[go: up one dir, main page]

CN102062793B - Probe Cards with Structurally Reinforced Test Sockets - Google Patents

Probe Cards with Structurally Reinforced Test Sockets Download PDF

Info

Publication number
CN102062793B
CN102062793B CN 200910222020 CN200910222020A CN102062793B CN 102062793 B CN102062793 B CN 102062793B CN 200910222020 CN200910222020 CN 200910222020 CN 200910222020 A CN200910222020 A CN 200910222020A CN 102062793 B CN102062793 B CN 102062793B
Authority
CN
China
Prior art keywords
reinforcement members
housing
accommodation space
test jack
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 200910222020
Other languages
Chinese (zh)
Other versions
CN102062793A (en
Inventor
曾赢慧
张久芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
King Yuan Electronics Co Ltd
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to CN 200910222020 priority Critical patent/CN102062793B/en
Publication of CN102062793A publication Critical patent/CN102062793A/en
Application granted granted Critical
Publication of CN102062793B publication Critical patent/CN102062793B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Measuring Leads Or Probes (AREA)

Abstract

The invention discloses a probe card and a structurally reinforced test socket therein, wherein the structurally reinforced test socket mainly comprises a plurality of test probes, a flat shell, a cover body, a plurality of first locking assemblies, at least one first reinforcing member, at least one second reinforcing member and a plurality of second locking assemblies. The shell is provided with at least one first accommodating space and at least one second accommodating space which are respectively used for arranging a first strengthening member and a second strengthening member, and a plurality of second locking assemblies penetrate through the first strengthening member, the shell and the second strengthening member, so that the shell is firmly clamped between the first strengthening member and the second strengthening member, and the Young coefficients of the first strengthening member and the second strengthening member are higher than that of the shell.

Description

Probe and structure-reinforced test jack wherein
Technical field
The present invention system relates to probe and wherein test jack, particularly is applied to the probe of wafer sort and wherein structure-reinforced test jack relevant for a kind of.
Background technology
Now in order to make electronic product meet multifunctionality and the light and handy propensity to consume of appearance and modeling, semiconductor packages tends to the technical development of wafer-level chip scale package (Wafer Level Chip SizePackage/WLCSP) gradually, wafer-level chip scale package and traditional different being of chip size packages, wafer-level chip scale package is directly to carry out packaging technology at wafer, and then cutting, through namely becoming the integrated circuit (IC) products that single encapsulation is finished after the cutting.The advantage of wafer-level chip scale package is, the finished-product volume that encapsulation is finished is less, can save the making of filler, lead frame and substrate, omit the techniques such as sticking crystalline substance and routing, therefore significantly reduce outside material and the cost of labor, also shorten the process time of encapsulation and can improve production yield and production capacity.But wafer-level chip scale package is a kind of encapsulating structure of size microminiaturization, and its package dimension approaches with chip size or equates, when therefore carrying out the wafer-level chip scale package test, the size of chip and quantity also can cause the difficulty of test.
Take 128 test sections (Testing side) of while testing wafer level chip scale package as example, wherein each test section may be defined as the one chip (Chip) on the wafer-level chip scale package, and have 8 contacts on each one chip, need be equiped with 1024 spring probes so want to test simultaneously in the test jack of 128 chips, test because each contact need use 8 spring probes.But because testing simultaneously 1024 contacts, distance can be dwindled between then being bound between contact and contact, relatively the distance of 1024 pins in the test jack also can be dwindled, but this moment is because area and the volume of test jack there is no change, so also have in the situation of reduction in the diagonal distance of test specification relatively, 1024 spring probes in the test jack will be because of the inequality of acting force when testing, cause the bending (socket housing bending) of test jack, in addition, the contraposition difficulty that also can cause operating personnel to test, spended time is in the contraposition of chip and test jack, and can cause loose contact serious the time, test can't be carried out smoothly, or cause test result unreliable, even must resurvey, cause expending time in and expense.For the industry of paying attention to timeliness and wish reduction cost, still remain to be improved.
Summary of the invention
In order to solve the desirable not to the utmost part of above-mentioned prior art, the invention provides a kind of structure-reinforced test jack, mainly comprise housing, lid and a plurality of first lock-in component of a plurality of test probes, flat.Housing has first surface and second, and the second face is offered a depressed part and is installed with wherein for lid, and a plurality of the first lock-in components are connected to each other locking with housing and lid.Structure-reinforced test jack further comprises at least one first reinforcement members, at least one second reinforcement members and a plurality of the second lock-in component, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the young's modulus of housing.The first surface of housing is concaved with at least one first accommodation space, and the first accommodation space is in order to arranging the first reinforcement members, and makes the first reinforcement members not protrude from the first surface of housing.Be formed with at least one second accommodation space between housing and the lid, the second accommodation space is in order to arranging the second reinforcement members, and makes the second reinforcement members corresponding to the first reinforcement members.Above-mentioned a plurality of the second lock-in components penetrate the first reinforcement members, housing and the second reinforcement members, housing firmly is held between the first reinforcement members and the second reinforcement members, and interosculates.In addition, above-mentioned a plurality of test probes penetrate housing and lid simultaneously, and the one end is in order to the contact semiconductor device, and the other end forms (PCBassembly) in order to the contact circuit plate.
Therefore, fundamental purpose of the present invention is to provide a kind of structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, utilize the second lock-in component to penetrate the first reinforcement members, housing and the second reinforcement members, housing firmly is held between the first reinforcement members and the second reinforcement members, by this intensity that can increase test jack, make test jack be difficult for causing bending.
Secondary objective of the present invention is to provide a kind of structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the young's modulus of housing, therefore test jack can be under outward appearance, constancy of volume, increase the intensity of test jack, make test jack be difficult for causing bending, reduce the test jack cost of manufacture.
Another object of the present invention is to provide a kind of structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the young's modulus of housing, when the quantity of the test probe in the test jack increases, still can keep the intensity of test jack, make test jack be difficult for causing bending, and then promote tested productivity.
A further object of the present invention is to provide a kind of structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, when carrying out high temperature or low-temperature test, for example, probe temperature is between-40 ℃ to 120 ℃, and this structure-reinforced test jack can avoid producing because of temperature variation the problem of distortion, makes in the contraposition of chip to be measured and test jack, keep good electrical contact, improve the fiduciary level of test result.
In addition, the present invention further provides a kind of probe, consist predominantly of the structure-reinforced test jack that a circuit board forms and is locked in circuit board composition central part.Wherein structure-reinforced test jack mainly comprises housing, lid and a plurality of first lock-in component of a plurality of test probes, flat.Housing has first surface and second, and the second face is offered a depressed part and is installed with wherein for lid, and a plurality of the first lock-in components are connected to each other locking with housing and lid.Structure-reinforced test jack further comprises at least one first reinforcement members, at least one second reinforcement members and a plurality of the second lock-in component, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the young's modulus of housing.The first surface of housing is concaved with at least one first accommodation space, and the first accommodation space is in order to arranging the first reinforcement members, and makes the first reinforcement members not protrude from the first surface of housing.Be formed with at least one second accommodation space between housing and the lid, the second accommodation space is in order to arranging the second reinforcement members, and makes the second reinforcement members corresponding to the first reinforcement members.Above-mentioned a plurality of the second lock-in components penetrate the first reinforcement members, housing and the second reinforcement members, housing firmly is held between the first reinforcement members and the second reinforcement members, and interosculates.
Therefore, a further object of the present invention is to provide a kind of probe, wherein employed structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, utilize the second lock-in component to penetrate the first reinforcement members, housing and the second reinforcement members, housing firmly is held between the first reinforcement members and the second reinforcement members, by this intensity that can increase test jack, makes test jack be difficult for causing bending.
A further object of the present invention is to provide a kind of probe, wherein employed structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the characteristic of the young's modulus of housing, therefore test jack can be under outward appearance, constancy of volume, can increase the intensity of test jack, make test jack be difficult for causing bending, reduce the test jack cost of manufacture.
A further object of the present invention is to provide a kind of probe, wherein employed structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, and the young's modulus of the first reinforcement members and the second reinforcement members is higher than the characteristic of the young's modulus of housing, when the quantity of the test probe in the test jack increases, still can keep the intensity of test jack, make test jack be difficult for causing bending, and then promote tested productivity.
A further object of the present invention is to provide a kind of probe, wherein employed structure-reinforced test jack, have the first reinforcement members and the second reinforcement members, when carrying out high temperature or low-temperature test, for example, probe temperature is between-40 ℃ to 120 ℃, this structure-reinforced test jack can avoid producing because of temperature variation the problem of distortion, make in the contraposition of chip to be measured and test jack, keep good electrical contact, improve the fiduciary level of test result.
Description of drawings
Fig. 1 is an explosive view, and the first preferred embodiment that proposes according to the present invention is a kind of structure-reinforced test jack;
Fig. 2 is a synoptic diagram, and the first preferred embodiment that proposes according to the present invention is a kind of second icon of structure-reinforced test jack;
Fig. 3 is a cut-open view, and the first preferred embodiment that proposes according to the present invention is a kind of structure-reinforced test jack.
[main element symbol description]
Structure-reinforced test jack 100
Test probe 1
Housing 2
First surface 21
The first accommodation space 211
Second 22
Depressed part 221
Through hole 23
Lid 3
The first lock-in component 4
The first reinforcement members 5
Screw 51
The second reinforcement members 6
Through hole 61
The second lock-in component 7
The second accommodation space 8
Circuit board forms 9
Embodiment
Because the present invention discloses the required probe of a kind of wafer sort and structure-reinforced test jack wherein, the probe of wherein utilizing and the use principle of test jack and basic function, for having, correlative technology field knows that usually the knowledgeable can understand, so with explanation hereinafter, no longer complete description.Simultaneously, graphic with what hereinafter contrasted, express the structural representation relevant with feature of the present invention, also do not need formerly to chat bright according to the complete drafting of physical size.
At first please refer to Fig. 1, according to the first preferred embodiment provided by the present invention, be a kind of explosive view of structure-reinforced test jack 100, mainly comprise housing 2, the lid 3 and a plurality of the first lock-in components 4 of a plurality of test probes 1, flat, housing 2 has first surface 21 and second 22.Please refer to Fig. 2, is second 22 of housing 2, and the depressed part 221 that second 22 central part of its middle shell 2 is offered a strip groove is installed with wherein for lid 3.Please continue with reference to figure 1, above-mentioned a plurality of the first lock-in components 4 are that housing 2 and lid 3 are connected to each other locking, and the material of housing 2 and lid 3 all is as good take ambroin.A plurality of test probes 1 penetrate housing 2 and lid 3 simultaneously, and the one end is in order to contact semiconductor device (not icon), and the other end forms 9 (PCB assembly) in order to contact a circuit board.
When being attached on the circuit board (PCB) for fear of test jack, the acting force of the spring probe on the test probe will cause test jack to produce bending (Bending), so that contraposition is difficult, loose contact.Structure-reinforced test jack 100 of the present invention further comprises at least one first reinforcement members 5, at least one second reinforcement members 6 and a plurality of the second lock-in components 7, wherein the young's modulus of the first reinforcement members 5 and the second reinforcement members 6 is higher than the young's modulus of housing 2, and the material of the first reinforcement members 5 and the second reinforcement members 6, configuration and size homogeneous phase are all good.In this preferred embodiment, the material of the first reinforcement members 5 and the second reinforcement members 6 is metal and is 2.The first surface 21 of housing 2 is concaved with at least one first accommodation space 211, this first accommodation space 211 is the groove of strip, in order to the first reinforcement members 5 to be set, and so that the first reinforcement members 5 does not protrude from the first surface 21 of housing 2, can keep and not increase the overall dimensions of structure-reinforced test jack 100 by this.Please continue with reference to figure 2, be formed with at least one second accommodation space 8 between housing 2 and the lid 3 in order to the second reinforcement members 6 to be set, the second accommodation space 8 is arranged with in the one side (as shown in Figure 2) of lid 3 in the face of housing 2, certainly this second accommodation space 8 also can be arranged with in the one side (not shown) of housing 2 in the face of lid 3, and this second accommodation space 8 is in order to arrange the second reinforcement members 6.
That the second reinforcement members 6 that is arranged at the second accommodation space 8 will be corresponding to the first reinforcement members 5 that is arranged at the first accommodation space 211 what this will give special heed to.In this preferred embodiment, the quantity of the first accommodation space 211 and the second accommodation space 8 is 2, and be horizontal arrangement, and 2 the first accommodation spaces 211 are the symmetry shape setting with respect to the first surface 21 of housing 2,2 the second accommodation spaces 8 also are the setting of symmetry shape with respect to lid 3, and 2 the first accommodation spaces 211 and the second accommodation space 8 all are arranged at the periphery of a plurality of test probes 1.
Please refer to Fig. 3, that Fig. 2 is along the cut-open view of A to A, key character of the present invention is, utilize a plurality of the second lock-in components 7 to penetrate the first reinforcement members 5, housing 2 and the second reinforcement members 6, by this housing 2 firmly is held between the first reinforcement members 5 and the second reinforcement members 6, and interosculates.In a preferred embodiment, be equipped with through hole 61 and 23 on the second reinforcement members 6 and the housing 2, the first reinforcement members 5 is provided with screw 51, the second lock-in component 7 can be bolt, can pass the second reinforcement members 6 and housing 2 and then locking on the first reinforcement members 5, by this intensity that can increase structure-reinforced test jack 100 of the present invention, make test jack be difficult for causing bending.And because utilize the young's modulus of the first reinforcement members 5 and the second reinforcement members 6 to be higher than the characteristic of the young's modulus of housing, therefore structure-reinforced test jack 100 of the present invention can be under outward appearance, constancy of volume, can increase the intensity of test jack, reach test jack and be difficult for causing bending, and then reduce the cost of manufacture of test jack.If when making housing 2 volumes of test jack become large if further will increase the quantity of the test probe in the test jack, structure-reinforced test jack 100 of the present invention still can utilize a plurality of the second lock-in components 7 to penetrate the first reinforcement members 5, housing 2 and the second reinforcement members 6, and keep suitable intensity, and then promote tested productivity.
The present invention further provides the second preferred embodiment, be a kind of probe, consist predominantly of circuit board composition 9 and be locked in the structure-reinforced test jack 100 that circuit board forms 9 central parts, wherein structure-reinforced test jack 100 mainly comprises housing 2, the lid 3 and a plurality of the first lock-in components 4 of a plurality of test probes 1, flat.Housing 2 has first surface 21 and second 22, the second 22 to be offered a depressed part 221 and is installed with wherein for lid 3, and a plurality of the first lock-in component 4 is connected to each other locking with housing 2 and lid 3.Wherein, the further feature of structure-reinforced test jack 100 is as described in aforementioned the first preferred embodiment.
Moreover, probe of the present invention and structure-reinforced test jack wherein, its first accommodation space and the second accommodation space more can be located on the first surface of housing and second periphery on demand, by this first reinforcement members and the second reinforcement members can frame be located at housing around; Or first accommodation space and the second accommodation space can form I font or groined type or and the geometric configuration of combination, with accommodating the first reinforcement members of difference and the second reinforcement members, the first reinforcement members like this and the second reinforcement members can with I font or groined type or and the geometric configuration of combination distribute and be arranged on the housing,, reduce probe and produce the chance of deformation with test jack wherein in the probe of different model or size and wherein test jack with suitable configuration the first reinforcement members and the second reinforcement members.
On the other hand, probe of the present invention and structure-reinforced test jack wherein, have the first reinforcement members and the second reinforcement members, when carrying out high temperature or low-temperature test, for example, probe temperature is between-40 ℃ to 120 ℃, this structure-reinforced test jack can avoid producing because of temperature variation the problem of distortion, make in the contraposition of chip to be measured and test jack, keep good electrical contact, improve the fiduciary level of test result.
The above is preferred embodiment of the present invention only, is not to limit interest field of the present invention.Simultaneously above description should understand and implement for the special personage who knows the art, so other does not break away from the equivalence of finishing under the disclosed spirit and change or modification, all should be included in the claim.

