. 4B is a side view cross-sectional schematic diagram of FIG. 4A), firstly, a substrate unit 1 is provided, which has a substrate body 10, and a plurality of shapes are formed on the upper surface of the substrate body 10. The recessed space 10a, a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10, and a plurality of negative electrode conductive pads 11b exposed on the upper surface of the substrate body 10 (step S200). Wherein, each recessed space 10 a is a cup-shaped groove, and the substrate unit 1 has a crystal placement area 11 disposed on the upper surface of the substrate body 10 . the

In addition, the substrate body 10 has a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, and a heat dissipation layer 101 disposed on the upper surface of the circuit substrate 100 for exposing the positive conductive pads 11a, the negative conductive pads The pad 11b and a part of the reflective insulating layer 102 located on the bottom surface 100a in the recessed space 10a. the

Please cooperate with Fig. 4, Fig. 4C and Fig. 4D (Fig. 4D is a schematic side view cross-sectional view of Fig. 4C), put a plurality of thermally conductive adhesive balls (or thermally conductive adhesive paste) B into these recessed spaces 10a respectively (step S202 ). That is, each thermally conductive adhesive ball B is placed on the bottom surface 100a in each recessed space 10a, and each thermally conductive adhesive ball B can be a solder ball or solder paste. the

Please cooperate with FIG. 4, FIG. 4E and FIG. 4F (FIG. 4F is a schematic side view cross-sectional view of FIG. 4E), a plurality of light-emitting diode chips 20 are respectively arranged on these heat-conducting adhesive balls B, and each light-emitting diode The die 20 has a positive terminal P and a negative terminal N (step S204 ). Wherein, the light emitting diode crystal grains 20 are electrically disposed on the crystal placement area 11 of the substrate unit 1, and the bottom of each light emitting diode grain 20 has a nickel/palladium/gold (Ni/Pd/Au) Layer M. the

Please cooperate with FIG. 4, FIG. 4G and FIG. 4H (FIG. 4H is a side view cross-sectional schematic diagram of FIG. 4G), pass through a tin furnace (reflow), so that these heat-conducting adhesive balls B form a plurality of these light-emitting diode crystals respectively. Particles 20 are respectively positioned on the thermally conductive adhesive layer H in the recessed spaces 10 a of the substrate unit 1 (step S206 ). Since the bottom of each light-emitting diode grain 20 has a nickel/palladium/gold (Ni/Pd/Au) layer M, each nickel/palladium/gold layer M is formed on each thermally conductive adhesive layer H and each Between the LED dies 20 . With the help of the nickel/palladium/gold layer M, a protective layer is formed between each LED die 20 and each thermally conductive adhesive layer H, thereby ensuring the light emission quality of the LED dies 20 . the

Please cooperate with FIG. 4, FIG. 4I and FIG. 4J (FIG. 4J is a schematic side view sectional view of FIG. 4I), through a plurality of wires Wa, to electrically connect each LED chip 20 to each anode conductor. between the electric pad 11a and each negative conductive pad 11b, wherein each two wires Wa are respectively electrically connected between the positive terminal P of each light-emitting diode chip 20 and each positive conductive pad 11a and electrically Connect between the negative terminal N of each LED die 20 and each negative conductive pad 11b (step S208 ). the

4 and 4K, form a transparent encapsulant 40 on the upper surface of the substrate body 10 to cover the LED chips 20 and the wires Wa (step S210). the

Taking the example given in the fourth embodiment of the present invention, each LED die 20 can be a blue LED die, and the light-transmitting encapsulant 40 can be a fluorescent gel, so the LED dies The blue light beams (not shown) projected by the chips 20 (the blue light-emitting diode chips) can directly pass through the light-transmitting encapsulation colloid 40 (the fluorescent colloid) or be reflected by the reflective insulating layers 102 and then Projected from the light-transmissive encapsulant 40 to generate a white light beam L similar to a fluorescent light source. the

Therefore, please refer to FIG. 4K again, the fourth embodiment of the present invention provides a light emitting diode packaging structure capable of positioning thermally conductive adhesive materials, which includes: a substrate unit 1, a thermally conductive adhesive unit, a light emitting unit 2, a conductive Unit W and a packaging unit 4. the

