CN101420834B

CN101420834B - Heat Radiation device

Info

Publication number: CN101420834B
Application number: CN2007101241700A
Authority: CN
Inventors: 刘鹏
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-10-26
Filing date: 2007-10-26
Publication date: 2012-03-21
Anticipated expiration: 2027-10-26
Also published as: CN101420834A

Abstract

The invention relates to a heat abstractor used for radiating heat generated by an electronic device; the heat abstractor comprises a base, a radiating fin group and a first and a second heat tubes; wherein, the bottom of the base is contacted with the electronic device; the first and the second heat tubes are connected with the base and the radiating fin group and are provided with a heat absorption section jointed with the base and a heat radiating section far from the heat absorption section; the radiating fin group comprises a first and a second radiating fin groups which are arranged in parallel; the first and the second radiating fin groups are respectively provided with a first and a second joint surfaces which are not in the same plane, the first and the second joint surfaces of the first radiating fin group are correspondingly connected with the first and the second joint surfaces of the second radiating fin group; the first and the second radiating fin groups are respectively provided with a plurality of grooves for containing the heat radiating sections of the heat tubes correspondingly to the heat radiating sections of the first and the second heat tubes on the first and the second joint surfaces.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic element radiating.

Background technology

Along with the constantly development of electronic information industry, electronic component (particularly central processing unit) running frequency and speed are in continuous lifting.But the heat that high-frequency high-speed will make electronic component produce increases thereupon, makes its temperature constantly raise, and the performance when the electronic component operation in serious threat for guaranteeing the normal operation of electronic component ability, must in time be discharged a large amount of heats that electronic component produced.

For this reason, the normally used heat abstractor of industry generally comprises a base and is located at the some radiating fins on the base, and this base end face is level and smooth entity metal, supplies to be sticked to distribute in the heat absorption of central processing unit surface and around reaching radiating fin.And along with the central processing unit volume is more and more littler; Its heating is also more concentrated, and because of being confined to the heat transfer property of metal, the heat at center place can not expand to the entire heat dissipation device fast; Especially on the radiating fin away from base part far away, heat abstractor can't obtain to break through shape and promote.And heat pipe obtains in the heat radiation field to use in a large number widely because of its preferable heat-conductive characteristic in recent years, and heat pipe becomes the preferred assembly of high-end radiator.

Summary of the invention

The present invention aims to provide the high heat-pipe radiating apparatus of a kind of radiating efficiency.

A kind of heat abstractor is used to distribute the heat that an electronic component produces, and it comprises that a bottom is with this electronic component substrate contacted, a radiating fin group and be connected said pedestal and first, second heat pipe of radiating fin group; Said first, second heat pipe all has the endotherm section that combines with pedestal and reaches the heat release section away from this endotherm section, and said radiating fin group comprises first, second radiating fin group side by side; Said first, second radiating fin group all has not first, second composition surface at grade, and corresponding first, second composition surface with the said second radiating fin group, first, second composition surface of the said first radiating fin group mutually combines; The heat release section of said first, second radiating fin group corresponding first, second heat pipe on first, second composition surface separately is provided with some grooves and the heat release section of ccontaining heat pipe.

Compared with prior art; Because first, second composition surface that first, second radiating fin combines with the heat release section of first, second heat pipe is not at grade; Make the heat release section of first, second heat pipe can be distributed in the different parts of radiating fin group; Homogeneouslly-radiating better improves the radiating efficiency of entire heat dissipation device.And, because and the mode that heat abstractor is established the heat release section of first, second heat pipe through first, second radiating fin group folder has replaced directly on fin, inserting the mode of heat pipe, make the easy to assembly of fin and heat pipe, reduced the manufacturing cost of entire heat dissipation device.

Combine embodiment that the present invention is done further description with reference to the accompanying drawings.

Description of drawings

Fig. 1 is the assembly drawing of heat abstractor of the present invention.

Fig. 2 is the sketch map of another angle of Fig. 1 heat abstractor.

Fig. 3 is the three-dimensional exploded view of Fig. 2 heat abstractor.

Fig. 4 is the part assembly drawing of Fig. 3 heat abstractor.

Fig. 5 is Fig. 3 heat abstractor inversion figure.

Embodiment

See also Fig. 1 and Fig. 2, heat abstractor of the present invention is used to be installed in electronic component (figure does not show) and upward it is dispelled the heat.This heat abstractor comprises that a pedestal 10, places the heating panel 20, on the pedestal 10 to place the radiating fin group, of heating panel 20 to connect first heat pipe 50 and second heat pipe 60 of pedestal 10, heating panel 20 and radiating fin group.Wherein this radiating fin group comprises the intermeshing first radiating fin group 30 and the second radiating fin group 40.

See also Fig. 3 and Fig. 4, said pedestal 10 is a rectangular heat conductivility good metal plate body, like copper coin, aluminium sheet etc.The lower surface of this pedestal 10 (figure mark) is in order to contact with electronic component, and the upper surface of pedestal 10 is provided with four parallel side by side grooves 120, to accommodate

combination heat pipe

50,60.

Heating panel 20 is a rectangular heat conductivility good metal plate body, have a upper surface (figure is a mark) and one and upper surface opposing lower surface 22 with the upper surface 12 of applying pedestal 10.Groove 120, the 220 common four-ways of forming of substrate 10, heating panel 20 are to accommodate heat pipe 50,60.Be appreciated that ground, in other embodiments, can by one be provided with accepting hole substrate replace substrate 10, heating panel 20 in the present embodiment.

The first radiating fin group 30 by some first radiating fins 32 perpendicular to heating panel 20 and combine side by side.Each first radiating fin 32 is processed by the unitary piece of metal sheet and roughly is the setting of " recessed " font.The first radiating fin group 30 comprises the body that contacts with heating panel 20 36 and the vertically extending shoulder 38 that makes progress from body 36 both sides.Body 36 crown centers have first composition surface 360, and shoulder 38 tops have second composition surface 380, and second composition surface 380 and first composition surface 360 be not at same horizontal plane and be higher than first composition surface 360 and be provided with.The first radiating fin group 30 is respectively equipped with two parallel grooves 366,388 in first, second composition surface 360,380.Some flangings (figure mark) are from bottom, sidepiece and the groove 366,388 of the first radiating fin group 30 vertical extent in the same way, with the distance that these radiating fins 32 are identical at interval.

The second radiating fin group 40 is fixed on the complementation that is meshing with each other on the first radiating fin group 30 and with it.The second radiating fin group 40 is made up of some second radiating fins 42.Each second radiating fin 42 is processed by the unitary piece of metal sheet and roughly is the setting of inverted " protruding " font.The second radiating fin group 40 comprises a body 46 and the lug boss 48 that extends downward vertically from body 46 middle parts.Lug boss 48 bottoms have

first composition surface

480, and 46 liang of side bottoms of body have second composition surface 460, and second composition surface 460 and first composition surface 480 be not at same horizontal plane and be higher than first composition surface 480.The second radiating fin group 40 is respectively equipped with two parallel grooves 488,466 in first, second composition surface 480,460.Some flangings (figure mark) are from the sidepiece of the second radiating fin group 40 and groove 466,488 vertical extent in the same way, with the distance that these radiating fins 32 are identical at interval.

First heat pipe 50 is bent to form continuously and is parallel to each other and two endotherm sections 51 of horizontal coplane, two parallel co-planar and away from the heat release section 53 of pedestal 10.Said two endotherm sections 51 each other near and two heat release section 53 are separated by a distance.First heat pipe 50 also comprises two linkage sections 56,57.Linkage section 56 connects an endotherm section 51 and a heat release section 53, and linkage section 57 connects another endotherm section 51 and another heat release section 53.Linkage section 56 is in an acute angle each other with linkage section 57.Another linkage section 58 interconnects two heat release section 53, makes the setting that takes the shape of the letter U of the part away from pedestal 10 of the heat pipe 50 of winning.

The structure of second heat pipe 60 and first heat pipe 50 is roughly the same.Second heat pipe 60 be bent to form continuously be parallel to each other and near two endotherm sections 61, and two heat release section 63 separated by a distance.Heat release section 63 is higher than endotherm section 61 and away from pedestal 10.Two endotherm sections 61 and two heat release section 63 interconnect through the

linkage section

66,67 of two inclinations.This linkage section 66 is in an acute angle each other with linkage section 67.Another linkage section 68 interconnects two heat release section 63, makes the setting that takes the shape of the letter U of the part away from pedestal 10 of second heat pipe 60.These endotherm sections 61 are folded in the endotherm section 51 of first heat pipe 50 wherein, and heat release section 63 is higher than that the heat release section 53 of first heat pipe 50 is provided with and away from pedestal 10.The distance of the heat release section 63 of second heat pipe 60 is greater than the distance of the heat release section 53 of first heat pipe 50.

See also Fig. 4-5, during assembling, pedestal 10 welds together with heating panel 20 and the

endotherm section

51,61 of first,

second heat pipe

50,60 is folded in therebetween.The first radiating fin group 30 is placed in the end face of heating panel 20, and the second radiating fin group 40 is placed on the radiating fin group 30.The lug boss 48 of the second radiating fin group 40 is placed between the shoulder 38 of the first radiating fin group 30.First composition surface 360,480 of first, second radiating

fin group

30,40 is meshing with each other, and second composition surface 380,460 is meshing with each other.The heat release section 53 of first heat pipe 50 is located in first composition surface 360, between 480 and be contained in the passage that groove 366,488 formed.The heat release section 63 of second heat pipe 60 is located in second composition surface 380, between 460 and be contained in the passage that groove 388,466 formed.

During electronic component work, the heat transferred of its generation is to pedestal 10, and one of which part heat is directly conducted to the radiating fin group through heat-conducting plate 20; Another part heat is absorbed by the endotherm section 51 of first heat pipe 50, is passed to the heat release section 53 that is positioned at radiating fin group mid portion through its

linkage section

56,57, reaches the radiating fin group again; The last part heat is absorbed by the endotherm section 61 of second heat pipe 60, is passed to through its

linkage section

66,67 to be positioned at the heat release section 63 of radiating fin away from the part of pedestal 10, reaches the radiating fin group again.Therefore the heat that produces of electronic component can conduct to the bottom, middle part of radiating fin group and fast away from the position, top of pedestal 10, around last radiating fin group is dispersed into heat.

In the present embodiment, because first,

second heat pipe

50,60 is the one brake forming, be equivalent to the heat conduction function of the heat pipe of four U types.Therefore this heat abstractor has only adopted two heat pipes just to reach the effect of four heat pipes, effectively reduces the cost of entire heat dissipation device.And the mode that heat abstractor presss from both sides the

heat release section

53,63 of establishing first,

second heat pipe

50,60 up and down through first, second radiating

fin group

30,40 has replaced the directly mode of slotting heat pipe on fin, makes the easy to assembly of fin and heat pipe.And; First composition surface 360,480 of first, second radiating

fin group

30,40, the position of second composition surface, 380,460 relative pedestals 10 can be adjusted; Make the

heat release section

53,63 of first,

second heat pipe

50,60 more reasonable, be evenly distributed on the radiating fin group, to improve the radiating efficiency of entire heat dissipation device.Be appreciated that ground, in other embodiments, can be set to " protruding " font, and can be set to be inverted " recessed " font structure away from the second radiating fin group simultaneously near the first radiating fin group of pedestal.

Claims

1. heat abstractor; Be used to distribute the heat that an electronic component produces; It comprises that a bottom is with this electronic component substrate contacted, a radiating fin group and be connected said pedestal and first, second heat pipe of radiating fin group; It is characterized in that: said first, second heat pipe all has the endotherm section that combines with pedestal and reaches the heat release section away from this endotherm section; Said radiating fin group comprises first, second radiating fin group side by side; Said first, second radiating fin group all has not first, second composition surface at grade; Corresponding first, second composition surface with the said second radiating fin group, first, second composition surface of the said first radiating fin group mutually combines, and the heat release section of said first, second radiating fin group corresponding first, second heat pipe on first, second composition surface separately is provided with some grooves and the heat release section of ccontaining heat pipe.

2. heat abstractor as claimed in claim 1 is characterized in that: the said first radiating fin group contacts with said pedestal, and the second radiating fin group places on the first radiating fin group and away from this pedestal.

3. heat abstractor as claimed in claim 2 is characterized in that: the complementation that is meshing with each other of said first, second radiating fin group.

4. heat abstractor as claimed in claim 3 is characterized in that: the said first radiating fin group is the setting of " protruding " font, and the second radiating fin group is the setting of " recessed " font.

5. heat abstractor as claimed in claim 3 is characterized in that: the said first radiating fin group is the setting of " recessed " font, and the second radiating fin group is the setting of " protruding " font.

6. heat abstractor as claimed in claim 1 is characterized in that: the heat release section of said first heat pipe is two mutual parallel heat release section, and the heat release section of said second heat pipe is two mutual parallel heat release section.

7. heat abstractor as claimed in claim 6 is characterized in that: the distance between two heat release section of said second heat pipe is greater than the distance between two heat release section of first heat pipe.

8. heat abstractor as claimed in claim 6 is characterized in that: said first heat pipe comprises that also one connects the linkage section of two heat release section, the setting that takes the shape of the letter U jointly of this linkage section and two heat release section.

9. heat abstractor as claimed in claim 6 is characterized in that: said second heat pipe comprises that also one connects the linkage section of two heat release section, the setting that takes the shape of the letter U jointly of this linkage section and two heat release section.

10. heat abstractor as claimed in claim 6 is characterized in that: the endotherm section of said first heat pipe is two mutual parallel endotherm sections, and two linkage sections at an angle to each other connect the heat release section of the endotherm section and first heat pipe of these first heat pipes respectively.