CN101055058A - Disc type core-layer sandwich plate and its uses - Google Patents
Disc type core-layer sandwich plate and its uses Download PDFInfo
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- CN101055058A CN101055058A CN 200710035001 CN200710035001A CN101055058A CN 101055058 A CN101055058 A CN 101055058A CN 200710035001 CN200710035001 CN 200710035001 CN 200710035001 A CN200710035001 A CN 200710035001A CN 101055058 A CN101055058 A CN 101055058A
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Abstract
A dish type core layer sandwich plate and the use thereof, the plate includes an upper surface layer, a lower surface layer and a core layer and is characterized in that the core layer is a dish type bubble-cap shape core plate, the section of the core plate is cone platform type dish type bubble-cap structure form, each dish type bubble-cap forms a dish member, the dish members are symmetric and parallel in distribution in dot array mode, and the cone platform heart part of the cone dish type bubble-cap can be sharp top shape, flat top shape and annular top shape. The dish member formed by calendering is distributed with two symmetric outer convex inner concave bubble-caps choosing the core layer surface as center to form a spatial two staged unit combination structure. By decorating the cone dish type bubble-cap, the cone platform structure with W type, WV type and WU type sections can be formed. The formed composite board structure can be single layer or multi-layer structure, can use the directionality of the unit structure and adapts apposition, folding and mixture multiple layer spatial combinations. The plate is used for manufacturing the industrial products having the object of press resistance, buffer, vibration insulation, sound isolation, heat insulation, and heat preservation.
Description
One, technical field
The present invention relates to the structure of composite sheet, be meant a kind of sandwich board structure of multilayer composite sheet especially.Mainly as the packing board core structure, also can be used for building wall board, floor, dividing plate core structure, shell, wallboard, floor, the dividing plate core structure of means of transportation such as car, ship, aircraft, and other is purpose sandwich board class industrial products sandwich layers with resistance to compression, buffering, vibrationproof, sound insulation, heat insulation, insulation etc.
Two, background technique
In order to economize on resources, improve the degree of utilizing of material, also be simultaneously in order to alleviate the weight of product, present many sheet materials are all using composite board.Difference according to material, composite sheet can be divided into composite metal plate, composited aluminum and plastic decking, nonmetal composite sheet, wood composite board and papery composite sheet, the characteristics of these composite sheets are to adopt multi-layer structure, have a necessarily hollow composite sheet by being compounded to form of surface layer and sandwich layer is a kind of.Largely depend on the plate cored structure of composite sheet for the performance of these composite sheets, various for the structural type of composite sheet plate core, reticular structure is arranged, corrugated structure is also arranged, also have lattice structure.In order to save resources such as timber, present this composite plate structure is used particularly extensive in papery sheet material, the trend that progressively replaces timber has been arranged, but composite paper board in the past adopts the composite paper board of corrugated structure mostly, corrugating medium's layer at its center of this cardboard is made of the shape that fluting medium is pressed into similar sine wave, this shape stressed has tangible directivity, becoming the stressed property of 90 degree just relatively good with the sinusoidal crest of corrugated paper place, but it is stressed just relatively poor on the direction consistent with sinusoidal waveform, sine wave is easy to be pressed the phenomenon of formation " stupefied " of collapsing, thereby greatly reduces the compressive strength and the buffering resistance to shock of corrugated paperboard.Since corrugated paperboard comes out, mostly concentrated on about the research of corrugated paperboard/case and how to have improved on its compressive strength and the buffering resistance to shock, and carried out a large amount of theories and experiment work.But be subjected to the limitation of corrugated corrugated structure form, the compressive strength of corrugated paperboard and buffering resistance to shock are difficult to obtain the breakthrough of essence.
Nineteen forties, the American has invented honeycomb composite cardboard, further is that society saves timber resources, promotes environmental protection, has played great function for creating new wrapper.Honeycomb cardboard has adopted nature honeycomb structure principle, fluting medium is sticked with glue the knot method connect into numerous hollow positive hexagonal prism, form stressed member---the cellular refill of an integral body, and the environmental protection and energy saving material of a kind of new midsole structure that forms at the bonding facial tissue in its two sides.The main feature of honeycomb cardboard is: (1) high strength, and surfacing, not yielding.The honeycomb structure near-isotropic, structure stability is good, and is not yielding, the most important characteristic that anti-pressure ability that it is outstanding and bending resistance are the packing-box design material require.(2) impact resistance, resiliency are good.(3) the inner cell for sealing of honeycomb structure wherein is full of air, has good tolerant noise-insulating warm-keeping performance.(4) pollution-free, meet modern environmental protection trend.Just because of its high strength, high bending resistance, honeycomb cardboard can not bend as corrugated paperboard easily but then, with the sling N pack carton of formation rule, and can only be used to make buffering backing member or packaging pallet etc. in the packaging box.Compare with corrugated paperboard, the cost height of honeycomb cardboard, difficult processing, insufficient formability have restricted its application area as wrapper greatly.
(patent No.: 200310110489.X) " the bubble-cap shape corrugated paperboard that a kind of lattice-like is arranged " proposed a kind of new blister configuration cardboard to Chinese invention patent.The blister configuration cardboard is maximized favourable factors and minimized unfavourable ones at wavy corrugated structure and cellular structure, and from compressive strength and the shock-absorbing capacity that has improved cardboard in essence, the stressed no significant difference of cardboard periphery has the near-isotropic feature.Simultaneously, the bubble-cap cardboard has kept the formability of corrugated paperboard, can make packaging box easily, and during moulding not the recipient can conveniently make the hexahedral special-shaped carton of non-right angle to restriction, the horn of plenty packaging model provides material base.The bubble-cap cardboard structurally changes the core paper of corrugated paperboard into dot matrix staggered hemisphere bubble-cap shape pit or convex closure moulding of arranging in order by the sinusoidal wave moulding that is arranged in parallel.The lattice symmetry distributed architecture of bubble-cap, the lateral force that has guaranteed cardboard has the near-isotropic feature, and bubble-cap might form airtight elastic bag at the cardboard interlayer, thereby has strengthened the compressive strength and the buffering antivibration ability of cardboard, has good multi-directional bending performance simultaneously again.Further perfect along with technology, the bubble-cap cardboard will become following a kind of superior paper wrapper.But this bubble-cap cardboard still is in the development stage of test room at present, does not still have a kind of its shaping process of maturation, particularly is fit to the preparation process of industrialized production.Therefore it is better very to be necessary further to develop a kind of stressing conditions now, can be fit to the NEW TYPE OF COMPOSITE sheet material of industrialized production again.
Three, summary of the invention
The objective of the invention is to the deficiency at existing composite board, it is better to propose a kind of stressing conditions, can be fit to the NEW TYPE OF COMPOSITE sheet material of industrialized production again.
Another object of the present invention is to propose the purposes of above-mentioned composite board.
According to the technology implementation scheme that purpose of the present invention proposed be: a kind of composite board, comprise upper surface layer, undersurface layer and sandwich layer, it is characterized in that: described sandwich layer is the bubble-cap shape fuse plate of dish, the cross section of fuse plate is a frustum formula dish blister configuration form, each dish-shaped bubble-cap forms a dish unit, the parallel symmetrical distribution of dot matrix way press by dish unit, and the frustum heart portion of frustum dish bubble-cap can be pinnacle shape, flat-top shape, also can be to encircle the top shape.By the butterfly unit that calendering forms, be the bubble-cap that the center is symmetrically distributed with two evagination indents with the core layer surface, thereby form space secondary cascade modular construction.By the modification to frustum dish bubble-cap, can form the cross section is the frustum structure of W type, WV type, WU type.Formed composite plate structure can be the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing.
The invention has the advantages that:
1) rigidity is big, and the buffering vibration absorption ability is strong, and dish-shaped cross section mainly is configured as taper, and loading transfer can be born big axially load (static load or alternate load) with small deformation apart from weak point, is suitable for the little occasion of axial space requirement, its effect disc-like shape spring.It is a kind of structural element that can the load work of maximum " in the space of minimum with ".
2) space secondary cascade modular construction makes it have the secondary resistance to deformation, becomes rigidity, characteristic of nonlinear on a large scale, can effectively resist temporary impact load.
3) compound mode is flexible.Adopt different compound modes with same configuration, the sandwich plate characteristic is in very large range changed.Can adopt two dimensional lattice compound modes such as parallel, dislocation, double space.Can adopt the compound mode of different-thickness, difformity, different geometrical construction sizes etc.
4) can utilize the directivity of modular construction, adopt multilayer space combinations such as involutory, superimposed, mixing.Sandwich layer iterative structure sandwich plate is good at the resistance to compression load-carrying properties.Involutory structure sandwich plate is good at buffering absorbing performance.The mixed construction sandwich plate is good at combination property.
5) lateral approach isotropy all around can improve the limit and press bearing capacity by increasing reticular density, thereby improves the compression resistance, creep-resistant property etc. of goods (as carton).
6) cardboard is collapsible, folding direction unrestricted, and the goods modeling ability is strong.
7) using scope is wide, and can be used for manufacturing and designing with resistance to compression, buffering, vibrationproof, sound insulation, heat insulation, insulation etc. is the purpose industrial products.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the solid of rotation sectional view of three kinds of basic configurations of generation core shape of the present invention;
Fig. 3 is the first structure of three a kinds of butterflies of the present invention enlarged diagram;
Fig. 4 is three kinds of state tectonic mapss of W type dish multilayer composite sheet of the present invention;
Fig. 5 is three kinds of state tectonic mapss of WV type dish multilayer composite sheet of the present invention;
Fig. 6 is three kinds of state tectonic mapss of WU type dish multilayer composite sheet of the present invention;
Fig. 7 is the parallel symmetrical distribution schematic representation of the first dot matrix of dish of the present invention;
Fig. 8 is the parallel schematic representation that is interspersed of the first dot matrix of dish of the present invention;
Fig. 9 is the reverse interleaved dot matrix distribution form schematic representation of the first dot matrix of dish of the present invention;
Figure 10 is the staggered in pairs dot matrix distribution form schematic representation of the first dot matrix of dish of the present invention.
Embodiment
Accompanying drawing has provided several embodiments of the present invention, and the invention will be further described below in conjunction with drawings and Examples.
From accompanying drawing as can be seen the present invention be a kind of composite board, comprise upper surface layer 1, undersurface layer 2 and sandwich layer 3, it is characterized in that: described sandwich layer is the bubble-cap shape fuse plate of dish, the cross section of fuse plate is frustum formula dish bubble-cap 4 structural types, each dish-shaped bubble-cap 4 forms a dish unit, the parallel symmetrical distribution of dot matrix way press by dish unit, and the frustum heart portion of frustum dish bubble-cap can be pinnacle shape, flat-top shape, also can be to encircle the top shape.The dish bubble-cap is the assemblying body of two evagination inner concave shape being symmetrically distributed up and down of center for forming with the core layer surface by calendering, and forms space secondary cascade modular construction.By the modification to frustum dish bubble-cap, can form the cross section is the frustum structure of W type, WV type, WU type.Formed composite plate structure can be the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing.Described sandwich board material is nonmetal or metallic material is made.
Embodiment one
A kind of composite board, comprise upper surface layer 1, undersurface layer 2 and sandwich layer 3, it is characterized in that: described sandwich layer 3 is the bubble-cap shape fuse plate of dish, the cross section of fuse plate is W type dish bubble-cap 4 structural types, the frustum heart portion of W type dish bubble-cap 4 is the pinnacle shape, each W type dish bubble-cap 4 forms a dish unit, and dish unit is that the center is protruded a cone and a conical ring body up and down respectively with the central layer surface, shown in Fig. 2 (a) and Fig. 3 (a).By rolling the W type dish unit that is generated, by the parallel central layer surface that is symmetrically distributed in of dot matrix way, to form the bubble-cap shape fuse plate of dish, as shown in Figure 7.Other dot matrix of butterfly unit distributes as Fig. 8, Fig. 9, shown in Figure 10.Formed composite plate structure can be the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing, as shown in Figure 4.
Embodiment two
A kind of composite board, comprise upper surface layer 1, undersurface layer 2 and sandwich layer 3, it is characterized in that: described sandwich layer 3 is the bubble-cap shape fuse plate of dish, the cross section of fuse plate is WV type dish bubble-cap 4 structural types, the frustum heart portion of WV type dish bubble-cap 4 is a ball top shape, each WV type dish bubble-cap 4 forms a dish unit, and dish unit is that the center is protruded the assemblying body of a circular cone and spherical crown and the assemblying body of a circular cone and annulus up and down respectively with the central layer surface, shown in Fig. 2 (b) and Fig. 3 (b).By the WV type dish unit that calendering is generated, to form the bubble-cap shape fuse plate of dish, approximate shown in Figure 7 by the parallel central layer surface that is symmetrically distributed in of dot matrix way.Similarly, the dot matrix of WV type dish unit distributes and also can adopt as Fig. 8, Fig. 9, mode shown in Figure 10.Formed composite plate structure can be the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing, as shown in Figure 5.
Embodiment three
A kind of composite board, comprise upper surface layer 1, undersurface layer 2 and sandwich layer 3, it is characterized in that: described sandwich layer 3 is the bubble-cap shape fuse plate of dish, the cross section of fuse plate is WU type dish bubble-cap 4 structural types, each WU type dish bubble-cap 4 forms a dish unit, dish unit is that the center forms the circular cone of an evagination indent and the assemblying body of annulus up and down respectively with the central layer surface, shown in Fig. 2 (c) and Fig. 3 (c).By the WU type dish unit that calendering is generated, to form the bubble-cap shape fuse plate of dish, similar shown in Figure 7 by the parallel central layer surface that is symmetrically distributed in of dot matrix way.The upward interior recess of WU type dish bubble-cap 4 and following indent place form the air sac type structure of two sealings respectively with upper surface layer 1 and undersurface layer 2.Similarly, the dot matrix of WU type dish unit distributes and also can adopt as Fig. 8, Fig. 9, mode shown in Figure 10.Formed composite plate structure can be the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing, as shown in Figure 6.
Purposes of the present invention: can be used as the packing board core structure, building wall board, floor, dividing plate core structure, shell, wallboard, floor, the dividing plate core structure of means of transportation such as car, ship, aircraft, and other is purpose sandwich board class industrial products sandwich layers with resistance to compression, buffering, vibrationproof, sound insulation, heat insulation, insulation etc.
Claims (10)
1, a kind of disc type core-layer sandwich plate comprises upper surface layer, undersurface layer and sandwich layer, it is characterized in that: described sandwich layer is the bubble-cap shape composite sheet of dish.
2, disc type core-layer sandwich plate as claimed in claim 1 is characterized in that: the cross section of described sandwich board is dish-shaped blister configuration form, and each dish-shaped bubble-cap forms a dish unit, and the parallel symmetrical distribution of dot matrix way is pressed by dish unit.
3, disc type core-layer sandwich plate as claimed in claim 1 is characterized in that: pinnacle shape or flat-top shape or ball top shape or the ring top shape of the central part of described dish-shaped bubble-cap for forming by calendering.
4, disc type core-layer sandwich plate as claimed in claim 1, it is characterized in that: described dish-shaped bubble-cap is the assemblying body of two evagination inner concave shape being symmetrically distributed up and down of center for forming with the core layer surface by calendering, and forms space secondary cascade modular construction.
5, disc type core-layer sandwich plate as claimed in claim 2 is characterized in that: described sandwich board material is nonmetallic material.
6, disc type core-layer sandwich plate as claimed in claim 2 is characterized in that: described sandwich board material is a metallic material.
7, disc type core-layer sandwich plate as claimed in claim 2 is characterized in that: the formation cross section of described dish-shaped bubble-cap is the frustum structure of W shape or WV shape or WU shape.
8, disc type core-layer sandwich plate as claimed in claim 1 is characterized in that: formed composite plate structure is the single or multiple lift structure, can utilize the directivity of modular construction, adopts multilayer space combinations such as involutory, superimposed, mixing.
9, a kind of purposes of disc type core-layer sandwich plate according to claim 1 is characterized in that: described sandwich layer for the bubble-cap shape composite sheet of dish as being purpose sandwich board class industrial products sandwich layers with resistance to compression, buffering, vibrationproof, sound insulation, heat insulation, insulation etc.
10, as the purposes of disc type core-layer sandwich plate as described in the claim 9, it is characterized in that: described sandwich layer is used as framies such as car, ship, aircraft, wallboard, floor, dividing plate core structure with core structure or for the bubble-cap shape composite sheet of dish as building wall board, floor, dividing plate with core structure or for the bubble-cap shape composite sheet of dish as packing board for the bubble-cap shape composite sheet of dish.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710035001 CN101055058A (en) | 2007-05-22 | 2007-05-22 | Disc type core-layer sandwich plate and its uses |
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| CN 200710035001 CN101055058A (en) | 2007-05-22 | 2007-05-22 | Disc type core-layer sandwich plate and its uses |
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| CN101055058A true CN101055058A (en) | 2007-10-17 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213356A (en) * | 2010-04-01 | 2011-10-12 | 严能进 | Profile and sheeting combined plate |
| CN102303427A (en) * | 2011-07-12 | 2012-01-04 | 北京航空航天大学 | Dual-interlayer symmetrical multi-pyramid configuration three-dimensional integrally-braid lattice composite material and preparation method thereof |
| CN105697997A (en) * | 2015-12-28 | 2016-06-22 | 青海模具制造科技有限公司 | Metal structural part |
| CN106003855A (en) * | 2016-07-08 | 2016-10-12 | 大连塑料研究所有限公司 | Reversely-convex telescopic hollow structural board and manufacturing method thereof |
| CN107310849A (en) * | 2017-06-27 | 2017-11-03 | 四川长虹电器股份有限公司 | A kind of combination board packing box on airplane component |
| CN109454951A (en) * | 2018-11-29 | 2019-03-12 | 北京理工大学 | A kind of bidirectional crossed ripple sandwich |
| WO2020061196A1 (en) * | 2018-09-20 | 2020-03-26 | The Curators Of The University Of Missouri | Energy dissipation using negative stiffness shells |
| CN111156273A (en) * | 2020-02-26 | 2020-05-15 | 中国工程物理研究院总体工程研究所 | Spherical composite disc spring |
-
2007
- 2007-05-22 CN CN 200710035001 patent/CN101055058A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213356A (en) * | 2010-04-01 | 2011-10-12 | 严能进 | Profile and sheeting combined plate |
| CN102303427A (en) * | 2011-07-12 | 2012-01-04 | 北京航空航天大学 | Dual-interlayer symmetrical multi-pyramid configuration three-dimensional integrally-braid lattice composite material and preparation method thereof |
| CN102303427B (en) * | 2011-07-12 | 2014-03-26 | 北京航空航天大学 | Dual-interlayer symmetrical multi-pyramid configuration three-dimensional integrally-braid lattice composite material and preparation method thereof |
| CN105697997A (en) * | 2015-12-28 | 2016-06-22 | 青海模具制造科技有限公司 | Metal structural part |
| CN106003855A (en) * | 2016-07-08 | 2016-10-12 | 大连塑料研究所有限公司 | Reversely-convex telescopic hollow structural board and manufacturing method thereof |
| CN107310849A (en) * | 2017-06-27 | 2017-11-03 | 四川长虹电器股份有限公司 | A kind of combination board packing box on airplane component |
| CN107310849B (en) * | 2017-06-27 | 2019-03-26 | 四川长虹电器股份有限公司 | A kind of combination board packing box on airplane component |
| WO2020061196A1 (en) * | 2018-09-20 | 2020-03-26 | The Curators Of The University Of Missouri | Energy dissipation using negative stiffness shells |
| CN109454951A (en) * | 2018-11-29 | 2019-03-12 | 北京理工大学 | A kind of bidirectional crossed ripple sandwich |
| CN111156273A (en) * | 2020-02-26 | 2020-05-15 | 中国工程物理研究院总体工程研究所 | Spherical composite disc spring |
| CN111156273B (en) * | 2020-02-26 | 2024-05-14 | 中国工程物理研究院总体工程研究所 | Spherical composite disc spring |
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Open date: 20071017 |