CN101349869B - System and method for aligning silicon chip by signal processing method - Google Patents
System and method for aligning silicon chip by signal processing method Download PDFInfo
- Publication number
- CN101349869B CN101349869B CN2008100414938A CN200810041493A CN101349869B CN 101349869 B CN101349869 B CN 101349869B CN 2008100414938 A CN2008100414938 A CN 2008100414938A CN 200810041493 A CN200810041493 A CN 200810041493A CN 101349869 B CN101349869 B CN 101349869B
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- mark
- signal
- registration signal
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims description 60
- 239000010703 silicon Substances 0.000 title claims description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 57
- 238000003672 processing method Methods 0.000 title abstract 2
- 230000033001 locomotion Effects 0.000 claims description 27
- 238000003384 imaging method Methods 0.000 claims description 18
- 238000001914 filtration Methods 0.000 claims description 14
- 238000005286 illumination Methods 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000001228 spectrum Methods 0.000 claims description 8
- 239000000284 extract Substances 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 abstract 1
- 239000003550 marker Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000000835 fiber Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 108010076504 Protein Sorting Signals Proteins 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000276 deep-ultraviolet lithography Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides an alignment system which uses signal processing method to realize alignment and an alignment method adopting the alignment system. The method comprises: using step method to scan alignment marks, based on the alignment marks and the special structure of a corresponding reference grating, processing digit filter on the scanned light intensity signals to extract the third level signals of the light intensity signals for alignment, analyzing the peak nearest to the center of the original light intensity signal in the oscillation wave of the alignments signal to attain an alignment position. The alignment system and alignment method combine step scanning, grating marks and the structure design of the reference grating, and use scan the third level signals of the light intensity signals to realize alignment, having high alignment accuracy.
Description
Technical field
The present invention is relevant with the lithographic equipment that integrated circuit or other microdevice are made the field, particularly a kind of silicon chip alignment system and alignment methods based on the registration signal frequency spectrum.
Background technology
In the semiconducter IC ic manufacturing process, complete chip need just can complete through photolithographic exposure repeatedly usually.Except the photoetching first time, the photoetching of all the other levels figure that stays that all figure of this level and level in the past will be exposed before exposure is accurately located, to guarantee the correct relative position between two layer patterns, the i.e. precision of alignment.Alignment precision is one of key technical index of projection mask aligner.The factor that influences alignment precision is numerous, and wherein the alignment precision between mask and the silicon chip is one of them significant effects factor.
What early stage lithography alignment system adopted is the mode that mask-silicon chip is directly aimed at, because alignment light source need be passed through projection objective, this just requires projection objective will consider the transmitance of exposure light source and alignment light source simultaneously.When exposure light source adopts deep ultraviolet light source (wavelength 193nm or 248nm) with the raising photolithography resolution, very difficult even projection objective only plates the unimodal anti-reflection film of deep ultraviolet, almost there is not possibility to guarantee the transmitance of alignment light source again.Therefore, the deep-UV lithography alignment system adopts mask registration to add the indirect alignment so that silicon chip is aimed at usually.Particularly, by on the work stage datum plate, alignment mark being set, adopt exposure light source, realize aiming between mask alignment mark and the datum plate mark as alignment light source; Adopt the special aligned light source simultaneously, realize aiming between silicon chip mark and the datum plate mark; Thereby set up the position coordinates relation between silicon chip mark and the mask mark indirectly, promptly realized the mask silicon pad alignment.