Wherein, the substrate unit 1 has a substrate body 10, a plurality of recessed spaces 10a formed on the upper surface of the substrate body 10, a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10, and a plurality of positive electrode conductive pads 11a exposed on the upper surface of the substrate body 10. The negative electrode conductive pad 11b on the upper surface of the substrate body 10 . In addition, the thermally conductive adhesive unit has a plurality of thermally conductive adhesive layers H respectively positioned in the recessed spaces 10a of the substrate unit 1, and each thermally conductive adhesive layer H is made of a plurality of solder balls or solder paste after passing through a tin furnace. The thermally conductive adhesive coating layer is formed (for example, as shown in FIG. 4C and FIG. 4D ). The light-emitting unit 2 has a plurality of light-emitting diode crystal grains 20 respectively disposed on the heat-conducting adhesive layer H and accommodated in the recessed spaces 10a, wherein each light-emitting diode grain 20 has a positive terminal P and A negative terminal N. the

Furthermore, the conductive unit W has a plurality of wires Wa, wherein every two wires Wa are respectively electrically connected between the positive terminal P of each LED chip 20 and each positive conductive pad 11a and are electrically connected to each other. Between the negative terminal N of each LED chip 20 and each negative conductive pad 11b. In other words, the positive terminal P and the negative terminal N of each LED chip 20 are electrically connected to each positive conductive pad 11a and each negative conductive pad 11b respectively through every two wires Wa. In addition, the package unit 4 has a transparent encapsulant 40 formed on the upper surface of the substrate body 10 to cover the LED chips 20 and the wires Wa. the

In addition, the fourth embodiment of the present invention further includes: a plurality of nickel/palladium/gold (Ni/Pd/Au) layers M respectively disposed on the bottoms of the LED grains 20, wherein each nickel/palladium/gold layer M is formed between each thermally conductive adhesive layer H and each LED chip 20 . the

In summary, the present invention designs one or more recessed spaces on the substrate body to accommodate multiple thermally conductive adhesive layers (such as solder balls or solder paste) and to accommodate multiple on the LED die. Therefore, through the use of the recessed space, not only the better positioning effect of the LED chips can be obtained, but also the better positioning of the LED chips can be achieved through the use of the thermally conductive adhesive layer. heat radiation. the

However, all scopes of the present invention should be based on the described claims, and all embodiments that conform to the spirit of the claims of the present invention and similar changes thereof should be included in the scope of the present invention. Within the scope of the invention, easily conceivable changes or modifications can be covered within the protection scope of the claims of this case. the

Claims (10)

1. the package structure for LED that can locate the heat conduction sticky material is characterized in that, comprising:

One base board unit; It has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;

One heat conduction adhesion unit, it has at least one sinking space that is positioned this base board unit and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein said at least one heat conduction adhesion coating and this heat dissipating layer are separated from one another;

One luminescence unit, it has many and is arranged on this heat conduction adhesion coating and is placed in the LED crystal particle in above-mentioned at least one sinking space, and wherein each LED crystal particle has a positive terminal and a negative pole end;

One conductive unit; It has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And

One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.

2. package structure for LED of locating the heat conduction sticky material as claimed in claim 1; It is characterized in that; Further comprise: a reflecting unit; It has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground, and the reflective colloid of this circulating type extends to a terminating point from a starting point, and this starting point is identical with the position of this terminating point; Wherein the reflective colloid of this circulating type is around those LED crystal particles; With form one be positioned at this substrate body top the spacing space of colloid, and this printing opacity packing colloid is limited in the spacing space of this colloid, and above-mentioned at least one sinking space is a trapezoidal shape groove.

3. package structure for LED of locating the heat conduction sticky material as claimed in claim 2; It is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc; The reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree; The end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm; The width of the reflective colloid of this circulating type bottom between 1.5～3mm, the thixotropic index of the reflective colloid of this circulating type between 4-6, and the reflective colloid of this circulating type be one be mixed with inorganic additive the white hot reflective colloid that hardens.

4. package structure for LED of locating the heat conduction sticky material as claimed in claim 1; It is characterized in that; Further comprise: a plurality of nickel/palladium/gold layers that are arranged at those LED crystal particle bottoms respectively; Wherein each nickel/palladium/gold layer forms between this heat conduction adhesion coating and each LED crystal particle, and serve as reasons many tin balls or tin cream of this heat conduction adhesion coating crossed formed heat conduction adhesion coating layer behind the tin stove.

