CN100507429C - Flat plate heat transfer device - Google Patents
Flat plate heat transfer device Download PDFInfo
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- CN100507429C CN100507429C CNB2004800287167A CN200480028716A CN100507429C CN 100507429 C CN100507429 C CN 100507429C CN B2004800287167 A CNB2004800287167 A CN B2004800287167A CN 200480028716 A CN200480028716 A CN 200480028716A CN 100507429 C CN100507429 C CN 100507429C
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- heat transfer
- transfer device
- flat plate
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- plate heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down. A dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source.
Description
Technical field
The present invention relates to a kind of flat plate heat transfer device, this flat plate heat transfer device can transmit heat by the working fluid cycles mechanism of using evaporation and condensation under the situation of not using independent mechanical energy; Especially relating to a kind of structure can be thinner, and can prevent to cause the improved flat plate heat transfer device that is out of shape by external impact.
Background technology
Recently, along with development of integration technology, it is littler, thinner that the electronic equipment such as notebook or PDA becomes.In addition, because the high sensitivity and the improved requirement of function of electronic equipment increased, energy consumption also is tending towards increasing thereupon.Thereby the electronic unit when electronic equipment moves from electronic equipment produces a large amount of heat, has therefore used various flat plate heat transfer devices so that these heats are diffused to the outside.
The habitual example of conventional flat plate heat transfer is a heat pipe, and the flat metal box body of this heat pipe is depressurized to vacuum, then working fluid is injected and is sealed in this metal case.
Heat pipe is mounted to the electronic unit that produces heat (or thermal source) and partly contacts.In this case, be positioned near the thermal source working fluid and be heated and evaporate, diffuse to the relatively low zone of temperature then.Afterwards, steam is condensed into liquid again and disperses heat to the outside, returns its initial position subsequently.By in the flat metal box body, carrying out this working fluid cycles mechanism, the thermal transpiration that produces in the thermal source can be arrived the outside, thereby the temperature of electronic unit is remained on proper level.
Fig. 1 shows conventional flat plate heat transfer 10, and it is installed between thermal source 20 and the radiator 30 so that heat is passed to radiator 30 from thermal source 20.
With reference to figure 1, conventional flat plate heat transfer 10 has metal case 50, and the inner space 40 of this metal case 50 is filled with working fluid.Be formed with capillary structure (wick structure) 60 on the medial surface of metal case 50, this capillary structure is used to provide effective working fluid cycles mechanism.
The heat that produces in the thermal source 20 be passed to this thermal source 20 contacted flat plate heat transfer devices 10 in capillary structure 60.Then, roughly be positioned at the working fluid evaporation that the capillary structure 60 (it is as " evaporation section ") directly over the thermal source 20 contains and pass inner space 40 and disperse along all directions, this working fluid is condensed again after roughly being positioned at capillary structure 60 (it is as " condensation portion ") under the radiator 30 to locate heat radiation then.The heat that condensation phase discharges is passed to radiator 30, discharges by the forced convertion of fan 70 then.
For in flat plate heat transfer device 10, realize above-mentioned heat transfer mechanism, liquid should absorb be arranged in the evaporation section directly over the thermal source 20 heat with evaporation, and then move to condensation portion.Therefore, should have sufficient space in the flat plate heat transfer device 10 in essence makes steam can diffuse to condensation portion.If there is not to make working fluid to diffuse to the adequate space of condensation portion, just can not suitably realizes using the heat transfer mechanism of the evaporation and the condensation of working fluid, thereby make the degradation of heat transfer unit (HTU) from evaporation section.
Simultaneously, because the thickness of electronic equipment thins down in recent years, so the thickness of flat plate heat transfer device also needs attenuation.But because conventional flat plate heat transfer 10 needs to keep its inside is vacuum (or decompression), and can not adopt the frame for movement that to bear external impact, therefore when making or operating this device, metal case 50 is easily by small impact extruded, this will cause the vapor dispersion channel distortion, thereby make the heat-transfer character variation of product.Therefore, conventional flat plate heat transfer 10 has limitation on the demand that satisfies at present for thin structure more.
Summary of the invention
The present invention is designed to solve prior art problems, therefore the purpose of this invention is to provide a kind of flat plate heat transfer device with improved internal structure, this flat plate heat transfer device can make device become thinner under the situation of the heat transfer mechanism of evaporation that keeps original use working fluid and condensation, and can avoid in the distortion of making or causing owing to the impact that may be subjected to during operation.
In order to realize above-mentioned purpose, the invention provides a kind of flat plate heat transfer device, this flat plate heat transfer device comprises: the flat case of heat conduction, it is installed between thermal source and the heat abstractor and includes working fluid, this working fluid evaporates by the heat that absorbs this thermal source, and by dispersing heat and condensation to this heat abstractor; And one deck net, it is installed in this flat case, and be configured to alternately interlacing up and down of netting twine, wherein, from this net near the crosspoint of this thermal source, be formed with vapor dispersion channel along the surface of described netting twine, and near the grid of this heat abstractor near the grid of this thermal source, be formed with liquid flow path by capillarity along the length direction of described netting twine; Wherein this net is that the order number is 10 to 60 screen cloth; Wherein this net is that the netting twine braiding of 0.12mm to 0.4mm forms by diameter; Wherein this net contacts with the upper plate of the flat case of this heat conduction and the inner surface of lower plate; And wherein this net is made of metal.
In addition, the height of the flat case of this heat conduction is preferably 0.3mm to 1.0mm.
In this net is under the situation of screen cloth, and preferably, the length direction of the vertical netting twine in the described netting twine is identical with the direction of carrying out the heat transmission.
Under the situation that the flat case of this heat conduction is made by electrolytic copper foil, preferably, the uneven surface of this electrolytic copper foil is as the medial surface of this flat case.
This net is by making one of in metal, polymer, plastics and the glass fibre.This this metal be selected from by copper, aluminium, stainless steel, molybdenum and their alloy composition group.
This flat case is by making one of in metal, thermal conductive polymer, the metal that is coated with thermal conductive polymer and the heat-conducting plastic.At this, this metal is selected from the group by copper, aluminium, stainless steel, molybdenum and their alloy composition.
This flat case uses a kind of mode in laser weld, plasma welding, TIG (tungsten argon arc) weldering, ultrasonic bonding, brazing, soldering and the stacked combination of hot pressing to seal.
The group that this working fluid selects Free water, methyl alcohol, ethanol, acetone, ammoniacal liquor, CFC working fluid, HCFC working fluid and HFC working fluid or their mixture to form.
Description of drawings
From below with reference to the description of accompanying drawing to embodiment, other purpose of the present invention and scheme will become more clear, wherein:
Fig. 1 is the cutaway view that conventional flat plate heat transfer is shown;
Fig. 2 is the cutaway view that illustrates according to the flat plate heat transfer device of the embodiment of the invention;
Fig. 3 illustrates the vertical view that is installed on according to the grid (lattice) of the mesh grid (woven mesh) in the flat case of the flat plate heat transfer device of the embodiment of the invention;
Fig. 4 illustrates line A-A ' the gained cutaway view of grid along Fig. 3;
Fig. 5 and Fig. 6 are respectively the phantom and the partial plans of this flat plate heat transfer device, and it shows the situation that forms liquid film when flat plate heat transfer device of the present invention moves on net;
Fig. 7 to Fig. 9 is the stereogram that illustrates according to the various outward appearances of flat plate heat transfer device of the present invention; And
Figure 10 to Figure 12 is the cutaway view that illustrates according to the various examples of the used box body of flat plate heat transfer device of the present invention.
The specific embodiment
Hereinafter will be described specifying the present invention, and, will be described in detail with reference to the accompanying drawings in order to understand the present invention better to embodiment.But embodiments of the invention can be made amendment in every way, therefore should not be construed as of the present invention range limited in following embodiment.The purpose that embodiments of the invention are provided only is clearer, more particularly bright in order to carry out to those skilled in the art.In the accompanying drawings, identical Reference numeral is represented identical member.
As shown in Figure 2, flat plate heat transfer device 100 comprises according to the preferred embodiment of the invention: flat case 130, and it is installed between thermal source 110 and the heat abstractor 120 such as fin; A net 140, it is inserted in this box body 130; And the working fluid in the injection box body 130, it is as the medium that heat is passed to heat abstractor 120 from thermal source 110.
In flat plate heat transfer device 100, be positioned at directly over the thermal source 110 that the working fluid of (being designated hereinafter simply as " evaporation section ") is evaporated to steam near the position, the vapor dispersion channel that will be described below that provides by net 140 is provided then and disperses.Afterwards, steam for example is being condensed into liquid near the position under the heat abstractor 120 in the temperature position more relatively low than the temperature of thermal source 110 (being designated hereinafter simply as " condensation portion ").Subsequently, the liquid of condensation flows to the position be positioned at directly over the thermal source 110 via liquid flow path, realizes a complete circulation, and wherein this liquid flow path is formed by the capillarity of net 140 generations, and this will be described below.In this process, working fluid is taken away heat from thermal source 110, then this heat is passed to heat abstractor 120.In addition, the heat that is passed to heat abstractor 120 discharges by the forced convertion that is produced by fan 150, thereby the temperature of thermal source 110 is remained in the proper level.Under the ideal state, it is basic identical that the working fluid heat transfer mechanism of use evaporation and condensation will last till that the temperature of thermal source 110 becomes with the temperature of heat abstractor 120.
The inner space of flat case 130 is decompressed to vacuum, and flat case 130 by the metal with excellent heat conductivity, thermal conductive polymer, be coated with the metal of thermal conductive polymer, perhaps heat-conducting plastic is made, can easily absorb the heat of thermal source 110 like this, and again heat be diffused to heat abstractor 120 easily.Preferably, described metal is a kind of in copper, aluminium, stainless steel and the molybdenum or their alloy.Especially, if flat case 130 made by the uneven electrolytic copper foil of one side, then preferably should the unevenness face towards the inner surface of flat case 130.In this case, working fluid can return more reposefully by capillarity, thereby can improve the efficient of flat plate heat transfer device 100.Consider the thermal conduction characteristic and the mechanical strength of flat case 130, the thickness of flat case 130 is preferably 0.01mm to 1.0mm.
Net 140 is located between the upper plate and lower plate of flat case 130, and is configured to alternately interlacing up and down of netting twine (wire) 140a and 140b.Net 140 can be made by in metal, polymer, glass fibre and the plastics any.Preferably, this metal is a kind of in copper, aluminium, stainless steel and the molybdenum or their alloy.Net 140 can manufacture the corresponding different shape of shape that has with the flat case 130 of flat plate heat transfer device 100.
As shown in Figure 3 and Figure 4, serve as reasons horizontal netting twine 140a and the vertically alternately mesh grid of interlacing of netting twine 140b of net 140.A/F in the cell of net 140 (a) is usually by following formula 1 expression.
Formula 1
a＝(1-Nd)/N
At this, d is the diameter (inch) of netting twine, and N is the grid number of net 140 in one inch scope.For example, if N is 100 in a square mesh 140, then in an inchage, have 100 grids.
In the present invention, net 140 is as the device that vapor dispersion channel (I) is provided, and the steam that is evaporated by thermal source 110 can flow in this vapor dispersion channel (I).Particularly, as shown in Figure 4, in net 140, by horizontal netting twine 140a and vertically the intersection of netting twine 140b produce space 160, and this space 160 is as vapor dispersion channel (I), steam can be dispersed at this vapor dispersion channel (I).At this, vertical netting twine 140b is defined as the netting twine of embarking on journey and arranging along the length direction in when braiding, and horizontal netting twine 140a is defined as the netting twine of arranging perpendicular to this vertical netting twine 140b.
Geometric area (A) according to following formula 2 calculation of steam dispersion channel (I).
Formula 2
A＝(a+d)d-πd
2/4
With reference to formula 2, the geometric area of vapor dispersion channel (I) is along with the increase of the diameter (d) of the minimizing of order number (N) and netting twine and increase.
Have four vapor dispersion channel (I) in a grid of net 140, described vapor dispersion channel (I) is total with adjacent grid, and working fluid can be dispersed to four direction reposefully based on the center (O) of grid like this, (sees
Arrow), as shown in Figure 3.
In net 140 is under the situation of screen cloth (screen mesh), and the gradient (not shown) of vertical netting twine 140b of seeing over, be provided with perpendicular to horizontal netting twine 140a along the horizontal length direction of netting twine 140a is seen over, will more be tilted perpendicular to the gradient (see figure 4) of the horizontal netting twine 140a of vertical netting twine 140b setting than the length direction of netting twine 140b longitudinally.Therefore, steam flows along the length direction of vertical netting twine 140b of net 140 and flows more smoothly than the length direction of netting twine 140a transversely, thereby can provide better heat transfer efficiency on the length direction of vertical netting twine 140b.Therefore, be under the situation of screen cloth in net 140, preferably, when installation and operate tablet formula heat transfer unit (HTU) 100, the heat transfer direction is consistent with the length direction of vertical netting twine 140b.
Simultaneously, as shown in Figure 5, when flat plate heat transfer device 100 practical operations according to the present invention, the liquid and the net 140 of having a common boundary with the upper plate and the lower plate of flat case 130 come in contact.Therefore, wedge gap 170 places of the vapor dispersion channel in net 140 (I) form liquid film 180 by liquid.
As shown in Figure 6, all be formed with liquid film 180 at all places, netting twine crosspoint.If suitably control mesh width (a) and/or netting twine diameter (d) in the parameter of net 140, then the liquid film 180 that forms at place, netting twine crosspoint can be connected with each other, thereby produces capillarity.Therefore, if be placed in working fluid evaporation in the evaporation section grid with the form of liquid film 180, the working fluid that then is placed in the adjacent mesh flows in this evaporation section grid by the length direction of capillarity along netting twine, and its amount is identical with evaporation capacity.
That is to say that in flat plate heat transfer device 100 according to the present invention, evaporation section is because the continuous evaporation of working fluid and disperse thereby lack liquid, and condensation portion since working fluid constantly in this condensation thereby have excessive liquid.But, the capillarity that the surface tension of the liquid film 180 that forms in grid produces will impel liquid to flow to evaporation section from condensation portion, the workflow physical efficiency is fed to evaporation section constantly along the length of netting twine like this, thereby keeps the heat transfer mechanism of the evaporation and the condensation of this use working fluid.That is to say that liquid flow path forms along the length of netting twine.
But if the order number of net 140 (mesh number) (N) increases too much or the diameter (d) of netting twine reduces too much, then vapor dispersion channel (I) will fully be blocked by liquid owing to surface tension.In this case, the working fluid that evaporates in evaporation section can not diffuse to condensation portion via vapor dispersion channel (I), thereby will upset smooth heat transmission.Therefore, should consider that net 140 not only will provide vapor dispersion channel (I), also will provide the parameter of suitably selecting net 140 under the situation of liquid flow path, the i.e. diameter (d) of order number (N) and netting twine by capillarity.Preferably, the order number of net 140 is 10 to 60, and the diameter of netting twine is in 0.12mm arrives the scope of 0.4mm.
According to the present invention, owing to used the net that vapor dispersion channel and liquid flow path can be provided simultaneously, so needn't have traditional capillary structure on the inner surface of flat case 130.Thereby with to save capillary structure corresponding, the thickness of flat plate heat transfer device 100 can be as thin as 0.3mm to 1mm.In addition, owing to be included in the net 140 in the flat plate heat transfer device 100 even can play the effect of supporting flat case 130, so the mechanical strength of this flat plate heat transfer device 100 is bigger than the mechanical strength of traditional heat transfer unit (HTU).
To shown in Figure 9, flat plate heat transfer device 100 according to the present invention can have different shape as Fig. 7, for example square, rectangle or T shape.In addition, the flat case 130 of flat plate heat transfer device 100 can be configured to combining of upper cartridge body 130a and lower box body 130b as shown in Figure 10 and Figure 11, also can be configured to only have a box body as shown in figure 12.
After the inner space with flat case 130 is decompressed to vacuum level and fills working fluid, seal this flat case 130.Sealing can use in laser weld, plasma welding, TIG (tungsten argon arc) weldering, ultrasonic bonding, brazing, soldering and the stacked combination of hot pressing (thermo-compressionlamination) any to carry out.
Working fluid can be a kind of in water, methyl alcohol, ethanol, acetone, ammoniacal liquor, CFC working fluid, HCFC working fluid and the HFC working fluid or their mixture.
Experiment embodiment
In order to assess the effect according to flat plate heat transfer device of the present invention, the inventor has made the flat plate heat transfer device of long 40mm, wide 70mm, high 0.65mm.Flat case is made of independently upper cartridge body and lower box body as shown in figure 10, and described upper cartridge body and lower box body are made by the thick rolling copper sheet of 0.1mm (rolledcopper foil).The net that is included in the flat case is that the order number is 15 copper screen cloth, and the diameter of netting twine is 0.2mm, and the content of copper is more than or equal to 99%.
In order to use this flat plate heat transfer device in this experiment, be located at screen cloth between upper cartridge body and the lower box body as shown in figure 10 and make each box body surface screen cloth, use denaturing acrylamide acid binary binding agent (denatured acrylic binary bond) (trade mark: HARDLOC) seal upper cartridge body and lower box body, and leave the working fluid hand-hole then by the DENKA company manufacturing of Japan.
Then, before injecting working fluid, by using rotary vacuum pump and diffusion vacuum pump inner pressure relief to 1.0 * 10 with flat case
-7Holder, the distilled water with 0.23cc injects the inside of this flat case as working fluid then.Afterwards, seal this box body.
With an end of the flat plate heat transfer device that as above makes at interval the central authorities in the zone of 10mm be connected the thermal source that length and width are respectively 12mm, and be connected the radiator that length and width are respectively 25mm and have fan apart from the central authorities in the zone of 10mm with the other end of this flat plate heat transfer device.Simultaneously, thermal source and radiator are connected to the same side.Then, from 1W to 5W, increase the power of thermal source, measure the temperature on thermal source surface simultaneously.
According to experimental result, even apply the power that is 5W to the maximum, the temperature of thermal source is not also above 47 ℃.Therefore, be appreciated that flat plate heat transfer device according to the present invention can be used as the Cooling Heat Transfer device of small-sized relatively and thinner thickness, electronic equipment that heat is lower.
Commercial Application
According to the present invention, by in flat case, inserting the net that vapor dispersion channel and liquid flow path can be provided simultaneously, capillary structure that can abandoning tradition, thus flat plate heat transfer device is become as thin as a wafer.In addition, because net supports flat case securely, so this flat plate heat transfer device can be because of making or percussion during operate tablet formula heat transfer unit (HTU) and being out of shape.
Now described the present invention in detail.But be understood that, given detailed description and instantiation only are used for purpose of explanation, it only shows the preferred embodiments of the present invention, because to those skilled in the art, under situation without departing from the spirit or scope of the invention, obviously variations and modifications can be arranged.。
Claims (9)
1. flat plate heat transfer device comprises:
The flat case of heat conduction, it is installed between thermal source and the heat abstractor and includes working fluid, and this working fluid evaporates by the heat that absorbs this thermal source, and by dispersing heat and condensation to this heat abstractor; And
One deck net, it is installed in this flat case, and is configured to alternately interlacing up and down of netting twine,
Wherein, from this net near the crosspoint of this thermal source, be formed with vapor dispersion channel along the surface of described netting twine, and near the grid of this heat abstractor near the grid of this thermal source, be formed with liquid flow path by capillarity along the length direction of described netting twine;
Wherein this net is that the order number is 10 to 60 screen cloth;
Wherein this net is that the netting twine braiding of 0.12mm to 0.4mm forms by diameter;
Wherein this net contacts with the upper plate of the flat case of this heat conduction and the inner surface of lower plate; And
Wherein this net is made of metal.
2. flat plate heat transfer device as claimed in claim 1,
Wherein the height of the flat case of this heat conduction is 0.3mm to 1.0mm.
3. flat plate heat transfer device as claimed in claim 1,
Wherein this flat case is formed by upper cartridge body and lower box body combined structure.
4. flat plate heat transfer device as claimed in claim 1,
Wherein this net is a screen cloth, and
The length direction of the vertical netting twine in the described netting twine is identical with the direction of carrying out the heat transmission.
5. flat plate heat transfer device as claimed in claim 1,
Wherein the flat case of this heat conduction is made by electrolytic copper foil, and
The uneven surface of this electrolytic copper foil is as the inboard of this flat case.
6. as each described flat plate heat transfer device in the claim 1 to 4,
Wherein this flat case is by a kind of the making in metal, the metal that is coated with thermal conductive polymer and the heat-conducting plastic.
7. flat plate heat transfer device as claimed in claim 6,
The metal that wherein is used to make the metal of this net and is used to make flat case is copper, aluminium, stainless steel or molybdenum.
8. as each described flat plate heat transfer device in the claim 1 to 5,
Wherein this flat case uses a kind of mode in laser weld, plasma welding, TIG weldering, ultrasonic bonding, brazing, soldering and the stacked combination of hot pressing to seal.
9. as each described flat plate heat transfer device in the claim 1 to 5,
Wherein this working fluid selects the group that Free water, methyl alcohol, ethanol, acetone, ammoniacal liquor, CFC working fluid, HCFC working fluid and HFC working fluid or their mixture are formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030068874 | 2003-10-02 | ||
| KR1020030068874A KR20050032888A (en) | 2003-10-02 | 2003-10-02 | Flat plate heat transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1864043A CN1864043A (en) | 2006-11-15 |
| CN100507429C true CN100507429C (en) | 2009-07-01 |
Family
ID=36499752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800287167A Expired - Fee Related CN100507429C (en) | 2003-10-02 | 2004-09-23 | Flat plate heat transfer device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070068656A1 (en) |
| EP (1) | EP1676086A4 (en) |
| JP (1) | JP2007507685A (en) |
| KR (1) | KR20050032888A (en) |
| CN (1) | CN100507429C (en) |
| TW (1) | TWI260388B (en) |
| WO (1) | WO2005031238A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI458932B (en) * | 2011-09-02 | 2014-11-01 | Giga Byte Tech Co Ltd | Heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100698460B1 (en) * | 2004-11-10 | 2007-03-23 | (주)셀시아테크놀러지스한국 | Plate Cooling Units and Chipsets Using the Same |
| GB2427582A (en) * | 2005-06-28 | 2007-01-03 | Asia Vital Components Co Ltd | Manufacture of a heat pipe using ultrasonic welding |
| CN100488694C (en) * | 2006-07-05 | 2009-05-20 | 奇鋐科技股份有限公司 | Method for manufacturing flat heat pipe by ultrasonic welding |
| KR100809587B1 (en) * | 2007-02-02 | 2008-03-04 | 이용덕 | Plate Heat Transfer |
| US20080310115A1 (en) * | 2007-06-15 | 2008-12-18 | Brandenburg Scott D | Metal screen and adhesive composite thermal interface |
| KR100890019B1 (en) * | 2007-08-10 | 2009-03-25 | 플루미나 주식회사 | Plate heat transfer device |
| CN101634532B (en) * | 2008-12-22 | 2011-06-15 | 富瑞精密组件（昆山）有限公司 | Heat pipe manufacturing method |
| JP4737285B2 (en) * | 2008-12-24 | 2011-07-27 | ソニー株式会社 | Heat transport device and electronic equipment |
| JP5309225B2 (en) * | 2009-01-06 | 2013-10-09 | マサチューセッツ インスティテュート オブ テクノロジー | Heat exchanger and related methods |
| US9546826B1 (en) | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
| US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
| WO2011111126A1 (en) | 2010-03-10 | 2011-09-15 | パナソニック株式会社 | Semiconductor device and method for manufacturing same |
| CN102374808A (en) * | 2010-08-26 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Flat-plate type vapor chamber |
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| US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
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| CN112996339B (en) * | 2019-12-12 | 2023-09-26 | 王训忠 | Uniform temperature plate device |
| CN112268472A (en) * | 2020-11-13 | 2021-01-26 | 爱美达（深圳）热能系统有限公司 | Processing technology of flexible temperature-equalizing plate and flexible temperature-equalizing plate |
| CN216079719U (en) * | 2021-06-25 | 2022-03-18 | 广东英维克技术有限公司 | Radiator in TV LED lamp area |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
| US3834457A (en) * | 1971-01-18 | 1974-09-10 | Bendix Corp | Laminated heat pipe and method of manufacture |
| US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
| JPS6166086A (en) * | 1984-09-07 | 1986-04-04 | Mitsubishi Heavy Ind Ltd | Heat pipe |
| US5560423A (en) * | 1994-07-28 | 1996-10-01 | Aavid Laboratories, Inc. | Flexible heat pipe for integrated circuit cooling apparatus |
| KR100290461B1 (en) * | 1998-05-25 | 2001-06-01 | 정선종 | Heat pipe having a wick structure |
| JP2000161878A (en) * | 1998-11-30 | 2000-06-16 | Furukawa Electric Co Ltd:The | Planar heat pipe |
| TW452642B (en) * | 1999-09-07 | 2001-09-01 | Furukawa Electric Co Ltd | Wick, plate type heat pipe and container |
| US6446706B1 (en) * | 2000-07-25 | 2002-09-10 | Thermal Corp. | Flexible heat pipe |
| JP2003179189A (en) * | 2001-12-12 | 2003-06-27 | Furukawa Electric Co Ltd:The | Thin heat sink and its packaging structure |
| US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
| JP4057455B2 (en) * | 2002-05-08 | 2008-03-05 | 古河電気工業株式会社 | Thin sheet heat pipe |
-
2003
- 2003-10-02 KR KR1020030068874A patent/KR20050032888A/en not_active Ceased
-
2004
- 2004-09-23 JP JP2006532074A patent/JP2007507685A/en not_active Ceased
- 2004-09-23 US US10/574,356 patent/US20070068656A1/en not_active Abandoned
- 2004-09-23 WO PCT/KR2004/002450 patent/WO2005031238A1/en active Application Filing
- 2004-09-23 CN CNB2004800287167A patent/CN100507429C/en not_active Expired - Fee Related
- 2004-09-23 EP EP04774703A patent/EP1676086A4/en not_active Withdrawn
- 2004-10-01 TW TW093129762A patent/TWI260388B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI458932B (en) * | 2011-09-02 | 2014-11-01 | Giga Byte Tech Co Ltd | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI260388B (en) | 2006-08-21 |
| US20070068656A1 (en) | 2007-03-29 |
| EP1676086A1 (en) | 2006-07-05 |
| TW200513627A (en) | 2005-04-16 |
| JP2007507685A (en) | 2007-03-29 |
| WO2005031238A1 (en) | 2005-04-07 |
| KR20050032888A (en) | 2005-04-08 |
| EP1676086A4 (en) | 2008-01-02 |
| CN1864043A (en) | 2006-11-15 |
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Correction item: Inventor Correct: Jin Xuandui False: Jin Xuandui Number: 46 Volume: 22 |
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