CN205946467U - Heat abstractor and electronic product of fin, PCB subassembly - Google Patents
Heat abstractor and electronic product of fin, PCB subassembly Download PDFInfo
- Publication number
- CN205946467U CN205946467U CN201620694970.0U CN201620694970U CN205946467U CN 205946467 U CN205946467 U CN 205946467U CN 201620694970 U CN201620694970 U CN 201620694970U CN 205946467 U CN205946467 U CN 205946467U
- Authority
- CN
- China
- Prior art keywords
- fin
- radiating fin
- chip
- sheet noumenon
- straight section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract 5
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is suitable for a heat dissipation field of electronic product provides a heat abstractor and electronic product of fin, PCB subassembly, and the heat abstractor of PCB subassembly includes the PCB board and install the chip on the PCB board, the chip is not pasted through the series thermal silica layer with the one side of PCB board contact has the fin, a plurality of heat radiation fins on the fin includes the sheet noumenon and is located the sheet noumenon, and the sheet noumenon and the chip adhesion of fin, heat radiation fins has the curved surface, and heat radiation fins is bent towards the sheet noumenon side bend of fin, and a plurality of heat radiation fins's crooked direction is the same, and has even interval between a plurality of heat radiation fins. This kind of design simple structure, it is nimble, simple to operate to extremely be fit for restricting the PCB subassembly of fin height because of the shell, not only guaranteed radiating effect but also greatly reduced manufacturing cost.
Description
Technical field
The utility model is related to heat abstractor, especially relates to a kind of fin, the heat abstractor of PCB assembly and electronics and produces
Product.
Background technology
Change-over circuit ability with power circuit constantly increases, and power consumption increases therewith, meeting during various electronic chip work
Produce substantial amounts of heat, if radiating not in time, chip overheating can be caused, the therefore higher chip of heat dissipation capacity is general all
Can be using to heat abstractor.
Mostly now widely used heat abstractor is that brass or bronze make tabular, sheet, splintery using by aluminium alloy
Fin.General fin will apply last layer heat conductive silica gel in electronic component with radiating rib contact surface in use so that unit
The heat of device effectively conducts on a heat sink.But existing fin is in order to ensure its radiating effect, in general all
It is that multigroup radiating thin slice is set using row on cooling base, and the thin slice that radiates all has firmly vertical, and its number is more, processing
Complex process, and highly larger, and in actual installation environment, lead to, especially with aluminium, the PCB assembly that shell to be installed,
If the relatively low heat production of PCB module dissipation need not consider heat dissipation problem more at least, if but the higher particularly CPU of PCB module dissipation
The high heat production of chip power-consumption is high, and at this moment we are necessary for considering the heat dissipation problem of this high power consumption chip otherwise temperature is too high necessarily will
Performance of impact chip etc..And the constructional device of current fin is not appropriate for becoming the PCB group that aluminium leads to shell installation
The heat abstractor of part.
So being directed to above-mentioned problem, our present urgent problems are how to provide a kind of structure simple,
Flexibility ratio is high, may be mounted on the chip of the high power consumption of PCB assembly with the logical shell of aluminium, and the high radiating of radiating efficiency
Device.
Utility model content
For above-mentioned defect, the purpose of this utility model be to provide a kind of fin, the heat abstractor of PCB assembly and
Electronic product, this heat radiating fin structure is simple, and flexibility ratio is high, may be mounted at the high power consumption of PCB assembly with the logical shell of aluminium
On chip, and radiating efficiency is high.
To achieve these goals, the utility model provides a kind of heat abstractor of PCB assembly, including pcb board and peace
It is loaded on the chip on described pcb board, the one side that described chip is not contacted with described pcb board is pasted with radiating by heat conduction silicone
Piece, described fin includes sheet noumenon and the resilient radiating fin of multiple tools being located on described sheet noumenon, described
The sheet noumenon of fin is pasted with described chip, and described radiating fin has curved surface, and described radiating fin dissipates towards described
The sheet noumenon lateral bend of backing, the bending direction of the plurality of radiating fin is identical, and has between the plurality of radiating fin
There is uniform interval.
According to heat abstractor of the present utility model, described radiating fin include the straight section being connected with described sheet noumenon and
The curved sections being connected with described straight section.
According to heat abstractor of the present utility model, described straight section is had angle with described sheet noumenon shape, and described straight section
The direction tilting is identical with the direction that described curved sections bend.
The utility model also provides a kind of fin, and described fin includes sheet noumenon and is located at described sheet noumenon
On the resilient radiating fin of multiple tools, the sheet noumenon of described fin pasted with described chip, described radiating fin tool
There is curved surface, and described radiating fin is towards the sheet noumenon lateral bend of described fin, the bending side of the plurality of radiating fin
To identical, and there is between the plurality of radiating fin uniform interval.
