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CN101879706A - Diamond grinding disc and manufacturing method thereof - Google Patents

Diamond grinding disc and manufacturing method thereof Download PDF

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CN101879706A
CN101879706A CN2009101404247A CN200910140424A CN101879706A CN 101879706 A CN101879706 A CN 101879706A CN 2009101404247 A CN2009101404247 A CN 2009101404247A CN 200910140424 A CN200910140424 A CN 200910140424A CN 101879706 A CN101879706 A CN 101879706A
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diamond
diamond particles
manufacturing
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grinding
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CN101879706B (en
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周呈祥
王鸿儒
周至中
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Kinik Co
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Kinik Co
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Abstract

本发明公开了一种钻石研磨碟及其制造方法,该方法包括以下步骤:提供一容置单元,容置单元内设置有多个钻石颗粒,且每一钻石颗粒具有至少一锐角研磨端。接着,提供一导引模具,导引模具具有多个凹槽。将导引模具压抵于多个钻石颗粒,使得钻石颗粒的锐角研磨端分别对应于该些凹槽插设。接着,移除导引模具,之后灌注一高分子材料至容置单元内并覆盖钻石颗粒。硬化高分子材料,接着,移除容置单元以完成本发明的钻石研磨碟。

The present invention discloses a diamond grinding disc and a manufacturing method thereof, the method comprising the following steps: providing a housing unit, in which a plurality of diamond particles are arranged, and each diamond particle has at least one sharp-angle grinding end. Next, providing a guide mold, the guide mold having a plurality of grooves. Pressing the guide mold against the plurality of diamond particles so that the sharp-angle grinding ends of the diamond particles are respectively inserted corresponding to the grooves. Next, removing the guide mold, and then pouring a polymer material into the housing unit and covering the diamond particles. Hardening the polymer material, and then removing the housing unit to complete the diamond grinding disc of the present invention.

Description

钻石研磨碟及其制造方法 Diamond grinding disc and manufacturing method thereof

技术领域technical field

本发明涉及一种钻石研磨碟及其制造方法,特别是一种可有效控制钻石排列方向的钻石研磨碟及其制造方法。The invention relates to a diamond grinding disc and a manufacturing method thereof, in particular to a diamond grinding disc capable of effectively controlling the arrangement direction of diamonds and a manufacturing method thereof.

背景技术Background technique

近年来,由于集成电路(Integrated Circuit,IC)技术发展快速且成熟,使得半导体产业成为蓬勃发展的产业之一,其中半导体产品可广泛应用于信息、通讯、消费性电子、工业仪器、运输及国防太空等领域,对电子产品影响很大,其重要性不可言喻。In recent years, due to the rapid and mature development of integrated circuit (Integrated Circuit, IC) technology, the semiconductor industry has become one of the booming industries, among which semiconductor products can be widely used in information, communications, consumer electronics, industrial instruments, transportation and national defense Space and other fields have a great impact on electronic products, and their importance cannot be overstated.

硅晶圆(Silicon Wafer)为半导体产业中极为重要的材料,而硅晶圆必须先经过化学机械研磨(Chemical Mechanical Polishing,CMP)工艺,使硅晶圆表面平整才可于其上进行制造芯片的后续工艺,以提升工艺的准确度及合格率。在化学机械研磨工艺中所使用的研磨垫(Polishing Pad),因长期研磨使用,其研磨粒子填塞入研磨垫空隙中造成研磨垫的研磨效率下降,必须定期修整研磨垫以去除残留的杂质及研磨残屑,使研磨垫维持在最佳研磨状态。因此,半导体工业利用钻石坚硬的特性,将钻石应用于清除研磨垫的研磨垫修整器(Pad Conditioner)上,而研磨垫修整器的外型为圆盘状或是圆环状,亦称为钻石研磨碟修整器(Diamond Disk Pad Conditioner)。Silicon wafer (Silicon Wafer) is an extremely important material in the semiconductor industry, and the silicon wafer must first undergo a chemical mechanical polishing (CMP) process to make the surface of the silicon wafer flat before manufacturing chips on it. Follow-up process to improve the accuracy and pass rate of the process. The polishing pad (Polishing Pad) used in the chemical mechanical polishing process is used for long-term grinding, and its abrasive particles are filled into the gap of the polishing pad, resulting in a decrease in the grinding efficiency of the polishing pad. The polishing pad must be regularly trimmed to remove residual impurities and grinding Debris keeps the polishing pad in the best grinding state. Therefore, the semiconductor industry takes advantage of the hard characteristics of diamonds to apply diamonds to the pad conditioner (Pad Conditioner) that removes the abrasive pad. The shape of the pad conditioner is disc-shaped or ring-shaped, also known as diamond Diamond Disk Pad Conditioner.

