CN101241313A - Lithographic equipment aligning system based on machine vision and alignment method - Google Patents
Lithographic equipment aligning system based on machine vision and alignment method Download PDFInfo
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Abstract
The invention provides a photoeching device alignment system and a method thereof based on machine vision by using grids with different periods as alignment marks. +-1 level diffracted light dark field images are obtained by an optical lighting system and an imaging system. The images are gathered by a CCD camera and an image gathering card, and image signal processing and alignment operation are performed by an image processing module to obtain an accurate alignment position finally and alignment between the wafer and the base stage is implemented. The whole system is simpler by combining Image processing with alignment marked grid phase information in a precondition of obtaining a rather high alignment precision.
Description
Technical field
The present invention is applied to make the lithographic equipment in field with integrated circuit or other microdevice, is specifically related to a kind of alignment system and alignment methods based on machine vision, realizes the accurate aligning of wafer and base station.
Background technology
Lithographic equipment of the prior art is mainly used in the manufacturing of integrated circuit (IC) or other microdevice.By lithographic equipment, the multilayer mask with different mask patterns can be imaged on the wafer that is coated with photoresist under accurately aiming at successively, for example semiconductor crystal wafer or LCD (liquid crystal) plate.Lithographic equipment is divided into two classes substantially, one class is the stepping lithographic equipment, the mask pattern single exposure is imaged on an exposure area of wafer, wafer moves with respect to mask subsequently, next exposure area is moved to mask pattern and projection objective below, again mask pattern is exposed in another exposure area of wafer, repeat the picture that this process all exposure areas on wafer all have mask pattern.Another kind of is the step-scan lithographic equipment, and in said process, mask pattern is not the single exposure imaging, but the scanning mobile imaging by the projection light field.In the mask pattern imaging process, mask and wafer move with respect to optical projection system and projected light beam simultaneously.
In the exposure process of lithographic equipment, critical step is with mask and wafer alignment.After exposing on wafer, the ground floor mask pattern from device, removes, after the PROCESS FOR TREATMENT that wafer is correlated with, carry out the exposure of second layer mask pattern, but for guarantee second layer mask pattern and subsequently the picture of mask pattern mask and wafer accurately need be aimed at respect to the accurate location of exposed mask pattern image on the wafer.IC device by the photoetching technique manufacturing needs multiexposure, multiple exposure to form multilayer circuit in wafer, for this reason, requires the configuration alignment system in the lithographic equipment, realizes the accurate aligning of mask and wafer.When characteristic dimension requires more hour, the requirement of alignment precision and consequent requirement to alignment precision are become strict more.
The alignment system of lithographic equipment, its major function is to realize the aligning of mask and wafer before the alignment exposure, promptly measure the coordinate (XW of wafer in coordinate system of machine, YW, Ф WZ), and the coordinate (XR of mask in coordinate system of machine, YR, Ф RZ), and calculates the position of mask, to satisfy the requirement of alignment precision with respect to wafer.
At present, the most alignment so that adopts of lithographic equipment is a grating alignment.Grating alignment is meant that even illumination beam on the grating alignment mark diffraction takes place, and the emergent light behind the diffraction carries the full detail about alignment mark structure.Senior diffraction light scatters from the phase alignment grating with wide-angle, after filtering zero order light by spatial filter, gather diffraction light ± 1 order diffraction light, the perhaps raising that requires along with the imaging lines, gather multi-level diffraction light (comprising senior) simultaneously in picture plane interference imaging, through photodetector and signal Processing, determine the centering adjustment position.
Prior art has following two kinds of alignment scheme:
A kind of is TTL (transistor-transistor logic) technique of alignment that sees through camera lens, the alignment mark of the periodic phase optical grating construction that laser lighting is provided with on wafer, diffraction light or scattered light by the collected wafer alignment mark of the projection objective of lithographic equipment shine on mask alignment mark, and this alignment mark can be amplitude or phase grating.Behind the mask mark detector is set, when scanning wafer under projection objective, surveys the light intensity that sees through the mask mark, the maximal value of detector output is represented correct alignment position.This aligned position provides zero reference for the position measurement that is used to monitor the laser interferometer that moves wafer platform position.
Another kind is OA (from an axle) technique of alignment, is positioned at benchmark alignment mark on a plurality of alignment marks on the wafer and the base station by the off-axis alignment systematic survey, realizes that wafer and base station aim at; The benchmark alignment mark on the base station is aimed at the alignment mark on the mask, the realization mask is aimed at base station again; The position relation of mask and wafer be can obtain thus, mask and wafer alignment finally realized.