5. the package structure for LED that can locate the heat conduction sticky material is characterized in that, comprising:

One base board unit; It has a substrate body, a plurality of sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;

One heat conduction adhesion unit, it has in a plurality of those sinking space that are positioned this base board unit respectively and is arranged at the heat conduction adhesion coating on this circuit substrate, and wherein a plurality of said heat conduction adhesion coatings and this heat dissipating layer are separated from one another;

One luminescence unit, it has many LED crystal particles that are arranged on this heat conduction adhesion coating respectively and are placed in those sinking space respectively, and wherein each LED crystal particle has a positive terminal and a negative pole end;

One conductive unit; It has many leads, and wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And

One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles and those leads.

6. package structure for LED of locating the heat conduction sticky material as claimed in claim 5; It is characterized in that, further comprise: a reflecting unit, it has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground; The reflective colloid of this circulating type extends to a terminating point from a starting point; And this starting point is identical with the position of this terminating point, and wherein the reflective colloid of this circulating type is around those LED crystal particles, with form one be positioned at this substrate body top the spacing space of colloid; And this printing opacity packing colloid is limited in the spacing space of this colloid, and each sinking space is a cup-shaped groove.

7. package structure for LED of locating the heat conduction sticky material as claimed in claim 5; It is characterized in that; Further comprise: a plurality of nickel/palladium/gold layers that are arranged at those LED crystal particle bottoms respectively; Wherein each nickel/palladium/gold layer forms between each heat conduction adhesion coating and each LED crystal particle, and serve as reasons many tin balls or tin cream of each heat conduction adhesion coating crossed formed heat conduction adhesion coating layer behind the tin stove.

8. the manufacture method that can locate the package structure for LED of heat conduction sticky material is characterized in that, comprises the following steps:

One base board unit is provided; It has a substrate body, at least one sinking space that forms in this substrate body upper surface, a plurality of anodal conductive welding pad that is exposed to this substrate body upper surface, and a plurality of negative pole conductive welding pad that are exposed to this substrate body upper surface, and wherein this substrate body has heat dissipating layer, and the reflective insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those anodal conductive welding pad and those negative pole conductive welding pad that a circuit substrate, is arranged at this circuit substrate bottom;

A plurality of heat conduction adhesion balls are put into this sinking space and are arranged on this circuit substrate, and wherein a plurality of said heat conduction adhesion balls and this heat dissipating layer are separated from one another;

Many LED crystal particles are arranged at respectively on those heat conduction adhesion balls, and wherein each LED crystal particle has a positive terminal and a negative pole end;

Cross the tin stove, those LED crystal particles are positioned the heat conduction adhesion coating in the sinking space of this base board unit so that those heat conduction adhesion balls form one;

See through many leads; Each LED crystal particle being electrically connected between each anodal conductive welding pad and each the negative pole conductive welding pad, wherein per two leads are electrically connected between positive terminal and each the anodal conductive welding pad of each LED crystal particle respectively and are electrically connected between the negative pole end and each negative pole conductive welding pad of each LED crystal particle; And

Be shaped a printing opacity packing colloid in this substrate body upper surface, to cover those LED crystal particles and those leads.

9. manufacture method of locating the package structure for LED of heat conduction sticky material as claimed in claim 8; It is characterized in that: this printing opacity packing colloid of above-mentioned shaping more advances one and comprises before the step of this substrate body upper surface: the mode with coating is coated with liquid glue material in the upper surface of the substrate body of this base board unit around ground; Solidify then should liquid state glue material to form the reflective colloid of a circulating type; The reflective colloid of this circulating type extends to a terminating point from a starting point; And this starting point is identical with the position of this terminating point; Wherein the reflective colloid of this circulating type is around those LED crystal particles, with form one be positioned at this substrate body top the spacing space of colloid, and this printing opacity packing colloid is limited in the spacing space of this colloid.

10. manufacture method of locating the package structure for LED of heat conduction sticky material as claimed in claim 8; It is characterized in that: each heat conduction adhesion ball is tin ball or tin cream; And the bottom of each LED crystal particle has one nickel/palladium/gold layer; Therefore this each nickel/palladium/the gold layer forms between this heat conduction adhesion coating and each LED crystal particle, and above-mentioned at least one sinking space is formed by a trapezoidal shape groove or by a plurality of cup-shaped grooves.

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