According to fin of the present utility model, described radiating fin include the straight section being connected with described sheet noumenon and with
The curved sections that described straight section connects.
According to fin of the present utility model, described straight section is had angle with described sheet noumenon shape, and described straight section inclines
The direction that oblique direction is bent with described curved sections is identical.
The utility model also provides a kind of electronic product, including pcb board and be installed on chip on described pcb board, institute
State the one side that chip do not contacted with described pcb board and be pasted with by heat conduction silicone and there is the resilient radiating fin of multiple tool,
Described radiating fin is located at the end face away from described chip for the described fin, and the plurality of radiating fin and described electronic product
Shell contact, the sheet noumenon of described fin pasted with described chip, and described radiating fin has curved surface, and described radiating
, towards the sheet noumenon lateral bend of described fin, the bending direction of the plurality of radiating fin is identical and the plurality of for fin
There is between radiating fin uniform interval.
According to electronic product of the present utility model, described radiating fin include the straight section being connected with described sheet noumenon and
The curved sections being connected with described straight section.
According to electronic product of the present utility model, described straight section is had angle with described sheet noumenon shape, and described straight section
The direction tilting is identical with the direction that described curved sections bend.
According to electronic product of the present utility model, the shell of described electronic product leads to shell for aluminium.
Fin of the present utility model includes sheet noumenon and the multiple radiating fins being located on described sheet noumenon,
When installation has the PCB assembly of this fin, smear heat conductive silica gel between chip and fin, both ensure that chip and radiating
The heat dispersion of piece plays the effect of fixing cooling fins again；Due to the elastic effect of radiating fin, when mounted can be by pressure
The radiating fin height of contracting fin, reduction height completes PCB and is installed into electronic product casing, then by the radiating of fin
Heat is distributed by the contact with shell for the fin.This design structure is simple, flexibly, easy for installation, and extremely suitable this
Plant the PCB assembly limiting fin height because of shell, not only ensure that radiating effect but also substantially reduced production cost.
Brief description
In order to be illustrated more clearly that the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or in description of the prior art required practical accompanying drawing simply introduce it should be apparent that, drawings discussed below is only this reality
With new embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also root
Obtain other accompanying drawings according to the accompanying drawing providing.
Fig. 1 is a kind of side sectional view of the heat abstractor of PCB assembly that the utility model embodiment is provided；
Fig. 2 is a kind of top view of the heat abstractor of PCB assembly that the utility model embodiment is provided；
Fig. 3 is a kind of side view of the fin of heat abstractor of PCB assembly that the utility model embodiment is provided；
Fig. 4 is that the utility model embodiment is provided a kind of a kind of fin of the fin of heat abstractor of PCB assembly
Top view；
Fig. 5 is that a kind of heat abstractor of PCB assembly that the utility model embodiment is provided is installed on the peace of electronic product
Dress schematic diagram one；
Fig. 6 is that a kind of heat abstractor of PCB assembly that the utility model embodiment is provided is installed on the peace of electronic product
Dress schematic diagram two；
Fig. 7 is that a kind of heat abstractor of PCB assembly that the utility model embodiment is provided is installed on the peace of electronic product
Dress schematic diagram three.
Specific embodiment
Core of the present utility model is to provide a kind of fin, the heat abstractor of PCB assembly and electronic product, this radiating
Piece and construction for heat radiating device are simple, and flexibility ratio is high, may be mounted at the little space of high density, and radiating efficiency is high.
For making purpose, technical scheme and advantage that the utility model is implemented clearer, below in conjunction with the utility model
Accompanying drawing in embodiment, is clearly and completely described it is clear that described to the technical scheme in the utility model embodiment
Embodiment be a part of embodiment of the utility model, rather than whole embodiment.Based on the embodiment in the utility model,
The every other embodiment that those of ordinary skill in the art are obtained under the premise of not making creative work, broadly falls into this practicality
Novel protected scope.
Refer to Fig. 1 and Fig. 2, Fig. 1 and Fig. 2 is a kind of dissipating of PCB assembly that the utility model embodiment is provided
The constitutional diagram one of thermal and constitutional diagram two, this heat abstractor includes:Pcb board 1, chip 2, heat conduction silicone 3 and fin
4.The one side that chip 2 is not contacted with pcb board 1 pastes fin 4 by heat conduction silicone 3, and with reference to Fig. 3, fin 4 includes sheet
Body 42 and the resilient radiating fin of multiple tools 41, the sheet noumenon 42 of fin 4 and the core that are located on sheet noumenon 42
Piece is pasted.That is, smearing heat conductive silica gel 3 between chip 2 on pcb board 1 and fin 4, fin 4 pass through radiating fin 41 with
The thermal conductive shell of electronic product contacts.