Described off-axis alignment technology specifically describes in detail in conjunction with Fig. 1.As shown in Figure 1, this lithographic equipment alignment system comprises: be used to provide the illuminator 8 ' of exposing light beam, this illuminator 8 ' comprises that a light source, one make the lens combination of illumination homogenising, catoptron, a condenser (all not shown among the figure); This light source adopts KrF excimer laser (wavelength 248nm), perhaps ArF excimer laser (wavelength 193nm), perhaps F2 laser instrument (wavelength 157nm), perhaps Kr2 laser instrument (wavelength 146nm), perhaps Ar2 laser instrument (wavelength 126nm), perhaps ultrahigh pressure mercury lamp (g-line, i-line) etc.; Be used to support the mask platform 6 ' of mask 4 ', the alignment mark 2 ' that on mask 4 ', is carved with mask pattern and has periodic structure; Be used for the mask pattern on the mask 4 ' is projected to projection optical system PL on the wafer 7 ', it is a projection objective; Be used to support the base station 9 ' of wafer 7 ', be carved with alignment mark 5 ', on base station 9 ', be carved with datum plate alignment mark 1 ' at wafer 7 '; Be used to aim at the off-axis alignment optical system 500 ' of base station 9 ' and wafer 7 ' and the aligning radiation source 300 ' of aiming at illumination is provided; The processing unit 200 ' that is used for registration signal; Be used for motion platform 10 ' and the measuring system IFx and the IFy of base station 9 ' servo motion, this measuring system IFx is basad displacement measuring device laser interferometer of an x, and measuring system IFy is basad displacement measuring device laser interferometer of a y.
At first,, aim at being positioned at a plurality of alignment marks 5 ' on the wafer 7 ' and being positioned at base station 9 ' last benchmark alignment mark 1 ' by described off-axis alignment optical system 500 ', thus the aligning of realization wafer 7 ' and base station 9 '.
Then, the exposing light beam IL of described illuminator 8 ' uniform irradiation is radiated on the alignment mark 2 ' on the mask 4 ', by projection objective PL the reduced image of the alignment mark 2 ' on the mask 4 ' is projected on the base station alignment mark 1 ' as benchmark on the base station 9 ', the sensor that utilizes base station alignment mark 1 ' to be transmitted under it carries out the photosignal conversion, by a series of scanning collection signal, carry out process of fitting treatment in conjunction with the locus signal that records by x basad displacement measuring device laser interferometer IFx and basad displacement measuring device laser interferometer of y IFy, set up the coordinate transformation relation of mask 4 ' and base station 9 ', be mutual alignment relation, thereby realize aiming at of mask 4 ' and base station 9 '.
Finally, can obtain the mutual alignment relation of mask 4 ' and wafer 7 ', to realize the aligning of mask 4 ' and wafer 7 '.
Further, U.S. Pat 712670 has been announced position measurement (aligning) apparatus and method of a kind of wafer mark and base station mark, this invention is by illuminator and optical imaging system, with wafer mark and the imaging successively of base station mark, image capturing unit (CCD (charge-coupled image sensor) or other photoelectric device) obtains the light field image of wafer mark and base station mark, adopt the method for signal Processing and graphical analysis then, determine the position relation between wafer mark and the base station mark.This invention is owing to adopt the light field imaging, and it is lower to be marked as image contrast, and the strip mark to only adopting one group of spacing to equate, is subject to the influence of factors such as CCD lens distortion, foozle and marking process distortion, is difficult to obtain higher alignment precision.
Summary of the invention
The object of the present invention is to provide a kind of lithographic equipment alignment system and alignment methods based on machine vision, it adopts the grating with different cycles as alignment mark, use the darkfield image of ccd video camera acquisition phase grating institute mark, by Flame Image Process and signal processing method, thereby realize the aligning of wafer and base station, and obtain higher alignment precision.
In order to achieve the above object, the invention provides a kind of lithographic equipment alignment system based on machine vision, the realization wafer is aimed at base station, this alignment system comprises: be positioned at the alignment mark on wafer or the base station, the light source module that sets gradually, lighting module, image-forming module, image capture module, image processing module and placement data acquisition and motion-control module; Described alignment mark on wafer or base station is arranged between image-forming module and placement data acquisition and the motion-control module;
Described alignment mark is made up of one group of large period grating branch and single minor cycle grating branch that is used for fine alignment that is used for coarse alignment;
Described image-forming module forms alignment mark ± 1 order diffraction light coherent dark field picture, and it is light and dark periodicity hot spot striped;
Described image capture module comprises ccd video camera and the image pick-up card that connects by circuit, gathers the darkfield image of alignment mark;
Described image processing module moves in host computer, and its darkfield image to the alignment mark that collects carries out picture signal to be handled, and obtains the registration signal of each grating branch; Utilize alignment algorithm to obtain aligned position, the realization base station is aimed at wafer.
