CN101201677A - Air guide structure of radiating fan - Google Patents
Air guide structure of radiating fan Download PDFInfo
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- CN101201677A CN101201677A CNA2006101622464A CN200610162246A CN101201677A CN 101201677 A CN101201677 A CN 101201677A CN A2006101622464 A CNA2006101622464 A CN A2006101622464A CN 200610162246 A CN200610162246 A CN 200610162246A CN 101201677 A CN101201677 A CN 101201677A
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- air
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- air guide
- cooling fan
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Abstract
Description
技术领域 technical field
本发明涉及一种散热风扇的导风结构,特别是有关一种将散热风扇所吹出的气流,选择性导引至键盘输入空间的散热风扇的导风结构。The invention relates to an air guiding structure of a cooling fan, in particular to an air guiding structure of the cooling fan which selectively guides the airflow blown by the cooling fan to a keyboard input space.
背景技术 Background technique
当天气寒冷时,尤其是低温的冬天,人们要运用计算机进行各种事务的操作处理时,冷冰冰的计算机键盘让使用者不愿碰触,但如不通过计算机键盘输入工作指令,又无法令计算机自行完成所需各种事务的处理,当然天寒时打字作业也较常温时缓慢,除了因天冷手指不灵活外,有时有些工作者会带上手套以保持手指温度,但手套一戴上会使得手指操作的灵活性降低,要进行输入工作指令于键盘也甚为不便,因此如何能使使用者的手指在天寒时能维持常温时的灵活度,又能不增加任何电暖设备,将是业界想实现的目标之一。When the weather is cold, especially in low-temperature winter, when people want to use computers to perform various operations, the cold computer keyboard makes users reluctant to touch it, but if they do not input work instructions through the computer keyboard, the computer cannot be activated. Handle all kinds of affairs by yourself. Of course, the typing work is slower in cold weather than in normal temperature. In addition to the inflexibility of fingers due to cold weather, sometimes some workers wear gloves to keep fingers warm. The flexibility of finger operation is reduced, and it is very inconvenient to input work instructions on the keyboard. Therefore, how to make the user's fingers maintain the flexibility of normal temperature when it is cold, without adding any electric heating equipment, will It is one of the goals that the industry wants to achieve.
发明内容 Contents of the invention
本发明所要解决的技术问题在于,提出一种散热风扇的导风结构,用以解决天寒时手指操作不灵活,导致工作效率降低的问题。The technical problem to be solved by the present invention is to propose an air guide structure of a cooling fan to solve the problem of inflexible finger operation in cold weather, resulting in reduced work efficiency.
为了实现上述的目的,本发明提供了一种散热风扇的导风结构,其设置于笔记本计算机内,笔记本计算机具有键盘、散热风扇及散热元件,其中散热风扇产生气流吹至散热元件,而散热风扇的导风结构包含导风管,前述导风管具有第一端及第二端,其第二端对应键盘,而第一端承接流经散热元件的气流并导引气流至第二端,并由第二端吹出气流至键盘,即气流吹拂至键盘输入区。In order to achieve the above object, the present invention provides an air guide structure of a heat dissipation fan, which is arranged in a notebook computer. The notebook computer has a keyboard, a heat dissipation fan and a heat dissipation element, wherein the heat dissipation fan generates an airflow and blows to the heat dissipation element, and the heat dissipation fan The air guide structure includes an air guide tube, the aforementioned air guide tube has a first end and a second end, the second end corresponds to the keyboard, and the first end receives the air flow flowing through the cooling element and guides the air flow to the second end, and The airflow is blown from the second end to the keyboard, that is, the airflow is blown to the keyboard input area.
本发明具有以下有益的效果:本发明的一种散热风扇的导风结构,其利用现有计算机零件来提升键盘输入空间的温度,使得天寒低温的工作环境,能令手指维持温度,以提高输入工作者手指的灵活性及灵敏度,增进天寒时的工作效率,而且也能选择性导引散热风扇所吹出的气流至键盘升温输入空间或其它位置,例如计算机的出风口,以便利使用者在高温环境时,直接将气流排出,而不导引至输入空间。The present invention has the following beneficial effects: the air guide structure of a cooling fan of the present invention uses existing computer parts to increase the temperature of the keyboard input space, making it possible to maintain the temperature of the fingers in a cold and low-temperature working environment to improve The flexibility and sensitivity of input workers' fingers can improve work efficiency in cold weather, and can also selectively guide the airflow blown by the cooling fan to the keyboard to heat up the input space or other locations, such as the air outlet of the computer, for the convenience of users In high temperature environments, the airflow is directly exhausted without being directed to the input space.
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明 Description of drawings
图1所示为本发明的散热风扇的导风结构组装于笔记本计算机中的示意图;Fig. 1 shows the schematic diagram that the air guide structure of the cooling fan of the present invention is assembled in a notebook computer;
图2所示为本发明的散热风扇的导风结构的第一实施例示意图Fig. 2 shows the schematic diagram of the first embodiment of the air guide structure of the cooling fan of the present invention
图3所示为本发明的散热风扇的导风结构的第一实施例的分解示意图;Fig. 3 shows the exploded schematic view of the first embodiment of the air guide structure of the cooling fan of the present invention;
图4所示为本发明的散热风扇的导风结构的第二实施例示意图;Fig. 4 shows the schematic diagram of the second embodiment of the air guide structure of the cooling fan of the present invention;
图5所示为本发明的散热风扇的导风结构的第三实施例示意图;FIG. 5 is a schematic diagram of a third embodiment of the air guide structure of the cooling fan of the present invention;
图6所示为本发明的散热风扇的导风结构的第四实施例的导风扰流示意图;FIG. 6 is a schematic diagram of a fourth embodiment of the air guiding structure of the cooling fan according to the present invention;
图7所示为本发明的散热风扇的导风结构的第五实施例的导风扰流示意图;以及Fig. 7 shows the schematic diagram of the air guide and spoiler of the fifth embodiment of the air guide structure of the cooling fan of the present invention; and
图8所示为本发明的散热风扇的导风结构的第五实施例的导风扰流剖面示意图。FIG. 8 is a schematic cross-sectional view of the air guide and spoiler of the fifth embodiment of the air guide structure of the cooling fan according to the present invention.
其中,附图标记:Among them, reference signs:
10a,10b,10c,10d,10e-散热风扇的导风结构10a, 10b, 10c, 10d, 10e - Air guide structure of cooling fan
11-导风管11-Air duct
12-栅板12-grid
13-扰流元件13- spoiler element
131-第一扰流板131 - First Spoiler
131a-孔洞131a - hole
132-第二扰流板132 - second spoiler
132b-孔洞132b - hole
121-穿孔121-Pierce
122-导板122-guide plate
20-笔记本计算机20-notebook computer
21-键盘21-keyboard
211-单排按键211-Single row of buttons
22-散热风扇22-cooling fan
23-散热元件23-radiating element
24-通风孔24 - ventilation holes
25-出风口25-air outlet
F-气流F-Airflow
E1-第一端E1 - first end
E2-第二端E2 - second end
E3-第三端E3-third end
具体实施方式 Detailed ways
请参阅图1、图2及图3,本发明提供了一种散热风扇的导风结构,此散热风扇的导风结构10a设置于一笔记本计算机20内,此笔记本计算机20具有键盘21、散热风扇22及散热元件23,此散热风扇22产生一气流F吹拂至散热元件23,此处的散热元件23能为但不限于一散热鳍片,此散热元件23承接由发热元件(图中未示,如中央处理单元、南北桥芯片等)导引过来的热量,因此,当气流F吹拂过散热元件23时,即会带走该热量,故流经散热元件23的气流就会带有热量。Please refer to Fig. 1, Fig. 2 and Fig. 3, the present invention provides a kind of air guiding structure of cooling fan, the
请继续参阅图1、图2及图3,上述散热风扇的导风结构10a,即第一实施例,其包含一导风管11,此导风管11具有一第一端E1及一第二端E2,其中前述的第一端E1承接流经散热元件23的气流F,并导引气流F至第二端E2,而第二端E2对应上述键盘21,因而第一端E1导引气流F至第二端E2时,第二端E2吹出气流F至键盘21。Please continue to refer to Fig. 1, Fig. 2 and Fig. 3, the
接着,请参阅图2及图3,上述导风管11的第二端E2呈扁平状,将第一端E1导引的气流F吹出至键盘21,并将第一端E1导引的气流F吹出至键盘21,且能进一步涵盖键盘21的单排按键211的侧面的部分区段,即是气流F吹出至单排按键211的侧面,且笔记本计算机20具有多个通风孔24,呈对应单排按键211的侧面以供气流F吹出至键盘21的输入空间。Next, please refer to FIG. 2 and FIG. 3 , the second end E2 of the above-mentioned
请参阅图4,图4所示为散热风扇的导风结构10b,即第二实施例,包含一导风管11及一栅板12,此栅板12设置于导风管11的第二端E2,并用以将第一端E1导引的气流F,吹出至键盘21前先调节气流F吹出的风量,因栅板12对应上述笔记本计算机20的多个通风孔24,而开设有多个穿孔121,其中多个通风孔24与多个穿孔121为两两对应,因而滑动栅板12时使得上述通风孔24与穿孔121两两呈开启或关闭状态,进而能调节气流F吹出的风量。Please refer to Fig. 4, Fig. 4 shows the
上述散热风扇的导风结构10b,即第二实施例中,还能包含一导板122,在本实施例中,导板122除设置于第二端E2与导风管11连通位置,还为由栅板12在相对出风口25处延伸此导板122,因而滑移栅板12调节气流F吹出的风量时,还能同步选择性地将由第二端E2导流的气流F,吹出至单排按键211的侧面,或选择性地将气流F导引至第三端E3(如后述第四实施例)吹出至出风口25(如图6所示)排出。The
请参阅图5,上述导风管11的第二端E2呈开口管状,为散热风扇的导风结构10c,即第三实施例,将第一端E1导引的气流F吹出至键盘21,并将第一端E1导引的气流F吹出至键盘21,且能进一步吹出至键盘21的单排按键211的侧面的部分区段,即气流F吹出至单排按键211的侧面,且笔记本计算机20具有多个通风孔24,呈对应单排按键211的侧面以供气流F吹出至键盘21的缮打空间。Please refer to FIG. 5 , the second end E2 of the above-mentioned
请再参阅图6,上述笔记本计算机20还能再具有一出风口25,为散热风扇的导风结构10d,即第四实施例,而导风管11还具有一对应上述出风口25的第三端E3,且第三端E3连通于导风管11,并将流经上述散热元件23的气流F导引至出风口25排出,即如上述第二实施例中,滑移栅板12调节气流F吹出的风量时,还能同步选择性地将由第二端E2导流的气流F,吹出至单排按键211的侧面,或选择性地将气流F导引至第三端E3吹出至出风口25排出。Please refer to Fig. 6 again, above-mentioned notebook computer 20 can also have an
另外,请参阅图7,图中所示为散热风扇的导风结构10e,即第五实施例,除包含一导风管11及一栅板12,还具有一扰流元件13,且扰流元件13设置于上述导风管11的第二端E2,以使自导风管11的第二端E2吹出的气流分散,而能平均吹拂于单排按键211的侧面,请再参阅图7及图8,图中所示表示上述扰流元件13包含第一扰流板131及第二扰流板132,且第一扰流板131及第二扰流板132皆分别开设有多个孔洞131a,132b,且孔洞131a,132b呈两两孔洞131a,132b为错位方式,因而当导风管11的第一端E1导引的气流F,流经第二端E2而吹出时,先碰触到第一扰流板131,气流F呈分散状,在又碰触到第二扰流板132再次呈分散状,而能平均流出于栅板12的穿孔121,吹拂于单排按键211的侧面。In addition, please refer to FIG. 7, which shows the
而为提供输入者吹出的气流F为之洁净,上述散热风扇的导风结构10e,即第五实施例能在导风管11的第二端E2再设置有一滤网,以过滤自第二端E2吹出的气流F。And for the airflow F blown out by the input person to be clean, the
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的普通技术人员当可根据本发明做出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.
Claims (8)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101992265A (en) * | 2010-12-07 | 2011-03-30 | 山东宏泰机电科技有限公司 | Method for manufacturing resin casting die used for modeling sodium silicate self-hardening sand |
CN104219926A (en) * | 2013-05-30 | 2014-12-17 | 英业达科技有限公司 | A heat dissipation module |
CN104571397A (en) * | 2013-10-15 | 2015-04-29 | 联想(北京)有限公司 | Heat-dissipation device and electronic equipment |
CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
-
2006
- 2006-12-13 CN CNA2006101622464A patent/CN101201677A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101992265A (en) * | 2010-12-07 | 2011-03-30 | 山东宏泰机电科技有限公司 | Method for manufacturing resin casting die used for modeling sodium silicate self-hardening sand |
CN101992265B (en) * | 2010-12-07 | 2013-02-06 | 山东宏泰机电科技有限公司 | Method for manufacturing resin casting die used for modeling sodium silicate self-hardening sand |
CN104219926A (en) * | 2013-05-30 | 2014-12-17 | 英业达科技有限公司 | A heat dissipation module |
CN104219926B (en) * | 2013-05-30 | 2017-03-08 | 英业达科技有限公司 | Radiating module |
CN104571397A (en) * | 2013-10-15 | 2015-04-29 | 联想(北京)有限公司 | Heat-dissipation device and electronic equipment |
CN104571397B (en) * | 2013-10-15 | 2019-01-15 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
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