At most, the stability of chip 2 directly determines the performance function of pcb board 1 to the heat that chip 2 on pcb board 1 produces
Our required levels whether can be kept.The method that chip 2 is welded by scolding tin is so that chip 2 and PCB 1 complete electrically
Connect and be mechanically connected.
Heat conduction silicone 3 is arranged on the chip surface 2 of pcb board 1 by way of smearing covering, can pass through thermal conductive silicon
Heat on chip 2 is carried out conduction by glue-line 3 derives, and the another side of heat conductive silica gel 3 is contacted with fin 4, thus heat conduction
The heat transfer of silica gel 3 to fin 4, plays through above-mentioned steps heat conduction silicone 3 and both ensure that dissipating of chip 2 and fin 4
Hot property plays the effect that fin 4 is fixed on chip 2 upper surface again.
Refer to Fig. 3 and Fig. 4, Fig. 3 is a kind of side view of fin that the utility model embodiment is provided；Fig. 4
It is a kind of top view of fin that the utility model embodiment is provided.The size choosing of chip 2 size radiating as needed
(size of fin etc. can be according to the size of chip for the size selecting fin 4 and radiating fin 41 quantity that needs punching press
And change), the end face of fin 4 no radiating fin 41 is contacted with the chip 2 on pcb board 1 by heat conductive silica gel 3 and fixing,
When pcb board 1 loads shell, the end face that fin 4 has radiating fin 41 can shrink height because radiating fin 41 has elasticity
Degree, so that pcb board 1 loads electronic product casing, and the radiating fin 41 of fin 4 is contacted with shell so that dissipating
Heat on backing 4 is derived by shell.
Fin 4, using having resilient heat sink material, is molded with required heat radiating fin structure by integrated punching.
As shown in figure 3, radiating fin 41 has curved surface, and radiating fin 41 is towards sheet noumenon 42 lateral bending of fin
Song, so that radiating fin 41 has elasticity.Meanwhile, radiating fin 41 include the straight section 411 that is connected with sheet noumenon 42 with
And the curved sections 412 being connected with straight section 411.Straight section 411 is had angle with sheet noumenon 42 shape, and the direction that straight section 411 tilts
Identical with the direction of curved sections 412 bending.Typically smaller than 90 degree of the angle that straight section 411 is formed with sheet noumenon 42, as shown in Figure 3
Situation；Certainly the angle that this straight section 411 also can be formed with sheet noumenon 42 is equal to 90 degree.
As shown in figure 4, the bending direction of multiple radiating fins 41 identical so that the pcb board 1 with fin 4 is loaded
During electronic product casing, it is easily installed.There is uniform interval simultaneously it is ensured that the heat of fin 4 between multiple radiating fins 41
Amount can uniformly derive.
Refer to Fig. 5 to Fig. 7, Fig. 5 to Fig. 7 is a kind of radiating dress of PCB assembly that the utility model embodiment is provided
Put the scheme of installation one, two and three being installed on electronic product.
Electronic product has thermal conductive shell 5, and thermal conductive shell 5 is made from a material that be thermally conductive, and pcb board 1 is arranged in thermal conductive shell 5
Portion, the radiating fin 41 of fin 4 is contacted with thermal conductive shell 5, thermal conductive shell 5 play protection pcb board 1 structure function and
Derive the effect of heat on fin 4.
When PCB assembly is fit into thermal conductive shell 5, less, the matching accordingly thermal conductive shell of this PCB assembly
5 also small volume height not high, generally aluminium leads to shell, if general radiator fin device is all to have vertically on cooling base
Thin slice, this vertical thin slice cannot bend, and height is higher, and pcb board 1 at this moment just cannot be fit into thermal conductive shell at all.
And the fin 4 of this utility model has elasticity, after fin 4 is arranged on chip 2 by heat conduction silicone 3, work as pcb board
1 when starting to be fit into thermal conductive shell, and shell is pressed onto radiating fin 41 along side, because radiating fin 4 has elasticity, by radiating
The effect of the contraction height of the radiating fin 41 of piece 4 is so that PCB assembly 1 is fit into thermal conductive shell 5.When PCB assembly 1 is complete
When entering thermal conductive shell 5, the radiating fin 41 of fin 4 completely completely attaches to so that radiating with jack-up and with thermal conductive shell 5
Heat on piece 4 is distributed by thermal conductive shell 5.
In sum, fin of the present utility model include sheet noumenon and be located at described sheet noumenon on multiple dissipate
Hot fin, when installing the PCB assembly with this fin, smears heat conductive silica gel between chip and fin, both ensure that
The heat dispersion of chip and fin plays the effect of fixing cooling fins again；Due to the elastic effect of radiating fin, when mounted
Can be by compressing the radiating fin height of fin, reduction height completes PCB and is installed into electronic product casing, then passes through to dissipate
Heat is distributed by the radiating fin of backing with the contact of shell.This design structure is simple, flexibly, easy for installation, and
The extremely suitable this PCB assembly limiting fin height because of shell, not only ensure that radiating effect but also had substantially reduced production
Cost.
Certainly, the utility model also can have other various embodiments, spiritual and its substantive without departing substantially from the utility model
In the case of, those of ordinary skill in the art work as and can make various corresponding changes and deformation according to the utility model, but these
Corresponding change and deformation all should belong to the scope of the claims appended by the utility model.
Claims (10)
1. a kind of heat abstractor of PCB assembly, including pcb board and be installed on chip on described pcb board it is characterised in that
The one side that described chip is not contacted with described pcb board is pasted with fin by heat conduction silicone, and described fin includes sheet
Body and be located at described sheet noumenon on the resilient radiating fin of multiple tools, the sheet noumenon of described fin with described
Chip is pasted, and described radiating fin has curved surface, and described radiating fin is towards the sheet noumenon lateral bend of described fin, institute
The bending direction stating multiple radiating fins is identical, and has uniform interval between the plurality of radiating fin.
2. heat abstractor according to claim 1 is it is characterised in that described radiating fin is included with described sheet noumenon even
The straight section connecing and the curved sections being connected with described straight section.
3. heat abstractor according to claim 2 is it is characterised in that described straight section and described sheet noumenon form a folder
Angle, and the direction that described straight section tilts is identical with the direction that described curved sections bend.
4. a kind of fin, in heat abstractor, this heat abstractor also includes pcb board and chip it is characterised in that described dissipate
Backing includes sheet noumenon and the resilient radiating fin of multiple tools being located on described sheet noumenon, the piece of described fin
Shape body is pasted with described chip, and described radiating fin has curved surface, and described radiating fin is towards the sheet of described fin
Body lateral bend, the bending direction of the plurality of radiating fin is identical, and have between the plurality of radiating fin uniform between
Every.
5. fin according to claim 4 is it is characterised in that described radiating fin includes being connected with described sheet noumenon
Straight section and the curved sections being connected with described straight section.
6. fin according to claim 5 is it is characterised in that described straight section is had angle with described sheet noumenon shape,
And direction that described straight section tilts is identical with the direction that described curved sections bend.
7. a kind of electronic product, including pcb board and be installed on chip on described pcb board it is characterised in that described chip not
The one side being contacted with described pcb board is pasted with by heat conduction silicone has the resilient radiating fin of multiple tool, described radiating
Fin is located at the end face away from described chip for the described fin, and the plurality of radiating fin is connect with the shell of described electronic product
Touch, the sheet noumenon of described fin is pasted with described chip, and described radiating fin has curved surface, and described radiating fin direction
The sheet noumenon lateral bend of described fin, the bending direction of the plurality of radiating fin is identical, and the plurality of radiating fin
Between there is uniform interval.
8. electronic product according to claim 7 is it is characterised in that described radiating fin is included with described sheet noumenon even
The straight section connecing and the curved sections being connected with described straight section.
9. electronic product according to claim 8 is it is characterised in that described straight section and described sheet noumenon form a folder
Angle, and the direction that described straight section tilts is identical with the direction that described curved sections bend.
10. electronic product according to claim 7 is it is characterised in that the shell of described electronic product leads to shell for aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620694970.0U CN205946467U (en) | 2016-07-01 | 2016-07-01 | Heat abstractor and electronic product of fin, PCB subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620694970.0U CN205946467U (en) | 2016-07-01 | 2016-07-01 | Heat abstractor and electronic product of fin, PCB subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205946467U true CN205946467U (en) | 2017-02-08 |
Family
ID=57931466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620694970.0U Expired - Fee Related CN205946467U (en) | 2016-07-01 | 2016-07-01 | Heat abstractor and electronic product of fin, PCB subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205946467U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN113097162A (en) * | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
| CN114080138A (en) * | 2020-08-14 | 2022-02-22 | 邢娟 | Heat radiation structure convenient to equipment is compatible good simultaneously |
-
2016
- 2016-07-01 CN CN201620694970.0U patent/CN205946467U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097162A (en) * | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
| CN108521753A (en) * | 2018-07-13 | 2018-09-11 | 安徽皖通邮电股份有限公司 | A kind of conductive structure for realizing high-efficiency heat conduction function |
| CN114080138A (en) * | 2020-08-14 | 2022-02-22 | 邢娟 | Heat radiation structure convenient to equipment is compatible good simultaneously |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170208 |