CN102062793A - Probe Cards with Structurally Reinforced Test Sockets - Google Patents
Probe Cards with Structurally Reinforced Test Sockets Download PDFInfo
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Abstract
Description
技术领域technical field
本发明系涉及探针卡与其中的测试插座,特别是有关于一种应用于晶片测试的探针卡与其中的结构强化的测试插座。The present invention relates to a probe card and a test socket therein, in particular to a probe card for chip testing and a structurally strengthened test socket therein.
背景技术Background technique
现今为了使电子产品符合多功能性及外观造型轻巧的消费趋势,半导体封装逐渐趋向晶片级芯片尺寸封装(Wafer Level Chip Size Package/WLCSP)的技术发展,晶片级芯片尺寸封装与传统的芯片尺寸封装不同在于,晶片级芯片尺寸封装是直接在晶片上进行封装工艺,然后再切割,经过切割后即成为单一封装完成的集成电路产品。晶片级芯片尺寸封装的优点在于,封装完成的成品体积较小,可以省下填胶、导线架及基板的制作,省略粘晶以及打线等工艺,因此大幅减少材料及人工成本外,也缩短封装的工艺时间并可提高生产良率及产能。但是,晶片级芯片尺寸封装是一种尺寸微小化的封装结构,其封装尺寸与芯片尺寸接近或相等,因此进行晶片级芯片尺寸封装测试时,芯片的尺寸及数量亦会造成测试的困难。Nowadays, in order to make electronic products conform to the consumption trend of multi-functionality and light appearance, semiconductor packaging gradually tends to the technological development of Wafer Level Chip Size Package (WLCSP), which is different from traditional chip size packaging. The difference is that wafer-level chip size packaging is directly packaged on the wafer, and then cut. After cutting, it becomes a single packaged integrated circuit product. The advantage of wafer-level chip size packaging is that the packaged finished product is smaller in size, which can save the production of glue filling, lead frame and substrate, and omit the process of die bonding and wire bonding, thus greatly reducing material and labor costs, and shortening The process time of packaging can be improved and the production yield and production capacity can be improved. However, WLCSP is a miniaturized packaging structure, and its package size is close to or equal to the chip size. Therefore, when performing WLCSP testing, the size and number of chips will also cause testing difficulties.
以同时测试晶片级芯片尺寸封装的128个测试区(Testing side)为例,其中每个测试区可定义为晶片级芯片尺寸封装上的单一芯片(Chip),而每个单一芯片上具有8个接点,故欲同时测试128个芯片的测试插座上需装设有1024根弹簧探针,因每一个接点需使用8根弹簧探针进行测试。但因同时测试1024个接点,则势必接点与接点间之间距会缩小,相对地测试插座上的1024根针的距离亦会缩小,但此时因为测试插座的面积与体积并无改变,故在相对地测试范围的对角距离亦有缩减的情况下,测试插座上的1024根弹簧探针在进行测试时将因作用力的不平均,造成测试插座的弯折(socket housing bending),除此之外,亦会导致操作人员进行测试的对位困难,花费时间在芯片与测试插座的对位上,而严重的时候会造成接触不良,使测试无法顺利进行,或造成测试结果不可靠,甚至必须重测,导致耗费时间与费用。对于重视时效及欲降低成本的业界而言,仍有待改善。Take the 128 testing areas (Testing side) of wafer-level chip size package as an example, where each test area can be defined as a single chip (Chip) on a wafer-level chip size package, and each single chip has 8 Therefore, 1024 spring probes need to be installed on the test socket to test 128 chips at the same time, because each contact needs to use 8 spring probes for testing. However, because 1024 contacts are tested at the same time, the distance between the contacts will be reduced, and the distance between the 1024 pins on the test socket will also be reduced. In the case that the diagonal distance of the test range is also reduced, the 1024 spring probes on the test socket will cause the test socket to bend due to the uneven force during the test. In addition, it will also lead to difficulties in the alignment of the test by the operator, and it will take time to align the chip and the test socket. Retesting is necessary, resulting in time and expense. For the industry that values timeliness and wants to reduce costs, there is still room for improvement.
发明内容Contents of the invention
为了解决上述先前技术不尽理想之处,本发明提供一种结构强化的测试插座,主要包含多个测试探针、扁平状的壳体、盖体与多个第一锁合组件。壳体具有第一面与第二面,第二面开设一凹陷部以供盖体容设其中,多个第一锁合组件将壳体与盖体互相连接锁固。结构强化的测试插座进一步包含至少一个第一强化构件、至少一个第二强化构件与多个第二锁合组件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数。壳体的第一面凹设有至少一个第一容置空间,第一容置空间用以设置第一强化构件,并使第一强化构件不凸出于壳体的第一面。壳体与盖体之间形成有至少一个第二容置空间,第二容置空间用以设置第二强化构件,并使第二强化构件对应于第一强化构件。上述的多个第二锁合组件穿透第一强化构件、壳体与第二强化构件,可使壳体稳固地夹持于第一强化构件与第二强化构件之间,且互相结合。此外,上述的多个测试探针同时穿透壳体与盖体,其一端用以接触半导体装置,另一端用以接触电路板组成(PCB assembly)。In order to solve the unsatisfactory problems of the prior art, the present invention provides a structurally strengthened test socket, which mainly includes a plurality of test probes, a flat shell, a cover and a plurality of first locking components. The casing has a first surface and a second surface, and a recess is provided on the second surface for the cover to accommodate therein, and a plurality of first locking components connect and lock the casing and the cover. The structurally strengthened test socket further includes at least one first strengthening member, at least one second strengthening member and a plurality of second locking components, and the Young's modulus of the first strengthening member and the second strengthening member is higher than that of the shell coefficient. At least one first accommodating space is recessed on the first surface of the casing, and the first accommodating space is used for arranging the first reinforcing member, and prevents the first reinforcing member from protruding from the first surface of the casing. At least one second accommodating space is formed between the casing and the cover, and the second accommodating space is used for arranging the second reinforcing member, and makes the second reinforcing member correspond to the first reinforcing member. The above-mentioned plurality of second locking components penetrate the first reinforcing member, the casing and the second reinforcing member, so that the casing can be firmly clamped between the first reinforcing member and the second reinforcing member and combined with each other. In addition, the above-mentioned multiple test probes penetrate through the casing and the cover simultaneously, one end thereof is used to contact the semiconductor device, and the other end is used to contact the circuit board assembly (PCB assembly).
因此,本发明的主要目的在于提供一种结构强化的测试插座,具有第一强化构件与第二强化构件,利用第二锁合组件穿透第一强化构件、壳体与第二强化构件,可使壳体稳固地夹持于第一强化构件与第二强化构件之间,通过此可增加测试插座的强度,使测试插座不易造成弯折。Therefore, the main purpose of the present invention is to provide a test socket with a strengthened structure, which has a first strengthening member and a second strengthening member, and the second locking component penetrates the first strengthening member, the shell and the second strengthening member, and can The shell is firmly clamped between the first reinforcement member and the second reinforcement member, thereby increasing the strength of the test socket and preventing the test socket from being easily bent.
本发明的次要目的在于提供一种结构强化的测试插座,具有第一强化构件与第二强化构件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数,因此测试插座可以在外观、体积不变之下,增加测试插座的强度,使测试插座不易造成弯折,降低测试插座制作成本。A secondary purpose of the present invention is to provide a structurally strengthened test socket, which has a first strengthening member and a second strengthening member, and the Young’s modulus of the first strengthening member and the second strengthening member is higher than that of the housing, Therefore, the strength of the test socket can be increased without changing the appearance and volume of the test socket, so that the test socket is not easy to be bent, and the manufacturing cost of the test socket can be reduced.
本发明的另一目的在于提供一种结构强化的测试插座,具有第一强化构件与第二强化构件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数,当测试插座上的测试探针的数量增加时,仍可维持测试插座的强度,使测试插座不易造成弯折,进而提升测试产能。Another object of the present invention is to provide a structurally strengthened test socket, which has a first strengthening member and a second strengthening member, and the Young’s modulus of the first strengthening member and the second strengthening member is higher than that of the housing, When the number of test probes on the test socket increases, the strength of the test socket can still be maintained, so that the test socket is not easy to be bent, thereby improving the test throughput.
本发明的再一目的在于提供一种结构强化的测试插座,具有第一强化构件与第二强化构件,当进行高温或低温测试时,例如,测试温度介于-40℃至120℃之间,此结构强化的测试插座可避免因温度变化产生变形的问题,使待测芯片与测试插座的对位上,保持良好的电性接触,提高测试结果的可靠度。Another object of the present invention is to provide a structurally strengthened test socket, which has a first strengthening member and a second strengthening member. When performing a high temperature or low temperature test, for example, the test temperature is between -40°C and 120°C. The test socket with a strengthened structure can avoid the problem of deformation caused by temperature changes, so that the alignment between the chip under test and the test socket can maintain good electrical contact, and the reliability of test results can be improved.
此外,本发明进一步提供一种探针卡,主要包含有一电路板组成、以及锁固于电路板组成中央部位的结构强化的测试插座。其中结构强化的测试插座主要包含多个测试探针、扁平状的壳体、盖体与多个第一锁合组件。壳体具有第一面与第二面,第二面开设一凹陷部以供盖体容设其中,多个第一锁合组件将壳体与盖体互相连接锁固。结构强化的测试插座进一步包含至少一个第一强化构件、至少一个第二强化构件与多个第二锁合组件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数。壳体的第一面凹设有至少一个第一容置空间,第一容置空间用以设置第一强化构件,并使第一强化构件不凸出于壳体的第一面。壳体与盖体之间形成有至少一个第二容置空间,第二容置空间用以设置第二强化构件,并使第二强化构件对应于第一强化构件。上述的多个第二锁合组件穿透第一强化构件、壳体与第二强化构件,可使壳体稳固地夹持于第一强化构件与第二强化构件之间,且互相结合。In addition, the present invention further provides a probe card, which mainly includes a circuit board and a structurally strengthened test socket locked at the center of the circuit board. The structurally strengthened test socket mainly includes a plurality of test probes, a flat shell, a cover and a plurality of first locking components. The casing has a first surface and a second surface, and a recess is provided on the second surface for the cover to accommodate therein, and a plurality of first locking components connect and lock the casing and the cover. The structurally strengthened test socket further includes at least one first strengthening member, at least one second strengthening member and a plurality of second locking components, and the Young's modulus of the first strengthening member and the second strengthening member is higher than that of the shell coefficient. At least one first accommodating space is recessed on the first surface of the casing, and the first accommodating space is used for arranging the first reinforcing member, and prevents the first reinforcing member from protruding from the first surface of the casing. At least one second accommodating space is formed between the casing and the cover, and the second accommodating space is used for arranging the second reinforcing member, and makes the second reinforcing member correspond to the first reinforcing member. The above-mentioned plurality of second locking components penetrate the first reinforcing member, the casing and the second reinforcing member, so that the casing can be firmly clamped between the first reinforcing member and the second reinforcing member and combined with each other.
因此,本发明的再一目的在于提供一种探针卡,其中所使用的结构强化的测试插座,具有第一强化构件与第二强化构件,利用第二锁合组件穿透第一强化构件、壳体与第二强化构件,可使壳体稳固地夹持于第一强化构件与第二强化构件之间,通过此可增加测试插座的强度,使测试插座不易造成弯折。Therefore, another object of the present invention is to provide a probe card, wherein the structurally strengthened test socket used has a first strengthening member and a second strengthening member, and the second locking component penetrates the first strengthening member, The housing and the second strengthening member can make the housing firmly clamped between the first strengthening member and the second strengthening member, thereby increasing the strength of the test socket and preventing the test socket from being easily bent.
本发明的再一目的在于提供一种探针卡,其中所使用的结构强化的测试插座,具有第一强化构件与第二强化构件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数的特性,因此测试插座可以在外观、体积不变之下,可增加测试插座的强度,使测试插座不易造成弯折,降低测试插座制作成本。Another object of the present invention is to provide a probe card, wherein the structurally strengthened test socket used has a first strengthening member and a second strengthening member, and the Young’s modulus of the first strengthening member and the second strengthening member is high Due to the characteristics of the Young's modulus of the shell, the test socket can increase the strength of the test socket without changing the appearance and volume, so that the test socket is not easy to be bent, and the production cost of the test socket is reduced.
本发明的再一目的在于提供一种探针卡,其中所使用的结构强化的测试插座,具有第一强化构件与第二强化构件,且第一强化构件与第二强化构件的杨氏系数高于壳体的杨氏系数的特性,当测试插座上的测试探针的数量增加时,仍可维持测试插座的强度,使测试插座不易造成弯折,进而提升测试产能。Another object of the present invention is to provide a probe card, wherein the structurally strengthened test socket used has a first strengthening member and a second strengthening member, and the Young’s modulus of the first strengthening member and the second strengthening member is high Due to the characteristics of the Young's modulus of the shell, when the number of test probes on the test socket increases, the strength of the test socket can still be maintained, so that the test socket is not easy to be bent, thereby improving the test throughput.
本发明的再一目的在于提供一种探针卡,其中所使用的结构强化的测试插座,具有第一强化构件与第二强化构件,当进行高温或低温测试时,例如,测试温度介于-40℃至120℃之间,此结构强化的测试插座可避免因温度变化产生变形的问题,使待测芯片与测试插座的对位上,保持良好的电性接触,提高测试结果的可靠度。Another object of the present invention is to provide a probe card, wherein the structurally strengthened test socket used has a first strengthening member and a second strengthening member. When performing a high temperature or low temperature test, for example, the test temperature is between - Between 40°C and 120°C, this structurally strengthened test socket can avoid the problem of deformation due to temperature changes, so that the alignment between the chip under test and the test socket can maintain good electrical contact and improve the reliability of test results.
附图说明Description of drawings
图1为一爆炸图,根据本发明提出的第一较佳实施例,为一种结构强化的测试插座;Fig. 1 is an exploded view, according to the first preferred embodiment of the present invention, it is a test socket with strengthened structure;
图2为一示意图,根据本发明提出的第一较佳实施例,为一种结构强化的测试插座的第二面图标;Fig. 2 is a schematic diagram, according to the first preferred embodiment of the present invention, it is a second icon of a structurally strengthened test socket;
图3为一剖视图,根据本发明提出的第一较佳实施例,为一种结构强化的测试插座。FIG. 3 is a cross-sectional view of a test socket with enhanced structure according to the first preferred embodiment of the present invention.
【主要元件符号说明】[Description of main component symbols]
结构强化的测试插座 100Structurally strengthened
测试探针 1
壳体 2
第一面 21The
第一容置空间 211The
第二面 22Second side 22
凹陷部 221Depression 221
通孔 23Through-
盖体 3
第一锁合组件 4The
第一强化构件 5The
螺孔 51Screw
第二强化构件 6Second strengthening
通孔 61Through
第二锁合组件 7
第二容置空间 8The
电路板组成 9
具体实施方式Detailed ways
由于本发明揭露一种晶片测试所需的探针卡与其中的结构强化的测试插座,其中所利用的探针卡与测试插座的使用原理与基本功能,已为相关技术领域具有通常知识者所能明了,故以下文中的说明,不再完整描述。同时,以下文中所对照的图式,表达与本发明特征有关的结构示意,并未亦不需要依据实际尺寸完整绘制,在先叙明。Since the present invention discloses a probe card required for chip testing and a structurally strengthened test socket therein, the principle of use and basic functions of the probe card and test socket used therein have been known by those with ordinary knowledge in the relevant technical field. It can be understood, so the description below will not describe it completely. At the same time, the following diagrams are used to express the structural representations related to the features of the present invention, which are not and need not be completely drawn according to the actual size, but are described first.
首先请参考图1,是根据本发明所提供的第一较佳实施例,为一种结构强化的测试插座100的爆炸图,主要包含多个测试探针1、扁平状的壳体2、盖体3与多个第一锁合组件4,壳体2具有第一面21与第二面22。请参考图2,是壳体2的第二面22,其中壳体2的第二面22的中央部位开设一长条状凹槽的凹陷部221以供盖体3容设其中。请继续参考图1,上述的多个第一锁合组件4是将壳体2与盖体3互相连接锁固,而壳体2与盖体3的材质均是以绝缘塑料为佳。多个测试探针1同时穿透壳体2与盖体3,其一端用以接触半导体装置(未图标),另一端用以接触一电路板组成9(PCB assembly)。First please refer to FIG. 1 , which is an exploded view of a structurally strengthened
为了避免测试插座锁附于电路板(PCB)上时,测试探针上的弹簧探针的作用力将导致测试插座产生弯折(Bending),使得对位困难、接触不良。本发明的结构强化的测试插座100进一步包含至少一个第一强化构件5、至少一个第二强化构件6与多个第二锁合组件7,其中第一强化构件5与第二强化构件6的杨氏系数高于壳体2的杨氏系数,且第一强化构件5与第二强化构件6的材质、构型与尺寸均相同为佳。在此较佳实施例中,第一强化构件5与第二强化构件6的材质均为金属且均为2个。壳体2的第一面21凹设有至少一个第一容置空间211,此第一容置空间211为长条状的凹槽,用以设置第一强化构件5,并使得第一强化构件5不凸出于壳体2的第一面21,通过此可维持且不增加结构强化的测试插座100的外型尺寸。请继续参考图2,壳体2与盖体3之间形成有至少一个第二容置空间8用以设置第二强化构件6,第二容置空间8凹设于盖体3面对壳体2的一面(如图2所示),当然此第二容置空间8亦可凹设于壳体2面对盖体3的一面(未图示),此第二容置空间8用以设置第二强化构件6。In order to avoid that when the test socket is locked on the circuit board (PCB), the force of the spring probe on the test probe will cause the test socket to bend (Bending), making alignment difficult and poor contact. The structurally strengthened
在此要特别留意的是,设置于第二容置空间8的第二强化构件6将会对应于设置于第一容置空间211的第一强化构件5。在此较佳实施例中,第一容置空间211与第二容置空间8的数量均为2个,且均为水平状排列,并且2个第一容置空间211相对于壳体2的第一面21呈对称状设置,2个第二容置空间8相对于盖体3亦呈对称状的设置,2个第一容置空间211与第二容置空间8皆设置于多个测试探针1的外围。It should be noted here that the second reinforcing
请参考图3,是图2沿A至A的剖视图,本发明的重要特征在于,利用多个第二锁合组件7穿透第一强化构件5、壳体2与第二强化构件6,通过此可使壳体2稳固地夹持于第一强化构件5与第二强化构件6之间,并且互相结合。于一较佳的实施例中,第二强化构件6与壳体2上均设有通孔61与23,第一强化构件5上设有螺孔51,第二锁合组件7可为螺栓,可穿过第二强化构件6与壳体2进而锁固在第一强化构件5上,通过此可增加本发明的结构强化的测试插座100的强度,使测试插座不易造成弯折。并且因为利用第一强化构件5与第二强化构件6的杨氏系数高于壳体的杨氏系数的特性,因此本发明的结构强化的测试插座100可以在外观、体积不变之下,可增加测试插座的强度,达到测试插座不易造成弯折,进而降低测试插座的制作成本。倘若进一步若要增加测试插座上的测试探针的数量而使测试插座的壳体2体积变大时,本发明的结构强化的测试插座100仍旧可以利用多个第二锁合组件7穿透第一强化构件5、壳体2与第二强化构件6,而维持相当的强度,进而提升测试产能。Please refer to FIG. 3 , which is a cross-sectional view along A to A of FIG. 2 . The important feature of the present invention is that a plurality of
本发明进一步提供第二较佳实施例,为一种探针卡,主要包含有一电路板组成9、以及锁固于电路板组成9中央部位的结构强化的测试插座100,其中结构强化的测试插座100主要包含多个测试探针1、扁平状的壳体2、盖体3与多个第一锁合组件4。壳体2具有第一面21与第二面22,第二面22开设一凹陷部221以供盖体3容设其中,并且多个第一锁合组件4将壳体2与盖体3互相连接锁固。其中,结构强化的测试插座100的其它特征如前述第一较佳实施例所述。The present invention further provides a second preferred embodiment, which is a probe card, which mainly includes a
再者,本发明的探针卡与其中的结构强化的测试插座,其第一容置空间及第二容置空间,更可依需求环设于壳体的第一面与第二面的周缘,通过此第一强化构件及第二强化构件能框设于壳体的四周;或第一容置空间及第二容置空间可形成I字形或井字形或及其组合的几何形状,以分别容置第一强化构件及第二强化构件,如此第一强化构件及第二强化构件能以I字形或井字形或及其组合的几何形状分布设置于壳体上,以适当配置第一强化构件及第二强化构件于不同型号或尺寸的探针卡与其中的测试插座,减少探针卡与其中的测试插座产生形变的机会。Furthermore, the probe card of the present invention and the structurally strengthened test socket therein, the first accommodating space and the second accommodating space can be arranged around the periphery of the first surface and the second surface of the casing according to requirements. , through which the first reinforcing member and the second reinforcing member can be framed around the casing; or the first accommodating space and the second accommodating space can form an I-shaped or a well-shaped geometric shape or a combination thereof, to respectively Accommodate the first reinforcement member and the second reinforcement member, so that the first reinforcement member and the second reinforcement member can be arranged on the shell in an I-shaped or square shape or a combination thereof, so as to properly arrange the first reinforcement member And the second strengthening member is used for different models or sizes of the probe card and the test socket therein, so as to reduce the chance of deformation of the probe card and the test socket therein.
另一方面,本发明探针卡与其中的结构强化的测试插座,具有第一强化构件与第二强化构件,当进行高温或低温测试时,例如,测试温度介于-40℃至120℃之间,此结构强化的测试插座可避免因温度变化产生变形的问题,使待测芯片与测试插座的对位上,保持良好的电性接触,提高测试结果的可靠度。On the other hand, the probe card of the present invention and the structurally strengthened test socket therein have a first strengthening member and a second strengthening member. When performing a high temperature or low temperature test, for example, the test temperature is between -40°C and 120°C During this period, the structurally strengthened test socket can avoid the problem of deformation due to temperature changes, so that the alignment between the chip under test and the test socket can maintain good electrical contact and improve the reliability of the test results.
以上所述仅为本发明的较佳实施例,并非用以限定本发明的权利范围。同时以上的描述,对于熟知本技术领域的专门人士应可明了及实施,因此其它未脱离本发明所揭示的精神下所完成的等效改变或修饰,均应包含在申请专利范围中。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of rights of the present invention. At the same time, the above description should be clear and implementable by those who are familiar with the technical field. Therefore, other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the patent scope of the application.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200415355A (en) * | 2003-02-07 | 2004-08-16 | Leadtek Research Inc | Test socket and its combined test member |
US20060186905A1 (en) * | 2005-02-22 | 2006-08-24 | Fujitsu Limited | Contactor for electronic parts and a contact method |
CN1922495A (en) * | 2004-04-27 | 2007-02-28 | 日本麦可罗尼克斯股份有限公司 | Electric connector |
CN101334425A (en) * | 2007-06-29 | 2008-12-31 | 京元电子股份有限公司 | Integrated circuit element test socket, socket substrate, test machine and manufacturing method thereof |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200415355A (en) * | 2003-02-07 | 2004-08-16 | Leadtek Research Inc | Test socket and its combined test member |
CN1922495A (en) * | 2004-04-27 | 2007-02-28 | 日本麦可罗尼克斯股份有限公司 | Electric connector |
US20060186905A1 (en) * | 2005-02-22 | 2006-08-24 | Fujitsu Limited | Contactor for electronic parts and a contact method |
CN101334425A (en) * | 2007-06-29 | 2008-12-31 | 京元电子股份有限公司 | Integrated circuit element test socket, socket substrate, test machine and manufacturing method thereof |
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