CN101329043B - Light source assembly and method for adjusting brightness of light source assembly - Google Patents

Abstract

The invention discloses a light source component, which comprises a carrier, a plurality of light-emitting units, a plurality of first wires and a plurality of second wires, wherein the light-emitting units, the first wires and the second wires are all configured on the carrier. In addition, each light-emitting unit is electrically connected to one of the second wires and one of the first wires respectively. Therefore, the light source component can provide a relatively uniform light source.

Description

Light source component and method for adjusting brightness of the light source component

technical field

The present invention relates to a light source assembly and a method for adjusting brightness, and in particular relates to a light source assembly using a light emitting unit and a method for adjusting brightness.

Background technique

In recent years, light emitting diode (LED) devices using gallium nitride-containing compound semiconductors, such as gallium nitride (GaN), aluminum gallium nitride (AlGaN), and steel gallium nitride (InGaN), have attracted much attention. . Group III nitrides are materials with a wide band energy gap, and their emission wavelengths can cover from ultraviolet light to red light, so it can be said to almost cover the entire visible light band. In addition, compared with traditional light bulbs, light-emitting diodes have absolute advantages, such as small size, long life, low voltage/current drive, not easy to break, mercury-free (no pollution problem), and good luminous efficiency (power saving), etc., Therefore, light-emitting diodes are widely used in industry.

Since the light emitting phenomenon of light emitting diodes does not belong to thermoluminescence or discharge luminescence, but to cold luminescence, the life of light emitting diode devices can be as long as more than 100,000 hours under the condition of good heat dissipation, and there is no need for idling time . In addition, light-emitting diode devices have the advantages of fast response (about 10-9 seconds), small size, low power consumption, low pollution (mercury-free), high reliability, and suitable for mass production, so their application fields are very wide . Therefore, light-emitting diodes are regarded as the most important light source in the 21st century.

In the light source assembly composed of light emitting diodes, since the luminance of each light emitting diode is not the same, the difference in local luminance will be relatively large. In addition, the light emitting diodes used in the existing light source components usually have encapsulation, and the heat dissipation efficiency of the encapsulation is poor. In addition, since the existing LEDs generate a large amount of heat energy during operation, and the brightness and lifetime of the LEDs are affected by temperature, when the power of the LEDs increases, the heat dissipation requirements gradually increase. The prior art uses a complex heat dissipation system, but the complex heat dissipation system will also cause problems such as excessive volume and increased cost.

Contents of the invention

In view of this, the present invention provides a light source assembly to improve the uniformity of the light source.

In addition, the invention provides a method for adjusting brightness, so as to adjust the brightness of the light source assembly.

The invention provides a light source assembly, which includes a carrier, a plurality of light emitting units, a plurality of first wires, a plurality of second wires and a transparent cover. Wherein, the light emitting unit, the first wire and the second wire are all arranged on the carrier. In addition, each light emitting unit is electrically connected to one of the second wires and one of the first wires. The first wires respectively connected to the light emitting units are electrically insulated from each other, and the second wires respectively connected to the light emitting units are electrically insulated from each other. At least one of the second wires has a removed area, and the size of the second wire in the removed area is smaller than the size of other areas of the second wire. The transparent cover is disposed on the carrier and covers the light emitting unit.

In an embodiment of the present invention, the material of the second wire may be metal material, ceramic material or metalloid.

In an embodiment of the present invention, the light source assembly further includes a plurality of first pads and a plurality of second pads, wherein each second wire is electrically connected to one of the first pads, and each first wire is respectively Electrically connected to one of the second pads.

In an embodiment of the present invention, the light emitting unit may be a light emitting chip package.

In an embodiment of the present invention, the light emitting unit may be a light emitting chip.

In an embodiment of the present invention, the light emitting unit may be a light emitting diode chip or an organic light emitting diode chip.

In an embodiment of the present invention, the light source assembly further includes a plurality of bumps disposed between the carrier and the light emitting units, wherein each light emitting unit is electrically connected to the second wire through one of the bumps, and each emits light. The unit is electrically connected to the first wire through the other one of the bumps.

In an embodiment of the present invention, the light source assembly further includes a plurality of wires, which are connected between the carrier and the light-emitting unit, wherein each light-emitting unit is electrically connected to the second wire through one of the wires, and each light-emitting unit is electrically connected to the second wire through one of the wires. The other one is electrically connected to the first wire.

In an embodiment of the present invention, the material of the transparent cover can be glass or acrylic.

In an embodiment of the present invention, the light source assembly further includes a heat dissipation dummy wire disposed on the surface of the carrier.

In an embodiment of the present invention, the light source assembly further includes a heat dissipation plate disposed under the carrier.

In an embodiment of the invention, the carrier has a plurality of heat conducting through holes.

In an embodiment of the present invention, the carrier may be a reel or a circuit board.

The present invention provides a method for adjusting brightness, which is used in the above-mentioned light source assembly, and the method for adjusting brightness includes the following steps. First, the brightness of the light emitting unit is detected. Then, a partial region of the second wire corresponding to a part of the light emitting unit is removed.

In an embodiment of the present invention, the method for removing a partial area of the second wire may be to use a laser.

In an embodiment of the present invention, the method for removing a partial area of the second wire may be to use punching.

Based on the above, the present invention utilizes the second wire to be electrically connected to the light emitting unit. When the brightness of the light-emitting unit is abnormal, a part of the second wire is removed to change the brightness of the light-emitting unit. Therefore, compared with the prior art, the light source assembly of the present invention can provide a more uniform light source. In addition, compared with the prior art using LEDs with sealant, the present invention uses bare crystals and a transparent cover to improve heat dissipation efficiency and service life.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, several embodiments are specifically cited below and described in detail with accompanying drawings.

Description of drawings

Fig. 1 is a top view of a light source assembly according to a first embodiment of the present invention.

2A and 2B are cross-sectional views of a light source assembly according to a second embodiment of the present invention.

Detailed ways

first embodiment

Fig. 1 is a top view of a light source assembly according to a first embodiment of the present invention. Please refer to FIG. 1, the light source assembly 100 of this embodiment includes a carrier 110, a plurality of light emitting units 120, a plurality of first wires 130 and a plurality of second wires 140, wherein the light emitting unit 120, the first wires 130 and the second The wires 140 are all disposed on the carrier 110 , and the light emitting unit 120 can be disposed on the carrier 110 through surface mount technology (SMT) or a plug-in method. The light emitting units 120 may be arranged in a line or in an area array. The carrier 110 may be a tape, a circuit board, a flexible circuit board or other types of carriers. In this embodiment, the light emitting unit 120 is a light emitting diode chip package, an organic light emitting diode chip package or other types of light emitting chip packages. However, in another embodiment, the light emitting unit 120 may also be a light emitting diode chip, an organic light emitting diode chip or other types of light emitting chips. In addition, each light emitting unit 120 is connected to a first wire 130 and a second wire 140 . In more detail, the material of the second wire can be metal material, ceramic material or metalloid.

In this embodiment, the light source assembly 100 further includes a plurality of first pads 150 and a plurality of second pads 160, wherein each second wire 140 is electrically connected to the first pad 150, and each first wire 130 are respectively electrically connected to the second pads 160 . Therefore, external power can be applied to the light emitting unit 120 through the first pad 150 and the second pad 160 . In addition, the surface of the carrier 110 can also be configured with heat dissipation dummy wires 135 , and the heat dissipation dummy wires 135 can be bonded to the light emitting unit 120 to improve heat dissipation. The method for adjusting the brightness of the light source assembly 100 will be described below.

Please continue to refer to the enlarged area of FIG. 1 , the method for adjusting brightness includes the following steps. First, the brightness of each light emitting unit 120 is detected. When some of the light-emitting units 120 operate abnormally (for example, the brightness is too high), the part of the region 140 a of the second wire 140 corresponding to the part of the light-emitting units 120 is removed. Therefore, the light-emitting brightness of the abnormal light-emitting unit 120 can be changed to match the light-emitting brightness of the surrounding light-emitting units 120 . In more detail, the method of removing the partial region 140a of the second wire 140 may be to use a laser. Alternatively, the method of removing the partial region 140a of the second wire 140 may be to use punching. In addition, the present embodiment does not limit the shape and position of the region 140a.

Since the brightness of the abnormal light-emitting unit 120 can be adjusted through the above-mentioned method, this light source assembly 100 has a higher yield rate. In addition, this light source assembly 100 can provide a relatively uniform light source

second embodiment

2A and 2B are cross-sectional views of a light source assembly according to a second embodiment of the present invention. Please refer to FIG. 2A first. The light source assembly 200 of this embodiment is similar to the above embodiment, the difference is that the light emitting unit 220 is a light emitting diode chip, an organic light emitting diode chip or other light emitting chips. In addition, the light source assembly 200 further includes a plurality of bumps 230 disposed between the carrier 110 and the light emitting units 220 , wherein each light emitting unit 220 is electrically connected to the second wire 140 and the first wire 130 respectively via the bumps 230 . However, the light source assembly 200 may also include a plurality of bonding wires 270 , and each light emitting unit 220 is electrically connected to the second wire 140 and the first wire 130 via the bonding wire 270 (as shown in FIG. 2B ).

In addition, the light source assembly 200 of this embodiment further includes a transparent cover 210 disposed on the carrier 110 and covering the light emitting unit 220 to protect the electrical connection between the light emitting unit 220 and the carrier 110 . The material of the transparent cover 210 may be glass, acrylic or other transparent materials. In addition, the transparent cover plate 210 can also be applied in the first embodiment. Moreover, in order to protect the electrical connection between the light emitting unit 220 and the carrier 110, the light source assembly 200 of this embodiment may also include a primer 240, which is arranged between the light emitting unit 220 and the carrier 110 to cover bump 230 .

In order to increase heat dissipation efficiency, the carrier 110 may have a plurality of heat conducting through holes 250 , which run through the entire carrier 110 , and the positions of the heat conducting through holes 250 may be located below the light emitting unit 220 . In addition, the light source assembly 200 may also include a heat sink 260 disposed under the carrier 110 . In this embodiment, the heat conduction through hole 250 may be in contact with the heat dissipation plate 260 . It should be noted that the heat conduction through hole 250 and the heat dissipation plate 260 can also be used independently, and the heat conduction through hole 250 and the heat dissipation plate 260 of this embodiment can also be applied in the first embodiment.

Compared with the LEDs in the prior art that are sealed with glue, the light emitting unit 220 of this embodiment is a bare die, so the light emitting unit 220 of this embodiment has higher heat dissipation efficiency. In other words, compared with the prior art, the light source assembly 200 of this embodiment has better heat dissipation efficiency and longer service life. In addition, the above-mentioned method for adjusting brightness can also be applied to the light source assembly 200 of this embodiment.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention, and anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (11)

1. A light source assembly, comprising: a carrier; A plurality of light emitting units are arranged on the carrier; a plurality of first wires configured on the carrier; A plurality of second wires are arranged on the carrier, and each of the light-emitting units is electrically connected to one of the second wires and one of the first wires, and the light-emitting units are respectively connected to one of the first wires. The first wires are electrically insulated from each other, the second wires respectively connected to the light emitting units are electrically insulated from each other, wherein at least one of the second wires has a removal area, and the second wires are in the the size of the removed region is smaller than the size of other regions of the second conductive line; and A transparent cover is arranged on the carrier and covers the light emitting units. 2. The light source assembly according to claim 1, wherein the material of the second wires comprises metal material, ceramic material or metalloid. 3. The light source assembly according to claim 1, further comprising a plurality of first pads and a plurality of second pads, wherein each of the second wires is electrically connected to the first pads respectively one of the first wires, and each of the first wires is electrically connected to one of the second pads. 4. The light source assembly according to claim 1, further comprising a plurality of bumps disposed between the carrier and the light-emitting units, wherein each of the light-emitting units is electrically connected via one of the bumps. is electrically connected to the second wire, and each of the light emitting units is electrically connected to the first wire through another one of the bumps. 5. The light source assembly according to claim 1, further comprising a plurality of bonding wires connected between the carrier and the light-emitting units, wherein each of the light-emitting units is electrically connected via one of the bonding wires. connected to the second wire, and each of the light emitting units is electrically connected to the first wire through another one of the wires. 6. The light source unit as claimed in claim 1, further comprising a heat dissipation dummy wire disposed on the surface of the carrier. 7. The light source assembly according to claim 1, further comprising a heat dissipation plate disposed under the carrier. 8. The light source assembly as claimed in claim 1, wherein the carrier has a plurality of heat conducting through holes. 9. A method for adjusting brightness, used for the light source assembly as claimed in claim 1, the method for adjusting brightness comprising: detecting the brightness of the light-emitting units; and Partial areas of the second wires corresponding to some of the light emitting units are removed. 10. The method for adjusting brightness as claimed in claim 9, wherein the method for removing part of the second wires comprises using a laser. 11. The method for adjusting brightness as claimed in claim 9, wherein the method for removing part of the second wires comprises using punching holes.

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