Claims (10)

1. structure-reinforced test jack, the housing, a lid and a plurality of the first lock-in component that comprise a plurality of test probes, a flat, this housing has first surface and second, this second face is offered a depressed part and is installed with wherein for this lid, described a plurality of the first lock-in component is that this housing and this lid are connected to each other locking, it is characterized in that:
This structure-reinforced test jack further comprises at least one first reinforcement members, at least one second reinforcement members and a plurality of the second lock-in component, and wherein the young's modulus of this first reinforcement members and the second reinforcement members is higher than the young's modulus of this housing;
The first surface of this housing is concaved with at least one first accommodation space, and this first accommodation space is in order to arranging this first reinforcement members, and makes this first reinforcement members not protrude from the first surface of this housing;
Be formed with at least one second accommodation space between this housing and this lid, this second accommodation space is in order to arranging this second reinforcement members, and makes this second reinforcement members corresponding to this first reinforcement members;
These a plurality of second lock-in components penetrate this first reinforcement members, this housing and this second reinforcement members, this housing firmly is held between this first reinforcement members and this second reinforcement members, and interosculates; And
Each test probe penetrates this housing and this lid simultaneously, and the one end is in order to contact semiconductor device, and the other end forms in order to contact a circuit board.
2. according to structure-reinforced test jack claimed in claim 1, it is characterized in that this second accommodation space is arranged with in the one side of this lid in the face of this housing.
3. according to structure-reinforced test jack claimed in claim 1, it is characterized in that the quantity of this first accommodation space and this second accommodation space is 2 and be horizontal arrangement.
4. according to structure-reinforced test jack claimed in claim 3, it is characterized in that, described 2 the first accommodation spaces are positioned at the first surface of this housing and are the setting of symmetry shape, described 2 the second accommodation spaces are positioned at this lid and are the setting of symmetry shape, and described 2 the first accommodation spaces and described 2 the second accommodation spaces are arranged at the periphery of described a plurality of test probes.
5. according to structure-reinforced test jack claimed in claim 1, it is characterized in that this first reinforcement members and this second reinforcement members are metal, and this first reinforcement members is all identical with material, configuration and the size of this second reinforcement members.
6. according to structure-reinforced test jack claimed in claim 1, it is characterized in that this housing and this lid are ambroin.
7. according to structure-reinforced test jack claimed in claim 1, it is characterized in that, each second lock-in component is bolt, this first reinforcement members is provided with screw, this second reinforcement members and this housing are equipped with through hole, and each bolt passes this second reinforcement members and this housing and locks in this first reinforcement members.
8. according to structure-reinforced test jack claimed in claim 1, it is characterized in that, the first surface of this housing and this periphery of second cave in respectively to form this first accommodation space and this second accommodation space, with accommodating this first reinforcement members of difference and this second reinforcement members.
9. according to structure-reinforced test jack claimed in claim 1, it is characterized in that, the first surface of this housing and second, cave in respectively to form this first accommodation space and this second accommodation space, and have I font or groined type or and the geometric configuration of combination, with respectively accommodating this first reinforcement members and this second reinforcement members.
10. probe, include the structure-reinforced test jack that a circuit board forms and is locked in this circuit board composition central part, this structure-reinforced test jack comprises housing, a lid and a plurality of first lock-in component of a plurality of test probes, a flat, this housing has first surface and second, this second face is offered a depressed part and is installed with wherein for this lid, described a plurality of the first lock-in component is connected to each other locking with this housing and this lid, it is characterized in that:
This structure-reinforced test jack further comprises at least one first reinforcement members, at least one second reinforcement members and a plurality of the second lock-in component, and wherein the young's modulus of this first reinforcement members and the second reinforcement members is higher than the young's modulus of this housing;
The first surface of this housing is concaved with at least one first accommodation space, and this first accommodation space is in order to arranging this first reinforcement members, and makes this first reinforcement members not protrude from the first surface of this housing;
Be formed with at least one second accommodation space between this housing and this lid, this second accommodation space is in order to arranging this second reinforcement members, and makes this second reinforcement members corresponding to this first reinforcement members;
These a plurality of second lock-in components penetrate this first reinforcement members, this housing and this second reinforcement members, this housing firmly is held between this first reinforcement members and this second reinforcement members, and interosculates; And
Each test probe penetrates this housing and this lid simultaneously, and the one end is in order to contact semiconductor device, and the other end forms in order to contact this circuit board.
CN 200910222020 2009-11-13 2009-11-13 Probe Cards with Structurally Reinforced Test Sockets Active CN102062793B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200910222020 CN102062793B (en) 2009-11-13 2009-11-13 Probe Cards with Structurally Reinforced Test Sockets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200910222020 CN102062793B (en) 2009-11-13 2009-11-13 Probe Cards with Structurally Reinforced Test Sockets