Silicon chip alignment system adopts laser distribution alignment so (Laser Step Alignment usually, LSA), the field is as alignment so (Field Image Alignment, FIA) and the laser interferometric alignment mode (LaserInterferometric Alignment, LIA).Wide glistening light of waves source is used as alignment so in the field, by surveying the light field image of alignment mark and reference marker, obtains the marginal position of alignment mark by image process method, thereby obtains the position of alignment mark with respect to reference marker.This silicon chip alignment system comprises a lighting source, a conduction optical fiber, and light source adopts Halogen lamp LED illumination or other wide ripple illuminator; As shown in Figure 1, illuminating bundle impinges perpendicularly on the silicon chip alignment mark through lens 1, catoptron 2, lens 2 and catoptron 3 from catoptron 1 top incident, from the two telecentric imaging system imagings of alignment mark beam reflected through lens 2 and lens 3 compositions; The image planes position is the reference marker plane, and the reference marker plane is to be made of the transparent medium that is carved with lighttight reference marker, and these marks are made up of some orthogonal horizontal lines and vertical line, are respectively applied for the aligning of X and Y direction.The position of reference marker with reference mark as a reference.The light beam that sees through through the reference marker plane has comprised the information of alignment mark and reference marker, and mark and reference marker are imaged on the CCD camera 1 that is used for the directions X acquisition of signal simultaneously and are used for the CCD camera 2 that the Y direction signal is surveyed through imaging len 3 again.The vision signal of X and Y direction is exported in two linear step-scans of CCD camera, is input to the registration signal processing unit.Signal processing unit solves the center X_c (or Y_c) of mark imaging according to the picked up signal intensity curve, and the X_1 by the reference marker imaging and X_r (or Y_1 and Y_r) set up the coordinate relation with datum plate, realizes aiming between silicon chip and the datum plate.
Further, U.S. Pat 6876946 has been announced a kind of based on the silicon chip alignment system of field as alignment so, this alignment system adopts alignment device shown in Figure 1, determine mark center according to the marking image signal that obtains, and, set up the position relation between silicon chip mark and the datum plate mark by the reference mark images signal.In addition, U.S. Pat 7038777 has also adopted similar apparatus and method to realize the silicon chip aligning.In essence, determine that the method for aligned position is to utilize the gray scale or the intensity curves of mark imaging in these inventions, certain ad-hoc location is determined the position coordinates of mark on center by obtaining curve or the curve.Its alignment precision depends on the resolution of the CCD camera that is used for obtaining marking image, and used its reality of CCD camera precision that can provide can only reach that the actual range between 2 is about 1 micron on the object of per two picture element correspondences on the image usually.Such alignment precision does not satisfy the requirement of the lithography alignment precision of further raising.
Summary of the invention
The object of the present invention is to provide a kind of method for processing signals of using to carry out alignment system and method that silicon chip is aimed at, to improve the alignment precision of lithographic equipment.
For achieving the above object, the invention provides a kind of silicon chip alignment system that is used for lithographic equipment, comprising: light source module, the Laser Modulation module, alignment mark, illumination and image-generating unit, the registration signal collecting unit, registration signal processing unit, and station acquisition and motion control unit; Described light source module provides illumination light, described Laser Modulation module is modulated described illumination light, described illumination and image-generating unit image in alignment mark on the reference grating of registration signal collecting unit, and light intensity signal is converted to digital signal by described registration signal collecting unit, described registration signal processing unit carries out match and extracts aligned position the signal of registration signal collecting unit output, described station acquisition and motion control unit are according to this aligned position that extracts, the control work stage moves to assigned address, described silicon chip alignment system scans alignment mark with step-by-step system, carry out digital filtering by the light intensity signal that scanning is obtained, the third level signal that extracts its light intensity signal is used for aiming at, analyze the peak of the most close original light intensity signal center position in the described third level signal oscillating waveform, obtain aligned position; Described alignment mark comprises two groups of orthogonal marks of orientation, and described every group echo is made of one group of lines of equidistantly arranging, form groove between the adjacent lines, and line thickness is less than groove width; Described is to have the cycle identical with alignment mark with reference to grating, identical striped number, but the different transmission-type grating of dutycycle; Described registration signal collecting unit comprises photoelectric signal processor, analog-to-digital conversion module and digital filter.
Described alignment mark comprises silicon chip alignment mark that is positioned on the silicon chip and the datum plate mark that is positioned on the datum plate, and described silicon chip alignment mark and described datum plate alignment mark have identical structure.
Described dutycycle with reference to grating is greater than the dutycycle of described alignment mark.
