CN101819163A - Detection device of subsurface defect of optical element and method thereof - Google Patents
Detection device of subsurface defect of optical element and method thereof Download PDFInfo
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- CN101819163A CN101819163A CN 201010189970 CN201010189970A CN101819163A CN 101819163 A CN101819163 A CN 101819163A CN 201010189970 CN201010189970 CN 201010189970 CN 201010189970 A CN201010189970 A CN 201010189970A CN 101819163 A CN101819163 A CN 101819163A
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Abstract
The invention provides a detection device of subsurface defect of an optical element with little measurement error and a method thereof. The detection device of the subsurface defect of the optical element comprises a microscope, a precise displacement platform and an image data processing unit connected with the microscope, wherein thethe image data processing unit is further connected with a laser displacement sensor which is used for measuring the movement amount of the precise displacement platform in the direction Z. In the invention, the optical microscope and the laser displacement sensor are adopted for measuring the subsurface detect, the subsurface defect depth and the appearances of the subsurface detect under different depths are obtained, and the observation of the appearances of the subsurface detect under different depths and the accurate depth measurement are realized, error resulting from the reposition of the traditional detection is avoided, and micron-level measurement precision is ensured. The invention is used for the detection of the subsurface defect of optical glass, and is suitable for the measurement of processing subsurface defect of ceramic, silicon, germanium and other engineering materials.
Description
Technical field
The present invention relates to optics processing and detection range, particularly relate to a kind of pick-up unit and method thereof that the optical element processing grinding stage produces subsurface defect that be used for.
Background technology
Along with the development of large laser optical system, astronomical telescope and space telescope system, more and more strict for the crudy requirement of optical element.For many years the optical element defect characteristics origin cause of formation be studies show that the subsurface defects such as micro-crack that produce in the optical element manufacture process are to cause the key factor of optical element defective.The life-span of the optical element in the optical system and performance are subjected to the especially influence of subsurface defect of its crudy.Therefore measure the degree and the degree of depth that subsurface defect of optical element produces accurately and efficiently, to optimize grinding and polishing process, raising working (machining) efficiency, to save processing cost significant, also provides the guidance foundation to the optical element that obtains the perfect surface of low defective simultaneously.
At present, mainly use for the measurement of subsurface defect of optical element and hit hole method or wedge surface polishing method and measure.This method is that the sample after will grinding earlier carries out the local polishing etching, utilize again contourgraph from the milling zone to the polishing area along certain direction, treating lateral areas field surface profile measures, obtain the pattern in tested zone, be the variation of degree of depth Z (highly) with X (level) direction, utilize microscope that the same area is observed again, must make the microscopic zone in full accord during observation with the contourgraph measured zone, and must know the coordinate of directions X, this relate to the microscopically sample relocate and microscope in the displacement accuracy problem of directions X, cause measurement result to introduce bigger error, cause finally that the degree of depth and topography measurement result's is unreliable.
Summary of the invention
Technical matters to be solved by this invention provides the pick-up unit of the little subsurface defect of optical element of a kind of measuring error.
The present invention also will provide a kind of detection method of subsurface defect of optical element.
The technical scheme that technical solution problem of the present invention is adopted is: the pick-up unit of subsurface defect of optical element, comprise microscope, precision displacement platform, the image data processing unit that is connected with microscope, also be connected with laser displacement sensor on described image data processing unit, described laser displacement sensor is used to measure the amount of movement of precision displacement platform in the Z direction.
The invention has the beneficial effects as follows: the present invention adopts optical microscope and laser displacement sensor to carry out the measurement of subsurface defect, can obtain the subsurface defect pattern under the subsurface defect degree of depth and the different depth simultaneously, realized the observation of subsurface defect pattern under the different depth and the accurate measurement of the degree of depth, avoided traditional detection to reorientate the error of being introduced, measuring accuracy is in micron dimension; The present invention does not need expensive contourgraph, has avoided traditional measurement method problem, the problem includes: the measuring error that the problem that relocates causes has also been avoided the necessary strict corresponding harsh requirement of contourgraph measured zone and microscopic zone in the classic method; The present invention is for optimizing the grinding and the glossing of optical element, improve working (machining) efficiency, save process time and cost important quantification reference is provided, also provide important detection foundation simultaneously for obtaining low defective finished surface, the subsurface defect that the present invention not only can be used for optical glass detects, and is applicable to that equally also the processing subsurface defect of construction materials such as pottery, silicon, germanium is measured.
Description of drawings
Fig. 1 is the structural representation of apparatus of the present invention.
Embodiment
As shown in Figure 1, measurement mechanism of the present invention comprises: microscope 1, laser displacement sensor 2, precision displacement platform 3, image data processing unit 4, image data processing unit 4 link together with microscope 1 and laser displacement sensor 2 respectively.Microscope 1 has the camera lens of high magnification large-numerical aperture and the camera lens of the wide visual field of low range, and wide visual field camera lens is used for the Primary Location in tested zone, and high-rate lens is used for accurate focusing and then measures the subsurface defect degree of depth and observation subsurface defect pattern.Laser displacement sensor 2 is used to measure the amount of movement of precision displacement platform 3 in the Z direction, and laser displacement sensor 2 has the above measuring accuracy of submicron order.Precision displacement platform 3 is used to place sample 5 and tested zone is accurately located, and precision displacement platform 3 can move on X and Z direction, and mobile accuracy is respectively submillimeter level and more than the micron order on X and the Z direction.Image data processing unit 41 image of gathering that is used to adjust the telescope to one's eyes carries out digital processing.
Above-mentioned data processing unit 4 can adopt common PC, and greater than 20mm, precision 0.1mm's precision displacement platform 3 beats in the Z direction ± 1 μ m at the directions X translation distance.Microscope 1 adopts the camera lens of high magnification (100 *) large-numerical aperture (NA=0.9) and the wide visual field of low range (5 *).Laser displacement sensor 2 can adopt the He-Ne laser of wavelength 632.8nm, and measuring accuracy 0.1 μ m realizes the depth survey of Z direction micron dimension.
Measuring method of the present invention may further comprise the steps:
1) sample 5 after will grinding earlier carries out the local polishing etching;
2) sample 5 is placed on the precision displacement platform 3, adopts the low range camera lens of microscope 1 to determine initial observation area;
3) use high-rate lens instead and observe, mobile precision displacement platform 3 makes sample 5 move horizontally at directions X, makes high-rate lens be scanned up to polishing area to sample 5 gradually from abrasive areas;
4) when high-rate lens moves to required measurement regional, regulate precision displacement platform 3 along the Z direction, make the high-rate lens of microscope 1 focus on measured zone, utilize of the displacement of laser displacement sensor 2 record precision displacement platforms 3 simultaneously in the Z direction, this displacement is and is observed the degree of depth of zone with respect to the initial observation position, if this zone has subsurface defect, this displacement is the degree of depth of observation area subsurface defect so, observe the subsurface defect pattern of this position simultaneously by microscope 1, disposable pattern and the depth information that obtains subsurface defect under the different depth.
Claims (6)
1. the pick-up unit of subsurface defect of optical element, comprise microscope (1), precision displacement platform (3), the image data processing unit (4) that is connected with microscope (1), it is characterized in that: also be connected with laser displacement sensor (2) on described image data processing unit (4), described laser displacement sensor (2) is used to measure the amount of movement of precision displacement platform (3) in the Z direction.
2. the pick-up unit of subsurface defect of optical element as claimed in claim 1, it is characterized in that: described microscope (1) has the camera lens of high magnification large-numerical aperture and the camera lens of the wide visual field of low range.
3. the pick-up unit of subsurface defect of optical element as claimed in claim 1 is characterized in that: described laser displacement sensor (2) has the above measuring accuracy of submicron order.
4. the pick-up unit of subsurface defect of optical element as claimed in claim 1, it is characterized in that: described precision displacement platform (3) can move on X and Z direction, and mobile accuracy is respectively submillimeter level and more than the micron order on X and the Z direction.
5. the pick-up unit of subsurface defect of optical element as claimed in claim 1 is characterized in that: described image data processing unit (4) employing PC.
6. the detection method of subsurface defect of optical element, it is characterized in that: this method may further comprise the steps:
1) sample (5) after will grinding earlier carries out the local polishing etching;
2) sample (5) is placed on the precision displacement platform (3), adopts the camera lens of the wide visual field of low range of microscope (1) to determine initial observation area;
3) camera lens of using the high magnification large-numerical aperture instead is observed, and mobile precision displacement platform (3) makes sample (5) move horizontally at directions X, makes the camera lens of high magnification large-numerical aperture be scanned up to polishing area to sample (5) gradually from abrasive areas;
4) when the camera lens of high magnification large-numerical aperture moves to required measurement regional, regulate precision displacement platform (3) along the Z direction, the lens focus of high magnification large-numerical aperture that makes microscope (1) is in measured zone, utilize the displacement of laser displacement sensor (2) record precision displacement platform (3) simultaneously in the Z direction, this displacement is and is observed the degree of depth of zone with respect to the initial observation position, if this zone has subsurface defect, this displacement is the degree of depth of observation area subsurface defect so, observe the subsurface defect pattern of this position simultaneously by microscope (1), disposable pattern and the depth information that obtains subsurface defect under the different depth.