Publications (2)

Publication Number Publication Date
CN102062793A CN102062793A (en) 2011-05-18
CN102062793B true CN102062793B (en) 2013-04-17

Family

ID=43998158

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200910222020 Active CN102062793B (en) 2009-11-13 2009-11-13 Probe Cards with Structurally Reinforced Test Sockets

Country Status (1)

Country Link
CN (1) CN102062793B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200415355A (en) * 2003-02-07 2004-08-16 Leadtek Research Inc Test socket and its combined test member
CN1922495A (en) * 2004-04-27 2007-02-28 日本麦可罗尼克斯股份有限公司 Electric connector
CN101334425A (en) * 2007-06-29 2008-12-31 京元电子股份有限公司 Integrated circuit element test socket, socket substrate, test machine and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4769538B2 (en) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 Contactor for electronic parts and contact method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200415355A (en) * 2003-02-07 2004-08-16 Leadtek Research Inc Test socket and its combined test member
CN1922495A (en) * 2004-04-27 2007-02-28 日本麦可罗尼克斯股份有限公司 Electric connector
CN101334425A (en) * 2007-06-29 2008-12-31 京元电子股份有限公司 Integrated circuit element test socket, socket substrate, test machine and manufacturing method thereof

Also Published As

Publication number Publication date
CN102062793A (en) 2011-05-18

Similar Documents

Publication Publication Date Title
US8044673B1 (en) Method and apparatus for positioning and contacting singulated semiconductor dies
TW457611B (en) Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package
US9341647B2 (en) Testing apparatus and method
KR101735418B1 (en) Manufacturing method of semiconductor package test socket using plural moldpin
US8836363B2 (en) Probe card partition scheme
CN104316859A (en) Chip testing equipment with high universality
CN101164152A (en) Probe card and method of manufacturing the same
CN101821634B (en) Multi-site probe
CN106646055A (en) Crystal oscillator detection carrier and tool
CN1936596B (en) Connection point assembly and LSI chip detection device for the same
US9995770B2 (en) Multidirectional semiconductor arrangement testing
CN107450008A (en) Chip test system
KR100385962B1 (en) Method of manufacturing for semiconductor device
CN103185819B (en) Probe card and manufacturing method thereof
CN102062793B (en) Probe Cards with Structurally Reinforced Test Sockets
US8172622B1 (en) Socket structure stack and socket structure thereof
CN101089643A (en) BGA Package Component Test Method and Test Socket Set for Real System
CN206059373U (en) Semiconductor device and electronic installation
CN207301134U (en) Vertical probe card and probe head for chip measurement
CN105445501B (en) Electrical detection device for environmental testing
CN201107386Y (en) test circuit board
KR102287237B1 (en) Insert assembly for receiving semiconductor device and test tray including the same
CN112904180B (en) Chip test board and chip test method
Feng et al. Material effect on thermal stress of annular-trench-isolated through silicon via (TSV)
CN202494701U (en) Device for integrated circuit test

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant