CN202049955U - Polycrystalline package structure for increasing the amount of current using a constant voltage power supply - Google Patents

Abstract

A polycrystal packaging structure using a constant voltage power supply and used for increasing the amount of current comprises a substrate unit, a light emitting unit, a current limiting unit, a frame unit and a packaging unit; the substrate unit is provided with a first crystal placing area and a second crystal placing area; the light-emitting unit is provided with a plurality of light-emitting diode chips which are electrically arranged on the first crystal placing area; the current limiting unit is provided with a plurality of current limiting chips which are electrically arranged on the second crystal placing area and are electrically connected with the light emitting unit; the frame unit is provided with a first surrounding frame colloid surrounding the plurality of light-emitting diode chips and a second surrounding frame colloid surrounding the plurality of current-limiting chips; the packaging unit is provided with a first packaging colloid which is surrounded by the first surrounding type frame colloid and is used for covering the plurality of light-emitting diode chips and a second packaging colloid which is surrounded by the second surrounding type frame colloid and is used for covering the plurality of current-limiting chips. This structure can use a constant voltage power supply as a source of power supply and can increase the amount of current supplied.

Description

Polycrystalline package structure for increasing the amount of current using a constant voltage power supply

technical field

The utility model relates to a polycrystalline packaging structure, in particular to a polycrystalline packaging structure which uses a constant voltage power supply and is used to increase the amount of current.

Background technique

The creation of electric lights can be said to have completely changed the way of life of all human beings. If we live without electric lights, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age. Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten filament lamps, and even the energy-saving lamps that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to recycle. Therefore, a packaging structure using light emitting diodes emerges accordingly.

Utility model content

The technical problem to be solved by the utility model is to provide a polycrystalline packaging structure, which can use a constant voltage power supply as a source of power supply and can increase the current supply according to different numbers of LED chips. In order to solve the above technical problems, the utility model provides a polycrystalline packaging structure using a constant voltage power supply and for increasing the amount of current, which includes: a substrate unit, which has a substrate body, a The first crystal mounting area, and a second crystal mounting area located on the upper surface of the substrate body; a light-emitting unit, which has a plurality of light-emitting diode chips electrically arranged on the first crystal mounting area; a current limiting unit It has a plurality of current limiting chips electrically arranged on the second crystal mounting area, and the plurality of current limiting chips are electrically connected to the light emitting unit; a frame unit has a surrounding shape formed on the upper surface of the substrate body The first surrounding frame colloid and a second surrounding frame colloid formed around the upper surface of the substrate body, the first surrounding frame colloid surrounds the above-mentioned plurality of light emitting diode chips to form a corresponding to the first placement The first colloid limiting space in the crystal area, and the second surrounding frame colloid surrounds a plurality of current limiting chips to form a second colloid limiting space corresponding to the second crystal placement area; a packaging unit, which has A first packaging colloid filled in the first colloid limiting space to cover the plurality of LED chips and a second packaging colloid filled in the second colloid limiting space to cover the plurality of current limiting chips.

The utility model also provides a polycrystalline packaging structure using a constant voltage power supply and used to increase the amount of current, which includes: a substrate unit, which has a substrate body, two first placed crystal area, and a second crystal mounting area located on the upper surface of the substrate body; a light emitting unit, which has at least one first light emitting module for generating a first color temperature and at least one first light emitting module for generating a second color temperature Two light-emitting modules, the above-mentioned at least one first light-emitting module has a plurality of first light-emitting diode chips electrically arranged on one of the first chip mounting regions, and the above-mentioned at least one second light-emitting module has a plurality of electrically arranged on the other The second light-emitting diode chip on the first crystal mounting area; a current limiting unit, which has a plurality of current limiting chips electrically arranged on the second crystal mounting area, and the multiple current limiting chips are electrically connected to the light emitting unit ; a frame unit, which has two first encircling frame colloids formed on the upper surface of the substrate body and a second encircling frame colloid formed on the upper surface of the substrate body, the two first encircling Type frame colloid surrounds the above-mentioned at least one first light-emitting module and the above-mentioned at least one second light-emitting module respectively to form two first colloid-limiting spaces corresponding to the above-mentioned two first crystal placement regions, and the second surrounding type The frame colloid surrounds a plurality of current limiting chips to form a second colloid limiting space corresponding to the second crystal placement area; The first encapsulant covering the at least one first light-emitting module and the at least one second light-emitting module respectively, and the second encapsulant filled in the second encapsulant space to cover a plurality of current limiting chips.

The utility model further provides a polycrystalline packaging structure using a constant voltage power supply and used to increase the amount of current, which includes: a substrate unit, which has a substrate body, two first placed on the upper surface of the substrate body crystal area, and a second crystal mounting area located on the upper surface of the substrate body; a light emitting unit, which has at least one first light emitting module for generating a first color temperature and at least one first light emitting module for generating a second color temperature Two light-emitting modules, wherein the above-mentioned at least one first light-emitting module has a plurality of first light-emitting diode chips electrically disposed on one of the first chip mounting regions, and the above-mentioned at least one second light-emitting module has a plurality of electrically disposed on another A second light-emitting diode chip on the first crystal mounting area; a current limiting unit, which has a plurality of current limiting chips electrically arranged on the second crystal mounting area, and the multiple current limiting chips are electrically connected to the light emitting diode chip. Unit; a frame unit, which has two first surrounding frame colloids formed around the upper surface of the substrate body and a second surrounding frame colloid formed around the upper surface of the substrate body, and one of the first The surrounding frame colloid surrounds another first surrounding frame colloid, and the above two first surrounding frame colloids respectively surround the above-mentioned at least one first light-emitting module and the above-mentioned at least one second light-emitting module, so as to form two corresponding to the above-mentioned two The first colloid limiting space of the first crystal placement area, the above-mentioned at least one second light-emitting module is located between the above-mentioned two first surrounding frame colloids, and the second surrounding frame colloids surround a plurality of current limiting chips, so as to forming a second colloidal limiting space corresponding to the second chip placement area; and a packaging unit, which has two fillings in the two first colloidal limiting spaces to cover the at least one first light-emitting module respectively. And the first encapsulation compound of the at least one second light-emitting module and a second encapsulation compound filled in the second colloid limiting space to cover a plurality of current limiting chips.

Therefore, the beneficial effect of the utility model is that: in addition to the design of "electrically connecting multiple light-emitting diode chips and multiple current limiting chips on the same substrate unit", the polycrystalline packaging structure of the utility model can be used The constant voltage power supply is used as the source of power supply, and it can also achieve the purpose of supplying different currents according to the number of LED chips used.

In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the accompanying drawings are only for reference and illustration, and are not intended to limit the present utility model.

Description of drawings

Fig. 1A is a three-dimensional schematic diagram of Embodiment 1 of the present utility model;

Fig. 1B is a schematic side view sectional view of Embodiment 1 of the utility model;

Fig. 1C is a schematic top view of Embodiment 1 of the present invention;

Fig. 1D is a functional block diagram of Embodiment 1 of the utility model;

FIG. 1E is a schematic circuit diagram of a 350mA current-limiting chip selected in Embodiment 1 of the present invention;

Fig. 1F is a schematic circuit diagram of selecting two 350mA current limiting chips in Embodiment 1 of the present invention;

Fig. 1G is a schematic circuit diagram of selecting three 350mA current-limiting chips in Embodiment 1 of the present invention;

Fig. 2A is a schematic top view of Embodiment 2 of the utility model;

Fig. 2B is a schematic side view sectional view of the second embodiment of the utility model;

Fig. 3 is a schematic top view of a third embodiment of the utility model;

Fig. 4A is a schematic top view of Embodiment 4 of the utility model;

Fig. 4B is a side view cross-sectional schematic diagram of Embodiment 4 of the present utility model;

Fig. 5A is a schematic top view of Embodiment 5 of the present utility model;

Fig. 5B is a side view cross-sectional schematic diagram of the fifth embodiment of the utility model;

Fig. 6A is a schematic top view of Embodiment 6 of the present utility model;

Fig. 6B is a schematic side view sectional view of Embodiment 6 of the present utility model;

Fig. 7A is a schematic top view of Embodiment 7 of the present utility model;

Fig. 7B is a schematic side view sectional view of Embodiment 7 of the present utility model;

Fig. 8 is a schematic top view of the eighth embodiment of the utility model;

Fig. 9A is a schematic top view of Embodiment 9 of the present utility model;

Fig. 9B is a schematic side view sectional view of Embodiment 9 of the present utility model;

Fig. 10 is a schematic side view sectional view of Embodiment 10 of the present utility model;

FIG. 11 is a schematic partial top view of the utility model using a plurality of spare welding pads.

[Description of reference signs of main components]

Constant voltage power supply S

Polycrystalline package structure Z

Substrate unit 1 Substrate body 10

                                                                             

                                                   

Conductive Pad 102

Positive pad P

Negative pad N

                                                                             

                                                                                                                                          

Two Crystal Area 12

                                                               

Light-emitting unit 2 LED chip 20

Positive electrode 201

Negative electrode 202

The first light-emitting module 2a The first light-emitting diode chip 20a

The second light-emitting module 2b The first light-emitting diode chip 20b

Current limiting unit C Current limiting chip C1

Frame unit 3 1st wrap-around frame colloid 30

The first surround border colloid 30A

                                                                                                                                  

T

                                       

Height Height H

Width D

                                                                           

Second -wiring border colloid 31

                                                                          

Encapsulation unit 4 1st encapsulant 40

The first encapsulant 40a

The first encapsulant 40b

The second encapsulant 41

Wire unit W Wire wire W1

The first group of light-emitting structures N1

The second group of light-emitting structures N2

Blue Beam L1

White Beam L2

Detailed ways

Embodiment one

As shown in FIG. 1A to FIG. 1D , Embodiment 1 of the present invention provides a polycrystalline packaging structure Z using a constant voltage power supply S for increasing current flow, which includes: a substrate unit 1 and a light emitting unit 2 , a current limiting unit C, a frame unit 3 and a package unit 4 .

The substrate unit 1 has a substrate body 10 , a first die placement region 11 on the upper surface of the substrate body 10 , and a second die placement region 12 on the upper surface of the substrate body 10 . For example, the substrate body 10 may have a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100, and a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100. And it is used to expose the insulating layer 103 of the plurality of conductive pads 102 .

The light emitting unit 2 has a plurality of light emitting diode chips 20 (unpackaged LED dies) electrically disposed on the first die mounting area 11 . For example, each light emitting diode chip 20 can be a blue light emitting diode chip, and each light emitting diode chip 20 can be electrically disposed on the first side of the substrate unit 1 by wire-bonding. placed on the crystal region 11.

The current limiting unit C has a plurality of current limiting chips C1 electrically disposed on the second chip mounting area 12 (only one current limiting chip is disclosed in the drawings of the present utility model as a representative). A plurality of current limiting chips C1 are electrically connected to the light emitting unit 2 to provide a specific current for the use of the light emitting unit 2 . For example, a plurality of current-limiting chips C1 can be electrically disposed on the second die-mounting area 12 of the substrate unit 1 and electrically connected between the constant voltage source supplier S and the light emitting unit 2 by way of bonding. (as shown in Figure 1D). In addition, because the plurality of current limiting chips C1 can serve as a bridge between the constant voltage source supplier S and the light emitting unit 2 , so that the light emitting unit 2 can obtain a stable current supply from the constant voltage source supplier S.

The frame unit 3 has a first surrounding frame glue 30 that can be formed around the upper surface of the substrate body 10 by coating and a second surrounding frame glue 30 that can be formed around the upper surface of the substrate body 10 by coating. Wrap-around frame colloid 31. The first surrounding frame glue 30 surrounds a plurality of LED chips 20 to form a first glue limiting space 300 corresponding to the first die mounting area 11, and the second surrounding frame glue 31 surrounds a plurality of current limiting chips C1 , to form a second colloid-limiting space 310 corresponding to the second crystal placement region 12 . In addition, the first surrounding frame glue 30 and the second surrounding frame glue 31 are separated from each other by a specific distance.

For example, the manufacturing method of the first surrounding frame glue 30 (or the second surrounding frame glue 31) includes at least the following steps: (1) First, apply liquid glue material (not shown) around the The upper surface of the substrate body 10 . The liquid glue can be arbitrarily surrounded into a predetermined shape (such as a circle, a square, a rectangle, etc.), and the starting point and the ending point of the surrounding coating liquid glue on the upper surface of the substrate body 10 are approximately the same position, Therefore, the starting point and the ending point have a slightly protruding appearance of the glue; (2) Then, the liquid glue is cured to form the first surrounding frame glue 30 . Therefore, the upper surface of the first surrounding frame glue 30 can present an arc shape, and the angle θ of the first surrounding frame glue 30 relative to the arc tangent T of the upper surface of the substrate body 10 can be between 40 and 50 degrees. The height H of the top surface of the first surrounding frame glue 30 relative to the upper surface of the substrate body 10 may be between 0.3 and 0.7 mm, and the width D of the bottom of the first surrounding frame glue 30 may be between 1.5 and 3 mm, The thixotropic index of the first surrounding frame glue 30 can be between 4 and 6, and the first surrounding frame glue 30 can be a white thermosetting frame glue mixed with inorganic additives.

The encapsulation unit 4 has a first encapsulant 40 filled in the first encapsulation space 300 to cover a plurality of LED chips 20 and a first encapsulant 40 filled in the second encapsulation space 310 to cover a plurality of current limiting chips C1. The second encapsulant 41 . The first encapsulant 40 and the second encapsulant 41 are separated from each other by a specific distance, and the first surrounding frame compound 30 and the second encapsulant 41 are separated from each other by a specific distance. For example, since the first encapsulant 40 can be a light-transmitting colloid (such as fluorescent colloid or transparent colloid), the blue light beam L1 projected by the plurality of LED chips 20 (such as a plurality of blue LED chips) It can pass through the first encapsulant 40 (such as fluorescent colloid) to generate a white light beam L2 similar to a fluorescent light source. In addition, the second encapsulant 41 can be an opaque glue, which is used to cover the multiple current limiting chips C1 to prevent the multiple current limiting chips C1 from being damaged by the white light beam L2.

The substrate unit 1 further includes: at least one heat insulation slit 13 penetrating the substrate body 10, and the heat insulation slit 13 can be located between the light emitting unit 2 and the current limiting unit C or between the first surrounding frame glue 30 and the second Between the colloids 31 of the surrounding frame. Therefore, through the use of the heat-insulating slit 13, the heat transfer path between the current limiting unit C and the light emitting unit 2 can be greatly reduced, and the utility model can effectively slow down the flow caused by one or more current limiting chips of the current limiting unit C. The speed at which the heat generated by C1 is transferred to the light-emitting unit 2.

As shown in Figure 1E to Figure 1G, for example, when a plurality of light-emitting diode chips 20 connected in series need a current supply of 350mA, the designer can choose a 350mA current limiting chip C1 to achieve it; When a series of light-emitting diode chips 20 need a current supply of 700mA, the designer can choose two 350mA current limiting chips C1 to achieve each group of multiple series-connected light-emitting diode chips 20 in parallel. The amount of current required; when three groups of LED chips 20 connected in series need a current supply of 1050mA, the designer can choose three 350mA current-limiting chips C1 to achieve each group of multiple LED chips in parallel. The amount of current required by the LED chips 20 connected in series. By analogy, the purpose of supplying different currents can be achieved based on the use of different groups and numbers of LED chips 20 . In other words, the utility model can not only directly use the constant voltage power supply S to obtain the required power, but the utility model can also increase the power required by the light-emitting unit 2 through the above-mentioned multiple current-limiting chips C1 connected in parallel. flow.

Embodiment two

From the comparison of FIG. 2A and FIG. 1A (or FIG. 2B and FIG. 1B ), the difference from the first embodiment is that the substrate unit 1 of the second embodiment can omit the fabrication of the thermal insulation slit 13 . For example, when the current limiting unit C does not generate too much heat, the solution of Embodiment 2 of the present invention can be considered.

Embodiment three

From the comparison of Fig. 3 and Fig. 1C, the difference from Embodiment 1 is that in Embodiment 3, the current limiting unit C is located between the first surrounding frame colloid 30 and the second surrounding frame colloid 31, and the second surrounding type The frame compound 31 surrounds the first surrounding frame compound 30 , the second encapsulant 41 surrounds the first encapsulant 40 , and the first encircling frame compound 30 and the second encapsulant 41 are connected to each other. In other words, the first surrounding frame gel 30 only surrounds the plurality of LED chips 20, while the second surrounding frame gel 31 simultaneously surrounds the multiple LED chips 20, the first surrounding frame gel 30 and the multiple current limiting chips. C1, therefore, the first surrounding frame glue 30 and the second surrounding frame glue 31 are arranged in a pattern similar to concentric circles.

Embodiment four

As shown in Figure 4A and Figure 4B, Embodiment 4 of the present invention provides a polycrystalline package structure Z using a constant voltage power supply (not shown), which includes: a substrate unit 1, a light emitting unit 2, a The current limiting unit C, a frame unit 3 and a package unit 4 .