Described one group of large period grating branch comprises that there is the grating branch of a small fixed difference in two cycles;
Described grating is a phase grating.
Described light source module provides the illuminating bundle that comprises at least two discrete wavelength light waves; Preferably, this light source module provides the illuminating bundle that comprises four discrete wavelength light waves, and wherein has at least the wavelength of two light waves to be near infrared or infrared band;
Described light source module comprises first Transmission Fibers that corresponding light source light wave number is provided with successively, the fiber coupler that corresponding light source light wave number is provided with, a bundling device and one second Transmission Fibers; This first Transmission Fibers and second Transmission Fibers are single-mode polarization maintaining fiber.
Described lighting module comprises Transmission Fibers and lamp optical system; This lamp optical system is successively by the polarizer, first lens, and illuminating aperture diaphragm, second lens and the polarization beam apparatus with polarization beam splitting face constitute.
Described image-forming module comprises λ/4 wave plates that are successively set between polarization beam apparatus and alignment mark, object lens, and be successively set on spatial filter between polarization beam apparatus and the image capture module, the 3rd lens that polychromatic light piece-rate system and corresponding light source light wave number are provided with;
The zero order diffracted light of described spatial filter filtering alignment mark and senior diffraction light, keep it ± 1 grade diffraction light passes through; Described polychromatic light piece-rate system is separated the diffraction light of each different wave length.
Ccd video camera in the described image capture module number is set corresponding to the light source light wave number, it obtains the high resolving power darkfield image of alignment mark under different wave length illumination respectively; Image pick-up card in the described image capture module is gathered in real time to the video data of ccd video camera output, and by high-speed interface, the image of gathering is real-time transmitted to image processing module.
The photosurface of described ccd video camera is positioned on the picture plane of image-forming module.
Described image capture module also comprises an imaging fibre, the darkfield image of alignment mark under the different wave length illumination is incorporated into the photosurface of each ccd video camera respectively by it.
Described placement data acquisition and motion-control module comprise the motion platform, placement data acquisition system and motion controller; Place wafer and base station on this motion platform, it is by linear motor driving, can realize x to or y to straight reciprocating motion; The position data of base station is gathered in real time by laser interferometer by this placement data acquisition system, through transferring to motion controller and image processing module respectively after the data pre-service; The movement locus of this motion controller controlled motion platform.
Described darkfield image to the alignment mark that collects carries out the method that picture signal handles: the gray scale to each the light and shade striped in the darkfield image is tangentially carried out integration along gratings strips;
The registration signal of described grating branch comprises the burst of three different cycles;
Described alignment algorithm comprises: utilize two large period grating branch signals that have small periodic inequality, determine the coarse alignment position; Utilize minor cycle grating branch signal, and the coarse alignment position, determine the fine alignment position; Utilization repeatedly according to the aligned position information that darkfield image obtained of the alignment mark that photographs, is determined final alignment position.
The present invention also provides a kind of lithographic equipment alignment methods based on machine vision of utilizing said system, specifically comprises following steps:
Step 1, mobile alignment mark, make it be in position within the field range that can be imaged on ccd video camera, the collection alignment mark ± 1 order diffraction Light Interference Streaks image, and be transferred in the image processing module, simultaneously, placement data acquisition system acquisition this moment the residing position data of base station and be transferred to image processing module;
Step 2.1, image processing module are carried out pre-service to the interference fringe image of the alignment mark that collects, reduce picture noise;
Step 2.2, image processing module carry out Threshold Segmentation to pretreated image, obtain bianry image;
Step 2.3, image processing module are partitioned into the zone at the alignment mark place in the above-mentioned bianry image that obtains;
Step 2.4, image processing module carry out along the gray integration of gratings strips tangential direction the gray scale of each the light and shade striped in the interference imaging image of alignment mark, obtain grey scale curve S1, S2 and the S0 of each grating branch image of alignment mark, i.e. the registration signal of each grating branch;
Step 3, image processing module carry out alignment algorithm to the registration signal of above-mentioned each grating branch that obtains to be handled, and obtains aligned position, and the realization base station is aimed at wafer; Specifically may further comprise the steps:
Step 3.1, extension signal curve S1 and S2 because there are small periodic inequality in S1 and S2 signal curve, can find position in S1 extension curve and the S2 extension curve the peak point X1 and the X2 of approaching coincidence, promptly obtain the coarse alignment position;
Step 3.2, extension signal curve S0 on the extension curve of S0, find distance above-mentioned coarse alignment position X1 and the immediate peak point X0 of X2, promptly obtain fine alignment position and storage;
In the described step 2.3, adopt edge-detection algorithm or template matching method, determine and be partitioned into the zone at alignment mark place in the image of being gathered.
