CN101141863B - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101141863B CN101141863B CN200610062520A CN200610062520A CN101141863B CN 101141863 B CN101141863 B CN 101141863B CN 200610062520 A CN200610062520 A CN 200610062520A CN 200610062520 A CN200610062520 A CN 200610062520A CN 101141863 B CN101141863 B CN 101141863B
- Authority
- CN
- China
- Prior art keywords
- copper
- heat abstractor
- pedestal
- base plate
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a heat radiating device, which comprises a copper bottom plate, a base seat matched with the bottom plate, a heat radiating fin group and a sensor, the base seat comprises a copper connecting piece and a protective part, the sensor is thermally touched with the connecting piece and held in a protection space formed by the connecting piece and the protective part, the connecting piece is penetrated in the base seat and touched with the copper bottom plate. The base seat of the heat radiating device comprises a bottom plate and a base seat, only the bottom plate and the connecting piece of the base seat adopt the copper material, the thermal connection of the sensor and the copper material, and the welding of the heat pipe not only are realized, the purpose of reducing the cost of the copper material being used in the single heat radiating device also is reached.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic component.
Background technology
Along with the fast development of computer industry, the serviceability of electronic components such as central processing unit improves constantly, and its caloric value is also increasing, and heat radiation becomes the problem that these heat-generating electronic elements must will solve when using.Current, the solution that industry is generally taked is heat abstractor to be installed dispel the heat on electronic component.
Heat abstractor commonly used comprises a metal base plate and the some radiating fins that extend from this base plate.This base plate adheres on heat-generating electronic elements and absorbs the heat that this electronic component produces, so with heat transferred to radiating fin and be dispersed into surrounding space.Yet development along with electronic industry; the running frequency and the function of electronic component promote day by day, and its caloric value also increases thereupon, for satisfying the radiating requirements of this electronic component; above-mentioned heat abstractor can install a fan additional usually so that forced draft to be provided, thereby improves the heat-sinking capability of heat abstractor.Simultaneously,, can also on this heat abstractor, install one and vary with temperature and export the temperature control sensor of varying voltage signal, come rotation speed of the fan is controlled for energy-conservation and prolong life-span of fan.In actual applications, this type of transducer need contact with copper material and could guarantee its service behaviour.Connecting transducer has two kinds of methods usually, and the one, directly transducer is connected on the copper base plate, but transducer can expose in the base plate outside, run into bigger collision vibrations easily and break away from measured piece, fail safe is not high; Another kind is that transducer is embedded in the copper base plate fully, but like this volume of base plate will have greatly increased, and its weight also increases relatively, has not only raised the cost but also can increase the heavy burden of electronic component.
Summary of the invention
The present invention aims to provide a kind of safe in utilization and cheaply with the heat abstractor of temperature control sensor.
A kind of heat abstractor; comprise a copper base plate, a pedestal that cooperates with base plate, a groups of fins and a transducer; described pedestal comprises a copper connector and a guard member; described transducer and connector thermo-contact and be contained in connector and guard space that guard member forms in, described connector is set in the pedestal and with copper base plate and contacts.
This execution mode compared with prior art has following advantage: the base of this heat abstractor comprises base plate and pedestal, only there is the connector of base plate and pedestal to adopt copper product, both realized the hot link of transducer and copper product and the welding of heat pipe, reach again reduced copper product in single heat abstractor use and the purpose that reduces cost.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of heat abstractor of the present invention.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is the enlarged drawing of base plate among Fig. 2.
Fig. 4 is the enlarged drawing of pedestal among Fig. 2.
Fig. 5 is the enlarged drawing of another angle of pedestal among Fig. 2.
Fig. 6 is the constitutional diagram of base plate, pedestal, heat pipe and transducer among Fig. 2.
Embodiment
See also Fig. 1 and Fig. 2, the heat abstractor of a preferred embodiment of the present invention comprises base (not label), a bracing frame 30, a groups of fins 40, two heat pipes 50 and a temperature control sensor 100 of being made up of a base plate 10 and a pedestal 20.This base plate 10 is positioned at below the pedestal 20, is used for contacting to absorb the heat of its generation with electronic component (figure does not show).This bracing frame 30 is fixed on the pedestal 20, to carry groups of fins 40 and groups of fins 40 and pedestal 20 are separated.This heat pipe 50 is L-shaped, and the one end is folded between base plate 10 and the pedestal 20, and the other end upwards passes bracing frame 30 and groups of fins 40 successively.This transducer 100 is embedded in the pedestal 20.