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| CN 201010189970 CN101819163A (en) | 2010-06-03 | 2010-06-03 | Detection device of subsurface defect of optical element and method thereof |
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| CN 201010189970 CN101819163A (en) | 2010-06-03 | 2010-06-03 | Detection device of subsurface defect of optical element and method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101949839A (en) * | 2010-09-03 | 2011-01-19 | 西安工业大学 | Device and method for measuring damage of optical surface subsurface layer |
| CN103149217A (en) * | 2013-03-12 | 2013-06-12 | 合肥知常光电科技有限公司 | Infrared phase locking and imaging method and device for surface and subsurface defect detection of optimal element |
| CN103206924A (en) * | 2012-01-11 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Metal mask plate surface shape measuring system and measuring method thereof |
| CN103217437A (en) * | 2013-03-13 | 2013-07-24 | 中国科学院上海光学精密机械研究所 | Optical element defect scanning device |
| CN103364176A (en) * | 2012-12-06 | 2013-10-23 | 西安工业大学 | Testing system for laser induced damage threshold |
| CN103399021A (en) * | 2013-08-15 | 2013-11-20 | 厦门大学 | Detection method of subsurface cracks of transparent optical element |
| CN103619537A (en) * | 2011-06-28 | 2014-03-05 | 康宁股份有限公司 | Glass edge finishing method |
| CN104076039A (en) * | 2014-03-28 | 2014-10-01 | 合波光电通信科技有限公司 | Automatic detection method for appearance defects of optical filters |
| CN104111089A (en) * | 2014-06-30 | 2014-10-22 | 苏州科德溯源仪器有限公司 | Computer-aided zoom type image measuring instrument |
| CN104259105A (en) * | 2014-07-24 | 2015-01-07 | 肇庆爱晟电子科技有限公司 | Method for screening microcrack temperature-sensitive chips |
| CN104792793A (en) * | 2015-04-28 | 2015-07-22 | 刘凯 | Optical defect detecting method and system |
| CN104807742A (en) * | 2015-04-16 | 2015-07-29 | 西北核技术研究所 | Laser focusing irradiation effect experimental device and method |
| CN105021625A (en) * | 2015-07-08 | 2015-11-04 | 苏州奥莱维信息技术有限公司 | Surface defect detection apparatus |
| CN105259178A (en) * | 2015-11-20 | 2016-01-20 | 云南卡索实业有限公司 | Shearing type linear trace laser detection system |
| CN105300996A (en) * | 2015-11-20 | 2016-02-03 | 昆明信诺莱伯科技有限公司 | Linear trace laser detection system for police |
| CN107063112A (en) * | 2017-03-30 | 2017-08-18 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of glass orifice surface defect layer depth measuring method |
| CN108896516A (en) * | 2018-05-19 | 2018-11-27 | 芜湖新利德玻璃制品有限公司 | A kind of organic glass crazing detection device based on light transmittance |
| WO2019129004A1 (en) * | 2017-12-28 | 2019-07-04 | Oppo广东移动通信有限公司 | Detection method, detection device, computer device, and computer readable storage medium |
| CN110542687A (en) * | 2019-07-02 | 2019-12-06 | 中国工程物理研究院激光聚变研究中心 | Detection device and detection method for appearance defects of microscopic elements |
| CN110686614A (en) * | 2019-10-11 | 2020-01-14 | 西安工业大学 | A detection device and detection method for subsurface defect depth information of optical components |
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| CN112179907A (en) * | 2020-08-14 | 2021-01-05 | 太原理工大学 | A method and system for detecting surface defects of sintered rolling-polishing abrasive blocks |
| CN113777152A (en) * | 2021-08-17 | 2021-12-10 | 华中科技大学 | Surface crack detection method based on laser displacement sensor |
| CN114295731A (en) * | 2021-12-28 | 2022-04-08 | 杭州电子科技大学 | Method for measuring depth of subsurface defect based on laser excitation longitudinal wave |
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| CN101949839A (en) * | 2010-09-03 | 2011-01-19 | 西安工业大学 | Device and method for measuring damage of optical surface subsurface layer |
| CN103619537A (en) * | 2011-06-28 | 2014-03-05 | 康宁股份有限公司 | Glass edge finishing method |
| CN103619537B (en) * | 2011-06-28 | 2016-05-04 | 康宁股份有限公司 | Glass edge method for fine finishing |
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| CN105259178A (en) * | 2015-11-20 | 2016-01-20 | 云南卡索实业有限公司 | Shearing type linear trace laser detection system |
| CN105300996A (en) * | 2015-11-20 | 2016-02-03 | 昆明信诺莱伯科技有限公司 | Linear trace laser detection system for police |
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| CN115332039B (en) * | 2022-10-13 | 2023-01-13 | 新美光(苏州)半导体科技有限公司 | Monocrystalline silicon structure, component, application and method for plasma processing equipment |
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