CN107170769B - A packaging structure of an image sensing chip and a packaging method thereof - Google Patents

Abstract

The invention discloses a packaging structure of an image sensing chip and a packaging method thereof. The packaging structure includes an image sensing chip. The image sensing chip includes an opposite first surface and a second surface. The first surface It has a plurality of pixels for collecting image information and a plurality of first pads connected to the pixels; a substrate covering the first surface of the image sensing chip, the substrate having wiring lines and the The contact end of the wiring line connection; the wiring line is used to electrically connect with the external circuit; the periphery of the image sensing chip is bonded and fixed with the substrate through anisotropic conductive glue, and the first soldering pad is connected through the The anisotropic conductive glue is electrically connected to the contact terminal. In a direction perpendicular to the substrate, the anisotropic conductive glue surrounds all the pixel points and does not overlap with the pixel points. When packaging the image sensing chip, the technical solution of the present invention has a simple process and reduces the production cost.

Description

A packaging structure and packaging method of an image sensing chip

Technical field

The present invention relates to the technical field of image acquisition devices, and more specifically, to a packaging structure of an image sensing chip and a packaging method thereof.

Background technique

An image sensor chip is an electronic device that can sense external light and convert it into electrical signals. Image sensing chips usually use semiconductor manufacturing processes for chip manufacturing. After the image sensor chip is produced, a series of packaging processes are performed on the image sensor chip to form a packaged package structure, which can be used in various electronic devices such as digital cameras, digital video cameras, etc.

In the prior art, when the image sensor chip is packaged, the pads on the surface of the image sensor chip are welded to the pads of a substrate, and the image sensor chip and the substrate are sealed and fixed around the substrate through adhesive. .

From the above description, it can be seen that when packaging image sensing chips in the existing technology, it is necessary to weld and then bond and fix them with adhesive, which is a complicated process and high cost.

Contents of the invention

In order to solve the above problems, the present invention provides a packaging structure of an image sensor chip and a packaging method thereof. When packaging the image sensor chip, the process is simple and the production cost is reduced.

In order to achieve the above objects, the present invention provides the following technical solutions:

A packaging structure of an image sensing chip, the packaging structure includes:

An image sensor chip includes an opposite first surface and a second surface. The first surface has a plurality of pixels for collecting image information and a plurality of first pixels connected to the pixels. soldering pad;

A substrate covering the first surface of the image sensing chip, with wiring lines and contact terminals connected to the wiring lines provided on the substrate; the wiring lines are used for electrical connection with external circuits;

The periphery of the image sensing chip is bonded and fixed to the substrate through anisotropic conductive glue, and the first soldering pad is electrically connected to the contact terminal through the anisotropic conductive glue. In the direction of the substrate, the anisotropic conductive glue surrounds all the pixel points and does not overlap with the pixel points.

Preferably, in the above package structure, the substrate includes a first area and a second area surrounding the first area; the first area is a light-transmitting area;

The first surface of the image sensor chip includes: a collection area and a non-collection area surrounding the collection area; the collection area is arranged opposite to the first area; the first soldering pad is located in the non-collection area ;

Wherein, the anisotropic conductive glue is located between the non-collection area and the second area.

Preferably, in the above packaging structure, the substrate is made of transparent material.

Preferably, in the above package structure, the wiring line is located on the surface of the second area facing the image sensor chip, and there is a light-shielding layer between the wiring line and the substrate.

Preferably, in the above package structure, the substrate is made of non-transparent material; the first area is provided with a window penetrating the substrate, and the window is used to expose all the pixel points.

Preferably, the above package structure further includes a transparent cover fixed on the substrate, and the transparent cover covers the window.

Preferably, in the above package structure, a side surface of the substrate facing the image sensor chip is further provided with an external terminal electrically connected to the wiring line, and the external terminal is used to electrically connect to the external circuit. .

Preferably, in the above package structure, the external circuit has a jack;

The external terminal is a plug pin that matches the jack, and the wiring line is electrically connected to the external circuit through the plug pin and the jack.

Preferably, the above packaging structure also includes:

A light source compensation device is provided on a side surface of the substrate facing away from the image sensor chip.

Preferably, in the above package structure, the first bonding pads are evenly distributed around the periphery of the image sensing chip.

Preferably, in the above package structure, the first surface of the image sensing chip is further provided with a plurality of auxiliary pads, the shape of the auxiliary pads is the same as the shape of the first bonding pad, and the auxiliary pads are The sheets and the first bonding pads are evenly distributed around the periphery of the image sensing chip.

Preferably, in the above package structure, the auxiliary pad and the first bonding pad are located on the periphery of the same rectangle, and a plurality of the first bonding pads are symmetrically distributed on two opposite sides of the rectangle;

A plurality of the auxiliary pads are symmetrically distributed on the other two opposite sides of the rectangle.

Preferably, in the above package structure, the auxiliary pad and the first bonding pad are located on the periphery of the same rectangle, and the first bonding pad and the auxiliary pad are alternately arranged on the periphery of the rectangle. .

The present invention also provides a packaging method for image sensing chips, which is used to produce the packaging structure described in any one of the above. The packaging method includes:

A plate is provided, which includes a plurality of packaging areas arranged in an array, with cutting channels between adjacent packaging areas; the packaging areas are provided with wiring lines and contact terminals electrically connected to the wiring lines; the wiring Lines are used for electrical connection with external circuits;

An image sensor chip is bonded and fixed in the packaging area through anisotropic conductive adhesive. The image sensor chip includes an opposite first surface and a second surface. The first surface has a plurality of Pixel points of image information and a plurality of first pads connected to the pixel points;

The plate is cut and separated along the cutting channel to form a plurality of package structures of the image sensing chips; after cutting, the plate is divided into multiple substrates, each of the substrates including one of the packages. district;

Wherein, the periphery of the image sensor chip is bonded and fixed to the packaging area through the anisotropic conductive glue, and the first soldering pad is electrically connected to the contact terminal through the anisotropic conductive glue; For each of the packaging areas, the anisotropic conductive glue surrounds all of the pixel points in a direction perpendicular to the packaging area and does not overlap with the pixel points.

Preferably, in the above packaging method, the packaging area includes a first area and a second area surrounding the first area; the first area is a light-transmitting area; and the first surface of the image sensing chip includes : a collection area and a non-collection area surrounding the collection area; the collection area is arranged opposite to the first area; the first welding pad is located in the non-collection area;

The method of bonding and fixing an image sensor chip in the packaging area through anisotropic conductive adhesive includes:

Apply anisotropic conductive glue around the periphery of each packaging area, bond one of the image sensor chips to the anisotropic conductive glue, and heat and press the anisotropic conductive glue to solidify it. The image sensor chip is fixed to the substrate through the anisotropic conductive adhesive and is electrically connected to the first bonding pad;

Wherein, the anisotropic conductive glue is located between the non-collection area and the second area.

Preferably, in the above packaging method, the substrate is a transparent material;

The provision of a plate includes:

A light-shielding layer with a predetermined pattern structure is formed on the surface of the plate, and the light-shielding layer with a predetermined pattern structure has openings corresponding to the first areas, and the openings are used to expose the corresponding first areas;

The wiring line and the contact terminal are formed on a side surface of the light-shielding layer of the preset pattern structure facing away from the board.

Preferably, in the above packaging method, the substrate is a non-transparent material;

The provision of a plate includes:

A window is formed in the first area of each packaging area and runs through the packaging area, and the window is used to expose all the pixels.

Preferably, the above packaging method also includes:

A transparent cover is fixed to each said window.

Preferably, in the above packaging method, before cutting, it also includes:

A light source compensation device is provided on the surface of each packaging area on the side facing away from the image sensing chip.

Preferably, in the above packaging method, before cutting, it also includes:

Form external terminals electrically connected to the wiring lines on each of the packaging areas, and the external terminals are used to electrically connect to the external circuit;

Wherein, the external terminal and the image sensor chip are located on the same side of the board.

As can be seen from the above description, in the packaging structure and packaging method of the image sensor chip provided by the embodiment of the present invention, the first bonding pad of the image sensor chip is directly electrically connected to the contact terminal on the substrate through anisotropic conductive adhesive. , and at the same time, the substrate and the image sensor chip can be bonded and fixed through the anisotropic conductive glue. Compared with the existing technology that requires welding and glue, the technical solution of the present invention is to carry out the bonding and fixation of the image sensor chip. When packaging, the process is simple and the production cost is reduced.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the packaging structure of an image sensing chip provided by an embodiment of the present invention;

Figure 2 is a top view of the packaging structure shown in Figure 1 in the opposite direction to the first direction Z;

Figure 3 is a top view of the packaging structure in Figure 1 in the first direction Z;

Figure 4 is a schematic diagram of the packaging structure of another image sensing chip provided by an embodiment of the present invention;

Figure 5 is a top view of an image sensor chip provided by an embodiment of the present invention;

Figure 6 is a top view of another image sensor chip provided by an embodiment of the present invention;

Figure 7 is a top view of another image sensor chip provided by an embodiment of the present invention;

Figures 8-11 are schematic flow charts of a packaging method provided by embodiments of the present invention;

Figures 12-15 are schematic flow charts of another packaging method provided by an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

In order to make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

Referring to Figures 1-3, Figure 1 is a schematic diagram of a packaging structure of an image sensor chip provided by an embodiment of the present invention. Figure 2 is a top view of the packaging structure shown in Figure 1 in the opposite direction of the first direction Z. Figure 3 This is a top view of the packaging structure in Figure 1 in the first direction Z.

The package structure includes: an image sensor chip 11. The image sensor chip 11 includes an opposite first surface and a second surface. The first surface has a plurality of pixels 12 for collecting image information and a plurality of pixels 12 for collecting image information. The first bonding pad 13 connected to the pixel point 12; the substrate 14 covering the first surface of the image sensor chip 11, the substrate 14 is provided with wiring lines and contact terminals connected to the wiring lines; The wiring lines are used for electrical connection with external circuits. The wiring lines include first interconnection lines for electrically connecting the pixel points 12 with external circuits. The external circuit performs image processing based on the image information collected by the pixels 12 .

The periphery of the image sensor chip 11 is bonded and fixed to the substrate 14 through anisotropic conductive glue 15, and the first bonding pad 13 is electrically connected to the contact terminal through the anisotropic conductive glue 15, In a direction perpendicular to the substrate 14 , the anisotropic conductive glue 15 surrounds all the pixel points 12 and does not overlap with the pixel points 12 . The wiring lines and the contact terminals are not shown in FIG. 1 and FIG. 3 .

In the embodiment of the present invention, the direction perpendicular to the substrate 14 is defined as the first direction Z, and the first direction Z is directed from the image sensor chip 11 to the substrate 14 . It is defined that the second direction X and the third direction Y are respectively perpendicular to the first direction Z, and the second direction X and the third direction Y are perpendicular. The second direction X and the third direction Y are both parallel to the substrate 14 .

The substrate 14 includes a first area A and a second area B surrounding the first area A; the first area A is a light-transmitting area; the first surface of the image sensor chip 11 includes: a collection area C and a non-collection area D surrounding the collection area C; the collection area C is arranged opposite to the first area A; and the first bonding pad 13 is located in the non-collection area D. Wherein, the anisotropic conductive glue 15 is located between the non-collection area D and the second area B.

In the first direction Z, the first area A completely exposes the collection area C. Optionally, the first area A and the collection area C can be set to be the same.

In the embodiment shown in FIGS. 1-3 , the substrate 14 is made of transparent material. Therefore, the light can directly pass through the first area A and enter the collection area C of the image sensor chip 11 . When the substrate 14 is a transparent material, the substrate 14 may be a glass substrate or a transparent plastic substrate.

The wiring line is located on the surface of the second area B facing the image sensor chip 11 , and there is a light-shielding layer between the wiring line and the substrate 14 .

The contact end is located on a side surface of the light shielding layer facing away from the substrate 14 . The light-shielding layer is disposed on the side of the substrate 14 facing the image sensor chip 11 to avoid friction and damage to the light-shielding layer. The wiring line and the contact end are blocked by the light-shielding layer to ensure that the appearance of the package structure does not show the wiring line and the contact end. The light shielding layer is not shown in Figures 1-3. Optionally, the light-shielding layer is a black ink layer.

The side surface of the substrate 14 facing the image sensor chip 11 is also provided with an external terminal 16 that is electrically connected to the wiring line. The external terminal 16 is used to electrically connect with the external circuit, so that the external circuit It is electrically connected to the pixels 12 in the image sensor chip 11 . In the first direction Z, the external terminal 16 is located at a position of the substrate 14 corresponding to the second area B, and does not overlap with the image sensor chip 11 .

In the embodiment shown in FIG. 1 , the external terminals 16 are solder balls. In other embodiments, the external terminal 16 may also be a soldering pad. When the external terminal is a solder ball or a pad, the external terminal 16 can be soldered to a pad in the external circuit, so that the external circuit is electrically connected to the wiring line.

In other embodiments, the external circuit has a jack, and the external terminal 16 can also be a plug pin that matches the jack. In this case, the wiring line is connected to the plug pin through the plug pin. The plugging of the jack realizes electrical connection with the external circuit.

In order to ensure the imaging quality of the package structure in a weak light environment, the package structure according to the embodiment of the present invention also includes: a light source compensation device provided on the surface of the substrate 14 facing away from the image sensor chip 11 17. In the first direction Z, the light source compensation device 17 is located at a position corresponding to the second area B of the substrate 14 . Optionally, the light source compensation device 17 is an LED device. The operation of the light source compensation device can be controlled through an external circuit. The wiring circuit also includes a second interconnection circuit for electrically connecting the light source compensation device and the external circuit. The second interconnection line is insulated from the first interconnection line.

The light source compensation device 17 can be connected to the contact end of the substrate 14 facing the surface of the image sensor chip 11 through a via hole penetrating the substrate 14, and then connected to an external circuit, or the light source compensation device 17 can be connected to the contact end on the other side of the substrate 14 through an FPC. end connection.

In the above embodiment, the substrate 14 is a transparent material, so the first area A is light-transmissive. The substrate 14 can package the image sensor chip 11 and electrically connect it to an external circuit, and can also reuse the image sensor chip 11 cover.

The packaging structure of the embodiment of the present invention can also be shown in Figure 4. Figure 4 is a schematic diagram of the packaging structure of another image sensor chip provided by the embodiment of the present invention. In the packaging structure shown in Figure 4, the substrate 14 is a non- Transparent material. At this time, the first area A is provided with a window K penetrating the substrate 14 , and the window K is used to expose all the pixels 12 . Since the substrate 14 is made of non-transparent material at this time, there is no need to provide a light-shielding layer at this time.

When the substrate 14 is made of non-transparent material, the substrate 14 may be a PCB substrate, an opaque plastic substrate, or a semiconductor substrate. At this time, the packaging structure further includes: a transparent cover 18 fixed on the substrate 14 , and the transparent cover 18 covers the window K. The transparent cover 18 may be tempered glass. The substrate 14 may have a single-layer or multi-layer stack structure, and the corresponding first interconnection line and/or the second interconnection line may also have a single-layer or multi-layer stack structure.

When the substrate 14 is a PCB substrate or an opaque plastic substrate, and the first interconnection line and the second interconnection line are in a multi-layer stacked structure, the first interconnection line and/or the second interconnection line It may include multiple metal wiring layers and metal plugs or via connection structures that interconnect the metal wiring layers of adjacent layers.

When the substrate 14 is a semiconductor substrate, the first interconnection line and/or the second interconnection line may include a through-hole interconnection structure penetrating the semiconductor substrate and located on the first surface and/or the second surface of the semiconductor substrate. A layer of rewired metal circuits electrically connected to the through-hole interconnect structure.

The number of the first interconnection lines is multiple (≥2), the number of the second interconnection lines is multiple (≥2), different first interconnection lines and/or second interconnections The lines are isolated and insulated from each other. The number and wiring mode of the first interconnection lines and the second interconnection lines are set according to the electronic components that need to be connected to external circuits.

Referring to Figure 5, Figure 5 is a top view of an image sensor chip provided by an embodiment of the present invention. In the embodiment shown in Figure 5, the first pads 13 of the image sensor chip 11 are evenly distributed on the image sensor chip. The periphery of chip 11. The first bonding pad 13 is located in the non-collection area D of the image sensing chip 11 . All first bonding pads 13 surround the acquisition area C. In this embodiment, since the first bonding pads 13 are evenly distributed on the periphery of the image sensor chip 11, when the anisotropic conductive adhesive 15 is used to bond and fix the substrate 14 and the image sensor chip 11, the image sensor can be The pressure on the anisotropic conductive adhesive 15 around the chip 11 is relatively uniform, ensuring the bonding and fixing effect between the substrate 14 and the image sensor chip 11, and avoiding problems caused by uneven pressure on the anisotropic conductive adhesive 15 from the image sensor chip 11. Problems such as glue overflow caused by excessive local pressure or poor bonding effect caused by insufficient pressure.

Referring to Figure 6, Figure 6 is a top view of another image sensor chip provided by an embodiment of the present invention. In the implementation shown in Figure 6, the first surface of the image sensor chip 11 is also provided with a plurality of auxiliary pads. 19. The shape of the auxiliary pad 19 is the same as the shape of the first bonding pad 13. The auxiliary pad 19 and the first bonding pad 13 are evenly distributed around the periphery of the image sensor chip.

The auxiliary pads 19 and the first bonding pads 13 are evenly distributed around the edge of the image sensor chip 11 . When the anisotropic conductive adhesive 15 is used to bond and fix the substrate 14 and the image sensor chip 11, the auxiliary gasket 19 makes the pressure on the anisotropic conductive adhesive 15 around the image sensor chip 11 more uniform, ensuring that the substrate 14 and the image sensor chip 11 are bonded and fixed. The bonding and fixing effect of the image sensor chip 11 avoids problems such as glue overflow caused by excessive local pressure due to uneven pressure of the image sensor chip 11 on the anisotropic conductive adhesive 15 or poor bonding effect caused by insufficient pressure. . The distance between the first welding pad 13 and the auxiliary pad 19 , the distance between the first welding pad 13 and the first welding pad 13 , the distance between the auxiliary pad 19 and the auxiliary pad 19 All are the same.

In the embodiment shown in FIG. 6 , the auxiliary pad 19 and the first bonding pad 13 are located on the periphery of the same rectangle, and a plurality of the first bonding pads 13 are symmetrically distributed on two opposite sides of the rectangle. Above; a plurality of auxiliary pads 19 are symmetrically distributed on the other two opposite sides of the rectangle.

Referring to Figure 7, Figure 7 is a top view of another image sensor chip provided by an embodiment of the present invention. In the embodiment shown in Figure 7, the auxiliary pad 19 and the first bonding pad 13 are also located in the same rectangular shape. Peripheral, Figure 7 is different from Figure 6 in that, at the periphery of the rectangle, the first bonding pads 13 and the auxiliary pads 19 are alternately arranged. The distance between the first bonding pad 13 and the auxiliary pad 19 is the same.

When packaging chips in the prior art, in order to obtain a thinner chip packaging structure, the chip needs to be thinned. Specifically, the chip can be thinned by mechanical grinding or chemical etching. However, the mechanical strength of the thinned chip is weak.

In the packaging structure of the embodiment of the present invention, the surface of the image sensor chip 11 facing away from the substrate 14 is thinned, and after the thinning process, a reinforcement layer is provided on the surface of the image sensor chip 11 facing away from the substrate 14 . The mechanical strength of the reinforcement layer is greater than the mechanical strength of the image sensor chip 11 . In this way, the image sensor chip 11 can be thinned to a greater extent based on the existing technology, and the mechanical strength can be increased through the reinforcement layer, thereby greatly reducing the thickness of the image sensor chip 11 while ensuring chip packaging. The structure has good mechanical strength. That is to say, the packaging structure according to the embodiment of the present invention, compared with the packaging structure in the prior art, can further increase the thinning process to reduce the thickness of the image sensor chip 11, so that the thickness of the image sensor chip 11 is thinner. Through mechanical The stronger reinforcement layer compensates for the mechanical strength after the thinning process, making the chip packaging structure lighter and thinner. Optionally, the reinforcing layer may be made of plastic sealing material.

It can be seen from the above description that in the packaging structure provided by the embodiment of the present invention, when the image sensor chip 11 and the substrate 14 are packaged, no welding process is required, and the image sensor chip 11 and the substrate 14 are directly bonded and fixed through the anisotropic conductive adhesive 15 The substrate 14, while bonding and fixing the image sensor chip 11 and the substrate 14, electrically connects the first bonding pad 13 to the wiring lines on the substrate 14. The process is simple and the manufacturing cost is low. Moreover, the distribution of the first bonding pads 13 can also be arranged or the auxiliary pads 19 can be added to make the pressure on the anisotropic conductive adhesive 15 around the image sensor chip 11 more uniform, ensuring that the substrate 14 and the image sensor chip 11 are bonded and fixed. Effective, avoid glue overflow or poor bonding effect and other problems.

Based on the above-mentioned packaging structure embodiment, another embodiment of the present invention also provides a packaging method for packaging an image sensor chip to form the packaging structure in the above-mentioned embodiment. The packaging method is shown in Figures 8 to 11. Figures 8 to 11 are schematic flow charts of a packaging method provided by embodiments of the present invention. The packaging method includes:

Step S11: As shown in FIGS. 8 and 9 , a plate 21 is provided. The plate 21 includes a plurality of packaging areas 22 arranged in an array, with cutting channels 20 between adjacent packaging areas 22 .

Figure 8 is a top view of the plate 21, and Figure 9 is a cross-sectional view of Figure 8 in the PP' direction. The packaging area 22 includes a first area A and a second area B surrounding the first area A; the first area AA is a light-transmitting area. In subsequent steps, after cutting, the plate 21 is divided into multiple substrates 14 .

The packaging area 22 is provided with wiring lines and contact terminals electrically connected to the wiring lines; the wiring lines are used for electrical connection with external circuits. The wiring lines and contact terminals are not shown in FIG. 8 .

In the embodiment shown in FIGS. 8 to 11 , the plate 21 is made of a transparent material as an example for explanation. When the board 21 is a transparent material, the providing a board includes: forming a light-shielding layer with a preset pattern structure on the surface of the board 21 , and the light-shielding layer with the preset pattern structure has a structure similar to that of the first area A. A corresponding opening is used to expose the corresponding first area A; the wiring line and the contact terminal are formed on a side surface of the light-shielding layer of the preset pattern structure facing away from the board.

When forming the light-shielding layer with the preset pattern structure, a mask with a preset pattern structure can be used to form the light-shielding layer with the preset pattern structure through an evaporation process; or, the preset pattern can be formed through a photolithography process. The light-shielding layer of the structure; or, the light-shielding layer of the preset pattern structure is formed through a screen printing process. When forming the wiring line, the wiring line may be formed through a screen printing process.

Step S12: As shown in FIG. 10 , an image sensor chip 11 is bonded and fixed in the packaging area 22 through the anisotropic conductive adhesive 17 .

The image sensor chip 11 includes an opposite first surface and a second surface. The first surface has a plurality of pixels 12 for collecting image information and a plurality of first pads connected to the pixels 12 13.

The first surface of the image sensor chip 11 includes: a collection area and a non-collection area surrounding the collection area; the collection area is arranged opposite to the first area A; the first bonding pad 13 is located on the Non-collection area. For the image sensor chip 11, reference can be made to the above-mentioned package structure embodiment, which will not be described again here.

Specifically, the method of bonding and fixing the image sensor chip 11 in all the packaging areas 22 includes: coating anisotropic conductive glue 15 on the periphery of each packaging area 22, and coating the anisotropic conductive glue 15 on the periphery of each packaging area 22. One of the image sensor chips 11 is bonded to the anisotropic conductive adhesive 15, and the anisotropic conductive adhesive 15 is hot-pressed and solidified, so that the image sensor chip 11 is fixed to the substrate 14 through the anisotropic conductive adhesive 15. , and is electrically connected to the first bonding pad 13 . Wherein, the anisotropic conductive glue 15 is located between the non-sensing area and the second area B. The anisotropic conductive adhesive 15 has electrical conductivity in a direction perpendicular to the substrate 14 and electrical insulation in a direction parallel to the substrate 14 .

Step S13: Cut and separate the plate material 21 along the cutting channel 20 to form a plurality of packaging structures of the image sensor chips.

As shown in Figure 11, before cutting, it also includes: forming external terminals 16 electrically connected to the wiring lines on each of the packaging areas 22, and the external terminals 16 are used to electrically connect to the external circuit. . The external terminal 16 and the image sensor chip 11 are located on the same side of the board 21 . After fixing the image sensor chip 11 in the packaging area 22 and before cutting, it also includes: arranging a light source compensation device 17 on the side surface of each packaging area 22 away from the image sensor chip 11, and the light source compensation device 17 is located in the second area. B.

After an image sensor chip 11 is bonded and fixed in the packaging area 22, before cutting, it also includes: thinning one side surface of the back plate 21 of the image sensor chip 11, and after the thinning process , forming a reinforcement layer on one side surface of the back plate 21 of the image sensor chip 11 .

After cutting, the plate 21 is divided into a plurality of substrates 14 , and each substrate 14 includes one packaging area 22 . Wherein, the periphery of the image sensor chip 11 is bonded and fixed to the packaging area 22 through the anisotropic conductive adhesive 15 , and the first bonding pad 13 is bonded to the packaging area 22 through the anisotropic conductive adhesive 15 . The contact end 13 is electrically connected; for each of the packaging areas 22, in the direction perpendicular to the packaging area, the anisotropic conductive glue 15 surrounds all the pixels 12 and is not connected to the pixels 12. overlap. After cutting, the package structure is shown in Figure 1.

In the packaging method shown in Figures 8 to 11, the plate 21 is made of a transparent material as an example for explanation. That is, the substrate 14 is made of a transparent material. After cutting, each substrate 14 is light-transmissive at the position corresponding to the acquisition area of the image sensor chip 11. .

When the plate 21 is made of a non-transparent material, that is, when the substrate 14 is made of a non-transparent material, it is necessary to form a window on the plate 21 corresponding to the acquisition area of each image sensor chip 11, and then bond and fix the image sensor on the packaging area 22. After chip 11, the transparent cover needs to be fixed on the window.

When the substrate 14 is made of non-transparent material, the packaging method can be as shown in Figures 12 to 15. Figures 12 to 15 are schematic flow charts of another packaging method provided by an embodiment of the present invention. The packaging method includes:

Step S21: As shown in Figure 12, a plate 12 is provided. At this time, the plate 12 is a non-transparent material.

The board 21 also includes a plurality of packaging areas 22 with cutting channels 20 between them. The packaging area 22 has a first area A and a second area B.

At this time, it is necessary to form a window K penetrating the packaging area 22 in the first direction Z in the first area A of each packaging area 22. The window K is used to expose all the pixels of the image sensor chip. .

Step S22: As shown in Figure 13, an image sensor chip 11 is bonded and fixed in the packaging area 22 through anisotropic conductive adhesive.

Step S23: As shown in Figure 14, a transparent cover 18 is fixed on each window K.

Step S24: As shown in Figure 15, an external terminal 16 electrically connected to the wiring line is formed on each packaging area 22, and a light source compensation is provided on the side surface of each packaging area 22 facing away from the image sensor chip 11. Device 17.

Step S25: Cut and separate the plate material 21 along the cutting channel 20 to form a plurality of packaging structures of the image sensor chips. After cutting, the package structure is shown in Figure 4.

The packaging method described in the embodiment of the present invention can be used to package the image sensor chip 11 to form the above-mentioned packaging structure. When packaging the image sensor chip 11 and the plate 21, no welding process is required, the manufacturing process is simple, and the cost is low. .

It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on its differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. As for the packaging method disclosed in the embodiment, since it corresponds to the packaging structure disclosed in the embodiment, the description is relatively simple. For relevant information, please refer to the corresponding description of the packaging structure.

The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (19)

1. The utility model provides a packaging structure of image sensing chip which characterized in that includes:

the image sensing chip comprises a first surface and a second surface which are opposite to each other, wherein the first surface is provided with a plurality of pixel points used for collecting image information and a plurality of first welding pads connected with the pixel points;

a substrate covering the first surface of the image sensing chip, wherein a wiring line and a contact end connected with the wiring line are arranged on the substrate; the wiring line is used for being electrically connected with an external circuit;

the periphery of the image sensing chip is adhered and fixed with the substrate through anisotropic conductive adhesive, the first welding pad is electrically connected with the contact end through the anisotropic conductive adhesive, and the anisotropic conductive adhesive surrounds all the pixel points in the direction perpendicular to the substrate and does not overlap with the pixel points;

the first surface of the image sensing chip is also provided with a plurality of auxiliary gaskets, the shape of each auxiliary gasket is the same as that of the corresponding first welding pad, and the auxiliary gaskets and the first welding pads are uniformly distributed on the periphery of the image sensing chip.

2. The package structure of claim 1, wherein the substrate comprises a first region and a second region surrounding the first region; the first area is a light-transmitting area;

the first surface of the image sensing chip comprises: an acquisition region and a non-acquisition region surrounding the acquisition region; the acquisition area is arranged opposite to the first area; the first welding pad is positioned in the non-collecting area;

wherein the anisotropic conductive adhesive is located between the non-acquisition region and the second region.

3. The package structure of claim 2, wherein the substrate is a transparent material.

4. The package structure of claim 3, wherein the wiring line is located on a surface of the second region facing the image sensor chip, and a light shielding layer is disposed between the wiring line and the substrate.

5. The package structure of claim 2, wherein the substrate is a non-transparent material; the first region is provided with a window penetrating through the substrate, and the window is used for exposing all the pixel points.

6. The package structure of claim 5, further comprising a transparent cover plate secured to the substrate, the transparent cover plate covering the window.

7. The package structure according to claim 1, wherein a side surface of the substrate facing the image sensor chip is further provided with an external terminal electrically connected to the wiring line, the external terminal being for electrical connection with the external circuit.

8. The package structure of claim 7, wherein the external circuit has a socket;

the external terminal is a plug pin matched with the jack, and the wiring circuit is plugged with the jack through the plug pin to realize electric connection with the external circuit.

9. The package structure of claim 1, further comprising:

the light source compensation device is arranged on one side surface of the substrate, which is away from the image sensing chip.

10. The package structure of claim 1, wherein the first pads are uniformly distributed around the periphery of the image sensor chip.

11. The package structure of claim 1, wherein the auxiliary pad and the first bonding pad are located at the periphery of the same rectangle, and a plurality of the first bonding pads are symmetrically distributed on two opposite sides of the rectangle;

a plurality of auxiliary gaskets are symmetrically distributed on the other two opposite sides of the rectangle.

12. The package structure of claim 1, wherein the auxiliary pads and the first pads are located at a same rectangular periphery, and the first pads and the auxiliary pads are alternately arranged at the rectangular periphery.

13. A packaging method for an image sensor chip, for manufacturing the packaging structure according to any one of claims 1 to 12, wherein the packaging method comprises:

providing a plate, wherein the plate comprises a plurality of packaging areas which are arranged in an array manner, and cutting channels are arranged between adjacent packaging areas; the packaging area is provided with a wiring line and a contact end electrically connected with the wiring line; the wiring line is used for being electrically connected with an external circuit;

an image sensing chip is adhered and fixed on the packaging area through anisotropic conductive adhesive, the image sensing chip comprises a first surface and a second surface which are opposite to each other, and the first surface is provided with a plurality of pixel points for collecting image information and a plurality of first welding pads connected with the pixel points;

cutting and separating the plate along the cutting channel to form a plurality of packaging structures of the image sensing chips; after cutting, the plate is divided into a plurality of substrates, and each substrate comprises one packaging area;

the periphery of the image sensing chip is adhered and fixed with the packaging area through the anisotropic conductive adhesive, and the first welding pad is electrically connected with the contact end through the anisotropic conductive adhesive; for each of the package regions, the anisotropic conductive paste surrounds all the pixel points in a direction perpendicular to the package region and does not overlap the pixel points.

14. The packaging method of claim 13, wherein the packaging region comprises a first region and a second region surrounding the first region; the first area is a light-transmitting area; the first surface of the image sensing chip comprises: an acquisition region and a non-acquisition region surrounding the acquisition region; the acquisition area is arranged opposite to the first area; the first welding pad is positioned in the non-collecting area;

the bonding and fixing of the image sensing chip in the packaging area through the anisotropic conductive adhesive comprises the following steps:

coating anisotropic conductive adhesive on the periphery of each packaging area, bonding one image sensing chip on the anisotropic conductive adhesive, and performing hot press curing on the anisotropic conductive adhesive to fix the image sensing chip with the substrate through the anisotropic conductive adhesive and electrically connect with the first welding pad;

wherein the anisotropic conductive adhesive is located between the non-acquisition region and the second region.

15. The packaging method of claim 14, wherein the substrate is a transparent material;

the provision of a sheet material includes:

forming a shading layer with a preset pattern structure on the surface of the plate, wherein the shading layer with the preset pattern structure is provided with openings corresponding to the first areas one by one, and the openings are used for exposing the corresponding first areas;

and forming the wiring circuit and the contact end on the surface of one side of the shading layer of the preset pattern structure, which is far away from the plate.

16. The packaging method of claim 14, wherein the substrate is a non-transparent material;

the provision of a sheet material includes:

and forming a window penetrating through the packaging areas in the first area of each packaging area, wherein the window is used for exposing all the pixel points.

17. The packaging method of claim 16, further comprising:

and fixing a transparent cover plate on each window.

18. The packaging method of claim 13, further comprising, prior to dicing:

and a light source compensation device is arranged on the surface of one side of each packaging area, which is away from the image sensing chip.

19. The packaging method of claim 13, further comprising, prior to dicing:

forming an external terminal electrically connected with the wiring line on each of the package regions, the external terminal being for electrical connection with the external circuit;

the external terminal and the image sensing chip are positioned on the same side of the plate.