This base plate 10 can be made by copper material, roughly is square, and its area is slightly larger than the top surface area of electronic component.As shown in Figure 3, these base plate 10 tops are concaved with two semi-circular recesses 11, and this two groove 11 is used for cooperating to come ccontaining heat pipe 50 with pedestal 20, and this two groove 11 is parallel with a pair of edge of base plate 10, side by side in the middle of base plate 10.This two groove 11 all is formed with the prominent chimb 110 that is in base plate 10 upper surfaces with base plate 10 upper surface junctions and junction each other.
As Fig. 4 and shown in Figure 5, this pedestal 20 comprises a body 21 and is installed on an a connection piece 27 and a guard member 28 on the body 21.The rectangle plate body that this body 21 is made for price metal materials low than copper such as aluminium, a fixed leg 22 is extended in its four corner respectively vertically downward, be provided with perforation 220 in the middle of this fixed leg 22, this perforation 220 is fixed to this heat abstractor on the circuit board (figure does not show) for screw rod spare 200 (please referring to Fig. 2) wears.The central part of this body 21 is offered a rectangle and is lacked portion 23, and this scarce portion 23 outwards is recessed to form arc-shaped depression portion (not label) respectively at place, one group diagonal angle, with the sweep of ccontaining L shaped heat pipe 50.This middle part that lacks portion 23 is striden and is provided with two crossbeams of being separated by 24 and 25, this crossbeam 24 and 25 lower surface form respectively two near semi-circular recesses 240 and 250, these grooves 240 and 250 and the junction of the lower surface of body 21 cave inward and form a stage portion 210, junction between these grooves 240 and 250 flushes with this stage portion 210, to cooperate, make base plate 10 transversely obtain spacing at body 21 with the chimb 110 of base plate 10.The upper surface middle part position of crossbeam 25 is formed with a V-shaped groove 252, is used for passing for the holding wire (not label) of transducer 100.Form an accommodation space 26 of ccontaining connector 27 between this crossbeam 24 and 25.The two ends of contiguous this accommodation space 26 in body 21 bottoms are concaved with a joint portion 260 that cooperates with connector 27 respectively.The lower surface of this body 21 is positioned at and lacks the portion 23 both sides projection two spacing raised line 212 of being separated by respectively, the short side direction of all parallel body 21 of this four raised line 212, and the distance 212 that is positioned at two raised lines 212 that lack portion 23 the same sides is just in time corresponding with base plate 10 length of sides, thereby vertically the base plate 10 that just in time is placed in the middle of their is being played position-limiting action.
This connector 27 is made by copper material, and its lower surface is parallel to offer respectively the semi-circular recesses 270 that is connected with 250 with groove 240.The upper surface middle part of this connector 27 offers a V-shaped groove 272, and this V-shaped groove 272 is connected with the V-shaped groove 252 of crossbeam 25, in order to ccontaining transducer 100.The upper recess at these connector 27 two ends forms a stepped shoulder 274, and this shoulder 274 cooperates with the joint portion 260 of body 20 and 260 lower surfaces in the joint portion that are sticked.Connector 27 is on being installed to body 21 time, and accommodation space 26 is passed and the upper surface of outstanding body 21 in its upper end, to cooperate with guard member 28.
This guard member 28 is than the low rectangle lid that waits the metal heat-conducting material to make of copper by prices such as aluminium; its lower surface is arranged with a square groove 280; be used for cooperating and form space ccontaining and protection transducer 100 with the V-shaped groove 272 of connector 27; one side of these square groove 280 openings is offered a breach 282, and the holding wire of being convenient to transducer 100 is derived.
As shown in Figure 2, this bracing frame 30 is stamped to form by a sheet metal, being a rectangle platform shape substantially. this bracing frame 30 has a main body 31, these main body 31 relative both sides bending vertically downward respectively extend to form a sidewall 33, this two side 33 is bent to parallel with main body respectively in opposite directions, extend to form two fixing feet 35 more vertically downward in two ends, these fixing feet 35 ends bend inwards and extend carrier 350. this carriers 350 parallel with main body 31 and by modes such as welding or stickups bracing frame 30 is fixed on the pedestal 20. and this main body 31 respectively offers a manhole 36 near two relative edge's edge vertical with two side 33, wearing in order to heating tube 50. through hole 36 peripheries are formed with flanging 360, the contact area of increase and heat pipe 50. this bracing frame 30 is installed between groups of fins 40 and the pedestal 20, groups of fins 40 there is the supplemental support effect, also is convenient to the secondary loading and unloading of transducer 100 simultaneously.
This groups of fins 40 comprises the some fin 41 that are parallel to pedestal 20 and bracing frame 30 and space arrangement.Each fin 41 is provided with the through hole 43 corresponding with the through hole 36 of bracing frame 30 near its two relative edges edge places, and these through hole 43 peripheries also are formed with flanging 430, these flangings 430 are arranged in a time-out at all fin 41, form the circular pipe of ccontaining heat pipe 50 with the flanging 360 of bracing frame 30 through holes 36.The relative two edges of another of this fin 41 have been bent to form flanging 45 respectively in the same way, and this flanging 45 also is bent to form the junction surface (not label) that these fin 41 are linked together in opposite directions.
This two heat pipe 50 is the L shaped body of specification unanimity, comprises that one is clipped in horizontal segment 52 and between base plate 10 and the pedestal 20 and is set in ducted vertical section 54 that bracing frame 30 through holes 36 and all fin 41 through holes 43 form.
See also Fig. 6, when assembling this heat abstractor, earlier with in the bottom-up accommodation space 26 that is placed in the middle of pedestal 20 bodies 21 of connector 27, make two grooves 270 and body 21 on the connector crossbeam 24 and 25 two grooves 240 and 250 be connected to form two passages of placing heat pipe 50 horizontal segments 52, the shoulder 272 of connector 27 is matched with the joint portion 260 of body 21.Then make 50 horizontal segments 52 dislocation of two heat pipes and lean on, its vertical section 54 is passed the diagonal angle recess that pedestal 20 lacks portions 23 respectively, its horizontal segment 52 be placed on crossbeam 24 and 25 and the groove 240,250 of connector 26 and 270 passages that form in, the sweep of this heat pipe 50 just in time is placed in the recess at the portion of lacking 23 diagonal angles.And then base plate 10 is placed on pedestal 20 bodies 21 bottoms, makes the groove 11 of base plate 10 aim at the horizontal segment 52 of corresponding heat pipe 50, and make base plate 10 in the position that pedestal 20 bodies 21 lower surface raised lines 212 are limited.Two grooves 240 of two grooves 11 of this base plate 10 and the crossbeam 24 of two grooves 270 on the connector 27 and connector 27 both sides and 25 and 250 cooperate the storage tank of the horizontal segment 52 that forms corresponding ccontaining two heat pipes 50.This base plate 10 can be fixed in body 21 lower surfaces with the mode of welding.Then, transducer 100 is placed on the V-shaped groove 274 of connector 27, the holding wire of transducer 100 is derived by the V-shaped groove of crossbeam 25, on connector 27, cover guard member 28 again.At last, bracing frame 30 and groups of fins 40 are placed on the pedestal 20 successively, make vertical section 54 correspondence of two heat pipes 50 pass the through hole 36 and 43 of bracing frame 30 and fin 41, thereby finish the assembling of this heat abstractor.
From as seen above-mentioned, the base of this heat abstractor comprises base plate disconnected from each other 10 and pedestal 20, only there is the connector 27 of base plate 10 and pedestal 20 to adopt copper material, both realized the hot link of transducer and copper material, reach again reduced copper product in the single heat abstractor use and the purpose that reduces cost.
Claims (12)
1. heat abstractor; comprise a copper base plate, a pedestal that cooperates with copper base plate, a groups of fins and a transducer; it is characterized in that: described pedestal comprises a copper connector and a guard member; described transducer and copper connector thermo-contact and be contained in copper connector and guard space that guard member forms in, described copper connector is set in the pedestal and with copper base plate and contacts.
2. heat abstractor as claimed in claim 1 is characterized in that: described pedestal has a body, and copper connector is embedded among this body.
3. heat abstractor as claimed in claim 2 is characterized in that: also comprise the heat pipe that connects copper base plate and groups of fins.
4. heat abstractor as claimed in claim 3 is characterized in that: described body middle part is provided with the scarce portion that a heating tube places and strides two crossbeams of being located in this scarce portion of being separated by, and described copper connector is ccontaining to be fixed between two crossbeams.
5. heat abstractor as claimed in claim 4 is characterized in that: described copper plate upper surface is formed with groove, and the lower surface of described copper connector and two crossbeams all is formed with groove, the common passage that forms ccontaining heat pipe of these grooves.
6. heat abstractor as claimed in claim 5 is characterized in that: top, described copper connector two ends respectively is arranged with a shoulder, and described base body correspondence is provided with the joint portion that cooperates the location with this shoulder.
7. heat abstractor as claimed in claim 5, it is characterized in that: the groove of described copper plate upper surface and copper plate upper surface junction are formed with the prominent chimb that is in copper plate upper surface, and described base body lower surface and this chimb contact position are formed with the stage portion that cooperates with this chimb and copper base plate is located in vertical this groove direction.
8. heat abstractor as claimed in claim 2 is characterized in that: outstanding base body surface, described copper connector upper end, and offer the V-shaped groove of placing transducer on its end face.
9. heat abstractor as claimed in claim 8 is characterized in that: the bottom surface of described guard member is arranged with a square groove and establishes breach in a side bottom.
10. heat abstractor as claimed in claim 8 is characterized in that: the upper surface of one of them of described two crossbeams offers the V-shaped groove that is connected with copper connector V-shaped groove.
11. heat abstractor as claimed in claim 3 is characterized in that: also comprise a bracing frame of being located on the pedestal, described groups of fins is carried on this bracing frame and with pedestal and separates.
12. heat abstractor as claimed in claim 11 is characterized in that: the both sides that support frame as described above is adjacent are extended with the fixing feet that is connected with pedestal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610062520A CN101141863B (en) | 2006-09-08 | 2006-09-08 | Heat radiating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610062520A CN101141863B (en) | 2006-09-08 | 2006-09-08 | Heat radiating device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101141863A CN101141863A (en) | 2008-03-12 |
CN101141863B true CN101141863B (en) | 2010-05-12 |
Family
ID=39193519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610062520A Expired - Fee Related CN101141863B (en) | 2006-09-08 | 2006-09-08 | Heat radiating device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101141863B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104047936A (en) * | 2014-06-13 | 2014-09-17 | 苏州柏德纳科技有限公司 | Connecting piece |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2304150Y (en) * | 1997-06-20 | 1999-01-13 | 刘震宇 | Smart computer microprocessor cooling device |
CN2319852Y (en) * | 1997-10-15 | 1999-05-19 | 林振义 | CPU thermal sensing device |
US6459586B1 (en) * | 2000-08-15 | 2002-10-01 | Galaxy Power, Inc. | Single board power supply with thermal conductors |
US6477047B1 (en) * | 2000-11-30 | 2002-11-05 | Advanced Micro Devices, Inc. | Temperature sensor mounting for accurate measurement and durability |
-
2006
- 2006-09-08 CN CN200610062520A patent/CN101141863B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2304150Y (en) * | 1997-06-20 | 1999-01-13 | 刘震宇 | Smart computer microprocessor cooling device |
CN2319852Y (en) * | 1997-10-15 | 1999-05-19 | 林振义 | CPU thermal sensing device |
US6459586B1 (en) * | 2000-08-15 | 2002-10-01 | Galaxy Power, Inc. | Single board power supply with thermal conductors |
US6477047B1 (en) * | 2000-11-30 | 2002-11-05 | Advanced Micro Devices, Inc. | Temperature sensor mounting for accurate measurement and durability |
Also Published As
Publication number | Publication date |
---|---|
CN101141863A (en) | 2008-03-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101853823B (en) | Heat sink and manufacturing method thereof | |
US20090168356A1 (en) | Memory module assembly with heat dissipation device | |
CN101166408A (en) | Heat radiation module | |
CN102421273B (en) | Heat abstractor and use the electronic installation of this heat abstractor | |
CN102111985A (en) | Heat-dissipating device | |
US20090159252A1 (en) | Heat sink having bumps for positioning heat pipes therein | |
US8496047B2 (en) | Heat dissipating apparatus extended laterally from heat pipe | |
CN101212884A (en) | Heat radiator | |
US20110094711A1 (en) | Heat dissipation device with heat pipe | |
CN201230438Y (en) | Combination of heat radiating device | |
US20120267078A1 (en) | Heat dissipation mechanism | |
CN101466244B (en) | Radiator | |
CN201199769Y (en) | Heat radiator | |
CN101141863B (en) | Heat radiating device | |
CN104604351B (en) | Air cooled electronic equipment and the device for cooling down electronic unit | |
CN101854792A (en) | Cooling device | |
CN201039636Y (en) | Radiator | |
CN101312634A (en) | Heat radiating device | |
CN205693973U (en) | A kind of pcb board assembly | |
CN101115368A (en) | Heat radiating device | |
CN205946467U (en) | Heat abstractor and electronic product of fin, PCB subassembly | |
CN102681634A (en) | Radiator | |
CN101539792B (en) | Heat dissipating device | |
CN101420834B (en) | Heat Radiation device | |
CN201194463Y (en) | heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20140908 |
|
EXPY | Termination of patent right or utility model |