为了增加研磨垫修整器的寿命及提高研磨特性,在中国台湾专利公告第412461号专利「修整晶圆抛光垫的钻石碟及其制法」及美国专利第5,092,910号「Abrasive Tool and Method For Making」中,揭露一种利用具规则性分布孔洞的模孔或是筛网的方式,以使钻石颗粒具规则性地排列图案于研磨工具上及其工艺方法,取代了传统研磨工具上的钻石颗粒以随机且不规则的排列方式。此外,于2003年7月11日中国台湾专利公告第541226号专利「具等高化磨料颗粒的研磨工具及其制造方法」揭露一种将钻石颗粒等高均匀排列的方法,是将磨料颗粒依适当间距排列于载具上的磨粒定位沟,以填充于磨粒结合沟内的结合剂,使得磨料颗粒排列取向呈一致性。In order to increase the life of the polishing pad dresser and improve the grinding characteristics, in China Taiwan Patent Publication No. 412461 Patent "Diamond Disc for Dressing Wafer Polishing Pad and Its Manufacturing Method" and US Patent No. 5,092,910 "Abrasive Tool and Method For Making" In the present invention, a method of using a mold hole or a screen with regularly distributed holes is disclosed to make the diamond particles regularly arrange patterns on the grinding tool and its process method, which replaces the diamond particles on the traditional grinding tool. Random and irregular arrangement. In addition, on July 11, 2003, Taiwan Patent Announcement No. 541226 Patent "Abrasive Tool with Contoured Abrasive Particles and Manufacturing Method thereof" discloses a method for uniformly arranging diamond particles with equal heights. Abrasive grain positioning grooves arranged on the carrier at appropriate intervals are used to fill the bonding agent in the abrasive grain bonding grooves so that the alignment of abrasive grains is consistent.

中国台湾第412461号专利及美国第5,092,910号专利虽可达到使各个钻石颗粒以适当间距均匀地排列的目的,但由于所使用的模孔或是筛网的网目尺寸较钻石颗粒为大,钻石颗粒仅能根据网目位置规则排列,而无法控制各个钻石颗粒于排列位置上的取向(Orientation),导致钻石碟上的钻石露出高度参差不齐,而对钻石碟修整器的研磨均匀性及使用寿命上有极大的不良影响。此外,钻石颗粒固着排列于晶圆表面后,仍需经过一道硬焊工艺以使钻石颗粒紧密地与晶圆表面结合,因而导致基材变形及钻石颗粒劣化的问题。Although China Taiwan No. 412461 patent and U.S. No. 5,092,910 patent can achieve the purpose of making each diamond particle evenly arranged at an appropriate distance, the mesh size of the die hole or screen used is larger than that of the diamond particle. The particles can only be arranged regularly according to the position of the mesh, but the orientation of each diamond particle at the arrangement position (Orientation) cannot be controlled, resulting in uneven diamond exposure heights on the diamond disc, and the grinding uniformity and use of the diamond disc dresser There is a great adverse effect on life expectancy. In addition, after the diamond particles are fixed and arranged on the wafer surface, a brazing process is still required to make the diamond particles tightly bonded to the wafer surface, which leads to the deformation of the substrate and the degradation of the diamond particles.

又,中国台湾第541226号专利用于排列钻石颗粒的载具必须先铣削出预定形状的定位沟,使得制造成本因载具额外的加工工序而增加,且为了使钻石颗粒趋于同一取向,将耗费较多制造时间于摆放钻石颗粒的工序上,致使生产钻石碟修整器的效率降低。Also, the No. 541226 patent of China Taiwan is used for arranging the carrier of the diamond particles, and the positioning groove of the predetermined shape must be milled out first, so that the manufacturing cost increases due to the additional processing steps of the carrier, and in order to make the diamond particles tend to the same orientation, the More manufacturing time is spent on the process of arranging diamond particles, resulting in lower efficiency in producing diamond disc dressers.

上述常用的钻石碟修整器的制造方法中,其多个钻石颗粒虽可规则地均匀排列,但却无法使各个钻石颗粒的取向呈一致性,或是需要花费过多成本及制造时间才可达到磨料颗粒的排列取向一致的目的。据此,现有的钻石研磨碟修整器仍有许多问题尚待解决。In the manufacturing method of the above-mentioned commonly used diamond disc dresser, although a plurality of diamond particles can be regularly and evenly arranged, the orientation of each diamond particle cannot be made to be consistent, or it takes too much cost and manufacturing time to achieve it. The purpose of the alignment and orientation of abrasive particles. Accordingly, there are still many problems to be solved in the existing diamond grinding disc dresser.

发明内容Contents of the invention

鉴于以上的问题,本发明提供一种可有效控制钻石排列方向的钻石研磨碟及其制造方法,以解决先前技术中钻石颗粒分布不均、方向取向杂乱无序而造成钻石颗粒高低不齐、以及工艺过于繁复且成本过高的限制或缺点。In view of the above problems, the present invention provides a diamond grinding disc capable of effectively controlling the arrangement direction of diamonds and its manufacturing method, so as to solve the problem of uneven distribution of diamond particles, disordered direction and orientation of diamond particles in the prior art, and uneven diamond particles. Limitations or disadvantages where the process is too complex and costly.

本发明所揭露的钻石研磨碟的制造方法,首先提供一容置单元,并贴附一塑性材料于容置单元中,再黏附多个钻石颗粒于塑性材料上,且该些钻石颗粒分别具有至少一锐角研磨端突设于塑性材料。接着,提供一导引模具,其中导引模具的一侧面具有多个锥状凹槽,将导引模具压抵于多个钻石颗粒,使得钻石颗粒的锐角研磨端分别对应于该些凹槽插设。接着,移除导引模具,之后灌注一高分子材料至容置单元内并覆盖该些钻石颗粒。硬化高分子材料以固定钻石颗粒,接着,移除容置单元以完成本发明的钻石研磨碟。The manufacturing method of the diamond grinding disc disclosed in the present invention firstly provides a housing unit, and attaches a plastic material in the housing unit, and then sticks a plurality of diamond particles on the plastic material, and these diamond particles have at least An acute-angle grinding end protrudes from the plastic material. Next, a guide mold is provided, wherein one side of the guide mold has a plurality of tapered grooves, and the guide mold is pressed against a plurality of diamond particles, so that the sharp-angled grinding ends of the diamond particles are respectively inserted into these grooves. set up. Next, the guiding mold is removed, and then a polymer material is poured into the containing unit to cover the diamond particles. The polymer material is hardened to fix the diamond particles, and then the accommodating unit is removed to complete the diamond grinding disc of the present invention.

本发明的功效在于提供一可设计为具有不同形状、尺寸、角度的锥状凹槽的导引模具,使钻石颗粒以锐角研磨端嵌入导引模具的锥状凹槽内,提高钻石颗粒有更多转向的机会,致使多个钻石颗粒均匀排列并具有一致性的方向取向,以达到钻石研磨碟具备良好研磨效果的目的。The effect of the present invention is to provide a guide mold that can be designed as tapered grooves with different shapes, sizes and angles, so that the diamond particles can be embedded in the tapered grooves of the guide mold with the sharp grinding end, so that the diamond particles can be more effective. The opportunity of multi-turning causes multiple diamond particles to be evenly arranged and have a consistent direction orientation, so as to achieve the purpose of diamond grinding disc with good grinding effect.

以下在实施方式中详细叙述本发明的详细特征以及优点,其内容足以使任何熟悉相关技术的人了解本发明的技术内容并据以实施,且根据本说明书所揭露的内容、申请专利范围及图式,任何熟悉相关技术的人可轻易地理解本发明前述的目的及优点。The detailed features and advantages of the present invention are described in detail below in the implementation manner, and its content is enough to make any person familiar with the related art understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the patent scope of the application and the drawings Anyone who is familiar with the related art can easily understand the aforementioned purpose and advantages of the present invention.

以上关于本发明内容的说明及以下实施方式的说明用以示范与解释本发明的原理,并且提供本发明权利要求保护范围更进一步的解释。The above descriptions about the contents of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principles of the present invention, and provide further explanations of the protection scope of the claims of the present invention.

附图说明Description of drawings

图1A至图1C为本发明一较佳实施例的导引模具的制造步骤流程示意图;1A to 1C are schematic flow charts of the manufacturing steps of the guide mold in a preferred embodiment of the present invention;

图2A至图2E为本发明一较佳实施例的钻石研磨碟的制作流程示意图;2A to 2E are schematic diagrams of the manufacturing process of a diamond grinding disc according to a preferred embodiment of the present invention;

图3为本发明的钻石研磨碟的剖面示意图;Fig. 3 is the schematic sectional view of diamond grinding disc of the present invention;

图4A为本发明钻石研磨碟的结构示意图;以及Fig. 4A is the structural representation of diamond grinding disc of the present invention; And

图4B为本发明的钻石研磨碟的结构示意图。Fig. 4B is a schematic structural view of the diamond grinding disc of the present invention.

其中,附图标记为Among them, the reference signs are

100.......................................金属模具100....................................Metal molds

103.......................................突出部103....................................Protrusion

104                                       树脂材料104 Resin material

200.......................................导引模具200....................................Guide mold

201.......................................凹槽201 ................................................. groove

300.......................................容置单元300...................................Accommodating unit

400.......................................塑性材料400................................................Plastic material

500、500a、500b            ...............钻石颗粒500, 500a, 500b ......... Diamond Granules

501、501a、501b            ...............锐角研磨端501, 501a, 501b .........Acute-angle grinding end

600.......................................基座600....................................Pedestal

700                                 ......固化胶状物700 ...curing jelly

800                                        高分子材料800 Polymer material

具体实施方式Detailed ways

为使对本发明的目的、构造、特征、及其功能有进一步的了解,兹配合实施例详细说明如下。In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

本发明藉由一导引模具调整钻石研磨碟的钻石颗粒的排列方向,首先,请参阅图1A至图1C,其为本发明的导引模具200的制造步骤流程示意图。首先,提供一金属模具100(图1A),金属模具100具有多个突出部103,突出部103例如是锥形体,突出部103以一固定距离彼此分离设置。然后,灌注一树脂材料104于金属模具100上,并覆盖住突出部103(图1B),树脂材料为环氧树脂(epoxy resin)。之后,将树脂材料104硬化,并与金属模具100脱离。由于金属模具100具有突出部103,因此,硬化后的树脂材料104会在金属模具突出部103之处形成相对应的凹槽。将硬化后的树脂材料104与金属模具100分离之后,形成本发明的导引模具200(图1C),其中,导引模具200具有多个凹槽201,凹槽的结构为锥形体,例如是三角锥状或四角锥状,而锥形体可以是相同边长或不同边长。此外,导引模具的凹槽201的底部呈V形,其具有一夹角,角度为100°至150°,凹槽201的尺寸为150至215微米(μm),此外,凹槽201可为相同尺寸或是不同尺寸,但并不以本发明所揭露的实施例为限。The present invention uses a guide mold to adjust the arrangement direction of the diamond grains of the diamond grinding disc. First, please refer to FIGS. First, a metal mold 100 ( FIG. 1A ) is provided. The metal mold 100 has a plurality of protrusions 103 , such as cones, and the protrusions 103 are separated from each other by a fixed distance. Then, pour a resin material 104 on the metal mold 100 and cover the protruding portion 103 ( FIG. 1B ), the resin material is epoxy resin (epoxy resin). Thereafter, the resin material 104 is hardened and separated from the metal mold 100 . Since the metal mold 100 has the protruding portion 103 , the hardened resin material 104 forms a corresponding groove at the protruding portion 103 of the metal mold. After the hardened resin material 104 is separated from the metal mold 100, the guide mold 200 (FIG. 1C) of the present invention is formed, wherein the guide mold 200 has a plurality of grooves 201, and the structure of the groove is a cone, such as Triangular or quadrangular pyramids, and the pyramids can have the same side length or different side lengths. In addition, the bottom of the groove 201 of the guiding mold is V-shaped, which has an included angle, the angle is 100° to 150°, and the size of the groove 201 is 150 to 215 microns (μm). In addition, the groove 201 can be The same size or different sizes, but not limited to the disclosed embodiments of the present invention.

接着,请参阅图2A至图2E,其为本发明一较佳实施例的钻石研磨碟的制作流程示意图。首先,提供一容置单元300,并贴附一塑性材料400于容置单元300中,将多个钻石颗粒500黏附于塑性材料400上(图2A),其中,钻石颗粒500的粒径为250至420微米(μm),且分别具有至少一锐角研磨端501突设于塑性材料400。接着,提供导引模具200,并将导引模具200压抵于钻石颗粒500上(图2B),使钻石颗粒分别对应于导引模具的凹槽201插设,由于导引模具的凹槽201对应钻石颗粒200设置,因此,在施加压力于导引模具200上时,凹槽201会使得钻石颗粒的排列方向改变,使钻石颗粒的锐角研磨端501抵顶于凹槽201且与凹槽的V形底部密合(fit),如此一来,钻石颗粒200的排列方向改变。之后,移除导引模具200。Next, please refer to FIG. 2A to FIG. 2E , which are schematic diagrams of the manufacturing process of a diamond grinding disc according to a preferred embodiment of the present invention. First, a housing unit 300 is provided, and a plastic material 400 is attached in the housing unit 300, and a plurality of diamond particles 500 are adhered to the plastic material 400 (Fig. 2A), wherein the diameter of the diamond particles 500 is 250 to 420 microns (μm), and have at least one sharp-angle grinding end 501 protruding from the plastic material 400 . Next, guide mold 200 is provided, and guide mold 200 is pressed against on the diamond grain 500 (Fig. 2B), and diamond grain is inserted corresponding to the groove 201 of guide mold respectively, because the groove 201 of guide mold The corresponding diamond particle 200 is set, therefore, when applying pressure on the guide mold 200, the groove 201 will change the arrangement direction of the diamond particle, so that the sharp angle grinding end 501 of the diamond particle is against the groove 201 and is in contact with the groove. The bottom of the V-shape is fitted, so that the arrangement direction of the diamond particles 200 is changed. After that, the guide mold 200 is removed.

接下来,灌注一高分子材料800至容置单元300中(图2C),并覆盖住钻石颗粒500,高分子材料800的材质为环氧树脂,以环氧树脂做为钻石颗粒500的结合剂,可避免现有技术的高温硬焊工艺所造成的基材变形及钻石颗粒劣化的问题。之后,将高分子材料800硬化以形成一基座600(图2D),最后,移除容置单元300及塑性材料400,并形成本发明的钻石研磨碟(图2E)。Next, pour a polymer material 800 into the accommodation unit 300 ( FIG. 2C ), and cover the diamond particles 500 . The material of the polymer material 800 is epoxy resin, and the epoxy resin is used as a bonding agent for the diamond particles 500 , which can avoid the deformation of the base material and the deterioration of diamond particles caused by the high-temperature brazing process in the prior art. After that, the polymer material 800 is hardened to form a base 600 ( FIG. 2D ). Finally, the accommodating unit 300 and the plastic material 400 are removed to form the diamond grinding disc of the present invention ( FIG. 2E ).

要说明的是,由于高分子材料所形成的基座600,其表面的平坦度不佳,为了提升研磨碟的整体平坦性,以及改善钻石颗粒500周缘的高分子材料于工艺后产生凹陷的问题,可选择性地形成一固化胶状物700于硬化的基座600上,其中,固化胶状物700为一光固化胶(UV glue),并藉由紫外光线的照射,使得光固化胶产生硬化,以得到平整表面且具有钻石颗粒500的钻石研磨碟。It should be noted that the flatness of the surface of the base 600 formed by the polymer material is not good. In order to improve the overall flatness of the grinding disc and improve the problem of the polymer material around the diamond particle 500 being sunken after the process , can selectively form a cured glue 700 on the hardened base 600, wherein the cured glue 700 is a photocurable glue (UV glue), and by the irradiation of ultraviolet light, the photocurable glue is produced Hardened to obtain a diamond grinding disc with a flat surface and 500 diamond particles.

请参阅图3,其为本发明的钻石研磨碟的剖面示意图,包括有基座600以及多个钻石颗粒500,基座600的材质为环氧树脂,钻石颗粒500具有至少一锐角研磨端501,钻石颗粒500以辐射状径向分布于基座600,并且露出锐角研磨端501于基座600表面,形成多个钻石颗粒500锐角研磨端501皆以同一高度朝轴向露出于基座600的状态。Please refer to FIG. 3 , which is a schematic cross-sectional view of a diamond grinding disc of the present invention, including a base 600 and a plurality of diamond particles 500, the material of the base 600 is epoxy resin, and the diamond particles 500 have at least one acute-angle grinding end 501, The diamond particles 500 are radially distributed on the base 600, and the sharp-angled grinding ends 501 are exposed on the surface of the base 600, forming a state where the sharp-angled grinding ends 501 of a plurality of diamond particles 500 are all exposed to the base 600 at the same height in the axial direction .

另外值得注意的是,本发明的钻石研磨碟亦可藉由改变导引模具200的凹槽201的形状、角度或尺寸,例如当凹槽201的结构为不同边长的锥形体时,以形成如图4A及图4B所示的不同排列角度的钻石颗粒的钻石研磨碟。如图4A所示,多个钻石颗粒500a以辐射状径向分布于基座600,且钻石颗粒的锐角研磨端501a以基座600的轴心为基准,以同心圆依序向外周缘逐渐增加倾斜角度,以使钻石研磨碟呈一中央高外围低的形状,当然,亦可以同心圆依序向轴心处逐渐增加倾斜角度,并不以本实施例为限。It is also worth noting that the diamond grinding disc of the present invention can also be formed by changing the shape, angle or size of the groove 201 of the guide mold 200, for example, when the structure of the groove 201 is a cone with different side lengths. Diamond grinding discs with diamond particles at different arrangement angles as shown in Figure 4A and Figure 4B. As shown in FIG. 4A, a plurality of diamond particles 500a are radially distributed on the base 600, and the sharp-angled grinding ends 501a of the diamond particles are based on the axis of the base 600, and gradually increase toward the outer periphery in concentric circles. The inclination angle is such that the diamond grinding disc has a shape with a high center and a low periphery. Of course, the inclination angle can also be gradually increased from the concentric circles to the axis, which is not limited to this embodiment.

另外,亦可制造出如图4B所示的钻石研磨碟,其中,多个钻石颗粒500b以辐射状径向分布于基座600,靠近外周缘的钻石颗粒的锐角研磨端501b朝轴向露出于基座600,其余的钻石颗粒500b以同心圆依序向基座600的轴心处逐渐增加倾斜角度,以使钻石研磨碟呈一中央低外围高的形状。熟悉此项技术的人,亦可将钻石研磨碟表面型态变化设计为各种几何形状,以满足钻石研磨碟于实际应用在研磨工艺上的需求,并不以本发明所揭露的实施例为限。In addition, a diamond grinding disc as shown in FIG. 4B can also be manufactured, wherein a plurality of diamond particles 500b are radially distributed on the base 600, and the sharp-angle grinding ends 501b of the diamond particles near the outer periphery are exposed in the axial direction. The base 600 and the rest of the diamond grains 500b gradually increase their inclination angles towards the axis of the base 600 in concentric circles, so that the diamond grinding disc has a shape with a center low and a periphery high. Those who are familiar with this technology can also design the surface morphology of diamond grinding discs into various geometric shapes to meet the requirements of diamond grinding discs in the actual application of grinding technology, and do not take the embodiments disclosed in the present invention as limit.

本发明的钻石研磨碟藉由一具有多个凹槽的导引模具,将凹槽压抵于钻石颗粒上,以使钻石颗粒的锐角研磨端嵌入凹槽内,如此一来,钻石颗粒藉由导引模具而调整其排列方向,并以固化胶状物披覆于高分子材料所形成的基座上,除了可大幅增加钻石颗粒转向的机会,降低制造成本,而不会出现现有技术中使用筛网网目所无法控制钻石颗粒取向的缺点,更可避免因高温硬焊工艺所造成的基材变形及钻石颗粒劣化的问题。The diamond grinding disc of the present invention uses a guide mold with multiple grooves to press the grooves against the diamond particles, so that the sharp-angled grinding ends of the diamond particles are embedded in the grooves, so that the diamond particles are Guide the mold to adjust its arrangement direction, and coat the base formed by the polymer material with the cured jelly, in addition to greatly increasing the chance of the diamond particles turning, reducing the manufacturing cost, and will not appear in the prior art. The disadvantage of being unable to control the orientation of diamond particles by using the screen mesh can avoid the deformation of the substrate and the deterioration of diamond particles caused by the high-temperature brazing process.

虽然本发明已以一较佳实施例揭露如上,然其并非用以限定本发明,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Those skilled in the art can make various corresponding modifications according to the present invention without departing from the spirit and essence of the present invention. Changes and modifications, but these corresponding changes and modifications should belong to the scope of protection of the appended claims of the present invention.

Claims (18)

1.一种钻石研磨碟的制造方法,其特征在于,包括有以下步骤:1. A method for manufacturing a diamond grinding disc, characterized in that, comprises the following steps: 提供一容置单元,该容置单元内设置有多个钻石颗粒,且每一该些钻石颗粒具有至少一锐角研磨端;A housing unit is provided, and a plurality of diamond particles are arranged in the housing unit, and each of the diamond particles has at least one acute-angle grinding end; 提供一导引模具,该导引模具具有多个凹槽;providing a guide mold, the guide mold has a plurality of grooves; 将该导引模具压抵于该些钻石颗粒,使该些钻石颗粒的锐角研磨端分别对应于该些凹槽插设;Pressing the guide mold against the diamond particles so that the sharp-angle grinding ends of the diamond particles are respectively inserted corresponding to the grooves; 移除该导引模具;remove the pilot mold; 灌注一高分子材料至该容置单元内并覆盖该些钻石颗粒;pouring a polymer material into the containing unit and covering the diamond particles; 硬化该高分子材料;以及harden the polymeric material; and 移除该容置单元。Remove the containment unit. 2.如权利要求1所述的制造方法,其特征在于,还包括贴附一塑性材料于该容置单元内,且该些钻石颗粒的锐角研磨端突设于该塑性材料。2 . The manufacturing method according to claim 1 , further comprising attaching a plastic material in the accommodating unit, and the sharp-angle grinding ends of the diamond particles protrude from the plastic material. 3.如权利要求1所述的制造方法,其特征在于,还包含形成有一固化胶状物于该硬化的高分子材料上。3. The manufacturing method according to claim 1, further comprising forming a cured jelly on the hardened polymer material. 4.如权利要求3所述的制造方法,其特征在于,该固化胶状物为一光固化胶。4. The manufacturing method according to claim 3, wherein the cured jelly is a photocurable glue. 5.如权利要求1所述的制造方法,其特征在于,该高分子材料的材质为环氧树脂。5. The manufacturing method according to claim 1, wherein the polymer material is made of epoxy resin. 6.如权利要求1所述的制造方法,其特征在于,该些导引模具的凹槽的形成包括有以下步骤:6. The manufacturing method according to claim 1, wherein the forming of the grooves of the guide molds comprises the following steps: 提供一金属模具,该金属模具具有多个凹陷部;providing a metal mold having a plurality of depressions; 提供一树脂层于该金属模具上,并覆盖该些凹陷部;providing a resin layer on the metal mold and covering the depressions; 硬化该树脂层;以及hardening the resin layer; and 将该硬化的树脂层与该金属模具分离,以获得该导引模具。The hardened resin layer is separated from the metal mold to obtain the guide mold. 7.如权利要求6所述的制造方法,其特征在于,该树脂层为环氧树脂。7. The manufacturing method according to claim 6, wherein the resin layer is epoxy resin. 8.如权利要求6所述的制造方法,其特征在于,该些凹槽为锥形体。8. The manufacturing method according to claim 6, wherein the grooves are conical. 9.如权利要求8所述的制造方法,其特征在于,该些锥形体包括三角锥或四角锥。9. The manufacturing method according to claim 8, wherein the pyramids comprise triangular pyramids or quadrangular pyramids. 10.如权利要求8所述的制造方法,其特征在于,该些锥形体为相同边长或不等边长。10. The manufacturing method according to claim 8, wherein the tapered bodies have the same or unequal side lengths. 11.如权利要求6所述的制造方法,其特征在于,该些凹槽的底部具有一夹角,该夹角为100°至150°。11 . The manufacturing method according to claim 6 , wherein the bottoms of the grooves have an included angle, and the included angle is 100° to 150°. 12.