The substrate unit 1 has a substrate body 10 , two first die placement regions 11 on the upper surface of the substrate body 10 , and a second die placement region 12 on the upper surface of the substrate body 10 . For example, the substrate body 10 may have a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100, and a plurality of conductive pads 102 disposed on the upper surface of the circuit substrate 100. And it is used to expose the insulating layer 103 of the plurality of conductive pads 102 .

The light emitting unit 2 has at least one first light emitting module 2a for generating a first color temperature and at least one second light emitting module 2b for generating a second color temperature. The first light-emitting module 2a has a plurality of first light-emitting diode chips 20a electrically disposed on one of the first die-mounting regions 11, and the second light-emitting module 2b has a plurality of first light-emitting diode chips 20a electrically disposed on the other first die-mounting region 11. on the second light emitting diode chip 20b.

The current limiting unit C has a plurality of current limiting chips C1 electrically disposed on the second die mounting area 12 . A plurality of current limiting chips C1 are electrically connected to the light emitting unit 2 to provide a specific and stable current for the first light emitting module 2 a and the second light emitting module 2 b respectively.

The frame unit 3 has two first surrounding frame adhesives 30 formed around the upper surface of the substrate body 10 and a second surrounding frame adhesive 31 formed around the upper surface of the substrate body 10 . Two first surrounding frame colloids 30 respectively surround the first light-emitting module 2a and the second light-emitting module 2b to respectively form two first colloid limiting spaces 300 corresponding to the two first crystal mounting regions 11, and the second The surrounding frame glue 31 surrounds the plurality of current limiting chips C1 to form a second glue limiting space 310 corresponding to the second die placement area 12 . In addition, the two first surrounding frame glues 30 are separated from each other by a predetermined distance, and the two first surrounding frame glues 30 are arranged on the substrate body 10 in parallel with each other, and each first surrounding frame glue 30 is connected to the second The surrounding frame glues 31 are separated from each other by a specific distance.

The encapsulation unit 4 has two first encapsulants (40a, 40b) filled in the two first colloid limiting spaces 300 to respectively cover the first light-emitting module 2a and the second light-emitting module 2b, and one encapsulant filled in the second colloid The second encapsulant 41 covering the plurality of current limiting chips C1 is inside the limiting space 310 . Each of the first encapsulant ( 40 a , 40 b ) and the second encapsulant 41 are separated from each other by a certain distance, and each of the first encircling frame compound 30 and the second encapsulant 41 are separated from each other by a certain distance. For example, one of the first packaging colloids 40a can be a fluorescent colloid with a first color, the other first packaging colloid 40b can be a fluorescent colloid with a second color, and the second packaging colloid 41 can be A light-tight colloid with a light-shielding effect.

The substrate unit 1 further includes: at least one heat insulation slit 13 penetrating the substrate body 10, and the heat insulation slit 13 can be located between the light emitting unit 2 and the current limiting unit C or between one of the first surrounding frame glue 30 and the Between the second surrounding frame colloids 31 , the function of the thermal insulation slit 13 is the same as that of the first embodiment.

The first group of light-emitting structures N1 may include: a substrate body 10 , a plurality of first LED chips 20 a , one of the first surrounding frame adhesives 30 and one of the first packaging adhesives 40 a. The second group of light-emitting structures N2 may include: a substrate body 10 , a plurality of second LED chips 20 b , another first surrounding frame compound 30 and another first packaging compound 40 b.

Embodiment five

From the comparison between Fig. 5A and Fig. 4A (or Fig. 5B and Fig. 4B), the difference from Embodiment 4 is that the two first surrounding frame glues 30 of the frame unit 3 of Embodiment 5 can be arranged in parallel with each other and connected together .

Embodiment six

From the comparison of FIG. 6A and FIG. 5A (or FIG. 6B and FIG. 5B ), the difference from the fifth embodiment is that in the sixth embodiment, each first surrounding frame colloid 30 can be a fluorescent colloid. In other words, the present invention can selectively add fluorescent powder in each first encircling frame colloid 30 according to different needs, thereby effectively reducing the occurrence of the two first encapsulation colloids (40a, 40a, 40b) The case of dark bands between.

Embodiment seven

As shown in FIG. 7A and FIG. 7B , Embodiment 7 of the present utility model provides a polycrystalline packaging structure Z that uses a constant voltage power supply (not shown) and is used to increase the amount of current, which includes: a substrate unit 1, A light emitting unit 2 , a current limiting unit C, a frame unit 3 and a packaging unit 4 .

