JP2003282642A - Electronic parts mounting unit and method of mounting the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic parts mounting unit and a method of mounting electronic parts, where structure of a mounting head is simplified to enable it to perform high-speed operation and the coating operation by the mounting head is eliminated to improve operation efficiency. <P>SOLUTION: The electronic parts mounting unit coats flux on chips 6 which are supplied to an electronic parts supply section 2 by facing their bump-forming surface upward, and mounts the chips on a substrate. In the electronic parts, a holding head 74 that receives the chips 6 taken out by the mounting head 33 from adhesive sheet 5 overturns with respect to a stage 79 on which flux is applied, and performs flux coating onto the bumps of chips 6 and flattening. The mounting head 33 takes out the chips 6 arranged on the stage 79 to mount them on the substrate after returning the holding head 74 to an original position. Thus, the function of the mounting head 33 is limited to moving/mounting operation to simplify the structure. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and electronic component mounting method for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, a mounting operation of repeatedly holding an electronic component taken out from an electronic component supply section by a mounting head and mounting it on a substrate is repeated. Among electronic components, an electronic component such as a flip chip in which bumps, which are protruding electrodes for connection, are formed is generally supplied with the bump formation surface facing upward.

The electronic component is taken out from the electronic component supply section by a dedicated pickup means having a reversing mechanism, and the taken out electronic component is reversed by the reversing mechanism and held with the bumps facing downward. . Then, the mounting head that mounts the electronic component on the substrate receives the inverted electronic component, and then performs the flux transfer operation of transferring and applying the flux to the bump at the flux transfer stage, and then moves onto the substrate to move the electronic component. The parts were being loaded.

[0004]

In the above-mentioned conventional electronic component mounting apparatus, the mounting head for mounting the electronic component on the substrate also serves as the working head for performing the flux transfer operation. Since the flux transfer operation is often performed also as a flattening operation of pressing the lower end portion of the bump of the electronic component against a flat surface to shape the bump, the flux transfer operation is also performed for the mounting head. A pressing mechanism for pressing the bump against the flattening surface at the time of flattening is required, and further, it is necessary to have a strength enough to withstand this pressing force. For this reason, there is a limit to the simplification and weight reduction of the mounting head, which is a factor that hinders the speeding up of mounting operation.

Even when flattening is not required, since the flux transfer operation and the mounting operation are performed in series by the same mounting head, it is possible to complete the mounting on the substrate after the components are taken out. Tact time was delayed and it was difficult to improve overall work efficiency.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of improving the work efficiency by eliminating the work of applying an adhesive substance by the mounting head.

[0007]

According to another aspect of the present invention, there is provided an electronic component mounting apparatus, wherein a plurality of projecting electrodes are applied to a projecting electrode of an electronic component having a plurality of projecting electrodes formed on a projecting electrode forming surface by applying an adhesive to the work. An electronic component mounting apparatus to be mounted, wherein an adhesive supply part for supplying an adhesive in a state where a liquid surface is flattened by spreading the adhesive on a flat stage, and the adhesive having a flattened liquid surface An electronic component arranged on the adhesive, which has an arrangement means for arranging the electronic component on the object in a state where the protruding electrode is in contact with the adhesive, and a mounting head having a mounting nozzle for adsorbing and holding the electronic component. Mounting means for picking up by the mounting nozzle and mounting it on a work; and electronic part recognition means for recognizing the position of the electronic part from the image acquired by the camera, which has a camera for imaging the electronic part held by the mounting nozzle. , The above And a mounting control means for positioning the electronic component held by the mounting nozzle by controlling the mounting means on the basis of the recognition result of the electronic component recognition unit to work.

An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, further comprising a squeegee for spreading the adhesive on the stage to flatten the liquid surface thereof.

An electronic component mounting apparatus according to a third aspect is the electronic component mounting apparatus according to the first aspect or the second aspect, wherein the arranging means has a protruding electrode forming surface of the electronic component facing upward. A holding head for holding the back surface of the electronic component is provided, and the holding head is turned upside down with respect to the stage to place the electronic component held by the holding head on the adhesive.

An electronic component mounting apparatus according to a fourth aspect is the electronic component mounting apparatus according to the third aspect, further comprising an electronic component supply section for supplying the electronic component with a protruding electrode forming surface facing upward. Electronic components are picked up from the electronic component supply unit by the mounting nozzle of the mounting head and delivered to the holding head.

An electronic component mounting apparatus according to a fifth aspect is the electronic component mounting apparatus according to the third aspect, in which the electronic component is supplied with the protruding electrode forming surface facing upward, and a pickup. Pickup means for picking up an electronic component from the electronic component supply unit by the pickup nozzle of the head and delivering it to the holding head.

An electronic component mounting apparatus according to a sixth aspect is the electronic component mounting apparatus according to the first aspect, further comprising an electronic component supply section for supplying the electronic component with a protruding electrode forming surface facing downward. The arranging means includes a pickup head that picks up and picks up the back surface of the electronic component of the electronic component supply section by a pickup nozzle to pick up and place the electronic component on the adhesive.

The electronic component mounting method according to claim 7 is an electronic component mounting method in which an adhesive is applied to the protruding electrodes of an electronic component having a plurality of protruding electrodes on the protruding electrode forming surface and the electronic components are mounted on a work. There is a liquid level flattening step of flattening the liquid surface by spreading the adhesive on a flat stage, and an electronic component on the adhesive with the liquid level flattened and the protruding electrode as the adhesive. A placement step of placing in contact with each other, a pickup step of picking up and picking up the electronic component placed on the adhesive by a mounting nozzle of a mounting head, and an electronic component held by the mounting nozzle is imaged by a camera. A component recognition process for recognizing the position of this electronic component from the image acquired by this imaging, and a mounting head is moved based on the recognition result of the component recognition process to align the electronic component with the work and then mounting And a degree.

The electronic component mounting method according to claim 8 is the electronic component mounting method according to claim 7, wherein in the liquid leveling step, an adhesive is spread on the stage by a squeegee and the liquid surface thereof is spread. Flatten.

An electronic component mounting method according to a ninth aspect is the electronic component mounting method according to the seventh aspect, wherein in the arranging step, the back surface of the electronic component is placed with the protruding electrode forming surface of the electronic component facing upward. The sucked holding head is turned upside down with respect to the stage so that the electronic component held by the holding head is arranged on the flattened liquid surface of the adhesive.

An electronic component mounting method according to a tenth aspect of the present invention is the electronic component mounting method according to the ninth aspect, wherein the electronic component is supplied from an electronic component supply section that supplies the electronic component with a protruding electrode formation surface facing upward. Is picked up by the mounting head and transferred to the holding head.

An electronic component mounting method according to an eleventh aspect is the electronic component mounting method according to the ninth aspect, wherein the electronic component is supplied from an electronic component supply section that supplies the electronic component with a protruding electrode forming surface facing upward. Is picked up by the pickup nozzle of the pickup head and transferred to the holding head.

An electronic component mounting method according to a twelfth aspect is the electronic component mounting method according to the seventh aspect, wherein in the arranging step, the electronic component is supplied with the protruding electrode forming surface facing downward. The backside of the electronic component is adsorbed and held by the pickup head from the section, and the electronic component held by the pickup head is arranged on the flattened liquid surface of the adhesive.

According to the present invention, the electronic component picked up from the electronic component supply unit is placed on the adhesive material spread on the flat stage, whereby the application of the adhesive material to the bump is completed and the adhesive material is applied onto the adhesive material. By taking out the arranged electronic components by the mounting head and mounting them on the work, it is possible to improve the work efficiency by eliminating the work of coating the adhesive with the mounting head.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a plan view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a side sectional view of an electronic component mounting apparatus according to Embodiment 1 of the present invention. Figure, Figure 3
Is a plan sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention, FIG. 4 is a perspective view of an inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIGS. Of operation of the reversing stage of the electronic component mounting apparatus of the first mode,
7 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. 8 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the first embodiment of the present invention. 9 is a timing chart of the electronic component mounting method according to the first embodiment of the present invention, FIG. 10, FIG. 11, FIG. 12, and FIG.
Is a process explanatory view of the electronic component mounting method according to the first embodiment of the present invention, and FIG. 14 is a plan view of a substrate which is an electronic component mounting target according to the first embodiment of the present invention.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. 1, 2, and 3. 2 shows a view taken along the line AA in FIG. 1, and FIG. 3 shows a view taken along the line BB in FIG. In FIG. 1, an electronic component supply unit 2 is arranged on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder (jig holding unit) 3
The jig holder 3 detachably holds the jig 4 to which the adhesive sheet 5 is attached.

A semiconductor chip 6 (hereinafter simply referred to as "chip 6"), which is an electronic component, is attached to the adhesive sheet 5 in a separated state. A plurality of bumps 6a (see FIG. 5A), which are protruding electrodes, are formed on the upper surface of the chip 6, and when the jig 4 is held by the jig holder 3, a plurality of electronic component supply units 2 are provided. The chip 6 is supplied with the bump formation surface (projection electrode formation surface) facing upward.

As shown in FIG. 2, an ejector 8 is arranged below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 has a pin elevating mechanism for elevating an ejector pin (not shown) for pushing up the tip,
From the adhesive sheet 5 to the chip 6 by the mounting head described later.
When picking up, the chip 6 is peeled from the adhesive sheet 5 by pushing up the chip 6 from below the adhesive sheet 5 with an ejector pin. The ejector 8 serves as an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.

As shown in FIG. 3, the substrate holding unit 1 is provided on the upper surface of the base 1 at a position separated from the electronic component supply unit 2 in the Y direction.
0 is placed. A substrate carry-in conveyor 12, a substrate distributing unit 11, and an upstream side and a downstream side of the substrate holding unit 10, respectively.
The board transfer section 13 and the board unloading conveyor 14 are arranged in series in the X direction. The substrate carry-in conveyor 12 receives the substrate 16 supplied from the upstream side and receives the substrate distribution unit 11
Pass to.

The substrate allocating section 11 has a structure in which the allocating conveyor 11a is slidable in the Y direction by a slide mechanism 11b. The substrate 16 (workpiece) received from the substrate loading conveyor 12 will be described below. The two substrate holding mechanisms of the substrate holding unit 10 are selectively distributed. The substrate holding unit 10 includes a first substrate holding mechanism 10A and a second substrate holding mechanism 10B, and holds the substrate 16 sorted by the substrate sorting unit 11 and positions it at the mounting position.

The board transfer section 13 is similar to the board distribution section 11 in that the transfer conveyor 13a is moved by the slide mechanism 13b.
Is configured to be slidable in the direction, the transfer conveyor 13a is selectively connected to the first substrate holding mechanism 10A and the second substrate holding mechanism 10B to receive the mounted substrate 16, and the substrate unloading conveyor. Pass it to 14. The board unloading conveyor 14 carries out the mounted board 16 having been mounted to the downstream side.

In FIG. 1, a first Y-axis base 20A and a second Y-axis base 20B are provided at both ends of the upper surface of the base 1.
Are arranged with their longitudinal direction oriented in the Y direction orthogonal to the substrate transport direction (X direction). The upper surface of the first Y-axis base 20A and the second Y-axis base 20B has a longitudinal direction (Y direction).
The Y-direction guides 21 are arranged over substantially the entire length, and the pair of Y-direction guides 21 are arranged in parallel so as to sandwich the electronic component supply unit 2 and the substrate holding unit 10.

The pair of Y-direction guides 21 includes a first beam member 31, a center beam member 30, and a second beam member 31.
Both ends of the three beam members of the beam member 32 are supported by the Y-direction guides 21 and are slidably installed in the Y-direction.

A nut member 23b is provided on the right side end of the center beam member 30 so as to project therefrom.
The feed screw 23a screwed to the b is the first Y-axis base 20.
It is rotationally driven by a Y-axis motor 22 arranged horizontally on A. By driving the Y-axis motor 22,
The center beam member 30 moves in the Y direction along the Y direction guide 21.
Move horizontally in the direction.

Further, nut members 25b and 25b are provided on the left side end portions of the first beam member 31 and the second beam member 32, respectively.
27b is projected, and the feed screws 25a and 27a screwed to the nut members 25b and 27b are respectively the second Y
The Y-axis motor 2 horizontally arranged on the shaft base 20B.
It is rotationally driven by 4, 26. Y-axis motor 24, 2
By driving 6, the first beam member 31 and the second beam member 32 horizontally move in the Y direction along the Y direction guide 21.

A mounting head 33 is mounted on the center beam member 30, and a feed screw 41a screwed into a nut member 41b connected to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is moved in the X-direction by being guided by the X-direction guide 42 (see FIG. 2) provided on the side surface of the center beam member 30 in the X-direction.

The mounting head 33 is provided with a plurality of nozzles 33a (four mounting nozzles) for sucking and holding one chip 6 (here, four nozzles), and each nozzle 33a sucks and holds the chip 6 to hold a plurality of chips 6. It is possible to move while holding it. By driving the Y-axis motor 22 and the X-axis motor 40, the mounting head 33 horizontally moves in the X and Y directions, picks up and holds the chip 6 of the electronic component supply unit 2, and holds the held chip 6 on the substrate. The board 16 held by the holder 10 is mounted on the electronic component mounting position 16a.

The pair of Y-direction guides 21, the center beam member 30, and the center beam member 30 are attached to the Y-direction guide 21.
Y-direction drive mechanism (Y-axis motor 22,
The feed screw 23a and the nut member 23b) and the X-direction drive mechanism (X-axis motor 40, feed screw 41a, and nut member 41b) that moves the mounting head 33 along the X-direction guide 42 are used to mount the mounting head 33 on an electronic component. Supply unit 2
A mounting head moving mechanism that moves between the substrate holding unit 10 and the substrate holding unit 10 is configured.

The first beam member 31 has the first camera 3
4 is mounted, and a nut member 44b is coupled to a bracket 34a that holds the first camera 34.
The feed screw 44a screwed into the nut member 44b is rotationally driven by the X-axis motor 43, and by driving the X-axis motor 43, the first camera 34 causes the first beam member 3 to move.
1 is moved in the X direction by being guided by the X direction guide 45 (see FIG. 2) provided on the side surface of 1.

By driving the Y-axis motor 24 and the X-axis motor 43, the first camera 34 horizontally moves in the X and Y directions. As a result, the first camera 34 moves the substrate holding unit 10 above the substrate holding unit 10 to capture an image of the substrate 16 held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B, and It is possible to perform a movement for retreating from the holding unit 10.

A pair of Y-direction guides 21, a first beam member 31, and a Y-direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) for moving the first beam member 31 along the Y-direction guide 21. And the first camera 34
X-direction drive mechanism (X-axis motor 43, feed screw 44a and nut member 4)
4b) constitutes a first camera moving mechanism that moves the first camera 34 at least above the substrate holding unit 10.

The second beam member 32 is attached to the second camera 3
5 is mounted, and a nut member 47b is coupled to a bracket 35a that holds the second camera 35. The feed screw 47a screwed onto the nut member 47b is
The second camera 35 is rotationally driven by the shaft motor 46, and by driving the X-axis motor 46, the second camera 35 is guided by the X-direction guide 48 (see FIG. 2) provided on the side surface of the second beam member 32 to move in the X-direction. Move to.

By driving the Y-axis motor 26 and the X-axis motor 46, the second camera 35 horizontally moves in the X and Y directions. As a result, the second camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2 and moves for retreating from the electronic component supply unit 2. And can be done.

A Y-direction drive mechanism (Y-axis motor 26, feed screw 27a and nut member) for moving the pair of first direction guide 21, second beam member 32 and second beam member 32 along the first direction guide 21. 27b) and the X-direction drive mechanism (X-axis motor 46, feed screw 47a, and nut member 47b) that moves the second camera 35 along the X-direction guide 48. A second camera moving mechanism that moves above the unit 2 is configured.

As shown in FIG. 3, a third camera 15 and a reversing stage 17 are arranged between the electronic component supply unit 2 and the substrate holding unit 10. The third camera 15 includes a line camera, and the mounting head 33 holding the chip 6 in the nozzle 33a moves above the third camera 15 to capture the image of the chip 6 held in the nozzle 33a. .

The inverting stage 17 will be described with reference to FIGS. 4, 5 and 6. In FIG. 4, a support post 7 connected to a block 71 is provided on a horizontal base member 70.
Two 2 are erected. An inversion table 73 is rotatably held on the support post 72 around a horizontal shaft 73a, and an inversion actuator 75 is coupled to the shaft 73a. By driving the reversing actuator 75, the shaft 73a rotates 180 degrees, whereby the reversing table 73 performs a vertical reversing operation.

A holding head 74 is provided on the reversing table 73, and the holding head 74 has a chip holding portion 7.
A plurality of 4a (electronic component holders) are arranged. The chip holding portion 74a has suction holes 74b. By vacuum suction from the suction holes 74b in a state where the chip 6 with the bump forming surface facing upward is placed on each chip holding portion 74a, the chip holding portion 74a is held. Holds the chip 6 by suction.
That is, the chip holding portion 74a holds the back surface of the chip 6 with the bump formation surface facing upward (FIG. 5A).
reference).

Here, the chip 6 is transferred to the holding head 74 by picking up the chip 6 from the electronic component supply unit 2 by the nozzle 33a of the mounting head 33 and then holding the chip 6 on the holding head 74 with the chip holding unit 74a facing upward. Is performed by transferring the holding head 7
The arrangement of the chip holding portions 74a in FIG.
It is set so as to match the arrangement of the three nozzles 33a.

Two slide posts 76 are erected on the base member 70, and a slider 77 fitted to the slide posts 76 slidably in the vertical direction is connected to an elevating table 78. A rod 84a of a lifting actuator 84 is coupled to the lifting table 78.
By driving the lifting actuator 84, the lifting table 78 moves up and down along the slide posts 76.

On the upper surface of the lifting table 78, the stage 7
9 is provided. The stage 79 has a flat bottom surface 79a.
Is a flat-bottomed container having a bottom surface 79a, as will be described later.
A transfer stage for transferring and applying the flux 80, which is an adhesive substance, to the bumps 6a of the chip 6, and a flattening stage for flattening the tips of the bumps 6a by pressing the bumps 6a during the transfer operation. It also functions as an arranging stage for arranging the chips 6 to which the flux 80 is transferred and applied in a predetermined arrangement for the taking-out operation by the mounting head 33.

A slide cylinder 81 for horizontally reciprocating the slide block 82 is horizontally arranged on the side surface of the elevating table 78. A squeegee unit 83 having two squeegees 83a and 83b (see FIG. 6) which can be raised and lowered is mounted on the slide block 82 so as to extend above the stage 79. Squeegee 83a, 83
As described below, b has the functions of a flux scraping squeegee and a flux spreading squeegee, respectively.

The flux 80 is supplied onto the bottom surface 79a,
As shown in FIG. 6A, in a state where the squeegee 83a is lowered and brought into sliding contact with the bottom surface 79a, the squeegee unit 83 is
By horizontally moving in the direction of arrow a, the bottom surface 79a
The flux 80 adhered to is scraped to one side.
Then, as shown in FIG. 6B, the squeegee unit 83 is moved downward with the squeegee unit 83 in a state where a predetermined gap is maintained between the bottom surface 79a and the lower end portion of the squeegee 83b.
By horizontally moving in the direction, the squeegee 83b spreads the flux 80 on the bottom surface 79a to flatten the liquid surface.

As a result, a flux film 80a having a predetermined film thickness t and having a flattened liquid surface is formed on the bottom surface 79a. The stage 79 is an adhesive supply unit that supplies a flux film 80a, which is an adhesive with the liquid surface flattened, by spreading the flux that is an adhesive on a flat bottom surface 79a. In addition to the flux 80, a resin adhesive or the like may be used as the adhesive depending on the type of the bump 6a.

When the flux film formation is completed in this way, the lifting actuator 84 is driven to lower the lifting table 78 as shown in FIG. 5 (a). As a result, the stage 79 descends to the transfer height position for transfer coating of the flux 80. And in this state,
As shown in FIG. 5B, the reversing actuator 75 is driven to reverse the reversing table 73 with respect to the stage 79. By this inversion operation, each chip holding portion 74a
The holding head 74 that holds the chip 6 by suction is shown in FIG.
As shown in (c), the flux film 80a is formed on the stage 79 and moves downward while drawing an arc.

Then, as shown in FIG.
If the bump 6a of the above-mentioned bumps abuts against the bottom surface 79a of the stage 79, a load F for pressing the stage 79 upward is applied by the lifting actuator 84. As a result, the bottom surface 79a is pressed against the lower surface of each bump 6a to perform the flattening of the bump 6a, that is, the shaping for flattening the tip of the bump 6a so that the height of the bump 6a is adjusted and the bump height is made uniform. .

Thereafter, the reversing table 73 is reversed to return the holding head 74 to the original position shown in FIG. Then, as shown in FIG. 6E, the chip 6 is placed on the stage 79 with the bumps 6a in contact with the flux film 80a. Here, the size of the stage 79 is determined according to the size of the holding head 74,
The size is such that the plurality of chips 6 held by each chip holding portion 74a can be simultaneously arranged on the flux film 80a. The array of the chips 6 on the stage 79 is the same as the array of the nozzles 33a on the mounting head 33.

The holding head 74 that holds the back surface of the chip 6 with the bump forming surface of the chip 6 facing upward, the reversing table 73 that reverses the holding head 74, and the reversing actuator 75 have a flat liquid surface. It is an arrangement means for arranging the chip 6 on the flux 80 with the bumps 6 a in contact with the flux 80. Then, the arranging means arranges the chips 6 held by the holding head 74 on the flux 80 by turning the holding head 74 upside down with respect to the stage 79. In the arranging operation of the chip 6, the flux 80 is applied to the lower end of the bump 6a by transfer at the same time as being inverted. As a result, the flux (adhesive) coating operation that has been conventionally performed by the mounting head is simultaneously performed by the reversing stage at the time of reversing.

When the placement of the chip 6 on the flux 80 of the stage 79 is completed in this way, the lifting actuator 84 is driven to raise the lifting table 78, and the stage 79 is positioned at the transfer height. Then, in this state, the chip 6 placed on the stage 79 is again held by the nozzle 33 a of the mounting head 33 and mounted on the substrate 16 held by the substrate holding unit 10. Then, in the process of the mounting head 33 moving to the substrate 16,
The mounting head 33 that holds the chip 6 is the third camera 15
By moving in the X direction above the third camera 1
Reference numeral 5 captures an image of the chip 6 held by the mounting head 33.

Therefore, the mounting head 33 and the above-described mounting head moving mechanism are mounting means having the following functions. That is, this mounting means has a mounting head 33 having a nozzle 33a for holding the chip 6 by suction,
The mounting head 33 picks up the plurality of chips 6 of the electronic component supply unit 2 and transfers them to the holding head 74, and the holding head 74 disposes the chips 6 arranged on the flux 80 of the stage 79 on the plurality of nozzles 33 a of the mounting head 33. These chips 6 held by the mounting head 33 are mounted on the substrate 16 by suction and picked up by.

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 7, the mechanism drive unit 50 includes a motor driver that electrically drives a motor of each mechanism described below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism driving unit 50 by the unit 54,
The following drive elements are driven.

The X-axis motor 40 and the Y-axis motor 22 drive the mounting head moving mechanism for moving the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 are a first camera moving mechanism that moves the first camera 34, and the X-axis motor 46 and the Y-axis motor 26 are a second camera that move the second camera 35. The moving mechanism is driven respectively.

The mechanism driving section 50 drives the lifting mechanism of the mounting head 33 and the component suction mechanism by the nozzles 33a (see FIG. 2) to lift the lifting actuator 75, lifting actuator 84, and ejector 8 of the reversing stage 17. The drive motor for the cylinder and ejector XY table 7 is driven. Further, the mechanism driving unit 50 drives the substrate carry-in conveyor 12, the substrate carry-out conveyor 14, the substrate sorting unit 11, the substrate transfer unit 13, the first substrate holding mechanism 10A, and the second substrate holding mechanism 10B.

The first recognition processing section 55 uses the first camera 3
The image captured in 4 is processed to recognize the position of the electronic component mounting position 16a (see FIG. 14) of the board 16 held by the board holding unit 10. The electronic component mounting position 16a is the substrate 16
16b to which bump 6a of chip 6 is bonded in
It shows the overall position of, and the position can be detected by image recognition.

Further, the first recognition processing section 55 carries out a board quality inspection by detecting the presence or absence of a bad mark applied to the board 16 for each electronic component mounting position 16a in the previous step. Furthermore, the chip 6 mounted on the electronic component mounting position 16a by processing the image captured by the first camera 34
Check the mounting condition such as the position shift.

The second recognition processing section 56 uses the second camera 3
The image picked up in 5 is processed to obtain the position of the chip 6 of the electronic component supply unit 2. The third recognition processing unit 57 processes the image captured by the third camera 15 and obtains the position of the chip 6 held by the mounting head 33. Therefore, the third recognition processing unit 57 serves as an electronic component recognition unit that recognizes the position of the chip 6 from the image acquired by the third camera 15.

The recognition results of the first recognition processing section 55, the second recognition processing section 56, and the third recognition processing section 57 are sent to the control section 54. The data storage unit 53 stores various data such as the inspection result of the board inspection and the mounting state inspection of the chip 6. The operation unit 51 is an input device such as a keyboard and a mouse, and performs data input and control command input.
The display unit 52 includes a first camera 34, a second camera 35,
The display of the image pickup screen by the third camera 15 and the operation unit 51
Display the guide screen when inputting.

Next, the processing function of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 8, a broken line frame 54
Shows the processing function of the control unit 54 shown in FIG.
Here, the processing functions executed by the first camera movement processing unit 54a, the second camera movement processing unit 54b, the reversal stage operation processing unit 54c, the pickup control unit 54d, and the mounting control unit 54e are respectively the first camera movement processing unit. The control means, the second camera movement control means, the reversing stage operation control means, the pickup control means, and the mounting control means are configured.

The first camera movement processing section 54a controls the first camera movement mechanism to perform the positioning operation of the first camera 34 when the board 16 held by the board holding section 10 is picked up and mounted. The retracting operation of moving the first camera 34 to a position that does not hinder the mounting of the chip 6 by the head 33 is performed. Here, the imaging of the substrate 16 is performed by imaging the bad mark application position in a state where the substrate 16 is loaded, the electronic component mounting position 16a before the chip 6 is mounted, and the electronic component after the chip 6 is mounted. The three types of imaging of the mounting position 16a are performed.

The second camera movement processing section 54b controls the second camera movement mechanism to position the second camera 35 when the chip 6 of the electronic component supply section 2 is imaged.
The retracting operation of moving the second camera 35 to a position that does not hinder the pick-up of the electronic component by the mounting head 33 is performed.

The reversing stage operation processing section 54c includes a reversing actuator 75, a lifting actuator 84, a squeegee unit 83 and a suction hole 74b of the holding head 74.
By controlling the vacuum suction operation from the mounting head 33 so that the chip 6 transferred from the mounting head 33 is turned upside down.
The placement operation is performed until it is placed on top.

The pickup control section 54d controls the mounting head moving mechanism to determine the positioning operation of the mounting head 33 when picking up the chip 6 from the electronic component supply section 2 by the second recognition processing section 56. It is performed based on the position of 6.

The mounting control section 54e controls the mounting head moving mechanism to control the positioning operation of the mounting head 33 when the chip 6 is mounted on the substrate 16 of the substrate holding section 10 by the electronic control of the first recognition processing section 55. This is performed based on the position of the electronic component mounting position 16a determined by the component mounting position detection processing unit 55a and the position of the chip 6 determined by the third recognition processing unit 57.
Therefore, the mounting control unit 54e serves as a mounting control unit that controls the mounting unit based on the recognition result of the electronic component recognition unit and positions the chip 6 held by the mounting nozzle 33 on the substrate 16.

The first recognition processing section 55 has a board inspection processing section 55b and a mounting state inspection processing section 55c in addition to the electronic component mounting position detection processing section 55a. Mounting control unit 54
In the mounting operation by e, the quality determination result of the board 16 detected by the board inspection processing unit 55b is referred to,
Electronic component mounting position 1 that was judged to be acceptable in the quality judgment
The chip 6 is mounted only on 6a.

The inspection result recording processing section 54f performs processing for storing the above-mentioned board quality determination result by the board inspection processing section 55b and the mounting state inspection result of the chip 6 by the mounting state inspection processing section 55c. These inspection results are sent to the inspection result recording processing unit 54f for data processing, and stored in the inspection result storage unit 53a provided in the data storage unit 53.

This electronic component mounting apparatus is configured as described above, and an electronic component mounting method will be described below with reference to the timing chart of FIG. 9 and each of FIGS. 10 to 14. FIG. 9 shows a time-series relationship of each unit process in the electronic component mounting operation execution process, and here, the operation from the first turn to the fifth turn is shown.

These unit processes include (1) liquid leveling process, (2) placement process, (3) mounting process, (4) transfer process, (5) component recognition process, and (6) substrate recognition process. , (7)
Among the unit processes, among these unit processes, (2) placement process, (3) mounting process, (4) transfer process, and (6) board recognition process are as shown in FIG. Further, it is divided into two sub-unit processes that are performed one after another in time.

Each unit process will be described. (1) The liquid level flattening step is a step of flattening the liquid level by spreading the flux 80 by the squeegee unit 83 on the bottom surface 79a, which is a flat stage, and the squeegee unit 83 By performing the ing operation, a flux film 80a having a flat liquid surface is formed on the bottom surface 79a of the stage 79 (see FIG. 10A).

(2) In the arranging step, the holding head 74, which has sucked the back surface of the chip 6 with the bump forming surface of the chip 6 facing upward, is turned upside down with respect to the stage 79, and is held by the holding head 74. Is a step of arranging the formed chip 6 on the flattened liquid surface of the flux 80,
When the chip 6 is landed, the bumps 6a are placed on the flux 80 in a state of being in contact with the flux 80. Further, in this arranging step, the plurality of chips 6 held by the holding head 74 are spread on the flat stage and the flux 8 is spread.
The flux 80 is applied to the bumps 6 a of the chip 6 by arranging the flux 80 on the bumps 6 a.

This arrangement process is composed of the following two sub-processes. (2) -1 Placement process (reversal / shaping)
By reversing the holding head 74 holding the chip 6, the chip 6 is pressed against the stage 79 on which the flux film 80a is formed to shape the height of the bump 6a. (2) -2 Placement process (return / up) is bump 6
This is a step of returning the holding head 74 to the original position after height shaping of a and raising the stage 79 on which the shaped chip 6 is arranged (see FIG. 11A).

In the (2) -1 arrangement step (inversion / shaping), the holding head 74 is turned upside down so that the chip 6 held by the holding head 74 faces the bottom surface 79a of the stage 79.
The tip portion of the bump 6a of the chip 6 is pressed against the bottom surface 79a to be shaped flat and the chip 6 is moved to the stage 79.
It also serves as a pressure placement step. Then, prior to this shaping, the above-mentioned (1) liquid surface flattening step is executed,
At the time of shaping, the flux 80 is applied to the bumps 6a of the chip 6.

(3) The mounting process is performed on the bottom surface 7 of the stage 79.
This is a process of adsorbing the chip 6 arranged on the substrate 9a by a plurality of nozzles 33a of the mounting head 33, taking it out, and mounting it on the substrate 16, which is constituted by the following two sub-processes. (3) -1 The mounting process (removal) is the stage 79
In this step, a plurality of chips 6 arranged on the flux 80 on the bottom surface 79a are adsorbed and taken out by the nozzles 33a of the mounting head 33 (see FIG. 11B).
At this time, the plurality of chips 6 are taken out from the stage 79 by the nozzles 33a for each chip 6 at the same time.

(3) -2 In the mounting step (mounting), the mounting head 33 is moved based on the recognition result of the component recognition step, and the plurality of chips 6 held by the nozzles 33a are placed on the substrate 16.
And the chip 6 is individually mounted on the substrate 16 (see FIG. 12B).

(4) The transfer step is a step of picking up the chip 6 from the electronic component supply section 2 by the mounting head 33 and delivering it to the holding head 74, and is composed of the following two sub steps. (4) -1 Transfer process (pickup)
Is mounted on the mounting head 3 with the plurality of chips 6 supplied with the bump forming surface facing upward in the electronic component supply unit 2.
This is a step of individually picking up by a plurality of three nozzles 33a (see FIG. 10B).

(4) -2 The transfer step (delivery) is a step of holding the back surfaces of the plurality of chips 6 picked up from the electronic component supply section 2 in the chip holding section 74a of the holding head 74 and delivering them ( See FIG. 11B). At this time, the nozzle 33a of the mounting head 33 to the holding head 74
Delivery of a plurality of chips 6 to and from each chip 6 is performed simultaneously for each chip 6. This (4) -2 transfer step is an electronic component holding step in which the holding head 74 holds the chip 6 with the chip holding portion 74a of the holding head 74 facing upward.

(5) The component recognition process is performed by the electronic component supply unit 2
10 is a step of recognizing the position by imaging the chip 6 with the second camera 35 (FIGS. 10A and 10B).
See FIG. 12B). (6) The board recognizing step is a step in which the board 16 is imaged by the first camera 34 in the board holding unit 10 to perform image recognition for a predetermined purpose.
It consists of two sub-processes.

(6) -1 Substrate recognition process (mounting position recognition)
Is a step of recognizing the position of the electronic component mounting position 16a by imaging the substrate 16 before mounting the chip by the first camera 34 (see FIG. 10A). The (6) -2 board recognition step (mounting state inspection) is a step of inspecting the mounting state by imaging the substrate 16 after mounting the chip (see FIG. 13A). (7) The component recognition step is a step in which the chip 6 before mounting held by the mounting head 33 is imaged by the third camera 15, and the position of the chip 6 is recognized from the image acquired by this imaging (FIG. 12). (See (a)).

Next, the electronic component mounting method will be described while showing the time-series relationship between the above-mentioned respective unit processes. Figure 1
In FIG. 0 (a), a large number of chips 6 are attached to the adhesive sheet 5 of the jig 4 held by the electronic component supply unit 2 with the bump forming surface facing upward. In the substrate holding unit 10, the substrates 16 are positioned in the first substrate holding mechanism 10A and the second substrate holding mechanism 10B, respectively.

First, the first turn is started. Figure 10
As shown in (a), the second camera 35 moves above the electronic component supply unit 2 and takes an image of a plurality of (four) chips 6 to be mounted in the first turn. Then, the image captured by the second camera 35 is processed by the second recognition processing unit 56 to obtain the positions of the plurality of chips 6.

At this time, the first camera 34 moves onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10 and is set on the substrate 16 as shown in FIG. 14 (a). Of the eight electronic component mounting positions 16a, 4 on the left side
The first camera 34 is sequentially moved so that the image capturing range 18 sequentially surrounds one electronic component mounting position 16a, and a plurality of electronic component mounting positions 16a are imaged to capture an image. Then, the first recognition processing unit 55 processes the image of the image capturing range 18 captured by the first camera 34 to obtain the position of the electronic component mounting position 16a of the board 16.

Further, in parallel with the above operation, in the reversing stage 17, the squeegee unit 83 spreads the flux 80 on the stage 79 to spread the flux film 80a.
Squeegee to form. That is, here, (5) component recognition process, (6) -1 substrate recognition process (mounting position recognition), and (1) liquid level flattening process are simultaneously executed in parallel (see FIG. 9).

Next, the mounting head 33 is attached to the electronic component supply unit 2
Of the mounting head 33, the mounting head 33 is sequentially positioned on these chips 6 based on the recognized positions of the plurality of chips 6 as shown in FIG. 10B. The plurality of chips 6 are sequentially picked up by the four nozzles 33a. Next, the mounting head 33 moves onto the holding head 74 and transfers the held plurality of chips 6 to the chip holding portion 74a.

The mounting head 33 is connected to the electronic component supply unit 2
When the second camera 35 exits from above, the second camera 35 immediately advances onto the electronic component supply unit 2, and in the second turn, images the chip 6 to be mounted and recognizes the position. here,
(4) -1 After the transfer step (pickup), (4)-
2 transfer process (transfer) is performed, and (4) -2 transfer process (transfer) and (5) component recognition process are simultaneously executed in parallel (see FIG. 9).

Then, as shown in FIG. 11A, when the second camera 35 moves away from the electronic component supply unit 2, the mounting head 33 moves onto the electronic component supply unit 2 and mounts on the second turn. The target chip 6 is individually picked up. In parallel with this, in the reversal stage 17, first, in the (1) liquid level flattening step, the flux film 8 is formed.
The stage 79 after the formation of 0a descends to the transfer height position,
Next, the holding head 74 is turned upside down with respect to the stage 79. As a result, the bumps 6 a of the chip 6 held by the holding head 74 face and come into contact with the bottom surface 79 a of the stage 79. Then, by pushing the stage 79 upward, shaping is performed to flatten the tip end portion of the bump 6a of the chip 6 (see FIG. 6D).

After that, the holding head 74 reverses and returns to the original position after releasing the vacuum suction from the suction hole 74b, and the stage 79 rises to the delivery height position. That is, here, (4) -1 transfer step (pickup)
And (2) placement step ((2) -1 placement step (reversal / shaping) and (2) -2 placement step (return / upward)) are simultaneously performed in parallel.

Next, as shown in FIG. 11B, the mounting head 33 picking up the plurality of chips 6 from the electronic component supply unit 2 moves above the holding head 74. After passing the held chip 6 to the holding head 74, the mounting head 33 immediately moves onto the stage 79, and the chip 6 arranged on the flux film 80a is taken out by the nozzle 33a.

Here, the (3) -1 mounting process (removal) is executed subsequent to the (4) -2 transfer process (delivery). Then, in this transfer step, the chip 6 placed on the stage 79 is immediately transferred to the holding head 74 from the mounting head 33.
Is taken out by the nozzle 33a of the mounting head 33.

Then, as shown in FIG. 12A, when the removal of the chip 6 from the stage 79 is completed,
In the reversing stage 17, a liquid level flattening process is performed in which the liquid level of the flux 80 of the stage 79 is flattened by the squeegee unit 83, and the flux film 80a is formed again on the stage 79.

The mounting head 33, which has taken out the chip 6 from the stage 79 and held it on the nozzle 33a, performs a scanning operation of moving above the third camera 15 and then performs the first operation.
The substrate 16 is held by the substrate holding mechanism 10A. Then, the image of the chip 6 held by scanning is taken in and the position of the chip 6 is recognized. here,
(7) Component recognition process (before mounting) and (1) liquid level flattening process are executed in parallel.

Thereafter, as shown in FIG. 12B, the mounting head 33 mounts the chip 6 on the substrate 16. Here, the mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the board inspection determination result. As a result, as shown in FIG. 14B, the chips 6 are mounted on the four electronic component mounting positions 16 a of the substrate 16.

Then, when the mounting head 33 mounts the chip 6, in the reversing stage 17, as shown in FIG.
(2) Arrangement step ((2) -1 arrangement step (reverse / shaping), (2) -2 arrangement step (return / rise)) similar to (a)
Is performed subsequent to the (1) liquid surface flattening step shown in FIG.

Further, in the electronic component supply unit 2, the second
The camera 35 picks up an image and recognizes the position of the chip 6 to be mounted in the third turn. Here, during execution of the (3) -2 mounting step (mounting), (2) arrangement step ((2) -1 arrangement step (reverse / shaping), (2)-
2 placement process (return / up) and (5) component recognition process are executed.

Next, as shown in FIG. 13A, when the second camera 35 leaves the electronic component supply unit 2, the mounting head 33 moves to the electronic component supply unit 2 and in the third turn. The chips 6 to be mounted are individually picked up. During this pick-up operation, the first camera 34 is moved onto the first substrate holding mechanism 10A of the substrate holding unit 10 and the substrate 16 is imaged. Here, inspection of the mounting state of the chip 6 mounted on the substrate 16 and position recognition of the plurality of electronic component mounting positions 16a on which the chip 6 is mounted in the next mounting turn are performed.

That is, in this image pickup, as shown in FIG. 14C, the first camera 34 is sequentially moved so that the image capturing range 18 sequentially surrounds the eight electronic component mounting positions 16 a set on the substrate 16. Then, the image is captured, and then the first camera 34 is retracted from above the substrate 16. Then, the image captured by the first camera 34 is processed by the first recognition processing unit 55, and the next inspection processing is performed.

First, with respect to the images in the four image capturing areas 18 on the left side, the mounting state of the chip 6, that is, whether the displacement of the position / orientation of the chip 6 is normal is inspected. Then, regarding the four image capturing ranges 18 on the right side, the position recognition of the electronic component mounting position 16a of the substrate 16 is performed. Here, during execution of (4) -1 transfer step (pickup), (6) board recognition step ((6) -1 board recognition step (mounting position recognition), (6) -2 board recognition step (mounting) Condition inspection)) is performed.

After that, the operation shifts to the operation shown in FIG. 13 (b). In this operation, similarly to the operation shown in FIG. 11B, the (3) -1 mounting step (removal) is executed following the (4) -2 transfer step (delivery). Thereafter, the same unit process as described above is repeatedly executed at the same timing.

As a result, as shown in FIG. 14D, the mounting of the chips 6 on the respective electronic component mounting positions 16a of the substrate 16 is completed, and thereafter, as shown in FIG. Image pickup for mounting state inspection of 6 is performed, and the electronic component mounting work on the board 16 is completed.

As described above, in the electronic component mounting method according to the first embodiment, the nozzles 33a of the mounting head 33 are arranged on the flux 80 of the stage 17 by the holding head 74 provided in the reversing stage 17. The chips 6 are arranged in parallel in the same manner as described above, and flux application to the bumps 6a and flattening of the bumps 6a are performed.

As a result, the mounting head does not require a pressing mechanism for pressing the bumps against the flattening surface during flattening which also serves as flux transfer, and further does not require sufficient strength to withstand this pressing force. . Therefore, the structure of the mounting head 33 can be simplified and the weight thereof can be reduced, and the mounting operation can be speeded up.

In the mounting operation, the holding head 74
The flux transfer operation, which also serves as the flattening operation performed by the mounting head 33, and the mounting operation by the mounting head 33 can be performed in parallel, and the tact time until the completion of mounting on the board after the component is taken out can be shortened. The work efficiency of can be improved.

Further, in the present embodiment, the mounting head 3
3 is provided with a plurality of nozzles 33a, and the holding head 74 is also provided with a plurality of chip holding portions 74a so that the mounting head 33 and the holding head 74 are aligned. 6 can be simultaneously delivered, and the holding head 7
4 allows the plurality of chips 6 arranged on the flux film 80a to be taken out simultaneously by the mounting head 33. Therefore, the mounting work time of the chip 6 by the mounting head 33 can be shortened and the productivity can be improved. In addition,
In the present embodiment, if shaping of the bumps 6a is not necessary, the pressing (shaping of the bumps 6a) in the placement step may be omitted.

(Embodiment 2) FIG. 15 is a plan view of an electronic component mounting apparatus according to Embodiment 2 of the present invention, FIG. 16 is a side sectional view of an electronic component mounting apparatus according to Embodiment 2 of the present invention, and FIG. Is a plan sectional view of an electronic component mounting apparatus according to a second embodiment of the present invention,
18 is a block diagram showing the configuration of a control system of the electronic component mounting apparatus according to the second embodiment of the present invention, and FIG. 19 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the second embodiment of the present invention. 20 is a timing chart of the electronic component mounting method according to the second embodiment of the present invention, and FIGS. 21, 22, 23, and 24 are process explanatory diagrams of the electronic component mounting method according to the second embodiment of the present invention.

In the second embodiment, as in the first embodiment, the chip 6 supplied by the electronic component supply unit 2 is mounted on the substrate 16 held by the substrate holding unit 10 via the inversion stage 17. The electronic component mounting apparatus includes a dedicated head for picking up the chip 6 from the electronic component supply unit 2. In the following description, the same elements as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

First, referring to FIGS. 15, 16 and 17,
The overall structure of the electronic component mounting device will be described. 16 is shown in FIG.
5 shows an AA arrow view, and FIG. 17 shows a BB arrow view in FIG. In FIG. 15, on the base 1, an electronic component supply unit 2, a reversal stage 17, a third camera 15, a substrate holding unit 10, a substrate sorting unit 11, and a substrate receiving unit which have the same configuration as those shown in the first embodiment. A transfer section 13 is provided.

Of the three beam members that move in the Y direction, the first beam member 31 and the center beam member 30 are provided with the first camera 34 and the mounting head 33, respectively, as in the first embodiment. . As shown in FIG. 15, a pickup head 36 is mounted on the second beam member 32, and a second camera 35 is integrally coupled to the side surface of the pickup head 36. The pickup head 36 includes a plurality of nozzles 36a (pickup nozzles) arranged in the same arrangement as the nozzles 33a of the mounting head 33.

By driving the Y-axis motor 26 and the X-axis motor 46, the pickup head 36 and the second camera 35 are integrally moved horizontally in the X and Y directions.
As a result, the pickup head 36 picks up the chip 6 from the electronic component supply unit 2 with the nozzle 36 a and transfers the chip 6 to the holding head 74 of the reversing stage 17. Further, the second camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2.

A pair of Y-direction guide 21, second beam member 32, and Y-direction drive mechanism for moving the second beam member 32 along the first direction guide 21 (Y-axis motor 26, feed screw 27a, and nut member). 27b) and the X-direction drive mechanism (X-axis motor 46, feed screw 47a and nut member 47b) for moving the second camera 35 along the second guide 48, the pickup head 36 and the second camera 35. A pickup head moving mechanism that integrally moves above the electronic component supply unit 2 is configured. The pickup head 36 and the pickup head moving mechanism are
The nozzle 36 a of the pickup head 36 constitutes pickup means for picking up the chip 6 from the electronic component supply unit 2 and delivering it to the holding head 74.

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 18, the mechanism drive unit 50 includes, in addition to the elements shown in the first embodiment,
The lift mechanism of the pickup head 36 and the component suction mechanism by the nozzle 36a are driven. The other elements are the same as those in the first embodiment.

Next, the processing function of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 19, the first camera movement processing unit 5 among the processing functions shown by the broken line frame 54
4a, inversion stage operation processing unit 54c, mounting control unit 54
The e and inspection result recording processing unit 54f are the same as those in the first embodiment, and the processing functions of the other processing units are also the same as those in the first embodiment.

The second camera movement processing section 54b controls the pickup head moving mechanism to perform the positioning operation of the second camera 35 when the chip 6 of the electronic component supply section 2 is imaged. The pickup control unit 54d controls the pickup head 36 and the pickup head moving mechanism to position the pickup head 36 when picking up the chip 6 from the electronic component supply unit 2 and delivering it to the holding head 74 of the reversing stage 17. Nozzle 3
The ascending / descending operation of 6a is performed based on the position of the chip 6 obtained by the second recognition processing unit 56. Pickup controller 5
4d is a pickup control means.

The electronic component mounting apparatus is configured as described above, and the electronic component mounting method will be described below with reference to the timing chart of FIG. 20 and the drawings of FIGS. Similar to FIG. 9 of the first embodiment, FIG. 20 shows a time-series relationship of each unit process in the electronic component mounting operation execution process. These unit steps are
Divided into (1) liquid leveling process, (2) placement process, (3) mounting process, (4) transfer process, (5) component recognition process, (6) board recognition process, and (7) component recognition process Among these unit processes, (2) placement process, (3) mounting process, (4) transfer process, and (6) substrate recognition process are
Similarly, it is divided into two sub-unit processes that are performed one after another in time. Among these unit processes, the same execution content as each unit process shown in the first embodiment is provided except for (4) transfer process described below.

(4) The transfer step is a step of picking up the chip 6 from the electronic component supply unit 2 with the pickup head 36 and delivering it to the holding head 74, and is composed of the following two sub-steps. In the (4) -1 transfer step (pickup), the plurality of chips 6 supplied with the bump formation surface facing upward in the electronic component supply unit 2 are individually picked up by the plurality of nozzles 36 a of the pickup head 36. This is the step (see FIG. 10B).

(4) -2 The transfer step (passing) is a step of holding the back surfaces of the plurality of chips 6 picked up from the electronic component supply section 2 in the chip holding section 74a of the holding head 74 and transferring them ( See FIG. 11B). At this time, the plurality of chips 6 are transferred from the nozzles 36 a of the pickup head 36 to the holding head 74.
About at the same time. This (4) -2 transfer step is
In the electronic component holding step, the holding head 74 holds the chip 6 with the chip holding portion 74a of the holding head 74 facing upward.

Next, the electronic component mounting method will be described, showing the time-series relationships of the unit processes. Figure 2
In FIG. 1 (a), a large number of chips 6 are attached to the adhesive sheet 5 of the jig 4 held by the electronic component supply unit 2 with the bump formation surface facing upward. In the substrate holding unit 10, the substrates 16 are positioned in the first substrate holding mechanism 10A and the second substrate holding mechanism 10B, respectively.

First, the first turn is started. Figure 21
As shown in (a), the second camera 35 moves together with the pickup head 36 above the electronic component supply unit 2,
In the first turn, the chip 6 to be mounted is imaged by the second camera 35 and the position is recognized. At this time, the first
The camera 34 moves to the substrate 16 held by the first substrate holding mechanism 10A, sequentially captures the plurality of electronic component mounting positions 16a, and captures images. Then, the image captured by the first camera 34 is processed to obtain the position of the electronic component mounting position 16a of the board 16.

Further, in parallel with the above operation, in the reversing stage 17, the squeegee unit 83 spreads the flux 80 on the stage 79 to spread the flux film 80a.
Squeegee to form. That is, here, (5) component recognition process, (6) -1 substrate recognition process (mounting position recognition), and (1) liquid level flattening process are simultaneously executed (see FIG. 20).

Next, while performing the positioning operation for sequentially positioning the pickup head 36 on these chips 6 based on the recognized positions of the plurality of chips 6, the four nozzles 36a of the pickup head 36 allow the plurality of chips 6 to be positioned. Are picked up in sequence. Then, in FIG.
As shown in (b), the pickup head 36 moves onto the holding head 74 and transfers the held plurality of chips 6 to the chip holding portion 74a. That is, here (4)
The (4) -2 transfer step (delivery) is executed after the -1 transfer step (pickup).

Next, as shown in FIG. 22 (a), the pickup head 36 moves together with the second camera 35 onto the electronic component supply section 2, and picks up the image of the chip 6 to be mounted in the second turn and positions it. Recognize. In parallel with this, in the reversal stage 17, the chip 6 is transferred to the stage 79 which is in the state of being lowered to the transfer height position after the flux film 80a is formed in (1) the liquid surface flattening step. The holding head 74 is turned upside down. As a result, similarly to the first embodiment, the bump 6a of the chip 6 held by the holding head 74 faces and abuts the bottom surface 79a of the stage 79, and shaping is performed to flatten the tip of the bump 6a. That is, here, (5) component recognition process and (2) -1 placement process (reversal / shaping) are simultaneously performed in parallel.

Next, as shown in FIG. 22B, in the electronic component supply section 2, the pickup head 36 individually picks up the chip 6 to be mounted in the second turn. In parallel with this, in the reversing stage 17, the holding head 74 reverses and returns to the original position after releasing the vacuum suction from the suction hole 74b, and the stage 79 moves up to the delivery height position. Then, subsequently, the mounting head 33 takes out the chip 6 placed on the stage 79. Here, during execution of (4) -1 transfer step (pickup), (2) -2 placement step (return
(Ascending), and subsequently (3) -1 mounting step (removal) is performed.

Next, as shown in FIG. 23A, the mounting head 33, which has taken out the chip 6 from the stage 79, performs a scanning operation of moving above the third camera 15 and then the first substrate. Substrate 16 held by holding mechanism 10A
Move above. Then, the image of the chip 6 held by scanning is taken in and the position of the chip 6 is recognized.

In parallel with this operation, in the reversing stage 17, the squeegee unit 83 causes the stage 79 to move.
The squeegee is performed by spreading the flux 80 to form the flux film 80a. And the electronic component supply unit 2
The pickup head 36 picking up the plurality of chips 6 moves from above to the holding head 74, and transfers the held chips 6 to the holding head 74. Here, (7)
The component recognition process (before mounting) and the (1) liquid level flattening process are simultaneously performed in parallel, and the (4) -2 transfer process (delivery) is performed.

After that, as shown in FIG. 23B, the mounting head 33 mounts the chip 6 on the substrate 16. Then, when the mounting head 33 mounts the chip 6, in the reversal stage 17, the same (2) -1 arrangement step (reversal / shaping) as in FIG. 22A, and the same as in FIG. 2) -2 arrangement step (return / upward) is performed, and further, in the electronic component supply unit 2, the second camera 35 performs image pickup and position recognition of the chip 6 to be mounted in the third turn. Here, (3) -2
Mounting process (mounting), (5) component recognition process, (2) placement process ((2) -1 placement process (reversal / shaping), (2) -2 placement process (return / upward)) concurrently To be executed.

Next, as shown in FIG. 24A, in the electronic component supply section 2, the pickup head 36 individually picks up the chip 6 to be mounted in the third turn. In parallel with this, in the reversing stage 17, the mounting head 33 takes out the chip 6 arranged on the stage 79. Then, in the substrate holding unit 10, the first camera 34 moves onto the first substrate holding mechanism 10A to move the substrate 16
Is imaged. By this imaging, the mounting state of the chip 6 mounted on the first turn is inspected, and the plurality of electronic component mounting positions 16 on which the chip 6 is mounted on the second turn 16 are mounted.
The position recognition of a is performed. Here, (3) -1 mounting step (takeout), (4) -1 transfer step (pickup), (6) -1 substrate recognition step (mounting position recognition), and subsequent steps (6). ) -2 The board recognition process (mounting state inspection) is performed in parallel.

Next, as shown in FIG. 24B, the mounting head 33 that has taken out the chip 6 from the stage 79 performs a scanning operation of moving above the third camera 15 and then the first substrate. Substrate 16 held by holding mechanism 10A
Move above. Then, the image of the held chip 6 is captured by scanning, the position of the chip 6 is recognized, and then the chip 6 is mounted on the substrate 16. At this time, the pickup head 36 performs an operation of delivering the chip 6 picked up from the electronic component supply unit 2 to the holding head 74. Here, the (3) -2 mounting process (mounting) and the (4) -2 transfer process (delivery) are simultaneously performed in parallel.

That is, in the above electronic component mounting method, the pickup of the chip 6 from the electronic component supply unit 2 is performed by the pickup head 36 which is provided separately from the mounting head 33 and can operate independently. Therefore, the mounting head 33 only needs to perform the mounting operation of the chip 6 on the substrate 16.

Therefore, it is possible to immediately shift to the (3) -1 mounting step (removal) after the completion of the (2) -2 arranging step (return / upward). Therefore, by the configuration shown in the first embodiment, that is, the mounting head 33, the pickup operation of the chip 6 from the electronic component supply unit 2 and the stage 7 are performed.
Compared to the method of performing both the mounting operation of mounting the chip 6 taken out from the substrate 9 on the substrate 16, the takt time can be shortened by the time indicated by the arrow Ta in FIG. 20 in one mounting turn.

The (2) placement step in the reversing stage 17 is performed after the (3) -1 mounting step (takeout) is performed (1) after the liquid leveling step is completed and (4)-
2 After the transfer process (delivery), the mounting head 33
It can be performed regardless of the operation of. Therefore, the takt time of the mounting operation in the first embodiment, that is, the mounting head 3
In addition to the operation time of 3, the (2) execution time of the placement process can be further shortened by the time indicated by the arrow Tb in FIG. 20 in one mounting turn, as compared with the takt time included in the series. Has become. In the present embodiment, if the bump 6a does not need to be shaped, the pressing (shaping of the bump 6a) in the placement step may be omitted.