In described step 3.1 and the step 3.2, the method of extension signal curve is: adopt the method for numerical fitting or judge the peaked method of gray scale, each peak point of picked up signal curve, this each peak point information is adopted the method for average, to obtain the cycle of this signal, utilize this cycle then, with fixing peak point extension signal curve.
In the described step 5,, adopt and ask averaging method, determine final alignment position a plurality of fine alignment positional informations that obtain.
Lithographic equipment alignment system and alignment methods based on machine vision provided by the invention, employing has the grating of different cycles as alignment mark, by optical lighting system and imaging system, can obtain alignment mark ± the relevant formed darkfield image of 1 order diffraction light, this image is gathered by ccd video camera and image pick-up card, and undertaken by image processing module that picture signal is handled and alignment function, and finally obtain the fine alignment position, realize aiming between wafer and the base station.Because the method that the present invention adopts Flame Image Process to combine with the raster phase information of alignment mark, under the prerequisite that obtains higher alignment precision, total system is more simple.
Description of drawings
Fig. 1 is the structural representation of lithographic equipment alignment system of the prior art;
Fig. 2 is the structural representation of the alignment system aimed at standard station of realization wafer of the present invention;
Fig. 3 is the structural representation of alignment mark among the present invention;
Fig. 4 is the interference imaging image of alignment mark formation among the present invention and the signal graph synoptic diagram after Flame Image Process;
Fig. 5 is the synoptic diagram of registration signal curve among the present invention and aligned position;
Fig. 6 is the process flow diagram of the realization wafer of the present invention alignment methods of aiming at standard station.
Embodiment
Below in conjunction with Fig. 2～Fig. 6, the specific embodiment of the present invention is described in further detail.
Fig. 2 is the structural representation of an embodiment of the lithographic equipment alignment system based on machine vision provided by the invention, this alignment system realization wafer is aimed at base station, it comprises: be positioned at the alignment mark on wafer 7 or the base station 9, the light source module 300 that sets gradually, lighting module, image-forming module, image capture module, image processing module and placement data acquisition and motion-control module; Described alignment mark on wafer or base station is arranged between image-forming module and placement data acquisition and the motion-control module;
Described alignment mark is made up of with the single minor cycle grating branch that is used for fine alignment one group of large period grating branch that is used for coarse alignment; This group large period grating branch comprises that there is the grating branch of a small fixed difference in two cycles; Described grating is a phase grating;
As shown in Figure 3, be the structural representation of the alignment mark that present embodiment adopted; Wherein the cycle of three grating branch respectively is P1, P0 and P2, and satisfy P1＞P2＞P0.Wherein, the cycle is that the grating branch of P1 and P2 is formed the large period grating branch, is used for coarse alignment, and exists fixing small periodic inequality Δ p1 between these 2 grating branch, promptly is expressed as: P1=P2+ Δ p1.And the cycle is the grating branch of P0 is described single minor cycle grating branch, is used for fine alignment.
Described light source module 300 provides the illuminating bundle that comprises two discrete wavelength at least, and for example, 2 discrete wavelength are respectively 633nm and 785nm; In the present embodiment, the illuminating bundle that this light source module 300 provides comprises 4 discrete wavelength λ 1, λ 2, λ 3 and λ 4, is respectively 532nm, 633nm, 785nm and 850nm;
4 light wave λ 1, λ 2, λ 3 and λ 4 that this multi-wavelength illuminating bundle is comprised, 4 single-mode polarization maintaining fibers 301 through the correspondence setting transfer to each fiber coupler 302 respectively, all enter bundling device 303 after the coupling, output to lighting module by single-mode polarization maintaining fiber 304 again.
Described lighting module comprises Transmission Fibers and lamp optical system; This lamp optical system is successively by the polarizer 505, lens 506, and illuminating aperture diaphragm 507, lens 508 and polarization beam apparatus 509 constitute; The multi-wavelength illuminating bundle is transmitted by Transmission Fibers, passes through the described polarizer 505 successively, lens 506, and illuminating aperture diaphragm 507, lens 508 are after the polarization beam splitting face 509a of polarization beam apparatus 509 impinges perpendicularly on image-forming module.
Described image-forming module comprises λ/4 wave plates 510 that are successively set between polarization beam apparatus 509 and the alignment mark, object lens 511, and be successively set on spatial filter 512 between polarization beam apparatus 509 and the image capture module, polychromatic light piece-rate system 513, the lens 514 that corresponding light source light wave number is provided with; So, in the present embodiment, 4 lens 514 should be set.
The multi-wavelength illuminating bundle is through λ/4 wave plates 510, impinge perpendicularly on the alignment mark 1 that is positioned on wafer 7 or the base station 9 through object lens 511 again, form the hot spot of circularly polarized light, and take place to reflect and diffraction, emergent light behind the diffraction carries the full detail about alignment mark structure, on the frequency plane of object lens 511, produce a series of diffraction patterns, respectively the grating part of alignment mark different cycles; The multi-wavelength diffraction light of alignment mark at first passes through spatial filter 512 behind lens 511 collimation, all zero order diffracted lights of its filtering alignment mark and senior diffraction light, only keep it ± and 1 grade diffraction light passes through; This alignment mark ± 1 order diffraction light passes through polychromatic light piece-rate system 513 again, make the diffraction light of different wave length separate, obtain wavelength respectively and be λ 1, λ 2, λ 3 and λ 4 ± 1 order diffraction light, it passes through corresponding lens 514 coherent imagings respectively, formation has the diffraction light coherent dark field picture of alignment mark structure information, it is light and dark periodicity hot spot striped, but among Fig. 2, has only shown wherein a kind of light path of wavelength X 1.
In the present embodiment, the illuminating aperture diaphragm 507 in the lamp optical system, lens 508, polarization beam apparatus 509, and the λ in the image-forming module/4 wave plates 510, object lens 511 form the Ke Le optical system.
Described image capture module comprises successively the ccd video camera 201 and the image pick-up card 202 of the corresponding light source light wave number that connects by circuit.The photosurface of this ccd video camera 201 is positioned on the picture plane of image-forming module, in order to obtain aligning 5 and the high resolving power darkfield image of the alignment mark 1 on the base station 9 under the different wave length illumination on the wafer 7 respectively.The video data that 202 pairs of ccd video cameras 201 of described image pick-up card are exported is gathered in real time, and by high-speed interface, the image that obtains is real-time transmitted to image processing module.
Described image capture module also can comprise an imaging fibre (not shown), is incorporated into the photosurface of ccd video camera 201 by its darkfield image with alignment mark 1 or 5, to obtain image information.
Shown in the first half of Fig. 4, shown in the present embodiment, the darkfield image of the alignment mark 1 that ccd video camera 201 obtains under certain wavelength illumination, since only kept alignment mark ± 1 order diffraction interference of light imaging, so in the image light and dark fringe period be correspondence the grating branch cycle 1/2, that is: P1 '=P1/2; P2 '=P2/2; P0 '=P0/2.
Described placement data acquisition and motion-control module comprise motion platform 10, placement data acquisition system 204 and motion controller 205; Place wafer 7 and base station 9 on this motion platform 10, it is by linear motor driving, can realize laterally the straight reciprocating motion of (x to) or vertical (y to); The position data of base station 9 is gathered in real time by laser interferometer by this placement data acquisition system 204, and through after the data pre-service such as coordinate conversion, offers motion controller 205, and by high-speed interface, real-time Transmission is to image processing module; The movement locus of these motion controller 205 controlled motion platforms;
Described image processing module is arranged in the host computer 203 operation, and this host computer 203 and image pick-up card 202 are connected by circuit, and it is PC or SUN workstation; The real time position data of alignment mark 1 that described image processing module photographs according to ccd video camera 201 or 5 darkfield image and the base station 9 gathered by placement data acquisition system 204, handle and alignment algorithm by picture signal, obtain registration signal and aligned position, the realization base station is aimed at wafer.
Concrete, the darkfield image of alignment mark 1 or 5 under certain illumination wavelengths adopted following image-signal processing method: the gray scale to each the light and shade striped in the darkfield image is tangentially carried out integration (accumulation) along gratings strips, can obtain grey scale curve S1, S2 and the S0 (being made of discrete pixel) of the half-sine wave form shown in Fig. 4 the latter half.In theory, the cycle of signal S1, S2 and S0 also equals 1/2 of corresponding grating branch cycle, that is: d1
i=P1/2; D2
i=P2/2; D0
i=P0/2; I=1,2 ... n.
But in the reality, because the influence of factors such as the aberration that imaging system exists, CCD lens distortion, the cycle of signal S1, S2 and S0 not exclusively equals 1/2 of the corresponding grating branch cycle, and distance is also non-equal fully between the crest of each signal, as there being d1
1≠ d1
2Situation.At this moment, can adopt spacing between each signal wave crest is averaged or fitting method, obtain the nominal cycle of S1, S2 and S0.
Fig. 5 is for specifically carrying out the synoptic diagram of signal alignment procedures, and the curve among the figure is signal S1, S2 and the extension of S0 on the cycle.Owing to have small periodic inequality between the cycle P1 of 2 large period grating branch and the P2, be similar to vernier caliper, in certain number of cycles, can show the coincide point that has a peak value on the signal curve of S1 and S2, be X1 and X2, this point is the coarse alignment position.Near this coarse alignment location point, can find one apart from the peak point X0 on the nearest S0 signal in this coarse alignment position, this peak point is the fine alignment point.
In theory, by rational design, can guarantee that coarse alignment signal peak coincide point overlaps fully with the fine alignment signal peak value point, be that X1, X2 and X0 overlap, but because the influence of the factors such as distortion of the deformed mark in the actual production, stochastic error, CCD camera lens, can have small site error between X1, X2 and the X0, but these site errors do not influence the judgement of fine alignment position.
At last, utilization repeatedly according to the aligned position information that darkfield image obtained of the alignment mark that photographs, is determined finally the most accurate aligned position.
As shown in Figure 6, the method that the present invention also provides a kind of alignment system that utilizes lithographic equipment to aim at specifically comprises following steps:
Step 1, mobile alignment mark 1 or 5, make it be in position within the field range that can be imaged on ccd video camera 201, gather alignment mark 1 or 5 ± 1 order diffraction Light Interference Streaks image, and be transferred in the image processing module, simultaneously, base station 9 residing position datas and be transferred to image processing module this moment are gathered by placement data acquisition system 204;
Step 2.1, image processing module are carried out pre-service to the interference fringe image of the alignment mark that collects, reduce picture noise;
Step 2.2, image processing module carry out Threshold Segmentation to pretreated image, obtain bianry image;
Step 2.3, image processing module are partitioned into the zone at the alignment mark place in the above-mentioned bianry image that obtains;
Step 2.4, image processing module carry out along the gray integration of gratings strips tangential direction the gray scale of each the light and shade striped in the interference imaging image of alignment mark, obtain grey scale curve S1, S2 and the S0 of each grating branch image of alignment mark, i.e. the registration signal of each grating branch;
Step 3, image processing module carry out alignment algorithm to the registration signal of above-mentioned each grating branch that obtains to be handled, and obtains aligned position, and the realization base station is aimed at wafer; Specifically may further comprise the steps:
Step 3.1, extension signal curve S1 and S2 because there are small periodic inequality in S1 and S2 signal curve, can find position in S1 extension curve and the S2 extension curve the peak point X1 and the X2 of approaching coincidence, promptly obtain the coarse alignment position;
Step 3.2, extension signal curve S0 on the extension curve of S0, find distance above-mentioned coarse alignment position X1 and the immediate peak point X0 of X2, promptly obtain fine alignment position and storage;
In the described step 2.3, adopt edge-detection algorithm or template matching method, determine and be partitioned into the zone at alignment mark place in the image of being gathered.
In described step 3.1 and the step 3.2, the method of extension signal curve is: adopt the method for numerical fitting or judge the peaked method of gray scale, each peak point of picked up signal curve, this each peak point information is adopted the method for average, to obtain the cycle of this signal, utilize this cycle then, with fixing peak point extension signal curve.
In the described step 5,, adopt and ask averaging method, determine final alignment position a plurality of fine alignment positional informations that obtain.
Lithographic equipment alignment system and alignment methods based on machine vision provided by the invention, employing has the grating of different cycles as alignment mark, by optical lighting system and imaging system, can obtain alignment mark ± the relevant formed darkfield image of 1 order diffraction light, this image is gathered by ccd video camera and image pick-up card, and undertaken by image processing module that picture signal is handled and alignment function, and finally obtain the fine alignment position, realize aiming between wafer and the base station.Because the method that the present invention adopts Flame Image Process to combine with the raster phase information of alignment mark, under the prerequisite that obtains higher alignment precision, total system is more simple.
Claims (26)
1, a kind of lithographic equipment alignment system based on machine vision, the realization wafer is aimed at base station, it is characterized in that, described alignment system comprises: be positioned at the alignment mark on wafer or the base station, the light source module that sets gradually, lighting module, image-forming module, image capture module, image processing module and placement data acquisition and motion-control module; Should be arranged between image-forming module and placement data acquisition and the motion-control module at the alignment mark on wafer or the base station;
Described alignment mark is made up of one group of large period grating branch and single minor cycle grating branch that is used for fine alignment that is used for coarse alignment;
Described image-forming module forms alignment mark ± 1 order diffraction light coherent dark field picture, and it is light and dark periodicity hot spot striped;
Described image capture module comprises ccd video camera and the image pick-up card that connects by circuit, gathers the darkfield image of alignment mark;
Described image processing module moves in host computer, and its darkfield image to the alignment mark that collects carries out picture signal to be handled, and obtains the registration signal of each grating branch; Utilize alignment algorithm to obtain aligned position, the realization base station is aimed at wafer.
2, the lithographic equipment alignment system based on machine vision as claimed in claim 1 is characterized in that, described one group of large period grating branch comprises that there is the grating branch of a small fixed difference in two cycles.
3, the lithographic equipment alignment system based on machine vision as claimed in claim 2 is characterized in that, described grating is a phase grating.
4, the lithographic equipment alignment system based on machine vision as claimed in claim 1 is characterized in that described light source module provides the illuminating bundle that comprises at least two discrete wavelength light waves.
5, the lithographic equipment alignment system based on machine vision as claimed in claim 4 is characterized in that described light source module provides the illuminating bundle that comprises four discrete wavelength light waves, and wherein has at least the wavelength of two light waves to be near infrared or infrared band.
6, the lithographic equipment alignment system based on machine vision as claimed in claim 5, it is characterized in that, described light source module comprises first Transmission Fibers that corresponding light source light wave number is provided with successively, fiber coupler, a bundling device and one second Transmission Fibers that corresponding light source light wave number is provided with.
7, the lithographic equipment alignment system based on machine vision as claimed in claim 6 is characterized in that, described first Transmission Fibers and second Transmission Fibers are single-mode polarization maintaining fiber.
8, the lithographic equipment alignment system based on machine vision as claimed in claim 1 is characterized in that described lighting module comprises Transmission Fibers and lamp optical system.
9, the lithographic equipment alignment system based on machine vision as claimed in claim 8 is characterized in that, described lamp optical system is successively by the polarizer, first lens, and illuminating aperture diaphragm, second lens and the polarization beam apparatus with polarization beam splitting face constitute.
10, the lithographic equipment alignment system based on machine vision as claimed in claim 1, it is characterized in that, described image-forming module comprises λ/4 wave plates that are successively set between polarization beam apparatus and the alignment mark, object lens, and be successively set on spatial filter between polarization beam apparatus and the image capture module, the 3rd lens that polychromatic light piece-rate system and corresponding light source light wave number are provided with.
11, the lithographic equipment alignment system based on machine vision as claimed in claim 10 is characterized in that, the zero order diffracted light of described spatial filter filtering alignment mark and senior diffraction light, keep it ± and 1 grade diffraction light passes through.
12, the lithographic equipment alignment system based on machine vision as claimed in claim 11 is characterized in that described polychromatic light piece-rate system is separated the diffraction light of each different wave length.
13, the lithographic equipment alignment system based on machine vision as claimed in claim 1 is characterized in that, in image capture module,
Described ccd video camera number is set corresponding to the light source light wave number, it obtains the high resolving power darkfield image of alignment mark under different wave length illumination respectively;
Described image pick-up card is gathered in real time to the video data of ccd video camera output, and by high-speed interface, the image of gathering is real-time transmitted to image processing module.
14, the lithographic equipment alignment system based on machine vision as claimed in claim 13 is characterized in that, the photosurface of described each ccd video camera is positioned on the picture plane of image-forming module.
15, the lithographic equipment alignment system based on machine vision as claimed in claim 13, it is characterized in that, described image capture module also comprises an imaging fibre, the darkfield image of alignment mark under the different wave length illumination is incorporated into the photosurface of each ccd video camera respectively by it.
16, the lithographic equipment alignment system based on machine vision as claimed in claim 1 is characterized in that described placement data acquisition and motion-control module comprise the motion platform, placement data acquisition system and motion controller.
