CN105843348A - Design method of air guide cover for heat dissipation of board card - Google Patents

Abstract

The invention discloses a method for designing a windshield aimed at heat dissipation of board cards. The specific implementation process is as follows: inside the server, a windshield is installed downstream of the cooling fan and upstream of the CPU, and a detachable part is arranged on the windshield , so that the wind blown by some fans can cross the CPU and blow to the downstream of the CPU. Compared with the existing technology, this design method of air guide cover for heat dissipation of boards increases the supportability of various boards and optimizes heat dissipation; the reasonable distribution of air volume will reduce the speed of fans, thereby reducing noise; The compatibility of heat dissipation under different configurations and heat dissipation requirements of servers solves the problem of board card overheating and CPU performance compatibility. It has strong practicability and is easy to promote.

Description

A Design Method of Air Guide Cover for Board Card Heat Dissipation

technical field

The invention relates to the technical field of computer heat dissipation, in particular to a design method for an air guide cover with strong practicability and aiming at heat dissipation of board cards.

Background technique

With the rapid development of the Internet economy, the status of the server has been significantly improved. In order to pursue the reliability of server heat dissipation, in addition to conventional designs such as air duct design, fan performance improvement, and radiator performance improvement, diversification and flexible guides for server configuration Windshield design is especially important.

In today's server heat dissipation design, the design of the air guide cover is usually relatively simple, which makes the server very reluctant to support various configurations. Windshield is the trend of future heat dissipation design.

Based on this, the present invention provides a method for designing an air guide cover for board card heat dissipation.

Contents of the invention

The technical task of the present invention is to provide a highly practical design method for the air guide cover aimed at heat dissipation of the board in view of the above deficiencies.

A method for designing a windshield for board card heat dissipation, its specific implementation process is: inside the server, a windshield is installed downstream of the cooling fan and upstream of the CPU, and a detachable part is set on the windshield so that part of the fan The blowing wind can blow over the CPU and blow downstream of the CPU.

The wind guide cover is arranged on the top of the CPU radiator and is composed of two horizontal plates and a vertical plate, wherein one horizontal plate is relatively parallel to the motherboard for installing the CPU and is arranged on the upper side of the cooling fan and the front side of the CPU radiator. A horizontal board is relatively parallel to the main board used for installing the CPU and is arranged on the top of the CPU radiator, and a vertical board is used to vertically connect the two horizontal boards. The above-mentioned detachable part is the vertical board.

When the above-mentioned vertical board is fixedly connected between the two horizontal boards, the air outlet of the cooling fan only passes through the CPU radiator, and the rest of the cooling channels are closed by the air guide cover.

When the above-mentioned vertical plate is disassembled, the air outlet part of the cooling fan passes through the CPU radiator, and the remaining part enters the motherboard downstream of the CPU radiator through the channel formed between the two horizontal panels, and the rear board on the motherboard is processed. Heat dissipation.

A method for designing an air guide cover for heat dissipation of boards according to the present invention has the following advantages:

According to the design method of the air guide cover for board card heat dissipation in the present invention, the designed air guide cover can effectively solve the overheating problem of the rear board card, increase the supportability of various board cards, and optimize heat dissipation; the reasonable distribution of air volume will reduce the The speed of the fan can be adjusted to reduce noise; it can realize the compatibility of heat dissipation under different configurations and heat dissipation requirements of the same server, and solve the problem of board card overheating and CPU performance compatibility. It has strong practicability and is easy to promote.

Description of drawings

Accompanying drawing 1 is the realization schematic diagram of the present invention.

The marks in the accompanying drawings indicate respectively:

1. Cooling fan, 2. Horizontal board 1, 3. Vertical board, 4. Horizontal board 2, 5. Rear board, 6. Main board, 7. CPU radiator.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figure 1, the present invention provides a method for designing an air guide cover for board heat dissipation. This design focuses on the compatibility of server heat dissipation, analyzes the cause of overheating of the board card, and finds that the air intake of the board card is all coming. The CPU heatsink blows out the air, and the air intake temperature of the board is above 50degC. Therefore, the air guide cover is designed to be compatible with the overheating problem of the board. This design is perfectly compatible with the case that the same server cannot dissipate heat.

The marks in the accompanying drawings represent respectively: 1, cooling fan, 2, horizontal plate one, 3, vertical plate, 4, horizontal plate two, 5, rear board, 6, main board, 7, CPU radiator.

As servers begin to be widely used in the Internet and other markets, heat dissipation compatibility design is particularly important, which can not only optimize server heat dissipation performance, but also optimize server noise and design cost.

The specific implementation process is as follows: inside the server, a windshield is installed downstream of the cooling fan and upstream of the CPU, and a detachable part is arranged on the windshield so that the wind blown by part of the fan can cross the CPU and blow to the downstream of the CPU.

The wind deflector is arranged on the top of the CPU heat sink and is made up of two horizontal plates and a vertical plate, wherein a horizontal plate, that is, a horizontal plate, is relatively parallel to the mainboard for installing the CPU and is arranged on the upper side of the cooling fan, and the CPU heats away. On the front side of the cooler, another horizontal board, that is, the second horizontal board is relatively parallel to the main board used to install the CPU and is set on the top of the CPU radiator. The vertical board is used to vertically connect the two horizontal boards. The above-mentioned detachable part is the vertical board .

When the above-mentioned vertical board is fixedly connected between the two horizontal boards, the air outlet of the cooling fan only passes through the CPU radiator, and the rest of the cooling channels are closed by the air guide cover.

When the baffle is not removed, because the rear end of the opening is also blocked, the wind from the fan can only pass through the CPU radiator. At this time, it is suitable for supporting high-end CPU, or reducing the noise caused by excessive fan speed. obviously helps.

When the above-mentioned vertical plate is disassembled, the air outlet part of the cooling fan passes through the CPU radiator, and the remaining part enters the motherboard downstream of the CPU radiator through the channel formed between the two horizontal panels, and the rear board on the motherboard is processed. Heat dissipation.

Generally speaking, the overheating of the board is because the air intake of the board is the hot air passing through the CPU radiator, the temperature of the board itself is very high, and the board itself has a certain amount of heat, usually the temperature of the board is too high at this time, Through the above design, the air inlet temperature of the board is improved, and the temperature of the board will naturally drop more obviously.

Nowadays, the same server is usually designed with different configurations. When it is fully equipped, it has a rear board or a rear hard disk, but when it is low, it does not. At this time, the design of the present invention can be well compatible with this problem, which is of great help to the server’s heat dissipation. .

The specific implementation described above is only a specific case of the present invention. The patent protection scope of the present invention includes but is not limited to the specific implementation described above. Appropriate changes or substitutions made by any person of ordinary skill in the technical field shall fall within the patent protection scope of the present invention.

Claims (4)

1. the wind scooper method for designing for board heat radiation, it is characterized in that, it implements process: at server internal, windshield is installed in the downstream of radiator fan air-out, CPU upstream, windshield arranges removable section so that the wind energy that part fan blows enough is crossed CPU and blowed to CPU downstream.

A kind of wind scooper method for designing for board heat radiation the most according to claim 1, it is characterized in that, described wind scooper is arranged on cpu heat top and is made up of two horizontal plates, a perpendicular plate, wherein a horizontal plate is opposing parallel and be arranged on the upside of radiator fan, on front side of cpu heat with for installing the mainboard of CPU, another horizontal plate is opposing parallel and be arranged on cpu heat top with for installing the mainboard of CPU, perpendicular plate then connects two horizontal plates for vertical, and above-mentioned removable section is this perpendicular plate.

A kind of wind scooper method for designing for board heat radiation the most according to claim 2, it is characterized in that, when above-mentioned perpendicular plate is fixedly connected between two horizontal plates, the air-out of radiator fan is only from cpu heat process, and remaining heat dissipation channel is then closed by wind scooper.

A kind of wind scooper method for designing for board heat radiation the most according to claim 2, it is characterized in that, when above-mentioned perpendicular plate is taken apart, the air-outlet part of radiator fan passes through from cpu heat, remainder is then entered on the mainboard in cpu heat downstream by the passage formed between two horizontal plates, dispels the heat the rearmounted board on mainboard.