CN105364715A - Polishing trimmer - Google Patents

Abstract

The invention relates to a polishing dresser, which comprises a base and a sapphire polishing pad, wherein the sapphire polishing pad comprises a root and a polishing layer, the root is fixedly arranged on the base, the polishing layer comprises a plurality of protrusions and a plurality of recesses, and a microstructure with the surface roughness of 0.1-5 microns is formed on the surface of at least one of the protrusions and the recesses. Therefore, the grinding layer and the root part of the polishing dresser are integrally formed, and the problem that grinding particles of a traditional dresser fall off is thoroughly solved; and the microstructure of the surface of the abrasive layer is utilized to increase the dressing efficiency of the polishing pad.

Description

Polishing trimmer

technical field

The present invention relates to the conditioning or activation of polishing tool surfaces; in particular, it relates to a polishing conditioner.

Background technique

Polishing refers to the technology of using physical machinery or chemicals to reduce the surface roughness of the processed object. It is mainly used in precision machinery and optical industries. During the polishing process, the processed object needs to be pressed on a high-speed rotating polishing pad for polishing. In order to prevent the polishing pad from being deformed or piled up after use to affect the efficiency of the subsequent polishing action, it is a necessary step to use a dresser to maintain a stable surface morphology of the polishing pad.

Existing polishing and dressing devices are made by bonding diamond abrasive grains to the surface of the metal substrate, but since the diamond abrasive grains are bonded to the surface of the metal substrate by sintering or adhesion, the bonding force will vary depending on the contact area. Affected by the thermal expansion and contraction between the contact surface and the contact surface, the diamond abrasive grains will fall off and cause scratches or even damage to the processed object; and the height, shape and size of the diamond abrasive grains exposed on the surface of the metal substrate are different, Makes the availability of diamond abrasive grains unstable.

China Taiwan Patent No. M465659 discloses an improved chemical mechanical grinding dresser, including an abrasive layer with a metal support layer and abrasive grains, wherein the abrasive grains are arranged on opposite sides of the metal support layer to reduce the wear of the abrasive layer on brazing The degree of deformation caused by post-cooling; in addition, the heights of each abrasive grain exposed on the metal support layer are equal and the tops all have a flat surface, so that the protruding ends of these abrasive grains can jointly form a flat surface, which improves the polishing effect of the dresser. Pad dressing uniformity.

However, although the above-mentioned improvement can increase the usability of each abrasive grain, it can also effectively reduce the possibility of the abrasive grain falling off, but because the abrasive grain and the metal support layer are still made of different materials, they may be damaged due to the presence of abrasive particles when heated or cooled. Different coefficients of thermal expansion lead to a decrease in the bonding force between the two, which cannot really solve the problem of abrasive particles falling off.

Contents of the invention

In view of this, the object of the present invention is to provide a polishing dresser, which can reduce the risk of abrasive particles falling off and can effectively maintain the polishing efficiency of the polishing pad.

In order to achieve the above object, the polishing conditioner provided by the present invention includes a base and a sapphire polishing pad. Wherein, the sapphire grinding pad includes a root portion and a grinding layer, the root portion is fixed on the base, and the grinding layer includes a plurality of protrusions and a plurality of recesses, wherein at least one of each protrusion and each recess is A microstructure with a surface roughness between 0.1 and 5 micrometers (μm) is formed on the surface of one.

The effect of the present invention is that the grinding layer and the root of the sapphire grinding pad are integrally formed, replacing the combination of grinding particles in the traditional dresser, and solving the problem of falling off of grinding particles caused by thermal expansion and contraction in the past; in addition, using The microstructure of the abrasive layer surface increases the efficiency of polishing pad conditioning.

Description of drawings

FIG. 1 is a cross-sectional view of a polishing dresser according to a preferred embodiment of the present invention, revealing that microstructures are formed on the surface of the protrusions of the abrasive layer.

FIG. 2 is a top view of the polishing conditioner according to the preferred embodiment of the present invention, showing that the sapphire polishing pad is fixed on the base in the form of a single disk.

Fig. 3 is a partial sectional view of the polishing dresser according to the preferred embodiment of the present invention, revealing the length of each part of the sapphire polishing pad.

FIG. 4 is a partial schematic view of the polishing dresser according to the above-mentioned preferred embodiment of the present invention, revealing that the shape of the protrusion of the grinding layer is a flat-topped cone.

FIG. 5 is similar to FIG. 1 , revealing that microstructures are formed on the surface of the concave portion of the grinding layer.

FIG. 6 is similar to FIG. 1 , revealing that microstructures are formed on both the surface of the protrusion and the surface of the recess of the polishing layer.

FIG. 7 is similar to FIG. 2 , showing that the sapphire polishing pads are arranged on the base in a ring shape of a plurality of disks.

FIG. 8 is similar to FIG. 2 , showing that the sapphire polishing pads are arranged on the base in a plurality of fan-shaped rings.

FIG. 9 is similar to FIG. 4 , revealing that the shape of the protrusion of the abrasive layer is a flat-topped quadrangular pyramid.

FIG. 10 is similar to FIG. 4 , revealing that the shape of the protrusion of the abrasive layer is a flat-topped triangular pyramid.

FIG. 11 is similar to FIG. 4 , revealing that the shape of the protrusion of the polishing layer is a flat-topped hexagonal pyramid.

FIG. 12 is similar to FIG. 4 , revealing that the shape of the protrusion of the grinding layer is a cylinder.

FIG. 13 is similar to FIG. 4 , revealing that the shape of the protrusion of the polishing layer is a square column.

【Symbol Description】

1 polishing trimmer

10 base

20 sapphire grinding pads

22 Root 24 Grinding layer 24A Protrusion

24B Recess 26 Microstructure

tThickness of sapphire lapping pad

wProtrusion bottom width hProtrusion height

p The distance between two adjacent protrusions

detailed description

In order to illustrate the present invention more clearly, the preferred embodiment is given hereby and the detailed description is as follows in conjunction with the drawings. Please refer to FIGS. The base 10 and a sapphire polishing pad 20 .

The crystal structure of the sapphire polishing pad 20 of the polishing trimmer 1 is a single crystal, twin crystal or polycrystalline structure, and includes a root portion 22 and a grinding layer 24, and the root portion 22 is brazed, glued or tenoned The abrasive layer 24 is fixed on the base 10 in a manner, and includes a plurality of protrusions 24A and a plurality of recesses 24B.

In this embodiment, the surface of each protrusion 24A is further formed with a microstructure 26 with a surface roughness ranging from 0.1 to 5 micrometers (μm), and the microstructure 26 is made by yellow light lithography technology or laser cutting technology have a patterned structure. The etching of the yellow light lithography process is to use halogen-containing gas or other compound gas, such as Cl ₂ , BCl ₃ or SF ₆ , etc. for dry etching, or use strong acid or mixed strong acid, such as sulfuric acid, phosphoric acid or sulfur-phosphoric acid for wet etching. etch.

As shown in FIGS. 2 and 3 , the sapphire polishing pad 20 is fixed on the base 10 in the form of a single disc, wherein the thickness t of the sapphire polishing pad 20 is between 100 and 5000 microns (μm). ; The bottom width w of each of the protrusions 24A of the abrasive layer 24 is between 5 and 250 microns (μm), and the height h is between 5 and 250 microns (μm); and between the two adjacent protrusions 24A The distance p between them is between 5 and 650 micrometers (μm), wherein the shape of the protruding portion 24A is a flat-topped cone (refer to FIG. 4 ).

The sapphire grinding pad 20 of the polishing dresser 1 in the above-mentioned embodiment is made of a material with high hardness and lower cost than diamond, and the grinding layer 24 is made of surface patterning, without the risk of abrasive particles falling off, and using finer The microstructure 26 effectively maintains the polishing efficiency of the polishing pad.

In addition, the microstructure 26 of the present invention is formed on the surface of the concave portion 24B as shown in FIG. 5 in addition to the above-mentioned surface formed on the protrusion 24A; even as shown in FIG. And the surface of the concave portion 24B. Since the surface of the polishing pad is uneven, when the polishing pad is in contact with the concave portion 24B of the abrasive layer 24, the microstructure 26 on the surface of the concave portion 24B can increase the polishing area of the polishing pad, effectively improving the efficiency of activating the polishing pad.

Furthermore, the pattern of the sapphire polishing pad 20 being fixed on the base 10 is not limited, and it means to include the pattern of the above-mentioned single disc, the annular arrangement of a plurality of discs as shown in FIG. 7 , or Or the form of a plurality of fan-shaped circular arrangements as shown in FIG. 8 .

In addition, the shape of each protrusion 24A of the abrasive layer 24 includes flat-topped polygonal pyramids such as flat-topped triangular pyramids and flat-topped quadrangular pyramids, three-dimensional trapezoids, cylinders, and polygonal columns such as square columns ( 9 to 13 refer to) or a combination of at least two shapes of the aforementioned shapes.

To sum up, the abrasive layer and the root of the polishing dresser of the present invention are integrally formed, which completely solves the problem of abrasive particles falling off in traditional dressers; and utilizes the microstructure on the surface of the abrasive layer to increase the dressing efficiency of the polishing pad.

The above descriptions are only preferred feasible embodiments of the present invention, and all equivalent changes made by applying the description of the present invention and the scope of the patent application should be included in the scope of the patent of the present invention.

Claims (11)

1. A polishing finisher, characterized in that comprising: a base; A sapphire grinding pad, comprising a root portion and a grinding layer, the root portion is fixed on the base, the grinding layer includes a plurality of protrusions and a plurality of recesses, wherein at least one of each protrusion and each recess A microstructure with a surface roughness ranging from 0.1 to 5 micrometers is formed on the surface. 2. The polishing trimmer according to claim 1, wherein the root of the sapphire polishing pad is fixed on the base by brazing, gluing or tenon. 3. The polishing trimmer as claimed in claim 1, wherein the crystal structure of the sapphire polishing pad is single crystal, twin crystal or polycrystalline structure. 4. The polishing conditioner as claimed in claim 1, wherein the thickness of the sapphire polishing pad is between 100 and 5000 microns. 5 . The polishing dresser as claimed in claim 1 , wherein the bottom width of each protrusion of the grinding layer is between 5 and 250 microns. 5 . 6 . The polishing dresser as claimed in claim 1 , wherein the height of each protrusion of the grinding layer is between 5 and 250 microns. 7. The polishing finisher as claimed in claim 1, characterized in that, the shape of each protrusion of the grinding layer is a flat-topped cone, a flat-topped polygonal pyramid, a three-dimensional trapezoid, a cylinder, a polygonal column, or at least one of the aforementioned shapes. A combination of two shapes. 8. The polishing conditioner as claimed in claim 1, wherein the distance between two adjacent protrusions is between 5 and 650 microns. 9. The polishing device as claimed in claim 1, wherein the microstructure of the polishing layer is obtained through a patterning process. 10 . The polishing device according to claim 9 , wherein the microstructure of the abrasive layer has a patterned structure produced by yellow light lithography. 11 . 11. The polishing dresser according to claim 9, characterized in that, the microstructure of the grinding layer is made with a patterned structure by laser cutting technology.