CN101137007A - Camera module and assembling method thereof - Google Patents

Abstract

The invention provides a camera module and an assembling method thereof. The camera module comprises a soft and hard composite board, a sensing chip and sealing glue. The soft and hard composite board comprises signal contacts and the sensing chip comprises conductive bumps for connecting with the signal contacts. Wherein the sealant is formed at the joint of the conductive bump and the signal contact.

Description

Camera module and assembly method thereof

technical field

The invention provides a camera module and its assembly method, especially a camera module and its assembly method which can be applied to portable electronic devices such as mobile phones and PDAs for capturing images.

Background technique

1A to 1C show the assembly process of a conventional camera module 1 .

First referring to FIG. 1A, a rigid-flex composite board 11 and a sensing chip 12 are provided, wherein the rigid-flex composite board 11 is composed of a first rigid circuit board 111, a second rigid circuit board 112, and a first rigid circuit board 111 and a second rigid circuit board 112. The flexible circuit board 113 is formed between the two rigid circuit boards 112 , and a through opening 114 is formed on the rigid-flex circuit board 11 . In addition, signal contacts 111A are formed on the first rigid circuit board 111 . The sensing chip 12 has a sensing area 121 and a pad 122 located on the periphery of the sensing area, and a conductive bump 13 structure is formed on the pad 122 for when the soft-hard composite board 11 and the sensing chip 12 are pressed together. , can help the electrical connection between the signal contact 111A and the pad 122 .

1B, the signal contact 111A of the first rigid circuit board 111 is combined with the conductive bump 13 of the sensing chip 12 by pressing the flexible and rigid composite board 11 and the sensing chip 12, so that the sensing chip 12 It is electrically connected with the first rigid circuit board 111 .

1C, in order to prevent water vapor and dust from penetrating into the sensor chip 12, a sealant 14 will be filled on the periphery of the sensor chip 12 in the final step to isolate the path of water vapor and dust from entering the sensor chip 12. .

A detailed description of the known technology shown in FIG. 1 can be found in Taiwan Patent No. 543925. The known camera module 1 shown in FIG. 1 needs to fill the periphery of the sensing chip 12 with sealant in order to prevent water vapor and dust from entering the sensing chip 12. Therefore, it is inevitable to reserve a filling seal on the flexible and hard composite board 11. The space W1 of the glue 14 , as shown in FIG. 1C , thus increases the width W of the rigid-flex composite board 11 , resulting in the inability to reduce the size of the entire camera module 1 .

Contents of the invention

The object of the present invention is to provide a camera module, by forming a sealant for blocking external dust between the signal contacts on the soft and hard composite board of the camera module and the pads of the sensing chip, so as to achieve the purpose of reducing the size of the camera module .

The invention provides a camera module, comprising:

The rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board arranged between the first rigid circuit board and the second rigid circuit board, and the rigid-flex composite board forms There are through openings, and signal contacts are formed on the first rigid circuit board;

A sensing chip, including a conductive bump and a sensing area, wherein the sensing chip is arranged on the first rigid circuit board, and the conductive bump is connected to the signal contact; and

The sealant is formed at the junction of the conductive bump and the signal contact.

Preferably, the camera module further includes a lens assembly disposed on the second rigid circuit board, wherein the lens module includes a lens holder and a lens for focusing the light so that the light passes through the opening and then enters the sensing area.

The invention provides a camera module, comprising:

The rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board arranged between the first rigid circuit board and the second rigid circuit board, and the rigid-flex composite board forms There is a through opening, and a conductive bump is formed on the first rigid circuit board;

The sensing chip includes a pad and a sensing area, wherein the sensing chip is arranged on the first rigid circuit board, and the pad is connected with the conductive bump; and

The sealant is formed at the junction of the conductive bump and the pad.

Preferably, the camera module further includes a lens assembly disposed on the second rigid circuit board, wherein the lens assembly includes a lens holder and a lens for focusing the light so that the light passes through the opening and then enters the sensing area.

The invention provides a method for assembling a camera module, comprising:

A rigid-flex composite board is provided, wherein the rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board disposed between the first rigid circuit board and the second rigid circuit board, and the first A signal contact is formed on a hard circuit board;

A sensing chip is provided, and conductive bumps are formed on the sensing chip;

Covering the sealant around the signal contacts or conductive bumps; and

The sensing chip and the rigid-flex composite board are pressed together so that the conductive bumps and the signal contacts are connected together.

Preferably, the assembly method further includes fixing the lens assembly on the second rigid circuit board, wherein the lens assembly includes a lens mount and a lens.

The invention provides a method for assembling a camera module, comprising:

A rigid-flex composite board is provided, wherein the rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board disposed between the first rigid circuit board and the second rigid circuit board, and the first Conductive bumps are formed on a hard circuit board;

A sensing chip is provided, and pads are formed on the sensing chip;

Covering the sealant around the pads or conductive bumps; and

The sensing chip and the rigid-flex composite board are pressed together so that the pads and the conductive bumps are connected together. Preferably, the assembling method further includes fixing the lens assembly on the second rigid circuit board, wherein the lens assembly includes a lens mount and a lens.

Description of drawings

1A to 1C show the assembly steps of a known camera module;

2A to 2D show a schematic diagram of a preferred embodiment of the assembly steps of the camera module of the present invention;

3A to 3B show schematic diagrams of another preferred embodiment of the assembly steps of the camera module of the present invention;

4A to 4B show schematic diagrams of another preferred embodiment of the assembly steps of the camera module of the present invention; and

5A to 5B show schematic diagrams of yet another preferred embodiment of the assembly steps of the camera module of the present invention.

Wherein, the reference signs are explained as follows:

1, 2 camera module 11, 21 soft and hard composite board

111, 211 first hard circuit board 111A, 211A signal contacts

112, 212 second hard circuit board 113, 213 flexible circuit board

114, 214 openings 12, 22 sensing chips

121, 221 sensing area 122, 222 pad

13, 23 Conductive bumps 14, 24 Sealant

25 viscose 26 lens assembly

261 lens mount 262 lens

Detailed ways

2A to 2D show an embodiment of the camera module assembly method and the camera module formed according to the assembly method of the present invention.

Referring first to FIG. 2A, FIG. 2A shows a rigid-flex composite board 21 and a sensing chip 22, wherein the rigid-flex composite board 21 is composed of a first rigid circuit board 211, a second rigid circuit board 212, and a first rigid circuit board 211 and a second rigid circuit board 212. The flexible circuit board 213 between the second rigid circuit boards 212 is formed, and the rigid-flex circuit board 21 is formed with an opening 214 passing through the first rigid circuit board 211 , the flexible circuit board 213 and the second rigid circuit board 212 . In addition, a signal contact 211A is formed on the first rigid circuit board 211 . The sensing chip 22 has a sensing region 221 and a pad 222 , and a conductive bump 23 is formed on the pad 222 .

Referring to FIG. 2B and FIG. 2C in sequence, after covering the surrounding area of the signal contact 211A with the sealant 24, the sensing chip 22 and the rigid-flex composite board 21 are pressed together so that the conductive bump 23 and the signal contact 211A are connected together. Therefore, the sensing chip 22 is electrically connected to the first rigid circuit board 211 . It can be seen from the embodiment in FIG. 2 that the difference between the present invention and the known technology in FIG. 1 is that the present invention first covers the sealant 24 around the signal contact 211A, and then presses the sensing chip 22 and the rigid-flex composite board 21 to make the sealant 24 Finally, it is filled at the junction of the conductive bump 23 and the signal contact 211A to achieve the effect of sealing the sensing chip 22. Therefore, the rigid-flex composite board 21 of the camera module of the present invention can be reduced in size because no space for filling the sealant 24 is required. be reduced.

In addition, referring to FIG. 2D , the camera module 2 provided in this embodiment further includes a lens assembly 26 , which is disposed on the second rigid circuit board 212 through an adhesive 25 . The lens assembly 26 includes a lens holder 261 and a lens 262 for focusing the light so that the light enters the sensing region 221 of the sensing chip 22 after passing through the opening of the rigid-flex composite board 21 .

It should be noted that the method of forming the sealant between the signal contact of the rigid-flex board and the camera module is not limited to the steps shown in FIG. 2 , but there are other methods that can achieve the same purpose. For example, as shown in FIG. 3A and FIG. 3B, in the camera module assembly method provided by other specific embodiments of the present invention, the sealant 24 can also be covered around the conductive bump 23, and then the soft-hard composite board can be pressed together. 21 and the sensing chip 22 to form the structure of the camera module 2 as shown in FIG. 2C . The difference between the method in FIG. 3 and the method in FIG. 2 is that the method in FIG. 2 first forms the sealant 24 on the signal contact 211A of the rigid-flex composite board 21 , while the method in FIG. 3 first forms the sealant 24 on the conductive bump 23 around.

Of course, the method for assembling the camera module provided by the present invention is not limited to only being able to form the structure of the conductive bump 23 on the pad 222 of the sensing chip 22 . As shown in FIG. 4A and FIG. 4B , in the camera module assembly method provided by another embodiment of the present invention, a structure of a conductive bump 23 may also be formed on the signal contact 211A of the first rigid circuit board 211 , And the encapsulant 24 is covered around the conductive bump 23 ; and then the rigid-flex composite board 21 and the sensing chip 22 are pressed together to form the structure of the camera module 2 as shown in FIG. 2C .

To sum up, the camera module and its assembly method provided by the present invention are not the known method of first pressing and then filling the sealant, but the sealant 24 is formed on the soft-hard composite board 21 and the sensor chip 22. At the junction, since the rigid-flex composite board 21 does not need to reserve a space for carrying the sealant 24 , the size of the camera module 2 can be reduced.

The above-described embodiments are only to illustrate the technical ideas and characteristics of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and it cannot limit the scope of protection of the patent application for the present invention, that is, all The equivalent changes or modifications made according to the spirit disclosed in the present invention should still be covered within the protection scope of the patent application of the present invention.

Claims (10)

1. A camera module, comprising: The rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board arranged between the first rigid circuit board and the second rigid circuit board, wherein the flexible The rigid composite board has an opening through the first rigid circuit board, the flexible circuit board and the second rigid circuit board, and the first rigid circuit board has signal contacts; a sensing chip, including a conductive bump and a sensing area, wherein the sensing chip is arranged on the first rigid circuit board and connected to the signal contact through the conductive bump; and The sealant is formed at the junction of the conductive bump and the signal contact. 2. The camera module according to claim 1, wherein the camera module further comprises a lens assembly disposed on the second rigid circuit board, the lens module includes a lens mount and a lens for focusing the light so that the light can be Enter the sensing area after passing through the opening. 3. The camera module as claimed in claim 1, wherein the conductive bump is formed on a pad of the sensing chip. 4. A camera module, comprising: The rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board arranged between the first rigid circuit board and the second rigid circuit board, the rigid-flex circuit board An opening through the first rigid circuit board, the flexible circuit board and the second rigid circuit board is formed on the composite board, and a conductive bump is formed on the first rigid circuit board; a sensing chip, including a pad and a sensing area, wherein the sensing chip is disposed on the first rigid circuit board and connected to the conductive bump through the pad; and The sealant is formed on the junction of the conductive bump and the pad. 5. The camera module according to claim 4, wherein the camera module further comprises a lens assembly disposed on the second rigid circuit board, the lens assembly includes a lens mount and a lens for focusing the light so that the light can pass through The opening then enters the sensing area. 6. The camera module as claimed in claim 4, wherein the conductive bump is formed on a signal contact of the first rigid circuit board. 7. A method for assembling a camera module, comprising: A rigid-flex composite board is provided, wherein the rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board disposed between the first rigid circuit board and the second rigid circuit board , wherein the first rigid circuit board has signal contacts; providing a sensing chip, the sensing chip has conductive bumps; Covering the sealant around the signal contact or the conductive bump; and The sensing chip and the rigid-flex composite board are pressed together so that the conductive bump and the signal contact are connected together. 8 . The method for assembling a camera module according to claim 7 , further comprising fixing a lens assembly on the second rigid circuit board, wherein the lens assembly includes a lens holder and a lens. 9. A method for assembling a camera module, comprising: A rigid-flex composite board is provided, wherein the rigid-flex composite board includes a first rigid circuit board, a second rigid circuit board, and a flexible circuit board disposed between the first rigid circuit board and the second rigid circuit board , wherein the first rigid circuit board has conductive bumps; providing a sensing chip, the sensing chip has pads; Covering the sealant around the pad or the conductive bump; and The sensing chip and the rigid-flex composite board are pressed together so that the pad and the conductive bump are connected together. 10 . The method for assembling a camera module according to claim 9 , further comprising fixing a lens assembly on the second rigid circuit board, wherein the lens assembly includes a lens holder and a lens. 11 .

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