17, the lithographic equipment alignment system based on machine vision as claimed in claim 16 is characterized in that, comprise in the motion platform in placement data acquisition and motion-control module,
Place wafer and base station on the described motion platform, it is by linear motor driving, can realize x to or y to straight reciprocating motion;
The position data of base station is gathered in real time by laser interferometer by described placement data acquisition system, through transferring to motion controller and image processing module respectively after the data pre-service;
The movement locus of described motion controller controlled motion platform.
18, the lithographic equipment alignment system based on machine vision as claimed in claim 1, it is characterized in that described image processing module carries out the method that picture signal handles to the darkfield image of the alignment mark that collects and is: the gray scale to each the light and shade striped in the darkfield image is tangentially carried out integration along gratings strips.
19, the lithographic equipment alignment system based on machine vision as claimed in claim 18 is characterized in that the registration signal of described grating branch comprises the burst of three different cycles.
20, the lithographic equipment alignment system based on machine vision as claimed in claim 19, it is characterized in that, the alignment algorithm that described image processing module carries out comprises: utilize two large period grating branch signals that have small periodic inequality, determine the coarse alignment position; Utilize minor cycle grating branch signal, and the coarse alignment position, determine the fine alignment position; Utilization repeatedly according to the aligned position information that darkfield image obtained of the alignment mark that photographs, is determined final alignment position.
21, a kind of lithographic equipment alignment methods based on machine vision of utilizing the described alignment system of claim 1 is characterized in that, specifically comprises following steps:
Step 1, mobile alignment mark, make it be in position within the field range that can be imaged on ccd video camera, the collection alignment mark ± 1 order diffraction Light Interference Streaks image, and be transferred in the image processing module, simultaneously, placement data acquisition system acquisition this moment the residing position data of base station and be transferred to image processing module;
Step 2, image processing module are carried out Flame Image Process to the interference fringe image of the alignment mark that collects, obtain the registration signal of each grating branch that alignment mark comprises;
Step 3, image processing module carry out alignment algorithm to the registration signal of above-mentioned each grating branch that obtains to be handled, and obtains aligned position, and the realization base station is aimed at wafer;
Step 4, utilize placement data acquisition and motion-control module, the moving movement platform is so that base station moves certain distance, again gather alignment mark ± position data of 1 order diffraction Light Interference Streaks image and base station, and transfer to image processing module, jump to step 2 subsequently, repeat repeatedly execution in step 2 and step 3, obtain a plurality of fine alignment positional informations;
Step 5, the comprehensive above-mentioned a plurality of fine alignment positional informations that obtain are determined final alignment position.
22, the lithographic equipment alignment methods based on machine vision as claimed in claim 21 is characterized in that described step 2 specifically comprises following steps:
Step 2.1, image processing module are carried out pre-service to the interference fringe image of the alignment mark that collects, reduce picture noise;
Step 2.2, image processing module carry out Threshold Segmentation to pretreated image, obtain bianry image;
Step 2.3, image processing module are partitioned into the zone at the alignment mark place in the above-mentioned bianry image that obtains;
Step 2.4, image processing module carry out along the gray integration of gratings strips tangential direction the gray scale of each the light and shade striped in the interference imaging image of alignment mark, obtain grey scale curve S1, S2 and the S0 of each grating branch image of alignment mark, i.e. the registration signal of each grating branch.
23, the lithographic equipment alignment methods based on machine vision as claimed in claim 22 is characterized in that, in the described step 2.3, adopts edge-detection algorithm or template matching method, determines and be partitioned into the zone at alignment mark place in the image of being gathered.
24, the lithographic equipment alignment methods based on machine vision as claimed in claim 21 is characterized in that described step 3 specifically comprises following steps:
Step 3.1, extension signal curve S1 and S2 because there are small periodic inequality in S1 and S2 signal curve, can find position in S1 extension curve and the S2 extension curve the peak point X1 and the X2 of approaching coincidence, promptly obtain the coarse alignment position;
Step 3.2, extension signal curve S0 on the extension curve of S0, find distance above-mentioned coarse alignment position X1 and the immediate peak point X0 of X2, promptly obtain fine alignment position and storage.
25, the lithographic equipment alignment methods based on machine vision as claimed in claim 24, it is characterized in that, in described step 3.1 and the step 3.2, the method of extension signal curve is: adopt the method for numerical fitting or judge the peaked method of gray scale, each peak point of picked up signal curve adopts the method for average to this each peak point information, to obtain the cycle of this signal, utilize this cycle then, with fixing peak point extension signal curve.
26, the lithographic equipment alignment methods based on machine vision as claimed in claim 21 is characterized in that, in the described step 5, to a plurality of fine alignment positional informations that obtain, adopts and asks averaging method, determines final alignment position.
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |