CN102214588A - Assembling method of camera module - Google Patents
Assembling method of camera module Download PDFInfo
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- CN102214588A CN102214588A CN2010101445409A CN201010144540A CN102214588A CN 102214588 A CN102214588 A CN 102214588A CN 2010101445409 A CN2010101445409 A CN 2010101445409A CN 201010144540 A CN201010144540 A CN 201010144540A CN 102214588 A CN102214588 A CN 102214588A
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- conducting block
- photographing module
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- sensing chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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Abstract
The invention relates to an assembling method of a camera module. The method includes: placing a first conductive block on the signal contact of a substrate and placing a second conductive block on the pad of a sensing chip; laminating the substrate and the sensing chip to combine the first conductive block and the second conductive block to connect the signal contact on the substrate and the pad on the sensing chip electrically; and then filling sealing compound between the substrate and the sensing chip. The method in the invention can improve the quality of the camera module through the interconnection of the two conductive blocks.
Description
Technical field
The present invention relates to the assemble method of photographing module, particularly relate to a kind of assemble method that can be applicable to the photographing module on mobile phone or the PDA portable electronic devices such as (Personal Digital Assistant, personal digital assistants).
Background technology
Existing photographing module is assembled to cover crystalline substance (Flip-Chip) encapsulation technology, at first the assembling flow path of the existing photographing module of explanation.See also Fig. 1, it is the assembling flow path figure of existing photographing module.The assemble method of existing photographing module comprises step S1: a soft-hard composite board is provided; Step S2: on a sensing chip, place a conductive projection (Conductive bump); Step S3: pressing soft-hard composite board and sensing chip and make conductive projection and signal contact interlink; Step S4: between soft-hard composite board and sensing chip, insert sealing.Carry out step S5 at last: utilize viscose that one camera lens module is fixed on the second rigid circuit board.
Each step of the assemble method of photographing module is as implied above, next sees also Fig. 2 to Fig. 5, and it is the assembling process schematic diagram of existing photographing module.As shown in Figure 2, soft-hard composite board 11 by one first rigid circuit board 111, one second rigid circuit board 112 and be arranged at the first rigid circuit board 111 and the second rigid circuit board 112 between a flexible circuit board 113 formed, formation has an opening 114 that runs through the first rigid circuit board 111, flexible circuit board 113 and the second rigid circuit board 112 on the soft-hard composite board 11, and the first rigid circuit board 111 has a signal contact 1111 (please refer to the step S1 among Fig. 1).Sensing chip 12 comprises a sensing unit 121 and a connection pad 122, and as described in the step S2, is placed with a conductive projection 13 on the connection pad 122, and generally speaking, the material of conductive projection 13 is a gold (Au).Fig. 3 shows that by the soft-hard composite board 11 of pressing and sensing chip 12, wherein conductive projection 13 interlinks with signal contact 1111.Fig. 4 shows soft-hard composite board 11 and the sensing chip 12 of inserting sealing 14.Fig. 5 shows and a camera lens module 16 to be fixed on the second rigid circuit board 112 and to form photographing module 1.
With Fig. 5 the function of each element in the photographing module 1 is described, the signal contact 1111 of soft-hard composite board 11 is set up by conductive projection 13 and with the connection pad 122 of sensing chip 12 and is electrically connected, and makes photographing module 1 be able to conducting and moves.The sealing 14 that is received in is in order to sealing soft-hard composite board 11 and sensing chip 12, damages photographing module 1 to avoid dust and aqueous vapor to enter in the photographing module 1.Camera lens module 16 comprises a camera lens 161 and a lens mount 162, and camera lens 161 in order to light penetration camera lens 161 when photographing module 1 is operated and opening 114, makes light be received to produce image by sensing unit 121 in alignment with opening 114 and sensing unit 121.
Existing photographing module 1 is made via above-mentioned assembling process, and the photographing module 1 that assembling is finished must be through reliability testing.The project of general reliability testing comprises: hot-fluid test, high-temperature test, high humility test, high/low-temperature impact test, flexible test, ultraviolet ray are tanned by the sun test, are resisted and fall shock-testing and focusing enforcement life test or the like automatically.In the process of aforementioned reliability testing, find existing photographing module 1 quite easily in the high/low-temperature impact test and anti-ly fall generation problem in the shock-testing, that is to say that the withstand shocks ability of power of existing photographing module 1 is lower.Therefore, need the more firm photographing module of a kind of structure, to promote the quality of photographing module.
Summary of the invention
The technical problem to be solved in the present invention is, at the prior art above shortcomings, provides a kind of assemble method of photographing module of the reliability that promotes photographing module.
The technical solution adopted for the present invention to solve the technical problems provides a kind of assemble method of photographing module, comprise: on substrate, place first conducting block respectively, on sensing chip, place second conducting block, wherein, this first conducting block is positioned on the signal contact of this substrate, and this second conducting block is positioned on the connection pad of this sensing chip; This substrate of pressing combines this first conducting block and this second conducting block with this sensing chip, and this signal contact and this connection pad are electrically connected; And, between this substrate and this sensing chip, insert sealing.
The assemble method of photographing module of the present invention comprises also a camera lens module is fixed on this substrate that wherein this camera lens module comprises lens mount and camera lens, and this alignment lens is in a sensing unit of this sensing chip.
This first conducting block and this second conducting block are for protruding piece, and the volume of this first conducting block is greater than the volume of this second conducting block, when this first conducting block combined with this second conducting block, this first conducting block was covered in this second conducting block to set up the electric connection between this first conducting block and this second conducting block.
This substrate is soft-hard composite board, copper clad laminate or ceramic substrate.
This soft-hard composite board comprise the first rigid circuit board, the second rigid circuit board and be arranged at this first rigid circuit board and this second rigid circuit board between flexible circuit board, and this signal contact is arranged on this first rigid circuit board.
This first conducting block protrudes piece for conduction, and this second conducting block is the conductive valley piece, when this first conducting block combined with this second conducting block, this first conducting block was inserted into the depressed part of this second conducting block to set up the electric connection between this first conducting block and this second conducting block.
The assemble method of photographing module of the present invention also comprises and utilizes one to plant bulb and produce a conduction embryo piece, controls this again and plants bulb and push this conduction embryo piece and detach this and plant bulb and form this conductive valley piece.
This first conducting block is the conductive valley piece, and this second conducting block protrudes piece for conduction, when this first conducting block combined with this second conducting block, this second conducting block was inserted into a depressed part of this first conducting block to set up the electric connection between this first conducting block and this second conducting block.
The assemble method of photographing module of the present invention also comprises and utilizes one to plant bulb and produce a conduction embryo piece, controls this again and plants bulb and push this conduction embryo piece and detach this and plant bulb and form this conductive valley piece.
The material of this first conducting block and this second conducting block is a gold.
The present invention places conducting block respectively on the connection pad of the signal contact of substrate and sensing chip, at substrate and sensing chip during by pressing, by the connection of two conducting blocks can strengthen between substrate and the sensing chip in conjunction with effect, thereby promote the steadiness of photographing module; Through reliability testing, compare with existing photographing module, assemble the photographing module of finishing by the inventive method and reach the anti-preferable test result of acquisition in the shock-testing of falling in the high/low-temperature impact test.
Description of drawings
Fig. 1 is the assembling flow path figure of existing photographing module.
Fig. 2 to Fig. 5 is the assembling process schematic diagram of existing photographing module.
Fig. 6 is the assembling flow path figure of assemble method first preferred embodiment of photographing module of the present invention.
Fig. 7 to Figure 10 is the assembling process schematic diagram of assemble method first preferred embodiment of photographing module of the present invention.
Figure 11 is the assembling flow path figure of assemble method second preferred embodiment of photographing module of the present invention.
Figure 12 to Figure 15 is the assembling process schematic diagram of assemble method second preferred embodiment of photographing module of the present invention.
Figure 16 to Figure 18 is the manufacture process schematic diagram of the conductive valley piece in assemble method second preferred embodiment of photographing module of the present invention.
Embodiment
The present invention proposes a kind of assemble method of the photographing module at link signal contact and connection pad, to solve the existing not impact-resistant shortcoming of photographing module.See also Fig. 6, it is the assembling flow path figure in assemble method first preferred embodiment of photographing module of the present invention.The assemble method of this photographing module comprises step S1 ': place one first conducting block (Bump) respectively on a substrate, place one second conducting block on a sensing chip; Wherein first conducting block is positioned on the signal contact of substrate, and second conducting block is positioned on the connection pad of sensing chip.Step S2 ': the pressing substrate combines first conducting block and second conducting block with sensing chip, make signal contact be electrically connected at connection pad.Step S3 ': between substrate and sensing chip, insert sealing.Step S4 ' a: camera lens module is fixed on the substrate.
Next see also Fig. 7 to Figure 10, it is the assembling process schematic diagram of assemble method first preferred embodiment of photographing module of the present invention.Substrate can adopt a soft-hard composite board, a copper clad laminate (FR4 Substrate) or a ceramic substrate (Ceramic Substrate).In this preferred embodiment, substrate 21 illustrates with soft-hard composite board.Among Fig. 7, soft-hard composite board (being substrate 21) comprise one first rigid circuit board 211, one second rigid circuit board 212 and be arranged at the first rigid circuit board and the second rigid circuit board between a flexible circuit board 213, and the first rigid circuit board 211 has a signal contact 2111.And soft-hard composite board 21 has an opening 214, and opening 214 runs through first rigid circuit board 211, second rigid circuit board 212 and the flexible circuit board 213.Be placed with one first conducting block 23 on the soft-hard composite board 21.On the other hand, sensing chip 22 comprises a sensing unit 221 and a connection pad 222, and be placed with one second conducting block 24 on the sensing chip 22, wherein first conducting block 23 is positioned on the signal contact 2111 of soft-hard composite board 21, and second conducting block 24 is positioned on the connection pad 222 of sensing chip 22 (step S1 ').By finding out among Fig. 7, first conducting block 23 is a conductive projection (Core bump), and second conducting block 24 also is a conductive projection, and the first conducting block volume is greater than the volume of second conducting block.In this preferred embodiment, the material of first conducting block 23 and second conducting block 24 is gold (Au).
Fig. 8 shows first conducting block 23 on the soft-hard composite board 21 in alignment with second conducting block 24 on the sensing chip 22, and through pressing step (step S2 ') and interconnected soft-hard composite board 21 and sensing chip 22.Because the volume of first conducting block 23 is greater than the volume of second conducting block 24, make the conducting block 23 of winning to cover whole second conducting block 24, help in the process of pressing soft-hard composite board 21 and sensing chip 22, to make second conducting block 24 to aim at first conducting block 23, combine conducting block 25 so that form one with the connection of second conducting block 24, therefore set up the electric connection of 222 of signal contact 2111 and connection pads by first conducting block 23.
Behind pressing soft-hard composite board 21 and the sensing chip 22, sealing 26 is inserted between soft-hard composite board 21 and the sensing chip 22 (step S3 '), as shown in Figure 9.Inserting sealing 26 is to damage photographing module 2 in order to prevent dust and aqueous vapor from entering.At last, a camera lens module 28 is fixed on the second rigid circuit board 212 to form photographing module 2 (step S4 '), camera lens module 28 comprises a lens mount 282 and a camera lens 281, and camera lens 281 is in alignment with the sensing unit 221 of sensing chip 22.In this preferred embodiment, fixed lens module 28 is to utilize viscose 27 that camera lens module 28 is fixed on the second rigid circuit board 212.Identical described in the structure of each element and function such as the prior art in the photographing module 2, and no longer add explanation.
Above-mentioned is the flow process of the assemble method of photographing module of the present invention, the inventive method is characterised in that and respectively is placed with a conducting block 23,24 respectively on substrate 21 and sensing chip 22, when pressing substrate 21 and sensing chip 22, make the conducting block 23,24 on the two elements interlink, thereby connect substrate 21 and sensing chip 22.In the connection procedure of substrate 21 and sensing chip 22, particularly the signal contact 2111 at substrate 21 is placed with first conducting block 23, and pressing substrate 21 is during with sensing chip 22, signal contact 2111 can be set up by first conducting block 23 and second conducting block 24 with being connected of 222 of connection pads, can strengthen being connected of signal contact 2111 and 222 of connection pads whereby, and further promote the bonding strength of 22 of substrate 21 and sensing chips.
The present invention also provides one second preferred embodiment, sees also Figure 11, and it is the assembling flow path figure in assemble method second preferred embodiment of photographing module of the present invention.In this preferred embodiment, first conducting block protrudes piece for conduction, and second conducting block is the conductive valley piece.The assemble method of photographing module comprises step S1
*: placing a conduction protrusion piece on the substrate and on a sensing chip, placing a conductive valley piece (Conductive cavity bump) respectively; Wherein conduction protrusion piece is positioned on the signal contact of substrate, and the conductive valley piece is positioned on the connection pad of sensing chip.Step S2
*: the pressing substrate combines conduction and protrudes piece and conductive valley piece with sensing chip, signal contact and connection pad are electrically connected.Step S3
*: between substrate and sensing chip, insert sealing.Step S4
*: a camera lens module is fixed on the substrate.
Next see also Figure 12 to Figure 15, it is the assembling process schematic diagram of assemble method second preferred embodiment of photographing module of the present invention.In this preferred embodiment, substrate 31 is that example illustrates with the copper clad laminate.Among Figure 12, the opening 312 that substrate 31 has a signal contact 311 and runs through substrate 31.Be placed with a conduction on the substrate 31 and protrude piece 33.On the other hand, sensing chip 32 comprises a sensing unit 321 and a connection pad 322, and be placed with a conductive valley piece 34 on the sensing chip 32, wherein conduction is protruded piece 33 and is positioned on the signal contact 311 of substrate 31, and conductive valley piece 34 is positioned at (step S1 on the connection pad 322 of sensing chip 32
*), and the material of conduction protrusion piece 33 and conductive valley piece 34 is gold (Au).
By finding out among Figure 12, conductive valley piece 34 has a depressed part 341, and conduction protrusion piece 33 is in alignment with depressed part 341, as pressing substrate 31 and sensing chip 32 (step S2
*) time, conduction is protruded piece 33 and is inserted into the depressed part 341 of conductive valley piece 34 and conduction protrusion piece 33 is combined with conductive valley piece 34, therefore form one in conjunction with conducting block 35, to set up the electric connection of 34 of conduction protrusion piece 33 and conductive valley pieces, as shown in figure 13.In the process of pressing substrate 31 and sensing chip 32, the depressed part 341 of conductive valley piece 34 provides a reference point of aiming at, and convenient aligning conduction is protruded piece 33 and conductive valley piece 34.
Behind pressing substrate 31 and the sensing chip 32, sealing 36 is inserted between substrate 31 and the sensing chip 32 (step S3 '), as shown in figure 14.Inserting sealing 36 is to damage photographing module 3 in order to prevent dust and aqueous vapor from entering.At last, a camera lens module 38 is fixed on the substrate 31 to form photographing module 3 (step S4 '), camera lens module 38 comprises a lens mount 382 and a camera lens 381, and camera lens 381 is in alignment with the sensing unit 321 of sensing chip 32.In this preferred embodiment, camera lens module 38 is to utilize viscose 37 to be fixed on the substrate 31.
In this preferred embodiment, before placing conductive valley piece 34, must produce conductive valley piece 34 in advance and just be carried out subsequent step.Next how explanation makes conductive valley piece 34, sees also Figure 16 to Figure 18, and it is the manufacture process schematic diagram of the conductive valley piece in assemble method second preferred embodiment of photographing module of the present invention.Among Figure 16, the bulb 4 of planting of ball attachment machine utilizes the processing procedure of making conductive projection to produce a conduction embryo piece 34 ', and the shape of conduction embryo piece 34 ' is identical with general conductive projection.Next control is planted bulb 4 and down push conduction embryo piece 34 ' and generation depressed part 341, as shown in figure 17.Control is at last planted that bulb 4 leaves depressed part 341 and is formed conductive valley piece 34, as shown in figure 18.
In addition, the present invention also provides one the 3rd preferred embodiment, and in this preferred embodiment, first conducting block is the conductive valley piece, and second conducting block protrudes piece for conduction.Its assemble method is identical haply with second preferred embodiment, difference only is, in the 3rd preferred embodiment, on a sensing chip, place a conduction and protrude piece, and on a substrate, place a conductive valley piece, the follow-up number of assembling steps and second preferred embodiment are identical, and repeat no more.
Because the present invention is placed with conducting block respectively on the connection pad of the signal contact of substrate and sensing chip, therefore at substrate and sensing chip during by pressing, can strengthen the effect that combines between substrate and the sensing chip by the connection of two conducting blocks, promote the steadiness of photographing module.Through reliability testing, compare with existing photographing module, assemble the photographing module finished by the inventive method in the high/low-temperature impact test and anti-ly fall the preferable test result of acquisition in the shock-testing.
The above is preferred embodiment of the present invention only, is not in order to limiting claim scope of the present invention, and therefore all other do not break away from the equivalence of being finished under the disclosed spirit and change or modify, and all should be contained in the scope of the present invention.
Claims (10)
1. the assemble method of a photographing module is characterized in that, comprising:
On substrate, place first conducting block respectively, on sensing chip, place second conducting block; Wherein, this first conducting block is positioned on the signal contact of this substrate, and this second conducting block is positioned on the connection pad of this sensing chip;
This substrate of pressing combines this first conducting block and this second conducting block with this sensing chip, and this signal contact and this connection pad are electrically connected; And
Between this substrate and this sensing chip, insert sealing.
2. the assemble method of photographing module as claimed in claim 1 is characterized in that: comprise also camera lens module is fixed on this substrate that wherein this camera lens module comprises lens mount and camera lens, and this alignment lens is in the sensing unit of this sensing chip.
3. the assemble method of photographing module as claimed in claim 1, it is characterized in that: this first conducting block and this second conducting block are for protruding piece, and the volume of this first conducting block is greater than the volume of this second conducting block, when this first conducting block combined with this second conducting block, this first conducting block was covered in this second conducting block to set up the electric connection between this first conducting block and this second conducting block.
4. the assemble method of photographing module as claimed in claim 1, it is characterized in that: this substrate is soft-hard composite board, copper clad laminate or ceramic substrate.
5. the assemble method of photographing module as claimed in claim 4, it is characterized in that: this soft-hard composite board comprise the first rigid circuit board, the second rigid circuit board and be arranged at this first rigid circuit board and this second rigid circuit board between flexible circuit board, and this signal contact is arranged on this first rigid circuit board.
6. the assemble method of photographing module as claimed in claim 1, it is characterized in that: this first conducting block protrudes piece for conduction, and this second conducting block is the conductive valley piece, when this first conducting block combined with this second conducting block, this first conducting block was inserted into the depressed part of this second conducting block to set up the electric connection between this first conducting block and this second conducting block.
7. the assemble method of photographing module as claimed in claim 6 is characterized in that: also comprise utilizing and plant bulb and produce conduction embryo piece, control this again and plant bulb and push this conduction embryo piece and detach this and plant bulb and form this conductive valley piece.
8. the assemble method of photographing module as claimed in claim 1, it is characterized in that: this first conducting block is the conductive valley piece, and this second conducting block protrudes piece for conduction, when this first conducting block combined with this second conducting block, this second conducting block was inserted into the depressed part of this first conducting block to set up the electric connection between this first conducting block and this second conducting block.
9. the assemble method of photographing module as claimed in claim 8 is characterized in that: also comprise utilizing and plant bulb and produce conduction embryo piece, control this again and plant bulb and push this conduction embryo piece and detach this and plant bulb and form this conductive valley piece.
10. the assemble method of photographing module as claimed in claim 1 is characterized in that: the material of this first conducting block and this second conducting block is gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101445409A CN102214588A (en) | 2010-04-09 | 2010-04-09 | Assembling method of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101445409A CN102214588A (en) | 2010-04-09 | 2010-04-09 | Assembling method of camera module |
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| Publication Number | Publication Date |
|---|---|
| CN102214588A true CN102214588A (en) | 2011-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101445409A Pending CN102214588A (en) | 2010-04-09 | 2010-04-09 | Assembling method of camera module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109428990A (en) * | 2017-09-05 | 2019-03-05 | 致伸科技股份有限公司 | Camera module and method for assembling camera module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127499A1 (en) * | 2002-01-07 | 2003-07-10 | International Business Machines Corporation | Low or no-force bump flattening structure and method |
| CN101137007A (en) * | 2006-09-01 | 2008-03-05 | 致伸科技股份有限公司 | Camera module and assembling method thereof |
| US20100025794A1 (en) * | 2008-07-31 | 2010-02-04 | Unimicron Technology Corp. | Image sensor chip package structure and method thereof |
-
2010
- 2010-04-09 CN CN2010101445409A patent/CN102214588A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127499A1 (en) * | 2002-01-07 | 2003-07-10 | International Business Machines Corporation | Low or no-force bump flattening structure and method |
| CN101137007A (en) * | 2006-09-01 | 2008-03-05 | 致伸科技股份有限公司 | Camera module and assembling method thereof |
| US20100025794A1 (en) * | 2008-07-31 | 2010-02-04 | Unimicron Technology Corp. | Image sensor chip package structure and method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109428990A (en) * | 2017-09-05 | 2019-03-05 | 致伸科技股份有限公司 | Camera module and method for assembling camera module |
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Application publication date: 20111012 |