CN100411090C - Electronic component mounting device - Google Patents

Abstract

In the electronic component mounting apparatus provided with the first, second and third beam members (31, 32 and 33), all the beam members are supported at both ends by a common Y-axis frame, connected to the first beam member by means of The assembly head of (31) supports the chip (6) from the electronic component feeding unit (2) by suction, and mounts the chip on the substrate supported by the first and second substrate supporting units (10A and 10B), setting the support A supporting device (SHU supporting device) (10) of a substrate holding unit of a slide table (50) on which the first and second substrate holding units (10A and 10B) are arranged, the sliding table operating It is movable between position (P1) and maintenance position (P2). With this configuration, the slide table (50) can be moved to a maintenance position (P2) where maintenance is easy, resulting in an improvement in work efficiency.

Description

Electronic component mounting device

technical field

The present invention relates to an electronic component mounting device for mounting electronic components on a substrate.

Background technique

A semiconductor chip is cut into individual pieces from a semiconductor wafer and is in a state of being adhered to a thin wafer from which it can be separated by an electronic component mounting device acting on a substrate such as a lead frame. As a type of electronic component mounting apparatus that performs transfer and mounting operations on electronic components, one is known in which an electronic component feeding unit that supports a thin wafer and feeds a semiconductor chip, a substrate supporting unit that supports a substrate, and a moving beam are successively arranged , the moving beam is provided with work heads that support semiconductor chips by suction on these units, thereby configuring the moving beam so as to be freely movable (for example, see Published Japanese Patent No. 2003-188194).

In the example of this patent document, in addition to the moving beam equipped with the above-mentioned working head, two moving beams are provided, one with a camera for recognizing the substrate and the other with a camera for recognizing the semiconductor chip at the electronic component feeding unit cameras, whereby these moving beams are supported at their ends by support frames. The apparatus is designed so that the three moving beams are moved cooperatively to accomplish an efficient component mounting operation.

Contents of the invention

However, with regard to the electronic component mounting device constructed as described above, one problem to be pointed out is that the workability of the device is lowered due to passage obstruction during operation caused by the layout of the device. That is, the substrate support unit supporting the substrates conveyed from the upstream side needs to be frequently performed by the operator in order to accompany the phase change operation when the substrate type is changed, and the maintenance operations of exchanging consumable parts and dealing with substrate jams due to conveying errors .

However, in configurations such as those described above, multiple moving beams are arranged on a common support frame, and in practice access from the sides of the device is obstructed by the support frame, and accessibility from the outside of the device to the substrate support unit is controlled by The existence of multiple moving beams hinders, thus resulting in a decrease in work efficiency.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus capable of improving work efficiency by improving accessibility to a substrate support unit from the outside of the apparatus.

The electronic component mounting apparatus of the present invention is provided with a nozzle that supports the electronic component by suction and mounts the electronic component on a substrate by supporting the electronic component with the nozzle by suction, and includes: a base; a substrate support unit which is at the center of the base and supports said substrate; a substrate transfer device which introduces the substrate into or sends out the substrate from the substrate support unit by transferring the substrate in the substrate transfer direction (X direction); arranged on the substrate a pair of support frames on both sides so as to straddle the substrate transfer route defined by the substrate transfer device; an electronic component feeding unit arranged on the side of the substrate support unit between the pair of support frames on the base platform, A beam member supported at its end by said supporting frame so that it is freely movable in a Y direction almost perpendicular to said substrate transport direction; a Y-axis moving device for moving the beam member in the Y direction, whereby the range of movement includes a space above the substrate supporting unit and a space above the electronic component feeding unit; a mounting head supported by the beam member so as to be freely movable in the X direction; an X axis that moves the mounting head in the X direction a moving device; and a support device for a substrate holding unit (hereinafter simply referred to as an SHU support device) that supports the substrate holding unit, whereby the substrate holding unit can move between an operation position and a maintenance position, wherein the operation position is controlled by It is possible that the substrate transfer device introduces or sends out substrates, and the maintenance position is arranged in the Y direction beyond the operation position away from the electronic component feeding unit.