The substrate unit 1 has a substrate body 10 , two first die placement regions 11 on the upper surface of the substrate body 10 , and a second die placement region 12 on the upper surface of the substrate body 10 . The light emitting unit 2 has at least one first light emitting module 2a for generating a first color temperature and at least one second light emitting module 2b for generating a second color temperature. The first light-emitting module 2a has a plurality of first light-emitting diode chips 20a electrically disposed on one of the first die-mounting regions 11, and the second light-emitting module 2b has a plurality of first light-emitting diode chips 20a electrically disposed on the other first die-mounting region 11. on the second light emitting diode chip 20b. The current limiting unit C has a plurality of current limiting chips C1 electrically disposed on the second die mounting area 12 . A plurality of current limiting chips C1 are electrically connected to the light emitting unit 2 .

The frame unit 3 has two first surrounding frame glues (30a, 30b) formed on the upper surface of the substrate body 10 and a second surrounding frame glue 31 formed around the upper surface of the substrate body 10, and one of them The first surrounding frame glue 30b surrounds another first surrounding frame glue 30a, so the two first surrounding frame glues (30a, 30b) are arranged in a pattern similar to concentric circles. Two first surrounding frame colloids (30a, 30b) respectively surround the first light-emitting module 2a and the second light-emitting module 2b to form two first colloid limiting spaces 300 corresponding to the two first crystal placement regions 11 , the second light-emitting module 2b is located between two first surrounding frame colloids (30a, 30b), and the second surrounding frame colloid 31 surrounds a plurality of current limiting chips C1 to form a The second colloid limiting space 310.

The encapsulation unit 4 has two first encapsulants (40a, 40b) filled in the two first colloid limiting spaces 300 to respectively cover the first light-emitting module 2a and the second light-emitting module 2b, and one encapsulant filled in the second colloid The second encapsulant 41 covering the plurality of current limiting chips C1 is inside the limiting space 310 .

The first group of light emitting structures N1 may include: a substrate body 10 , a plurality of first LED chips 20 a , one of the first surrounding frame glue 30 a and one of the first packaging glue 40 a. The second group of light-emitting structures N2 may include: a substrate body 10 , a plurality of second LED chips 20 b , another first surrounding frame glue 30 b and another first packaging glue 40 b. The first group of light-emitting structures N1 with a lower color temperature is disposed on the inner circle, and the second group of light-emitting structures N2 with a higher color temperature is disposed on the outer circle. Embodiment eight

From the comparison between Fig. 8 and Fig. 7A, the difference from Embodiment 7 is that in Embodiment 8, the positions of the first group of light-emitting structures N1 and the second group of light-emitting structures N2 are reversed, so the first group with a lower color temperature The light emitting structure N1 is disposed on the outer circle, and the second group of light emitting structures N2 with higher color temperature is disposed on the inner circle.

Embodiment nine

From the comparison of FIG. 9A and FIG. 7A (or FIG. 9B and FIG. 7B ), the difference from the seventh embodiment is that in the ninth embodiment, both the first surrounding frame colloids (30a, 30b) can be fluorescent colloids. In other words, the present invention can selectively add fluorescent powder in the two first surrounding frame colloids (30a, 30b) according to different needs, so that the light source (as shown by the upward arrow in Figure 9B) It can be guided between the two first packaging colloids (40a, 40b), thereby reducing the occurrence of dark bands between the two first packaging colloids (40a, 40b).

Embodiment ten

From the comparison between Fig. 10 and Fig. 7B, the difference from the seventh embodiment is that in the tenth embodiment, the first surrounding frame colloid 30a of the inner ring can be fluorescent colloid, while the first surrounding frame colloid 30b of the outer ring can be For reflective colloid. In other words, the present invention can selectively add fluorescent powder in the first surrounding frame colloid 30a of the inner ring according to different needs, so that the light source (as shown by the upward arrow in FIG. 10 ) can be guided It is introduced between the two first packaging colloids (40a, 40b), thereby reducing the occurrence of dark bands between the two first packaging colloids (40a, 40b). In addition, through the design of "the first surrounding frame colloid 30b of the outer ring is reflective colloid", the light source projected by the utility model can obtain a better light-gathering effect.