如权利要求6所述的制造方法,其特征在于,该些凹槽的尺寸为150至215微米,而该些钻石颗粒的粒径为250至420微米。12. The manufacturing method as claimed in claim 6, wherein the grooves have a size of 150-215 microns, and the diamond particles have a particle size of 250-420 microns. 13.如权利要求1所述的制造方法,其特征在于,该些钻石颗粒的锐角研磨端分别对应于该些凹槽插设,以使得该些钻石颗粒转向。13 . The manufacturing method according to claim 1 , wherein the sharp-angled grinding ends of the diamond particles are respectively inserted corresponding to the grooves, so that the diamond particles are turned around. 14 . 14.一种如权利要求1所述的制造方法所制造的钻石研磨碟,其特征在于,包括有:14. A diamond grinding disc manufactured by the manufacturing method according to claim 1, characterized in that, comprising: 一高分子基座;以及a polymer base; and 多个钻石颗粒,设置于该高分子基座上,该些钻石颗粒分别具有至少一锐角研磨端且露出于该高分子基座的表面。A plurality of diamond particles are arranged on the polymer base, and each of the diamond particles has at least one sharp-angle grinding end and is exposed on the surface of the polymer base. 15.如权利要求14所述的钻石研磨碟,其特征在于,该高分子基座的材质为环氧树脂。15. The diamond grinding disc according to claim 14, wherein the polymer base is made of epoxy resin. 16.如权利要求14所述的钻石研磨碟,其特征在于,该些钻石颗粒以辐射状径向设置于该基座,且该些钻石颗粒的锐角研磨端以同一高度朝轴向露出于该基座。16. The diamond grinding disc according to claim 14, wherein the diamond particles are radially arranged on the base, and the sharp-angle grinding ends of the diamond particles are exposed axially at the same height base. 17.如权利要求14所述的钻石研磨碟,其特征在于,该些钻石颗粒以辐射状径向分布于该基座,且该些钻石颗粒的锐角研磨端以该基座的轴心为基准,以同心圆依序向外周缘逐渐增加倾斜角度,以使该钻石研磨碟呈一中央高外围低的形状。17. The diamond grinding disc according to claim 14, wherein the diamond particles are radially distributed on the base, and the sharp-angle grinding ends of the diamond particles are based on the axis of the base , gradually increasing the inclination angle toward the outer periphery in concentric circles, so that the diamond grinding disc has a shape with a high center and a low periphery. 18.如权利要求14所述的钻石研磨碟,其特征在于,该些钻石颗粒以辐射状径向分布于该基座,靠近外周缘的该些钻石颗粒的该些锐角研磨端朝轴向露出于该基座,其余的该些钻石颗粒以同心圆依序向该基座的轴心处逐渐增加倾斜角度,以使该钻石研磨碟呈一中央低外围高的形状。18. The diamond grinding disc according to claim 14, wherein the diamond particles are radially distributed on the base, and the sharp-angle grinding ends of the diamond particles near the outer periphery are exposed axially On the base, the rest of the diamond particles gradually increase their inclination angles towards the axis of the base in concentric circles, so that the diamond grinding disc has a shape with a lower center and a higher periphery.
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CN102152250A (en) * 2010-12-29 2011-08-17 华侨大学 Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state
CN102152250B (en) * 2010-12-29 2015-01-21 华侨大学 Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state
CN105014516A (en) * 2015-07-29 2015-11-04 柳州市旭平首饰有限公司 Gem bead polishing machine
CN108747876A (en) * 2018-06-11 2018-11-06 河北思瑞恩新材料科技有限公司 A kind of preparation method of lacquer painting abrasive sand dish
CN109333893A (en) * 2018-09-27 2019-02-15 福建省海钛智能科技有限公司 A kind of automation equipment applying to artificial diamond silica gel mould preparation process
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CN112959235A (en) * 2021-02-24 2021-06-15 合肥铨得合半导体有限责任公司 Method for adjusting diamond brush tip surface in diamond disc

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