According to the present invention, work efficiency can be improved by improving accessibility to the substrate support unit from the outside by adopting a configuration of an SHU support device configured to support the substrate support unit so that the substrate support unit can be moved between an operation position and a maintenance position , at which operation position it is possible to introduce or carry out substrates by said substrate transfer device, the maintenance position is arranged beyond the operation position away from the electronic component feeding unit.

Description of drawings

FIG. 1 is a plan view of an electronic component mounting apparatus as an embodiment for practicing the present invention;

Fig. 2 is a side sectional view of an electronic component mounting apparatus as an embodiment for practicing the present invention;

3 and 4 are sectional views of an electronic component mounting apparatus as an embodiment for practicing the present invention;

5, 6 and 7 are plan views of a SHU supporting device as an electronic component mounting device of an embodiment for practicing the present invention;

8A and 8B are side sectional views of a SHU supporting device as an electronic component mounting device of an embodiment for practicing the present invention;

FIG. 9 is a block diagram showing the structure of a control system of an electronic component mounting apparatus as an embodiment for practicing the present invention;

10 and 11 are plan views of a SHU supporting device as an electronic component mounting device of an embodiment for practicing the present invention.

Detailed ways

Next, some embodiments for practicing the present invention will be described with reference to the drawings. First, the entire configuration of the electronic component mounting apparatus is described with reference to FIGS. 1 , 2 , 3 and 4 . Fig. 2 shows the view on the arrow A-A in Fig. 1, and Fig. 3 and Fig. 4 respectively show the views on the arrow B-B in Fig. 2 . In FIG. 1 , an electronic component feeding unit 2 is arranged on a base 1 . As shown in FIGS. 2 and 3 , the electronic component feeding unit 2 is provided with a jig support (a jig support unit) 3 , and the jig support 3 supports a jig 4 to which an adhesive sheet 5 is mounted in a freely attachable and detachable manner. A semiconductor chip 6 (hereinafter simply referred to as a chip 6 ) as an electronic component is connected to this adhesive sheet 5 by adhesive force in an individually separated manner.

As shown in FIG. 2 , under the adhesive sheet 5 supported by the jig holder 3 , an ejector 8 is arranged on the ejector table 7 in a horizontally movable manner. The ejector 8 is provided with a pin lifter that lifts or lowers an ejector pin (not shown in the figure) to push up the chips. And when the mounting head to be described later picks up the chip 6 from the adhesive sheet 5 , the ejector pin pushes the chip 6 up from the underside of the adhesive sheet 5 to separate the chip 6 from the adhesive sheet 5 . The ejector 8 constitutes an adhesive sheet separating device that separates the chip 6 from the adhesive sheet 5 .

As shown in FIG. 3 , at the central portion of the upper plane of the base 1 , the SHU supporting device 10 is arranged at a position away from the electronic component feeding unit 2 in the Y direction (first direction). The SHU supporting device 10 supports a first substrate supporting unit 10A and a second substrate supporting unit 10B each supporting a substrate 16 on which a chip 6 is mounted. The intake conveyor 12 and the substrate distributing device 11 are arranged on the upstream side of the SHU support device 10, and the substrate collecting device 13 and the outgoing conveyor 14 are both continuously arranged on the downstream side of the SHU support device in the X direction.

The adhesive-coated substrate 16 is fed to the introduction conveyor 12 by means of the upstream side device, and the adhesive-coated substrate 16 is transferred to the substrate distributing device 11 . The substrate distribution apparatus 11 includes a distribution conveyor 11a which is slidably arranged in the Y direction by means of a slide device 11b and which selectively distributes the substrate 16 received from the introduction conveyor 12 to the first substrate supporting unit 10A or The second substrate supporting unit 10B (both are arranged at the central portion of the base 1 ). The first substrate supporting unit 10A and the second substrate supporting unit 10B support the substrate 16 distributed by the substrate distributing device 11 to position the substrate to its mounted position.

Similar to the substrate distributing device 11, the substrate collecting device 13 includes a collecting conveyor 13a, which is slidably arranged in the Y direction by means of a sliding device 13b, by selectively connecting the collecting conveyor 13a to the first or second The substrate support unit 10A or 10B is connected to receive the mounted substrate 16 and transfer the substrate to the outgoing conveyor 14 . The send-out conveyor 14 takes out the conveyed mounted substrate 16 to the downstream side.

The introduction conveyor 12, the substrate distributing device 11, the substrate collecting device 13, and the outgoing conveyor 14 constitute a substrate conveying device that introduces the substrate 16 to the first and second substrates by transferring the substrate in the X direction (ie, the substrate conveying direction). The second substrate supporting units 10A and 10B, or the substrate 16 is taken out from the first and second substrate supporting units 10A and 10B. As a reminder, as a configuration of the substrate transfer apparatus, in addition to using a type of transfer such as that employed in this embodiment, a substrate transfer method using lift pins or pushers or a pick-and-place based substrate transfer method may also be employed.

In FIG. 1 , a pair of supporting frames (X-axis frames 20A and 20B) are arranged on both sides of the upper plane of the base 1 such that they straddle the substrate transfer route defined by the above-mentioned substrate transfer device and sufficiently cover the base in the Y direction. The entire length of Desk 1. The layout on the base 1 is such that the electronic component feeding unit 2 is placed on the side of the first and second substrate supporting units 10A and 10B between the Y-axis frames 20A and 20B.

At a pair of first direction guides 21 arranged on the upper planes of the Y-axis frames 20A and 20B, there are provided a first beam member 31 (beam member), a second beam member 32 and a third beam member 33 so that these The beam member is supported at both ends thereof in the Y direction by the first direction guides 21 so as to be free to move. In other words, the first, second and third beam members 31, 32 and 33 are supported by the Y-axis frames 20A and 20B at both ends thereof so as to be freely movable in the Y direction.

At the right side end portion of the first beam member 31, a nut member 23b protrudes, and the feed screw 23a threadedly engaged with the nut member 23b is rotatably driven by the Y-axis motor 22, which rotates in the horizontal direction. Arranged on the first Y-axis frame 20A. By operating the Y-axis motor 22 , the first beam member 31 moves horizontally in the Y direction along the first direction guide 21 .

On the first beam element 31 , an assembly head 34 is supported which is provided with a first camera 35 which is integrally movable on a side plane, thereby allowing the assembly head to move freely in the X direction. And a feed screw 41 a is rotatably driven by the X-axis motor 40 , which is threadedly engaged with a nut member 41 b connected to the fitting head 34 . By operating the X-axis motor 40, the assembly head 34 moves in the X direction guided by the second direction guide 42 (refer to FIG. 2 ), which is fitted on the side plane of the first beam member 31 in the X direction. . The X-axis motor 40, the feed screw 41a and the nut member 41b constitute an X-axis transport means for transporting the mounting head 34 in the X direction.

The mounting head 34 has a plurality (four in this case) of nozzles 34a each capable of supporting a single chip 6 by suction, so that when a plurality of chips 6 are supported by sucking the chip 6 to each nozzle 34a The assembly head 34 is movable. By operating the Y-axis motor 22 and the X-axis motor 40, the assembly head 34 moves horizontally in the X and Y directions, whereby the assembly head picks up and supports the chip 6 in the electronic component feeding unit 2, and the supported chip 6 Mounted on the substrate 16 supported by the first substrate supporting unit 10A or the second substrate supporting unit 10B.

And, along with the movement of the mounting head 34, the first camera 35 also moves integrally, and captures an image of the substrate 16 supported by the first or second substrate supporting unit 10A or 10B. The Y-axis motor 22, the feed screw 23a, and the nut member 23b constitute a Y-axis moving device that moves the first beam member 31 in the Y direction, whereby the moving range includes the space above the first and second substrate supporting units 10A and 10B and Space above the electronics feed unit 2.

At the left end portions of the second and third beam members 32 and 33, nut members 25b and 27b protrude, respectively, and the feed screws 25a and 27a threadedly engaged with the nut members 25b and 27b are driven by the Y-axis motor 24, respectively. and 26 are rotatably driven, and the motor is arranged on the second Y-axis frame 20B in the horizontal direction. By operating the Y-axis motors 24 and 26, the second and third beam members 32 and 33 move horizontally along the first direction guide 21 in the Y direction.

On the second beam member 32 , the second camera 36 is mounted, and the nut member 44 b is connected to the bracket 36 a supporting the second camera 36 . The feed screw 44 a threadedly engaged with the nut member 44 b is rotatably driven by the X-axis motor 43 . And by operating the X-axis motor 43 , the second camera 36 is guided to move in the X direction by the second direction guide 45 provided on the side plane of the second beam member 32 (see FIG. 2 ).

By operating the Y-axis motor 24 and the X-axis motor 43, the second camera 36 moves horizontally in the X and Y directions. Through these movements, the second camera 36 can move above the first and second substrate support units 10A and 10B to capture images of the substrate 16 supported by these substrate support units 10A and 10B, and can also be further moved to the exit position (located at above a maintenance position to be described later), the withdrawal position is arranged away from the electronic component feeding unit 2 for withdrawal from these substrate support units described above. Detection of the mounting condition of the chip 6 on the substrate 16 becomes possible by performing recognition processing on an image of the substrate 16 on which electronic components have been mounted, captured by the second camera 36 .

Therefore, in the configuration described above, the Y-axis motor 24, the feed screw 25a, and the nut member 25b constitute the second Y-axis conveying means that is placed between the first and second substrate supporting units 10A and 10B. The second beam member 32 is moved to and from an exit position arranged at a position away from the electronic component feeding unit 2 beyond the space above the first and second substrate supporting units 10A and 10B in the Y direction.

On the third beam member 33 , a third camera 37 is mounted, and the nut member 47 b is connected to a bracket 37 a supporting the third camera 37 . The feed screw 47 a threadedly engaged with the nut member 47 b is rotatably driven by the X-axis motor 46 . And by operating the X-axis motor 46 , the third camera 37 is guided to move in the X direction by the second direction guide 48 provided on the side plane of the third beam member 33 (see FIG. 2 ).

By operating the Y-axis motor 26 and the X-axis motor 46, the third camera 37 moves horizontally in the X and Y directions. Through these movements, the third camera 37 can move over the electronic component feeding unit 2 to capture images of the chip 6 supported by the electronic component feeding unit 2 and can perform a movement to exit from above the electronic component feeding unit 2 . By performing recognition processing on the image data captured by the third camera 37 , the position of the chip 6 in the electronic component feeding unit 2 can be detected.

As shown in FIG. 3 , the fourth camera 15 is arranged between the electronic component feeding unit 2 and the SHU supporting device 10 . The fourth camera 15 captures an image of the chip 6 supported by the assembly head 34 as the assembly head 34 picking up the chip 6 at the electronic component feeding unit 2 moves in the X direction above the fourth camera 15 .

As shown in FIGS. 2 and 3 , on the upper plane where the first and second substrate supporting units 10A and 10B are arranged in parallel, the SHU supporting device 10 is provided with a slide table 50 , whereby the slide table is arranged to be arranged along the Y direction. The guide rail 52 on the base 1 is free to move. That is, the configuration of the SHU supporting device 10 includes a sliding table 50 linearly moving substantially in the Y direction on the base 1, on which the first and second substrate supporting units 10A and 10B are disposed.

By moving the slide table 50, the first and second substrate supporting units 10A and 10B move between the operation position P1 (refer to FIG. 3 ) and the maintenance position 2 (refer to FIG. 4 ), which are positions under normal device operating conditions. , the introduction and delivery of the substrate 16 can be carried out by means of the substrate transfer device, and the maintenance position 2 is arranged in the Y direction beyond the operation position P1 and away from the electronic component feeding unit 2, and the maintenance position 2 changes the operation and maintenance operation in stages Easy access during the period. In other words, the SHU supporting device 10 supports the first and second substrate supporting units 10A and 10B such that the two units can move between the operation position P1 and the maintenance position P2.

Next, referring to FIGS. 5 , 6 , 7 and 8 , the constitution of the SHU supporting device 10 is described. Of the two guide rails 52 arranged on the upper plane of the base 1 in the Y direction, a slider 51 (see also FIG. 2 ) is fixed on the lower plane of the slide table 50 , which is configured to be freely swipe. With this configuration, the slide table 50 is free to move in the Y direction.

On the upper plane of the abutment 1 between the guide rails 52 , positioning elements 54 are arranged in the Y direction. During the movement of the slide table 50 in the Y direction, the holding device 53 provided in the slide table 50 is held by the recesses 54 a and 54 b provided in the positioning device 54 for positioning. In this way, the slide table 50 is configured to be positionable in the Y direction.

As shown in FIG. 5 , on the upper plane of the slide table 50 shown by a dotted line, identification marks 50 a are arranged at three points adjacent to diagonal positions (see also FIG. 3 ). The identification mark 50a is a reference point that can be optically detected by a camera. This point will be described later. The purpose of providing the identification mark 50a is to judge whether the slide table 50 is supported at the correct position of the operating position P1, or to check whether it is supported by a device such as Position errors caused by thermal deformation of related devices such as feed screws.

As the reference observation camera that captures the image of the identification mark 50a, either the first camera 35 or the second camera 36 is suitably used, which will be described later. As a reminder, although the identification mark 50a provided on the slide table 50 is used here as a reference point, the identification mark as a reference point may be provided in the first and second substrate supporting units 10A and 10B.

Now, referring to FIGS. 5 and 8 , the structure and function of the holding device 53 will be described. FIG. 8A shows a C-C cross-section in FIG. 5 . As shown in FIG. 8A , at the edge of the lower plane side of the slide table 50 , a support block 56 is fixed, and a slide hole 56 a passes through the support block 56 . An L-shaped stopper 57 is slidably inserted into the slide hole 56a. A compression spring 60 is fitted between a rim 57 a provided on the stopper 57 and a block 59 fixed on the lower plane of the slide table 50 .

Since the detent 57 is urged against the positioning element 54 by means of the compression spring 60 , the tip of the detent 57 fits in a recess 54 a or 54 b provided in the positioning element 54 . With the stopper 57 installed in the recess 54a, the slide table 50 is positioned at the side of the operation position P1, and with the stopper 57 installed at the recess 54b, the slide table 50 is positioned at the side of the maintenance position P2.

In the base table 1, biasing means 55 for positioning the slide table 50 are provided (see also FIG. 3). The biasing device 55 has a contact element 55 a that comes into planar contact with the edge of the slide table 50 by projecting or recessing in the Y direction. With the stopper 57 fitted in the recess 54a, the stopper 57 is pushed against the inner plane of the recess 54a by operating the biasing device 55 to push the contact element 55a against the edge plane of the slide table 50 in the direction of the arrow. By this arrangement, the position of the slide table 50 at the operating position P1 is fixed. That is, the positioning member 54 having the concave portion 54a, the clamping device 53 and the pushing device 55 constitute a fixing device for fixing the slide table 50 at the operating position P1.

A handle unit 57 b with a stopper 57 extending upward protrudes toward the upper plane side of the slide table 50 via a through-slot 50 b provided in the slide table 50 . At the edge of the through-slot 50b, an upright grip element 58 is arranged facing the handle unit 57b. As shown in FIG. 8B , when the operator holds the handle unit 57 b and pulls toward the side of the grip member 58 , the stopper 57 is released from the recess 54 a (or 54 b ). By this operation, the clamping state of the slide table 50 by the clamping device 53 is released so that the slide table 50 is movable in the Y direction.

That is, as shown in FIG. 8B, when the operator releases the stopper 57 from the recess 54a, and grasps and pulls out the handle unit 57b and the grip member 58 in the Y direction to release the pull to the X direction of the handle unit 57b, The tip of the stopper 57 is in contact with the side edge plane 54c of the positioning member 54, as shown in FIG. When the operator continues to hold the grip member 58 and pull out the slide table 50 in the Y direction, in this case the slide table 50 stops at the position where the stopper 57 is arranged in the recess 54b (ie, the maintenance position P2).

In this way, by arranging the SHU supporting device 10 supporting the first and second substrate supporting units 10A and 10B such that the units are freely movable between the operation position P1 and the maintenance position P2, it is solved in the configuration of the electronic component mounting apparatus that hinders the movement from the SHU support unit 10. The problem that the outside of the device reaches the first and second substrate support units 10A and 10B, in this configuration, a plurality of beam elements move along the common Y-axis frame 20A and 20B, which are arranged on the second One and the second substrate supports both sides of the units 10A and 10B. As a reminder, in the case of a stage changing operation or the like by the first and second substrate supporting units 10A and 10B placed at the maintenance position P2, it is preferable to place the second beam member 32 above the operation position P1.

That is, in the case where an operator needs to perform a phase change operation accompanied by a type change caused by a board type change, a maintenance operation for exchanging consumable parts, or dealing with a board jam caused by a transport error, it is possible to pull out The first and second substrate supporting units 10A and 10B come to the easy-to-reach maintenance position P2, resulting in an improvement in work efficiency. As a reminder, in this embodiment, as a substrate supporting member, a substrate supporting member including a plurality of substrate supporting units 10A and 10B has been exemplified, but, naturally, similar Effect.

Referring now to FIG. 9, the configuration of the control system of the electronic component mounting apparatus will be described. In FIG. 9, a fiducial observation camera 61 is a camera for capturing an image of an identification mark 50a provided on the slide table 50 and capturing fiducial points provided on the first and second substrate supporting units 10A and 10B. As the reference observation camera 61, the first camera 35 mounted on the assembly head 34 in order to recognize the substrate can be used, or can be used supported by the second beam member 32 so as to detect the mounting state of the chip 6 mounted on the substrate 16 at X The direction of the second camera 36 is freely movable. However, it is preferred to use the first camera 35 which moves integrally with the camera-mounted assembly head 34 .

The recognition processing unit 62 executes a process for recognizing the position of the recognition mark 50 a as a reference point using the image data acquired by the reference observation camera 61 . The control unit 63 is equipped with three kinds of processing functions: a substrate position correction calculation part 64, a thermal deformation correction calculation part 65, and a substrate support unit position judgment part 66, and performs processing based on the recognition processing result of the recognition processing unit 62 (to be described later) explain).

First, the substrate position correction calculation section 64 performs calculation of the corrected substrate position, that is, the position of the substrate 16 held by the first or second substrate holding unit 10A or 10B, based on the position of the identification mark 50a recognized by the recognition processing unit 62. . The thermal deformation correction calculation section 65 performs calculation to correct errors caused by thermal deformation generated at each part of the relevant device based on the position of the reference point recognized by the recognition processing unit 62 . That is, when the device is continuously operated for a certain period of time, each part of the related device such as the feed screw and the guide is heated due to the heat generated by the motor and the friction at the sliding part, and the Thermal deformation causes a temporary change in the corresponding position of each part of the device concerned. The thermal deformation correction corrects a temporary change in the relevant position by detecting the position of the identification mark 50a as a reference point at predetermined intervals.

The calculation results of the substrate position correction calculation section 64 and the thermal deformation correction calculation section 65 are transmitted to the device control unit 67 . When the mounting head 34 mounts the chip 6 on the substrate 16, which has taken out the chip 6 from the electronic component feeding unit 2, the device control unit 67 controls the X-direction and The mobile device in the Y direction. By this control, the position error of the substrate 16 caused by the displacement of the first and second substrate holding units 10A and 10B and the position error of the mounting head 34 caused by the thermal deformation of each part of the related device are corrected so that Chip 6 is correctly positioned relative to substrate 16 .

The position judging section of the substrate supporting unit 66 similarly performs a process of judging whether the first and second substrate supporting units 10A and 10B are correctly positioned based on the position of the reference point detected by the recognition processing unit 62 . The judgment result is sent to the reporting unit 68; in the case of judging that the position of the first or second substrate supporting unit 10A or 10B has not been corrected, the reporting unit 68 generates a report warning of such an error.

With this configuration, during the step of repeating the moving action of the first or second substrate supporting unit 10A or 10B between the operation position P1 and the maintenance position P2, any malfunction that may occur when, for some reason, can be prevented When the first or second substrate supporting unit 10A or 10B continues to operate in a state of being erroneously positioned at the operation position P1. The position judgment of the substrate support unit can be performed by using the already set reference observation camera without adding any new constituent elements.

Meanwhile, in the above example, it was confirmed that the movement of the first and second substrate supporting units 10A and 10B between the operation position P1 and the maintenance position P2 is performed manually by the operator to slide the slide table 50. However, as shown in FIGS. 10 and 11, an SHU supporting device 110 provided with an actuator that reciprocates the slide table 50 may be used. That is, according to this configuration, the SHU supporting device 110 includes an actuator that moves the first and second substrate supporting units 10A and 10B between the operation position P1 and the maintenance position P2. With this configuration, the slide table 50 can be moved automatically without manual operation by an operator.

In FIG. 10 , the slider 51 is arranged on the lower plane of the slide table 50, and the slider 51 is arranged on the guide rail 52 so as to slide freely in the Y direction. The guide rail 52 is arranged on the upper plane of the base 1, as shown in FIG. 5 An example of construction is shown. Between the guide rails 52, an air cylinder 70 is arranged, and the protruding or retreating direction of the rod 70a is directed in the Y direction. A stopper 71 connecting the tip of the rod 70a is fixed to the lower plane of the slide table 50, and by operating the air cylinder 70 to protrude or recess the rod 70a, the slide table 50 is moved reciprocally guided by the guide rail 52 in the Y direction.

On the upper plane of the abutment 1 , positioning elements 72 and 73 are arranged. As shown in FIG. 10 , in the case where the rod 70 a protrudes so that the slide table 50 moves to the operation position P1 , the stopper 71 and the positioning member 72 come into contact and stop. The sliding table 50 is then correctly positioned in the operating position P1 and is fixed there because the brake 71 is pushed against the positioning element 72 by means of the cylinder 70 . That is, according to this configuration example, the air cylinder 70 , the stopper 71 and the positioning member 72 constitute fixing means for fixing the slide table 50 at the operation position P1 .

In addition, FIG. 11 shows a state where the slide table 50 is positioned at the maintenance position P2 by retracting the lever 70a. That is, since the stopper 71 is in contact with the positioning member 73, the position of the slide table 50 is correctly located at the maintenance position P2 and fixed there.

This application is based on and claims the benefit of priority from Japanese Patent Application No. 2003-433143 filed on December 26, 2003, the entire disclosure of which is incorporated herein by reference.

Industrial applicability

The electronic component mounting device of the present invention has the advantage of improving work efficiency by improving accessibility from the outside to the substrate support unit, and the device is suitable for electronic component mounting having a configuration of a plurality of beam elements moving on a general support frame Devices are useful.

Claims (11)

1. electronic component mounting apparatus comprises:

Nozzle, it supports electronic unit by suction, and supports electronic unit with described nozzle and electronic unit is installed on the substrate by suction;

Base station;

The substrate supporter, it is arranged in this base station central part and supports described substrate;

Base plate transmission device, it is by being that transmission base plate is introduced this substrate and sent this substrate to described substrate supporter or from described substrate supporter on the directions X in the board transport direction;

A pair of scaffold, thus its both sides that are arranged in described substrate are across the board transport route that is limited by described base plate transmission device;

The electronic unit feed unit, it is arranged in the side of the described substrate supporter between the described a pair of scaffold on the described base station;

The beam element, thus can on Y direction, move freely by described scaffold supporting at its both ends perpendicular to described board transport direction;

Y-axis shift moves device, and it is the trave lling girder element on the Y direction, and moving range comprises the space of described substrate supporter top and the space of described electronic unit feed unit top thus;

Assembly head, it is made and can be moved freely on directions X by the support of described beam element;

The X-axis mobile device, it moves this assembly head on directions X; With

The supporting arrangement of substrate supporter, this supporting arrangement supports described substrate supporter in the mode that the substrate supporter can move between operating position and maintenance position, can introduce or send substrate by described base plate transmission device at this operating position place, this maintenance position is arranged in and surpasses this operating position on the Y direction away from described electronic unit feed unit.

2. the described electronic component mounting apparatus of claim 1, the supporting arrangement of wherein said substrate supporter are included in the driver that moves described substrate supporter between described operating position and the described maintenance position.

3. the described electronic component mounting apparatus of claim 1, the supporting arrangement of wherein said substrate supporter are provided with on described base station substantially at the linearly moving sliding stand of Y direction, and described substrate supporter is arranged on the described sliding stand.

4. the described electronic component mounting apparatus of claim 3 also comprises: in the fixture of the fixing described sliding stand of described operating position.

5. the described electronic component mounting apparatus of claim 3 also comprises:

But the datum mark of the optical detection on described sliding stand or described substrate supporter,

Catch the reference observation camera of the image of this datum mark,

From the identification processing unit of the view data obtained by reference observation camera identification reference point location and

The position judgment unit of substrate supporter, it judges based on the position of the datum mark of being discerned by described identification processing unit whether the substrate supporter accurately locatees at described operating position.

6. the described electronic component mounting apparatus of claim 3 wherein also comprises:

But be arranged in the datum mark of the optical detection on described sliding stand or the described substrate supporter,

Catch the reference observation camera of this datum mark,

From the identification processing unit of the view data obtained by reference observation camera identification reference point location and

The thermal distortion correction calculating unit, it is based on revising the error that is caused by thermal deformation by the position of the datum mark of described identification processing unit identification.

7. the described electronic component mounting apparatus of claim 3 also comprises:

But be arranged in the datum mark of the optical detection on described sliding stand or the described substrate supporter,

Catch the reference observation camera of this datum mark,

From the identification processing unit of the view data obtained by reference observation camera identification reference point location,

The position judgment parts of substrate supporter, it judges based on the position of the datum mark of being discerned by described identification processing unit whether the substrate supporter accurately locatees at described operating position,

With

The thermal distortion correction calculating unit, it revises the error that is caused by thermal deformation based on the position of the datum mark of being discerned by described identification processing unit.

8. each described electronic component mounting apparatus of claim 5 to 7, wherein said reference observation camera is the video camera that is used for discerning substrate.

9. each described electronic component mounting apparatus of claim 5 to 7, wherein said reference observation camera is mounted in the video camera on the described assembly head.

10. each described electronic component mounting apparatus of claim 5 to 7, wherein said reference observation camera is the video camera that is used to detect the mounting condition that is installed in the electronic unit on the substrate.

11. each described electronic component mounting apparatus of claim 5 to 7 also comprises:

The second beam element, at its two ends by the supporting of described scaffold make can on the Y direction, move freely and

Second y-axis shift moves device, it is moving this second beam element making progress of described substrate supporter on Y direction between space and the going-back position, this going-back position be arranged on the Y direction surpass this substrate supporter upwards space away from described electronic unit feed unit

Wherein said reference observation camera is made and can be moved freely on directions X by described second beam element supporting.

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