CN101916135B - Electronic device - Google Patents
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- Publication number
- CN101916135B CN101916135B CN 201010249191 CN201010249191A CN101916135B CN 101916135 B CN101916135 B CN 101916135B CN 201010249191 CN201010249191 CN 201010249191 CN 201010249191 A CN201010249191 A CN 201010249191A CN 101916135 B CN101916135 B CN 101916135B
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- fan
- heat
- electronic device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract 17
- 238000010438 heat treatment Methods 0.000 description 24
- 238000009423 ventilation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic device which comprises a first circuit board, a first radiator, a second circuit board, a second radiator, a covering piece and a fan. The first heat sink contacts the first circuit board, wherein the first heat sink includes a plurality of first fins, and the second circuit board and the plurality of first fins define at least one first heat dissipation channel. A second heat sink contacts the second circuit board, wherein the second heat sink includes a plurality of second fins. The covering piece covers the second radiator, wherein the covering piece and the plurality of second fins define at least one second radiating flow channel. The fan is arranged at the end parts of the first heat dissipation flow channel and the second heat dissipation flow channel and drives an air flow to pass through the first heat dissipation flow channel and the second heat dissipation flow channel so as to remove heat generated by the first circuit board and the second circuit board.
Description
Technical field
The present invention relates to a kind of electronic equipment, particularly relate to a kind of electronic equipment of tool heat sinking function.
Background technology
In existing inserted computer module, on motherboard and display card, be equipped with respectively centrifugal fan to remove the heat that element was produced of motherboard and display card.And, need want extra system fan, outer gas stream is introduced the inserted computer module to dispel the heat.
Yet itself cost of the centrifugal fan of existing inserted computer module is higher, and because number of fans is too much, power consumption is larger.
Summary of the invention
A kind of electronic equipment that the present invention namely provides for wish solves the problem of prior art, it comprises a first circuit board, one first heating radiator, a second circuit board, one second heating radiator, a covering and a fan.The first heating radiator contacts this first circuit board, and so that this first circuit board is dispelled the heat, wherein, this first heating radiator comprises a plurality of the first fins.Second circuit board is parallel to this first circuit board, and wherein, this second circuit board defines at least one the first radiating flow passage with these a plurality of first fins.The second heating radiator contacts this second circuit board, and so that this second circuit board is dispelled the heat, wherein, this second heating radiator comprises a plurality of the second fins.Covering is covered on this second heating radiator, and wherein, this covering defines at least one the second radiating flow passage with these a plurality of second fins.Fan is located at the end of this first radiating flow passage and this second radiating flow passage, and this fans drive one air-flow is through this first radiating flow passage and this second radiating flow passage, the heat that is produced to remove this first circuit board and this second circuit board.
In this embodiment, because the lower aerofoil fan of use cost replaces centrifugal fan, so cost is lower.And, can dispel the heat to the first heating radiator and the second heating radiator effectively simultaneously by single aerofoil fan, therefore two above centrifugal fans that are compared to prior art dispel the heat to different motherboards and display card respectively, can save the use of at least one fan.Therefore even can replace existing system fan in addition, because the present invention uses single tubeaxial fan to dispel the heat, this fan can be over against the ventilation mouth on the housing,, further saves the fan cost, and reduces power consumption.
Description of drawings
Fig. 1 is the exploded view of the electronic equipment of the demonstration embodiment of the invention; And
Fig. 2 is the complete structure after the electronic equipment of the demonstration embodiment of the invention is assembled.
The main element symbol description
10～air-flow
100～electronic equipment
110～first circuit board
120～the first heating radiators
121～the first fins
122～the first radiating flow passages
130～second circuit board
140～the second heating radiators
141～the second fins
142～the second radiating flow passages
150～covering
151～breach
160～fan
161～side
170～housing
171～the first ventilation mouths
172～the second ventilation mouths
Embodiment
With reference to Fig. 1, it comprises a first circuit board 110, one first heating radiator 120, a second circuit board 130, one second heating radiator 140, a covering 150 and a fan 160 for the electronic equipment 100 that shows the embodiment of the invention.
The first heating radiator 120 these first circuit boards 110 of contact, so that the integrated circuit on this first circuit board 110 is dispelled the heat, wherein, this first heating radiator 120 comprises a plurality of the first fins 121.The second heating radiator 140 these second circuit boards 130 of contact, so that the integrated circuit on this second circuit board 130 is dispelled the heat, wherein, this second heating radiator 140 comprises a plurality of the second fins 141.Second circuit board 130 is parallel to this first circuit board 110.
This second circuit board 130 and at least one the first radiating flow passage 122 of these a plurality of the first fin 121 definition.Covering 150 is covered on this second heating radiator 140, wherein, and this covering 150 and at least one the second radiating flow passage 142 of these a plurality of the second fin 141 definition.Fan 160 is located at the end of this first radiating flow passage 122 and this second radiating flow passage 142.The air port of fan 160 is over against the end of this first radiating flow passage 122 and this second radiating flow passage 142, this fan 160 drives an air-flow through this first radiating flow passage 122 and this second radiating flow passage 142, the heat that is produced to remove this first circuit board 110 and this second circuit board 130 thus.
With reference to Fig. 2, the complete structure after its electronic equipment 100 for the demonstration embodiment of the invention is assembled.Electronic equipment 100 more comprises a housing 170, and wherein, this first circuit board 110, this first heating radiator 120, this second circuit board 130, this second heating radiator 140, this covering 150 and this fan 160 are located in this housing 170.This housing comprises one first ventilation mouth 171 and one second ventilation mouth 172.171 pairs of this first ventilation mouths should fan 160, this air-flow 10 enters this housing 170 from this first ventilation mouth 171, flow through simultaneously this first radiating flow passage 121 and this second radiating flow passage 141, and leave this housing 170 from this second ventilation mouth 172, heat is taken away this housing 170.
In this embodiment, this fan 160 is aerofoil fan, and this first circuit board 110 is motherboard, and this second circuit board 130 is display card.But the side of these fan 160 butts or contiguous this first circuit board 110 and this second circuit board 130, fan 160 and butt or be adjacent to the end of this first radiating flow passage 122 and this second radiating flow passage 142.Collocation is with reference to Fig. 1, Fig. 2, and this covering 150 is a fan housing, hides a side 161 of this fan 160.This covering 150 also has breach 151, and the air port of breach 151 corresponding fans 160 is to avoid affecting fan 160 steering currents.
In this embodiment, because the lower aerofoil fan of use cost replaces centrifugal fan, so cost is lower.And, can dispel the heat to the first heating radiator and the second heating radiator effectively simultaneously by single aerofoil fan, therefore two above centrifugal fans compared to prior art dispel the heat to different motherboards and display card respectively, can save the use of at least one fan.Therefore even can replace existing system fan in addition, because the present invention uses single tubeaxial fan to dispel the heat, this fan can be over against the ventilation mouth on the housing,, further saves the fan cost, and reduces power consumption.
In the above-described embodiments, the material of covering 150 can be metal, plastic cement or other materials, and its major function is definition the second radiating flow passage 142.
In the above-described embodiments, the external form of the first heating radiator 120 and the second heating radiator 140 is rectangular haply, the first fin 121 and the second fin 141 are tabular, and the first radiating flow passage 122 and the second radiating flow passage 142 extend along parallel direction, but above-mentioned exposure does not limit the present invention.
Though in the above-described embodiments, system fan omitted, but above-mentioned exposure does not limit the present invention, in a variation, can optionally select to set up system fan yet.
In the above-described embodiments, airflow direction can be opposite, also can provide radiating effect, and above-mentioned exposure does not limit the present invention.
Although disclosed the present invention in conjunction with above concrete preferred embodiment; yet it is not to limit the present invention; anyly be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010249191 CN101916135B (en) | 2010-08-06 | 2010-08-06 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010249191 CN101916135B (en) | 2010-08-06 | 2010-08-06 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101916135A CN101916135A (en) | 2010-12-15 |
| CN101916135B true CN101916135B (en) | 2013-04-10 |
Family
ID=43323661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010249191 Active CN101916135B (en) | 2010-08-06 | 2010-08-06 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101916135B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9348377B2 (en) * | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
| CN109716512B (en) * | 2016-09-21 | 2021-08-03 | 华为技术有限公司 | Heat radiator |
| WO2020000189A1 (en) * | 2018-06-26 | 2020-01-02 | 深圳市大疆创新科技有限公司 | Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly |
| CN113508571A (en) * | 2020-10-13 | 2021-10-15 | 深圳市大疆创新科技有限公司 | Heat radiation structure, camera and unmanned vehicles |
| US12262514B2 (en) | 2021-04-08 | 2025-03-25 | International Business Machines Corporation | Heat sinks with beyond-board fins |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101464715A (en) * | 2007-12-18 | 2009-06-24 | 联想（新加坡）私人有限公司 | Computer with improved cooling features |
| CN101587286A (en) * | 2008-05-20 | 2009-11-25 | 三星电子株式会社 | Image projecting apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI261494B (en) * | 2005-03-28 | 2006-09-01 | Via Tech Inc | Heat dissipater module and electronic device having the same |
-
2010
- 2010-08-06 CN CN 201010249191 patent/CN101916135B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101464715A (en) * | 2007-12-18 | 2009-06-24 | 联想（新加坡）私人有限公司 | Computer with improved cooling features |
| CN101587286A (en) * | 2008-05-20 | 2009-11-25 | 三星电子株式会社 | Image projecting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101916135A (en) | 2010-12-15 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |