CN101960596B - 具有两个晶片的有源像素传感器 - Google Patents
具有两个晶片的有源像素传感器 Download PDFInfo
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- CN101960596B CN101960596B CN200980108186.XA CN200980108186A CN101960596B CN 101960596 B CN101960596 B CN 101960596B CN 200980108186 A CN200980108186 A CN 200980108186A CN 101960596 B CN101960596 B CN 101960596B
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- China
- Prior art keywords
- pixel region
- charge
- support circuit
- pixel
- switching mechanism
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
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- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/058,845 US7858915B2 (en) | 2008-03-31 | 2008-03-31 | Active pixel sensor having two wafers |
US12/058,845 | 2008-03-31 | ||
PCT/US2009/001951 WO2009123693A1 (en) | 2008-03-31 | 2009-03-27 | Active pixel sensor having two wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101960596A CN101960596A (zh) | 2011-01-26 |
CN101960596B true CN101960596B (zh) | 2012-07-18 |
Family
ID=40720010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980108186.XA Active CN101960596B (zh) | 2008-03-31 | 2009-03-27 | 具有两个晶片的有源像素传感器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7858915B2 (zh) |
EP (1) | EP2257982A1 (zh) |
JP (1) | JP2011517510A (zh) |
KR (1) | KR20100129780A (zh) |
CN (1) | CN101960596B (zh) |
TW (1) | TWI442555B (zh) |
WO (1) | WO2009123693A1 (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100922924B1 (ko) * | 2007-12-28 | 2009-10-22 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
US20100149379A1 (en) * | 2008-12-16 | 2010-06-17 | Summa Joseph R | Image sensor with three-dimensional interconnect and ccd |
US9196547B2 (en) | 2009-04-03 | 2015-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dual shallow trench isolation and related applications |
US20110156197A1 (en) * | 2009-12-31 | 2011-06-30 | Tivarus Cristian A | Interwafer interconnects for stacked CMOS image sensors |
FR2958079B1 (fr) * | 2010-03-26 | 2012-09-21 | Commissariat Energie Atomique | Dispositif imageur cmos a architecture en trois dimensions |
TWI513301B (zh) * | 2010-06-02 | 2015-12-11 | Sony Corp | 半導體裝置,固態成像裝置及相機系統 |
US20120002092A1 (en) | 2010-06-30 | 2012-01-05 | Guidash Robert M | Low noise active pixel sensor |
JP5570377B2 (ja) | 2010-09-30 | 2014-08-13 | キヤノン株式会社 | 固体撮像装置 |
US8969779B2 (en) * | 2011-02-11 | 2015-03-03 | Nokia Corporation | Photodetecting structure with photon sensing graphene layer(s) and vertically integrated graphene field effect transistor |
US8637800B2 (en) * | 2011-04-19 | 2014-01-28 | Altasens, Inc. | Image sensor with hybrid heterostructure |
DE102011101835A1 (de) * | 2011-05-16 | 2012-11-22 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Bildsensor |
US8339494B1 (en) * | 2011-07-29 | 2012-12-25 | Truesense Imaging, Inc. | Image sensor with controllable vertically integrated photodetectors |
US8736728B2 (en) | 2011-07-29 | 2014-05-27 | Truesense Imaging, Inc. | Image sensor with controllable vertically integrated photodetectors |
US8946612B2 (en) | 2011-07-29 | 2015-02-03 | Semiconductor Components Industries, Llc | Image sensor with controllable vertically integrated photodetectors |
US8730362B2 (en) | 2011-07-29 | 2014-05-20 | Truesense Imaging, Inc. | Image sensor with controllable vertically integrated photodetectors |
US8829637B2 (en) | 2011-07-29 | 2014-09-09 | Semiconductor Components Industries, Llc | Image sensor with controllable vertically integrated photodetectors using a buried layer |
US9070611B2 (en) | 2011-07-29 | 2015-06-30 | Semiconductor Components Industries, Llc | Image sensor with controllable vertically integrated photodetectors |
US8890047B2 (en) * | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
US8686342B2 (en) * | 2012-04-09 | 2014-04-01 | Omnivision Technologies, Inc. | Double-sided image sensor formed on a single semiconductor wafer die |
US8773562B1 (en) | 2013-01-31 | 2014-07-08 | Apple Inc. | Vertically stacked image sensor |
JP5962533B2 (ja) * | 2013-02-13 | 2016-08-03 | ソニー株式会社 | 固体撮像素子、駆動方法、および撮像装置 |
US9526468B2 (en) | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
CN104967763B (zh) * | 2015-06-09 | 2019-04-26 | 联想(北京)有限公司 | 一种图像采集器件、图像采集方法及电子设备 |
US10014333B2 (en) | 2015-08-26 | 2018-07-03 | Semiconductor Components Industries, Llc | Back-side illuminated pixels with interconnect layers |
JP6963873B2 (ja) | 2017-05-26 | 2021-11-10 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、固体撮像素子の製造方法および電子機器 |
US12185018B2 (en) | 2019-06-28 | 2024-12-31 | Apple Inc. | Stacked electromagnetic radiation sensors for visible image sensing and infrared depth sensing, or for visible image sensing and infrared image sensing |
FR3114439B1 (fr) * | 2020-09-18 | 2022-10-07 | Commissariat Energie Atomique | Circuit microelectronique tridimensionnel a repartition optimisee de ses fonctions numerique et analogique |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1941390A (zh) * | 2005-09-29 | 2007-04-04 | 三星电子株式会社 | 具有两个半导体层的像素、图像传感器及图像处理系统 |
EP1883112A1 (fr) * | 2006-07-24 | 2008-01-30 | St Microelectronics S.A. | Capteur d'images éclairé par la face arrière à température de substrat uniforme |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3031606B2 (ja) | 1995-08-02 | 2000-04-10 | キヤノン株式会社 | 固体撮像装置と画像撮像装置 |
WO2000021280A1 (en) | 1998-10-07 | 2000-04-13 | California Institute Of Technology | Silicon-on-insulator (soi) active pixel sensors with the photosites implemented in the substrate |
JP3713418B2 (ja) | 2000-05-30 | 2005-11-09 | 光正 小柳 | 3次元画像処理装置の製造方法 |
US7265402B2 (en) | 2001-11-05 | 2007-09-04 | Zycube Co., Ltd. | Solid-state image sensor including a microlens |
US6927432B2 (en) | 2003-08-13 | 2005-08-09 | Motorola, Inc. | Vertically integrated photosensor for CMOS imagers |
US7160753B2 (en) | 2004-03-16 | 2007-01-09 | Voxtel, Inc. | Silicon-on-insulator active pixel sensors |
JP4742523B2 (ja) | 2004-06-14 | 2011-08-10 | ソニー株式会社 | 固体撮像素子及びその駆動方法 |
KR100610481B1 (ko) | 2004-12-30 | 2006-08-08 | 매그나칩 반도체 유한회사 | 수광영역을 넓힌 이미지센서 및 그 제조 방법 |
KR100782463B1 (ko) * | 2005-04-13 | 2007-12-05 | (주)실리콘화일 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
FR2888989B1 (fr) | 2005-07-21 | 2008-06-06 | St Microelectronics Sa | Capteur d'images |
JP2007228460A (ja) * | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
DE102006012908A1 (de) | 2006-03-10 | 2007-09-13 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Elektroden-Membran-Einheit und Brennstoffzelle |
US8049256B2 (en) | 2006-10-05 | 2011-11-01 | Omnivision Technologies, Inc. | Active pixel sensor having a sensor wafer connected to a support circuit wafer |
-
2008
- 2008-03-31 US US12/058,845 patent/US7858915B2/en active Active
-
2009
- 2009-03-27 KR KR1020107024103A patent/KR20100129780A/ko not_active Application Discontinuation
- 2009-03-27 WO PCT/US2009/001951 patent/WO2009123693A1/en active Application Filing
- 2009-03-27 JP JP2011501844A patent/JP2011517510A/ja active Pending
- 2009-03-27 CN CN200980108186.XA patent/CN101960596B/zh active Active
- 2009-03-27 EP EP09728194A patent/EP2257982A1/en not_active Withdrawn
- 2009-03-30 TW TW098110514A patent/TWI442555B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1941390A (zh) * | 2005-09-29 | 2007-04-04 | 三星电子株式会社 | 具有两个半导体层的像素、图像传感器及图像处理系统 |
EP1883112A1 (fr) * | 2006-07-24 | 2008-01-30 | St Microelectronics S.A. | Capteur d'images éclairé par la face arrière à température de substrat uniforme |
Non-Patent Citations (1)
Title |
---|
JP特开2001-339057A 2001.12.07 |
Also Published As
Publication number | Publication date |
---|---|
TW201001689A (en) | 2010-01-01 |
KR20100129780A (ko) | 2010-12-09 |
CN101960596A (zh) | 2011-01-26 |
US7858915B2 (en) | 2010-12-28 |
TWI442555B (zh) | 2014-06-21 |
JP2011517510A (ja) | 2011-06-09 |
WO2009123693A1 (en) | 2009-10-08 |
US20090242950A1 (en) | 2009-10-01 |
EP2257982A1 (en) | 2010-12-08 |
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Owner name: OMNIVISION TECH INC. Free format text: FORMER OWNER: KODAK COMPANY Effective date: 20110706 |
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Free format text: CORRECT: ADDRESS; FROM: NEW YORK STATE, THE USA TO: CALIFORNIA STATE, THE USA |
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Address after: American California Patentee after: OmniVision Technologies, Inc. Address before: American California Patentee before: Omnivision Technologies Inc. |