In addition, as shown in FIG. 11 , in Embodiments 1 to 10, the substrate unit 1 has a plurality of positive pads P disposed on the upper surface of the substrate body 10 and a plurality of negative pads N disposed on the upper surface of the substrate body 10. , each LED chip 20 has an anode 201 and a cathode 202, the anode 201 of each LED chip 20 corresponds to at least two of the plurality of anode pads P, and the cathode 202 of each LED chip 20 is in phase Corresponding to at least two of the plurality of negative pads N. In addition, the wire unit W has a plurality of wires W1. Every two wires W1 are respectively electrically connected between the anode 201 of each LED chip 20 and one of the at least two anode pads P and electrically connected between the cathode 202 of each LED chip 20 and at least two of them. between one of the negative pads N.

Because the anode 201 and the cathode 202 of each light-emitting diode chip have at least one spare anode pad P and at least one spare cathode pad N respectively, so when one end of the wire W1 is hit (welded) on one of the anode pads P or When the negative pad N fails (causing floating soldering, that is, there is no electrical connection between the wire W1 and the "positive pad P or negative pad N"), the manufacturer does not need to clear the wire formed on the positive pad due to the failure of the wire. The welding slag on the surface of the welding pad P (or the welding slag on the surface of the negative electrode welding pad N), one end of the wire W1 can be hit on another positive electrode welding pad P (or another negative electrode welding pad N) to save welding Line time (improving the efficiency of wire bonding) and increasing the yield of wire bonding.

To sum up, in addition to the design of "electrically connecting multiple light-emitting diode chips and multiple current-limiting chips to the same substrate unit", the utility model enables the polycrystalline packaging structure of the utility model to use constant voltage The power supply is used as the source of power supply, and can also achieve the purpose of supplying different amounts of current according to the number of LED chips used.

The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, all equivalent technical changes made by using the description and accompanying drawings of the present utility model are included in this utility model. new type of protection.

Claims (10)

1. a polycrystalline encapsulating structure that uses the constant voltage supply supply and be used to increase the magnitude of current is characterized in that, comprising:

One base board unit, it has first crystal area, and second crystal area that is positioned at this substrate body upper surface that a substrate body, is positioned at this substrate body upper surface;

One luminescence unit, it has a plurality of light-emitting diode chip for backlight unit that electrically are arranged on this first crystal area;

One current limliting unit, it has a plurality of current limliting chips that electrically are arranged on this second crystal area, and a plurality of current limliting chips are electrically connected at this luminescence unit;

One frame unit, it has first a circulating type frame colloid and that forms in this substrate body upper surface around ground and forms in the second circulating type frame colloid of this substrate body upper surface around ground, this first circulating type frame colloid is around above-mentioned a plurality of light-emitting diode chip for backlight unit, to form a spacing space of first colloid corresponding to this first crystal area, and this second circulating type frame colloid is around a plurality of current limliting chips, to form a spacing space of second colloid corresponding to this second crystal area; And

One encapsulation unit, it has one and is filled in this spacing space of first colloid and is filled in this spacing space of second colloid to cover second packing colloid of a plurality of current limliting chips with first packing colloid and that covers above-mentioned a plurality of light-emitting diode chip for backlight unit.

2. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, each light-emitting diode chip for backlight unit is a blue led chips, this first packing colloid is a fluorescent colloid or a transparent colloid, this second packing colloid is a light tight colloid, and above-mentioned a plurality of current limliting chip is parallel with one another.

3. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, the upper surface of this first circulating type frame colloid is a circular arc, this first circulating type frame colloid with respect to the angle of the circular arc tangential line of this substrate body upper surface between 40 to 50 degree, the end face of this first circulating type frame colloid with respect to the height of this substrate body upper surface between 0.3 to 0.7mm, the width of this first circulating type frame colloid bottom is between 1.5 to 3mm, the thixotropic index of this first circulating type frame colloid is between 4 to 6, and this first circulating type frame colloid is one to be mixed with the white hot sclerosis frame colloid of inorganic additive.

4. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface, each light-emitting diode chip for backlight unit has an anodal and negative pole, in anodal corresponding above-mentioned a plurality of anodal weld pads of each light-emitting diode chip for backlight unit at least two, and in the corresponding above-mentioned a plurality of negative pole weld pads of the negative pole of each light-emitting diode chip for backlight unit at least two.

5. use constant voltage supply supply as claimed in claim 4 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, further comprise: a lead unit, it has many leads, wherein per two leads be electrically connected between the positive pole of each light-emitting diode chip for backlight unit and in above-mentioned at least two anodal weld pads one of them respectively and be electrically connected at the negative pole of each light-emitting diode chip for backlight unit and in above-mentioned at least two negative pole weld pads one of them between.

6. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, this first circulating type frame colloid and this second circulating type frame colloid specific range separated from one another, this first packing colloid and this second packing colloid specific range separated from one another, and this first circulating type frame colloid and this second packing colloid specific range separated from one another.

7. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, this second circulating type frame colloid is around this first circulating type frame colloid, this second packing colloid is around this first packing colloid, and this first circulating type frame colloid and this second packing colloid are connected with each other.

8. use constant voltage supply supply as claimed in claim 1 and be used to increase the polycrystalline encapsulating structure of the magnitude of current, it is characterized in that, this base board unit has at least one heat insulation slit that runs through this substrate body, and above-mentioned at least one heat insulation slit is between this luminescence unit and this current limliting unit or between this first circulating type frame colloid and this second circulating type frame colloid.

9. a polycrystalline encapsulating structure that uses the constant voltage supply supply and be used to increase the magnitude of current is characterized in that, comprising:

One base board unit, it has first crystal area, and second crystal area that is positioned at this substrate body upper surface that a substrate body, two are positioned at this substrate body upper surface;

One luminescence unit, it has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature, above-mentioned at least one first light emitting module has a plurality of first light-emitting diode chip for backlight unit that electrically are arranged on one first crystal area wherein, and above-mentioned at least one second light emitting module has a plurality of second light-emitting diode chip for backlight unit that electrically are arranged on other one first crystal area;

One current limliting unit, it has a plurality of current limliting chips that electrically are arranged on this second crystal area, and a plurality of current limliting chips are electrically connected at this luminescence unit;

One frame unit, it has two first circulating type frame colloids and that form in this substrate body upper surface around ground and forms in the second circulating type frame colloid of this substrate body upper surface around ground, above-mentioned two first circulating type frame colloids are respectively around above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module, to form the spacing space of first colloid of two corresponding above-mentioned two first crystal areas respectively, and this second circulating type frame colloid is around a plurality of current limliting chips, to form a spacing space of second colloid corresponding to this second crystal area; And

One encapsulation unit, it has two and is filled in respectively in above-mentioned two the first spacing spaces of colloid and is filled in this spacing space of second colloid to cover second packing colloid of a plurality of current limliting chips with first packing colloid and that covers above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively.

10. a polycrystalline encapsulating structure that uses the constant voltage supply supply and be used to increase the magnitude of current is characterized in that, comprising:

One base board unit, it has first crystal area, and second crystal area that is positioned at this substrate body upper surface that a substrate body, two are positioned at this substrate body upper surface;

One luminescence unit, it has at least one first light emitting module and at least one second light emitting module that is used to produce second kind of colour temperature that is used to produce first kind of colour temperature, wherein above-mentioned at least one first light emitting module has a plurality of first light-emitting diode chip for backlight unit that electrically are arranged on one first crystal area wherein, and above-mentioned at least one second light emitting module has a plurality of second light-emitting diode chip for backlight unit that electrically are arranged on other one first crystal area;

One current limliting unit, it has a plurality of current limliting chips that electrically are arranged on this second crystal area, and a plurality of current limliting chips are electrically connected at this luminescence unit;

One frame unit, it has two first circulating type frame colloids and that form in this substrate body upper surface around ground and forms in the second circulating type frame colloid of this substrate body upper surface around ground, and one of them first circulating type frame colloid is around the another one first circulating type frame colloid, above-mentioned two first circulating type frame colloids are respectively around above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module, to form the spacing space of first colloid of two corresponding above-mentioned two first crystal areas respectively, above-mentioned at least one second light emitting module is between above-mentioned two first circulating type frame colloids, and this second circulating type frame colloid is around a plurality of current limliting chips, to form a spacing space of second colloid corresponding to this second crystal area; And

One encapsulation unit, it has two and is filled in respectively in above-mentioned two the first spacing spaces of colloid and is filled in this spacing space of second colloid to cover second packing colloid of a plurality of current limliting chips with first packing colloid and that covers above-mentioned at least one first light emitting module and above-mentioned at least one second light emitting module respectively.

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