Described light source module is that wavelength is single wavelength laser light source of 300nm～800nm.Preferable, described light source is that wavelength is that the ruddiness or the wavelength of 633 nanometers is the green glow of 532 nanometers.
Described Laser Modulation module is carried out high frequency modulated to laser signal.
Described illumination and image-generating unit comprise relay lens, semi-transparent semi-reflecting lens, object lens, catoptron and lens, and wherein said object lens and lens are formed two telecentric imaging systems.
Described photoelectric signal processor comprises analog band-pass filter, and its band connection frequency comprises the frequency of the modulation signal of described Laser Modulation module.Described digital filter comprises lowpass digital filter and high-pass digital filter, the cutoff frequency of described lowpass digital filter is the upper limit of third level signal in the frequency spectrum of selected registration signal, and the cutoff frequency of described high-pass digital filter is the lower limit of third level signal in the frequency spectrum of selected registration signal.
Described registration signal processing unit comprises that registration signal match link, aligned position find the solution link, aim at controlling unit.Wherein, described registration signal match link is carried out process of fitting treatment with sinusoidal model to registration signal.Described aligned position is found the solution the matched curve that link obtains according to match and is asked for a peak of its most close original signal center, as aligned position.Described aligning controlling unit is converted to position coordinates under the worktable coordinate system with the aligned position that obtains, and stores described position coordinates.Described aligning controlling unit control position collection and motion control unit, registration signal collecting unit, and the control of whole alignment system and operation.
Described station acquisition and control module comprise the placement data acquisition module, are used to carry the motion platform of work stage, and motion-control module; Described station acquisition module is gathered the positional information of work stage, and position data is offered registration signal processing unit and motion-control module in real time; Described moving control module for controlling motion platform drives work stage to certain location, and silicon chip alignment mark or datum plate alignment mark are carried out step-scan; Described motion platform under the control of motion-control module, carries out straight reciprocating motion and hi-Fix by linear motor driving on the orthogonal directions in surface level.
Accordingly, the present invention also provides a kind of silicon chip alignment methods of utilizing above-mentioned silicon chip alignment system, comprises the steps:
Step 2, moving control module for controlling work stage move described mark to assigned address;
Step 3, open alignment light source, shine described mark; Illuminated part mark is on imaging system images in reference to grating; Project the photodetector with reference to the grating back after the reference Grating Modulation, photodetector is collected the light intensity signal that described mark imaging produces;
Step 4,3 method set by step, scan described mark with step-by-step system after, photodetector collects a continuous light intensity signal, this light intensity signal obtains the set of number discrete signal after through filtering and noise reduction and analog to digital conversion; This light intensity signal also carries out filtering through digital filter, obtains a third level signal of forming this registration signal;
Step 5, after the step-scan of having finished whole mark, the registration signal processing unit signal that filtering obtains to step 4 carries out process of fitting treatment, finds the solution aligned position, and according to the coordinate of current work stage, the aligned position that obtains is converted to position coordinates under the worktable coordinate system, and stores;
Step 6, registration signal processing unit are according to the position coordinates of the datum plate mark of being stored, and the position coordinates of silicon chip mark, set up the coordinate position relation between the two.
Wherein, described step 5 further comprises following concrete steps:
Registration signal match link in step 5.1, the registration signal processing unit is carried out match to the registration signal that obtains, and obtains the parameter of model of fit;
Description of drawings
Fig. 1 is the alignment system synoptic diagram of the field of prior art as alignment so;
Fig. 2 is the synoptic diagram of an embodiment of alignment system involved in the present invention;
Fig. 3 a is the vertical view of alignment mark of the present invention;
Fig. 3 b is the cross-sectional view of alignment mark of the present invention;
Fig. 4 is of the present invention with reference to the grating synoptic diagram;
Fig. 5 is the intensity signal synoptic diagram of the alignment mark imaging of the mirror gathered of photodetector after with reference to Grating Modulation;
Fig. 6 is the digital signal synoptic diagram that is converted to through analog to digital conversion circuit;
Fig. 7 is a registration signal processing unit structural representation of the present invention;
Fig. 8 is the fourier spectrum figure through the digital signal of analog to digital converter sampling and analog to digital conversion generation;
Fig. 9 is the final registration signal synoptic diagram of the present invention;
Figure 10 is the curve synoptic diagram that registration signal match link of the present invention match obtains.
In the accompanying drawing:
2, silicon chip; 3, datum plate; 4, work stage 5, station acquisition module; 6, motion platform; 7, motion-control module; 10, light source module; 11, Laser Modulation module; 12, relay lens; 13, semi-transparent semi-reflecting lens; 14, object lens; 15, catoptron; 16, lens; 17, with reference to grating; 18, Conductive fiber; 19, photodetector; 20, photoelectric signal processor; 21, analog to digital conversion circuit; 22, digital filter; 23, registration signal match link; 24, aligned position is found the solution link; 25, aim at controlling unit; 100, illumination and image-generating unit; 200, registration signal collecting unit; 300, registration signal processing unit; 400, station acquisition and motion control unit.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described.
Fig. 2 has shown the synoptic diagram of an embodiment of alignment system involved in the present invention.This alignment system is used for determining that the position between silicon chip mark WM and the datum plate mark SM concerns.
As shown in the figure, this alignment system comprises: be positioned at alignment mark WM and the alignment mark SM that is positioned on the datum plate 3 on the silicon chip 2, the light source module 10 that sets gradually, Laser Modulation module 11, illumination and image-generating unit 100, registration signal collecting unit 200, registration signal processing unit 300, station acquisition and motion control unit 400.
Described silicon chip alignment mark WM has identical structure with datum plate alignment mark SM, this silicon chip alignment mark or datum plate alignment mark be divided into again X to mark and Y to mark.Mark on the either direction is made of one group of lines of equidistantly arranging, forms groove between the adjacent lines, and line thickness is less than groove width, and its vertical view is shown in Fig. 3 a, and its cross-sectional view is shown in Fig. 3 b.X to the lines of mark and groove along X to arrangement, Y is to extension; Y to the lines of mark and groove along Y to arrangement, X is to extension.
Described light source module 10 adopts single wavelength laser light source of wavelength 300nm～800nm, as the LASER Light Source of 633nm.The illuminating bundle that light source module 10 is sent outputs to Laser Modulation module 11 through optical fiber.
11 pairs of laser of described Laser Modulation module carry out high frequency modulated.The purpose of high frequency modulated is to have sufficiently high signal to noise ratio (S/N ratio) for follow-up registration signal detection provides high-quality high frequency carrier to guarantee registration signal.Have following expression through the output intensity signal after the high frequency modulated:
I wherein
InBe input light light intensity, I
OutBe output light light intensity, δ
0Be modulated amplitude, f is a frequency modulating signal.
Described illumination and image-generating unit 100 comprise relay lens 12, semi-transparent semi-reflecting lens 13, object lens 14 and catoptron 15, and lens 16, wherein the illuminating bundle that sends of Laser Modulation module 11 incides on silicon chip mark WM or the datum plate SM through relay lens 12, semi-transparent semi-reflecting lens 13, object lens 14 and catoptron 15, the two telecentric imaging system that folded light beam is formed through object lens 14 and lens 16 images in the picture plane with alignment mark WM or SM, forms light and dark periodicity light and shade striped.The mark imaging has comprised the information such as position, structure and phase place of alignment mark.
Described registration signal collecting unit 200 comprises with reference to grating 17, Conductive fiber 18, photodetector 19, photoelectric signal processor 20, analog to digital conversion circuit 21 and digital filter 22.
Wherein, described is to have the cycle identical with alignment mark with reference to grating 17, identical striped number, but the transmission-type grating of different dutycycles.As shown in Figure 4.The black part of the reference grating shown in the figure is divided into lightproof part, and white portion is the light transmission part.
Described photodetector 19 is gathered the intensity signal of the alignment mark imaging after 17 modulation of reference grating.With alignment mark with all to have 3 fringe number with reference to grating 17 be example, this light intensity signal has form as shown in Figure 5.
Described photoelectric signal processor 20 has the function of light intensity signal being carried out filtering and noise reduction, obtains near the signal of the frequency range of frequency spectrum frequency modulating signal.Concrete, described photoelectric signal processor 20 comprises analog band-pass filter, and its band connection frequency comprises the frequency of the modulation signal of described Laser Modulation module 11.
Described analog to digital conversion circuit 21 is a digital signal with the analog signal conversion that obtains, as shown in Figure 6.
22 pairs of these digital signals of described digital filter are carried out filtering, obtain forming the signal of the third level of this digital signal.
As shown in Figure 7, described registration signal processing unit 300 comprises that registration signal match link 23, aligned position find the solution link 24 and aim at controlling unit 25, be used for the determining of processing, aligned position of registration signal, the collection of work stage position data, and the motion control of work stage etc.Wherein, registration signal match link 23 is used for the registration signal that obtains is carried out match, obtains the parameter of model of fit; Aligned position is found the solution link 24 and is used to find the solution aligned position, the position coordinates of work stage when obtaining alignment mark and being in aligned position; Aim at controlling unit 25 and be used for control position collection and motion control unit 400, and the control of whole alignment system and operation.
Registration signal match link 23 is used for the registration signal that obtains is carried out process of fitting treatment.Model of fit is chosen as sinusoidal curve model as follows:
S(x)＝DC+Acos(2πx/p)+Bsin(2πx/p)
In the formula, DC, A, B are model parameter.By least square method, solve parameter DC easily, A, B.
Aligned position is found the solution link 24 according to the model parameter that obtains, and the peak point that solves registration signal is to determine aligned position.
The aligned position that aligning controlling unit 25 is used for obtaining is converted to the position coordinates under the worktable coordinate system, and stores this position coordinates; Simultaneously, aim at controlling unit 25 and also be used for control position collection and motion control unit 400, and the control of whole alignment system and operation.
Described station acquisition and motion control unit 400 comprise work stage 4, placement data acquisition module 5, motion platform 6 and motion-control module 7.
Described placement data acquisition module 5 is used to gather the positional information of work stage 4, and position data is offered registration signal processing unit 300 and motion-control module 7 in real time; Motion-control module 7 is used for controlled motion platform 6 drive work stage 4 and moves to certain location, so that silicon chip mark WM or datum plate mark SM are carried out step-scan; Motion platform 6 is by linear motor driving, under the control of motion-control module 7, can realize laterally straight reciprocating motion and the high-precision location of (x to) or vertical (y to).
The present invention also provides a kind of alignment methods of utilizing said system, specifically comprises the steps:
Step 2, motion-control module 7 controlled motion platforms 6 drive work stage 4 movement indicias to assigned address, to carry out step-scan.
Step 3, open alignment light source 10, beginning step-scan alignment mark.Illuminated part alignment mark is on imaging system images in reference to grating 17.Gather the light intensity signal that the alignment mark imaging after 17 modulation of reference grating produces with reference to the photodetector 19 of grating 17 back, this light intensity signal 20 carries out Filtering Processing through the Photoelectric Signal Processing unit, to remove noise.
Step 4, the simulating signal that produced by step 3 produce the digital signal of a sequence, as Fig. 6 through analog to digital converter 21 sampling and analog to digital conversion.Its fourier spectrum as shown in Figure 8.Follow-up digital filtering is promptly chosen its third level signal, shown in frame of broken lines among the figure.This digital signal sequences divides biography under the two-way, and one the tunnel directly delivers to registration signal processing unit 300, is used for follow-up comparison, and another road is passed to and carried out filtering in the digital filter 22, obtains final registration signal, as shown in Figure 9.
Step 5, after the step-scan of having finished whole alignment mark, registration signal processing unit 300 is chosen the signal that step 5 filtering obtains and is carried out process of fitting treatment, finds the solution crest location, it is aligned position, and according to the coordinate of current work stage 4, the aligned position that obtains is converted to position coordinates under the worktable coordinate system, and stores; Specifically comprise the steps:
Registration signal match link 23 in step 5.1, the registration signal processing unit 300 is carried out match with sinusoidal model to registration signal, obtains the parameter of model of fit.The curve that match obtains is shown in solid line among Figure 10.
Aligned position in step 5.2, the registration signal processing unit 300 is found the solution link 24 according to the model of fit parameter of trying to achieve, determine aligned position, be the peak of the most close original signal center in the sinusoidal curve that obtains of match, shown in frame of broken lines among Figure 10.
Aligning controlling unit 25 in step 5.3, the registration signal processing unit 300 is according to the position coordinates of current work stage 4, and it is coordinate under the worktable coordinate system that aligned position is found the solution the aligned position coordinate conversion of trying to achieve the unit, and storage.
Step 6, registration signal processing unit 300 are according to the position coordinates of the datum plate mark SM that is stored, and the position coordinates of silicon chip mark WM, set up the coordinate position relation between the two.
Claims (17)
1. a silicon chip alignment system that is used for lithographic equipment comprises: light source module, Laser Modulation module, alignment mark, illumination and image-generating unit, registration signal collecting unit, registration signal processing unit, and station acquisition and motion control unit; Described light source module provides illumination light, described Laser Modulation module is modulated described illumination light, described illumination and image-generating unit image in alignment mark on the reference grating of registration signal collecting unit, and light intensity signal is converted to digital signal by described registration signal collecting unit, described registration signal processing unit carries out match and extracts aligned position the signal of registration signal collecting unit output, described station acquisition and motion control unit are according to this aligned position that extracts, and the control work stage moves to assigned address; It is characterized in that: described silicon chip alignment system scans alignment mark with step-by-step system, carry out digital filtering by the light intensity signal that scanning is obtained, the third level signal that extracts its light intensity signal is used for aiming at, analyze the peak of the most close original light intensity signal center position in the described third level signal oscillating waveform, obtain aligned position; Described alignment mark comprises two groups of orthogonal marks of orientation, and described every group echo is made of one group of lines of equidistantly arranging, form groove between the adjacent lines, and line thickness is less than groove width; Described is to have the cycle identical with alignment mark with reference to grating, identical striped number, but the different transmission-type grating of dutycycle; Described registration signal collecting unit comprises photoelectric signal processor, analog-to-digital conversion module and digital filter.
2. the silicon chip alignment system that is used for lithographic equipment according to claim 1, it is characterized in that: described alignment mark comprises silicon chip alignment mark that is positioned on the silicon chip and the datum plate mark that is positioned on the datum plate, and described silicon chip alignment mark and described datum plate alignment mark have identical structure.
3. the silicon chip alignment system that is used for lithographic equipment according to claim 1 is characterized in that: described dutycycle with reference to grating is greater than the dutycycle of described alignment mark.
4. the silicon chip alignment system that is used for lithographic equipment according to claim 1 is characterized in that: described light source module is that wavelength is single wavelength laser light source of 300nm～800nm.
5. the silicon chip alignment system that is used for lithographic equipment according to claim 4 is characterized in that: described light source is that wavelength is that the ruddiness or the wavelength of 633 nanometers is the green glow of 532 nanometers.
6. the silicon chip alignment system that is used for lithographic equipment according to claim 1 is characterized in that: described Laser Modulation module is carried out high frequency modulated to laser signal.
7. the silicon chip alignment system that is used for lithographic equipment according to claim 1, it is characterized in that: described illumination and image-generating unit comprise relay lens, semi-transparent semi-reflecting lens, object lens, catoptron and lens, and wherein said object lens and lens are formed two telecentric imaging systems.
8. the silicon chip alignment system that is used for lithographic equipment according to claim 1 is characterized in that: described photoelectric signal processor comprises analog band-pass filter, and its band connection frequency comprises the frequency of the modulation signal of described Laser Modulation module.
9. the silicon chip alignment system that is used for lithographic equipment according to claim 1, it is characterized in that: described digital filter comprises lowpass digital filter and high-pass digital filter, the cutoff frequency of described lowpass digital filter is the upper limit of third level signal in the frequency spectrum of selected registration signal, and the cutoff frequency of described high-pass digital filter is the lower limit of third level signal in the frequency spectrum of selected registration signal.
10. the silicon chip alignment system that is used for lithographic equipment according to claim 1 is characterized in that: described registration signal processing unit comprises that registration signal match link, aligned position find the solution link, aim at controlling unit.
11. the silicon chip alignment system that is used for lithographic equipment according to claim 10 is characterized in that: described registration signal match link is carried out process of fitting treatment with sinusoidal model to registration signal.
12. the silicon chip alignment system that is used for lithographic equipment according to claim 10, it is characterized in that: described aligned position is found the solution the matched curve that link obtains according to match and is asked for a peak of its most close original signal center, as aligned position.
13. the silicon chip alignment system that is used for lithographic equipment according to claim 10 is characterized in that: described aligning controlling unit is converted to position coordinates under the worktable coordinate system with the aligned position that obtains, and stores described position coordinates.
14. the silicon chip alignment system that is used for lithographic equipment according to claim 10 is characterized in that: described aligning controlling unit control position collection and motion control unit, registration signal collecting unit, and the control of whole alignment system and operation.
15. the silicon chip alignment system that is used for lithographic equipment according to claim 2 is characterized in that: described station acquisition and control module comprise the placement data acquisition module, are used to carry the motion platform of work stage, and motion-control module; Described station acquisition module is gathered the positional information of work stage, and position data is offered registration signal processing unit and motion-control module in real time; Described moving control module for controlling motion platform drives work stage to certain location, and silicon chip alignment mark or datum plate alignment mark are carried out step-scan; Described motion platform under the control of motion-control module, carries out straight reciprocating motion and hi-Fix by linear motor driving on the orthogonal directions in surface level.
16. a silicon chip alignment methods of utilizing silicon chip alignment system as claimed in claim 1 is characterized in that, comprises the steps:
Step 1, registration signal processing unit issue the position of silicon chip mark to be aimed at or datum plate mark to motion-control module;
Step 2, moving control module for controlling work stage move described mark to assigned address;
Step 3, open alignment light source, shine described mark; Illuminated part mark is on imaging system images in reference to grating; Project the photodetector with reference to the grating back after the reference Grating Modulation, photodetector is collected the light intensity signal that described mark imaging produces;
Step 4,3 method set by step, scan described mark with step-by-step system after, photodetector collects a continuous light intensity signal, this light intensity signal obtains the set of number discrete signal after through filtering and noise reduction and analog to digital conversion; This light intensity signal also carries out filtering through digital filter, obtains a third level signal of forming this registration signal;
Step 5, after the step-scan of having finished whole mark, the registration signal processing unit signal that filtering obtains to step 4 carries out process of fitting treatment, finds the solution aligned position, and according to the coordinate of current work stage, the aligned position that obtains is converted to position coordinates under the worktable coordinate system, and stores;
Step 6, registration signal processing unit are according to the position coordinates of the datum plate mark of being stored, and the position coordinates of silicon chip mark, set up the coordinate position relation between the two.
17. alignment methods according to claim 16 is characterized in that:
Described step 5 comprises following concrete steps:
Registration signal match link in step 5.1, the registration signal processing unit is carried out match to the registration signal that obtains, and obtains the parameter of model of fit;
Aligned position in step 5.2, the registration signal processing unit is found the solution link according to trying to achieve the model of fit parameter, determines aligned position;
Aligning controlling unit in step 5.3, the registration signal processing unit is according to the position coordinates of current work stage, and it is coordinate under the worktable coordinate system that aligned position is found the solution the aligned position coordinate conversion of trying to achieve the unit, and storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100414938A CN101349869B (en) | 2008-08-07 | 2008-08-07 | System and method for aligning silicon chip by signal processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100414938A CN101349869B (en) | 2008-08-07 | 2008-08-07 | System and method for aligning silicon chip by signal processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101349869A CN101349869A (en) | 2009-01-21 |
| CN101349869B true CN101349869B (en) | 2010-06-23 |
Family
ID=40268701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100414938A Active CN101349869B (en) | 2008-08-07 | 2008-08-07 | System and method for aligning silicon chip by signal processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101349869B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587306B (en) * | 2009-04-09 | 2010-12-29 | 上海微电子装备有限公司 | Alignment signal processing method in photoetching technology |
| CN102081309B (en) * | 2009-11-27 | 2013-01-16 | 上海微电子装备有限公司 | Method for improving alignment scanning success rate |
| CN102645855A (en) * | 2012-04-24 | 2012-08-22 | 上海宏力半导体制造有限公司 | Enhanced global alignment (EGA) mark and photolithograph pattern |
| CN106873638B (en) * | 2017-02-17 | 2020-11-10 | 南通大学 | Dual-probe automatic alignment system based on laser displacement sensor |
| CN109959638A (en) * | 2017-12-22 | 2019-07-02 | 凯迈（洛阳）环测有限公司 | Quick accurate automatic aligning method and processing unit for transmission-type visibility meter |
| CN111077743B (en) * | 2019-11-28 | 2021-10-01 | 中国科学院微电子研究所 | Alignment signal digital synchronization demodulation method and device |
| CN114061452A (en) * | 2021-11-04 | 2022-02-18 | 中国科学院微电子研究所 | Validity evaluation method and system of photoelectric signal calculation results for ultra-precision position detection |
-
2008
- 2008-08-07 CN CN2008100414938A patent/CN101349869B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101349869A (en) | 2009-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101303533B (en) | Aligning system, aligning method for photolithography equipment and enhancement type aligning mark | |
| CN101349869B (en) | System and method for aligning silicon chip by signal processing method | |
| CN101241313B (en) | Lithographic equipment aligning system based on machine vision and alignment method | |
| CN101246314B (en) | Silicon slice alignment signal processing method | |
| CN101149254B (en) | High accuracy vision detection system | |
| US9945698B2 (en) | Macro-micro composite grating ruler measuring system and measuring method using same comprising a macro-scale reading module, a micro-scale reading module and a measuring reference line | |
| CN101329514B (en) | System and method for aligning photolithography apparatus | |
| CN102540778B (en) | Measuring system and photoetching device using same | |
| CN101943865B (en) | Alignment marks for photoetching equipment and alignment method | |
| CN101251724B (en) | Aligning system, method and lithographic device thereof | |
| CN102141738B (en) | Nano-scale automatic focusing system for projection lithography | |
| CN101299132B (en) | Aligning mark used for photolithography equipment aligning system and its use method | |
| CN110926340A (en) | Novel grating ruler displacement measurement device | |
| CN102708566B (en) | Novel single-camera and single-projection light source synchronous calibrating method | |
| CN101566800A (en) | Aligning system and aligning method for lithography equipment | |
| CN109916331A (en) | A three-dimensional detection method of structured light micro-nano structure based on composite grating | |
| CN101487992B (en) | Silicon slice mark capturing system and method | |
| CN102043341B (en) | Alignment signal acquisition system for photo-etching equipment and alignment method | |
| CN102540780B (en) | For registration signal disposal system and the aligning signal processing method of lithographic equipment | |
| JP2013015413A (en) | Three-dimensional shape measurement apparatus and three-dimensional shape measurement method | |
| KR20200024079A (en) | Exposure device | |
| CN1700101A (en) | Focusing and leveling sensor for projection photo-etching machine | |
| CN102402140A (en) | Alignment system | |
| CN107342239B (en) | A kind of alignment measuring device and a kind of alignment system and method | |
| CN104089581A (en) | Long-grating scribed line measurement system and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |