CN100447053C - Method for fixing semiconductor carrier plate - Google Patents

Abstract

The invention relates to a method for fixing semiconductor carrier plates, which mainly adheres a single-sided adhesive tape on a strip-shaped soft plate in advance, cuts the single-sided adhesive tape into independent carrier plates, fixes the independent semiconductor carrier plates by the single-sided adhesive tape, and finally attaches the semiconductor carrier plates to a heat-resistant plate with micro-viscosity along the boundary of the semiconductor carrier plates on the strip-shaped soft plate to complete alignment so as to carry out subsequent part assembly operation. Therefore, the semiconductor carrier plates can be replaced by manual alignment and attachment to the heat-resistant plate, so that the cost is reduced, and the yield and the accuracy are improved.

Description

Fixing method of semiconductor substrate

technical field

The invention relates to a method for fixing a semiconductor carrier.

Background technique

SMT (Surface Mounting Technology) is an English abbreviation for a new generation of electronic surface mount technology. It compresses traditional electronic components to about one tenth of the original volume, and realizes high density, high reliability, miniaturization and low cost of electronic product assembly, and becomes the foundation of the electronic information industry.

In short, SMT consists of three parts: surface mount components (SMD), placement technology, and placement equipment. Due to the high assembly density of SMD, the existing electronic products and systems can be reduced by 40%-60% in volume, 60%-80% in weight, and 30%-50% in cost. At the same time, it also has the reliability of SMD. High performance and good high-frequency characteristics, so the selection and configuration of SMT surface mount technology and its equipment has become the key to the quality assurance of electronic products and systems.

For surface mount, an alignment procedure is still required before SMT. However, the traditional alignment method is too dependent on manual work, resulting in many shortcomings.

Please refer to FIGS. 1A-1C . FIGS. 1A-1C are schematic diagrams of a known alignment procedure. As shown in FIG. 1A , firstly, a carrier 1 with a plurality of grooves 1 a is prepared, and the size of the grooves 1 a is set according to the flexible board 2 to be carried. Then, put the prefabricated flexible board 2 into the groove 1 a of the carrier 1 , as shown in FIG. 1B . Next, on the edges of the upper and lower ends of the placed flexible boards 2, 3, 4, stick and fix them with heat-resistant adhesive tapes 8a, 8b as shown in FIG. 1C. After fixing, the SMT procedure can be started.

However, in the alignment process shown in FIG. 1B , in addition to manually placing the flexible boards 2 , 3 , and 4 into the carrier 1 , it is still necessary to tear off the previously attached fixing tape after the SMT process is completed. Therefore, the traditional alignment procedure is not only costly, but also inefficient.

Contents of the invention

The main purpose of the present invention is to provide a method for fixing semiconductor carrier boards, which mainly uses single-sided adhesive tape to attach the strip-shaped soft board to the heat-resistant board, instead of manually aligning and attaching these semiconductor carrier boards to the heat-resistant board. board, while reducing costs, increasing yield and accuracy.

Based on the above-mentioned purpose, the fixing method of the semiconductor carrier board of the present invention is mainly to attach the strip-shaped soft board to the heat-resistant board by means of a single-sided adhesive tape, and along the boundaries of the semiconductor carrier boards on the strip-shaped soft board, Cut into individual carrier boards, and each independent semiconductor carrier board is still fixed on the heat-resistant board by single-sided adhesive tape.

Description of drawings

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

1A-1C are schematic diagrams of known alignment procedures.

2A to 2D are schematic diagrams of the method for fixing the semiconductor carrier of the present invention.

FIG. 3 is a schematic side view of the fixed semiconductor carrier of the present invention.

In the picture:

1 carrier, 1a groove, 2, 3, 4 soft board, 8a, 8b heat-resistant tape, 10 ribbon-shaped soft board, 10a carrier board, 10b boundary, 10c perforation, 10d slit, 12 heat-resistant board, 13 Sticky Substance, 14 Single Sided Tape

Detailed ways

Please refer to FIGS. 2A-2D . FIGS. 2A-2D are schematic diagrams of a method for fixing a semiconductor substrate of the present invention. As shown in Fig. 2A, before carrying out the alignment procedure of the present invention, first provide strip-shaped soft board 10 (before not punching, it has a plurality of carrier boards as semiconductor carrier board 10a), heat-resistant board 12, and A viscous substance 13 is applied on the heat-resistant plate 12 . The multiple dotted boxes on the strip-shaped flexible board 10 (as shown by the boundary 10b) are only used to indicate that the inside of the box belongs to the carrier board with circuits, and it does not mean that it must be marked on the strip-shaped flexible board 10 frame line.

Briefly speaking, in the fixing method of the semiconductor substrate of the present invention, the strip-shaped soft board 10 is pasted and fixed with the help of the single-sided adhesive tape 14 as shown in FIG. The boundary 10b between the boards (the dotted line shown in FIG. 2A or FIG. 2B ) cuts out a slit 10d at the periphery of the carrier 10a (that is, the original boundary 10b) by means of continuous punching, and the semiconductor carrier 10a Cut into individual carrier plates, as shown in Figure 2C. In this way, although the semiconductor carrier 10a has been separated from the tape-shaped flexible board 10, each semiconductor carrier is still fixed on the single-sided adhesive tape 14 due to the single-sided adhesive tape 14 under the semiconductor carrier 10a, As shown in Figure 2D.

The strip-shaped flexible board 10 shown in FIG. 2A can have a plurality of holes such as tooth holes 10c on both sides. The perforations 10c are similar to the holes of the film negative, and their purpose is also roughly the same. Since the material of the strip-shaped flexible board 10 is very elastic like a film negative, the strip-shaped flexible board 10 can be rolled into a roll like a film negative before performing the manufacturing steps shown in FIGS. 2B-2C . When it is necessary to carry out the manufacturing steps shown in Figures 2B-2C, the special automation device can draw out the required length from the roll of strip-shaped flexible board 10 by means of the tooth hole 10c, so as to achieve the effect of automatic operation. Of course, the strip-shaped flexible board 10 does not necessarily have the tooth holes 10c, but such a design is more convenient for automatic operation. In addition, the parts of the strip-shaped flexible board 10 that are not the semiconductor carriers (such as the semiconductor carrier 10 a ) are the flexible board scraps.

Specifically, in the method for fixing a semiconductor carrier board of the present invention, after providing the strip-shaped soft board 10 and the heat-resistant board 12 as described above, the strip-shaped soft board that roughly conforms to the heat-resistant board 12 in length can be drawn out. 10, and attached on the single-sided adhesive tape 14 as shown in Figure 2B. In order to allow the semiconductor carrier 10a to be separated from the strip-shaped soft board 10, but it is desired that the semiconductor carrier 10a is still fixed on the single-sided adhesive tape 14, so when punching along the boundary 10b as shown in Figure 2B, only the tape is cut. The part of the flexible board 10, and the single-sided adhesive tape 14 should not be cut as much as possible (the side view shown in FIG. 3), as shown in FIG. 2C. Then, as shown in FIG. 2D, after the soft board edge material is torn off from the single-sided adhesive tape 14, the strip-shaped soft board 10 of the next section can be attached on the single-sided adhesive tape 14 as shown in FIG. 2B, and as shown in FIG. As mentioned above, the process shown in FIGS. 2C-2D is carried out to achieve automatic operation.

Before the SMT assembly operation is to be carried out, the side of the single-sided adhesive tape 14 in the finished product (the single-sided adhesive tape 14 adhesively combined with the strip-shaped flexible board 10) as shown in Figure 2D is transferred and pasted to the surface as the flexible board. The heat-resistant plate 12 of the tool. Since the bonding force between the single-sided tape 14 and the heat-resistant board 12 is greater than the bonding force between the single-sided tape 14 and the strip-shaped flexible board 10, accurate transfer and attachment can be performed.

Through the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various changes and equivalent arrangements within the protection scope of the present invention.

Claims (4)

1. A method for fixing a semiconductor carrier, the method comprising: Provide a ribbon flexible board with multiple semiconductor substrates; providing a heat-resistant plate with adhesiveness; attaching a single-sided adhesive tape to the back of the tape; and Along the borders of the semiconductor carriers on the tape-shaped flexible board, cut into independent carriers, and each independent semiconductor carrier is still fixed by the single-sided tape; Tear off the part of the tape-shaped soft board that is not the semiconductor carrier board from the single-sided tape, and attach the tape-shaped soft board attached to the semiconductor carrier board to the heat-resistant board with the help of the single-sided tape. The bonding force between the hot plates is greater than the bonding force between the single-sided adhesive tape and the strip-shaped soft board. 2 . The method for fixing a semiconductor carrier as claimed in claim 1 , wherein the portion of the strip-shaped flexible board that is not the semiconductor carrier is a flexible board scrap. 3 . 3. The fixing method of the semiconductor carrier as claimed in claim 1, wherein after tearing off the part of the tape-shaped soft board that is not the semiconductor carrier from the single-sided adhesive tape, the fixing method of the semiconductor carrier further comprises: A section of the strip-shaped soft board is attached to the single-sided adhesive tape. 4. The method for fixing a semiconductor carrier as claimed in claim 1, wherein two sides of the strip-shaped flexible board have tooth holes.

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