(Embodiment 3) FIG. 25 is a plan sectional view of an electronic component mounting apparatus of Embodiment 3 of the present invention, and FIG. 26 is a process explanatory diagram of an electronic component mounting method of Embodiment 3 of the present invention. . In the third embodiment, in the electronic component mounting apparatus shown in the second embodiment, the electronic component supply unit 2 for supplying the chip 6 stuck to the adhesive sheet 5 is arranged with the bump forming surface facing downward on the tray. This is a replacement of the supply form in which the chips housed face down are supplied.

FIG. 25 shows a plane cross section of the electronic component mounting apparatus. On the base 1, an inversion stage 17, which has the same structure as that shown in the first embodiment, a third camera 15, a substrate holder 10, a substrate distributor 11, and a substrate transfer unit 13 are arranged. An electronic component supply unit 2A is arranged on the front side of the inversion stage 17. The components other than the electronic component supply unit 2A are the same as those shown in the second embodiment.

In the electronic component supply section 2A, a plurality of trays 4A for accommodating the chips 6 having the bumps 6a in a posture with the bump forming surface facing downward are arranged in parallel. Tray 4
The chip 6 in A is picked up by the pickup head 36 similar to that in the second embodiment, and the reversal stage 1
7 is directly transferred to the stage 79 without the holding head 74.

The operation at this time will be described with reference to FIG. In FIG. 26A, the chip 6 of the tray 4A of the electronic component supply unit 2A is imaged and its position is recognized by the second camera 35 similar to that shown in the second embodiment.
Then, based on this position recognition result, the pickup head 36 sucks and holds the back surface of the bump forming surface of the chip 6 to pick up.

In the reversing stage 17, the squeegee unit 83 performs squeegeeing to spread the flux 80 on the stage 79 to form the flux film 80a, and the stage 79 is raised to the take-out height position by the mounting head 33. There is. Then, in the substrate holding unit 10, the substrate 1 held by the first substrate holding mechanism 10A
6, the first camera 34 moves to the electronic component mounting position 1
6a is sequentially imaged to recognize the position.

Then, as shown in FIG. 26B, the pickup head 36 holding the chip 6 in the nozzle 36a moves onto the stage 79 of the reversing stage 17, and the chip 6 in a posture with the bump forming surface facing downward is staged. The flux 80 formed at 79 is arranged on the flattened liquid surface. As a result, the chips 6 are arranged on the stage 79 in the same arrangement as the arrangement of the nozzles 33 a of the mounting head 33.

Therefore, in the third embodiment,
The arranging means for arranging the chips 6 is provided with a nozzle 36a (pickup nozzle) on the back surface of the chips 6 of the electronic component supply unit 2A.
Pick-up head 3 which is sucked and held by and picked up and placed on flux film 80a of stage 79
6 is provided.

Then, when the pickup head 36 moves away from the stage 79, the mounting head 33 moves to the stage 79, and the plurality of chips 6 arranged on the stage 79 are taken out. After that, the mounting head 33 moves on the third camera 15 to image the chip 6 and recognize the position, as in the operation described in the first embodiment. Then, the mounting head 33 moves onto the substrate 16 of the substrate holding unit 10 to individually mount the chips 6 on the substrate 16.

In the third embodiment, when the bumps are shaped, either of the following two methods can be adopted. The first method is the pickup head 3
When the chip 6 picked up by 6 is placed on the stage 79, the chip 6 is pressed against the stage 79 by the pickup head 36 to press the bumps 6a against the bottom surface 79a of the stage 79 for shaping. In this case, if the pressurizing mechanism of the pickup head 36 is incorporated, the bump 6a can be shaped more reliably.

The second method is a method of shaping by the inversion stage 17. When the chip 6 is placed on the stage 79, the holding head 74 is inverted to abut against the back surface of the chip 6 on the stage 79, and the lifting actuator 84 is driven to press the bump 6a against the bottom surface 79a of the stage 79. Perform shaping.

[0142]

According to the present invention, the electronic component picked up from the component supply unit is arranged on the adhesive material spread on the flat stage, whereby the application of the adhesive material to the bumps is completed, and the adhesive material is applied. Since the electronic component arranged in the above is taken out by the mounting head and mounted on the work, it is possible to improve the work efficiency by eliminating the work of coating the adhesive with the function of the mounting head.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a plan sectional view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a perspective view of an inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 5 is an operation explanatory diagram of the inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 6 is an operation explanatory diagram of the inversion stage of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 7 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 8 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 9 is a timing chart of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 10 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 11 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 12 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 13 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 14 is a plan view of a substrate on which electronic components are mounted according to the first embodiment of the present invention.

FIG. 15 is a plan view of an electronic component mounting device according to a second embodiment of the present invention.

FIG. 16 is a side sectional view of an electronic component mounting device according to a second embodiment of the present invention.

FIG. 17 is a plan sectional view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 18 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 19 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 20 is a timing chart of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 21 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 22 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 23 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 24 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention.

FIG. 25 is a plan sectional view of an electronic component mounting apparatus according to a third embodiment of the present invention.

FIG. 26 is a process explanatory diagram of the electronic component mounting method according to the third embodiment of the present invention.

[Explanation of symbols]

2 Electronic parts supply department 6 chips 10 Substrate holder 10A First substrate holding mechanism 10B Second substrate holding mechanism 15 Third camera 16 substrates 16a Electronic component mounting position 17 Inversion stage 30 Center beam member 31 First Beam Member 32 Second beam member 33 mounting head 33a nozzle 34 First camera 35 Second camera 36 Pickup head 36a nozzle 54d Pickup controller 54e Mounting control unit 55 First Recognition Processing Unit 56 Second recognition processing unit 57 Third Recognition Processing Unit 74 holding head 74a Chip holding part 80 flux 83 Squeegee unit

Continued front page    F-term (reference) 5E313 AA03 AA11 AA23 CC03 DD01                       DD07 EE02 EE03 EE24 FF28                       FG05                 5F044 KK01 LL04 PP15

Claims (12)

[Claims] 1. An electronic component mounting apparatus for applying an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes formed on a protruding electrode formation surface, and mounting the electronic component on a work, the method comprising: An adhesive material supply unit for supplying an adhesive material in a state where the liquid surface is flattened by spreading the adhesive material, and an electronic component on the adhesive material having the liquid surface flattened, and the protruding electrode is brought into contact with the adhesive material. Arrangement means for arranging in an open state, and a mounting means having a mounting head having a mounting nozzle for sucking and holding an electronic component, and picking up the electronic component disposed on the adhesive by the mounting nozzle and mounting it on a work, An electronic component recognizing unit that has a camera for capturing an image of the electronic component held by the mounting nozzle and that recognizes the position of the electronic component from an image acquired by the camera; and the mounting unit based on the recognition result of the electronic component recognizing unit. To Control to the electronic component mounting apparatus characterized by comprising a mounting control means for positioning the electronic component held by the mounting nozzle to the workpiece. 2. The electronic component mounting apparatus according to claim 1, further comprising a squeegee that spreads an adhesive on the stage to flatten a liquid surface thereof. 3. The arranging means comprises a holding head for holding the back surface of the electronic component with the protruding electrode forming surface of the electronic component facing upward, and the holding head is turned upside down with respect to the stage. The electronic component mounting apparatus according to claim 1 or 2, wherein the electronic component held by a holding head is arranged on the adhesive material. 4. An electronic component supply section for supplying the electronic component in a state in which a protruding electrode forming surface faces upward, and an electronic nozzle is picked up from the electronic component supply section by a mounting nozzle of the mounting head to hold the holding head. The electronic component mounting apparatus according to claim 3, wherein the electronic component mounting apparatus is delivered to the electronic component mounting apparatus. 5. An electronic component supply section for supplying the electronic component with a surface on which a protruding electrode is formed facing upward, and an electronic component picked up from the electronic component supply section by a pickup nozzle of a pickup head and received by the holding head. 4. The electronic component mounting apparatus according to claim 3, further comprising pickup means for delivering. 6. An electronic component supply section for supplying the electronic component in a state in which a protruding electrode formation surface faces downward, and the arranging means sucks and holds a back surface of the electronic component of the electronic component supply section by a pickup nozzle. 2. The electronic component mounting apparatus according to claim 1, further comprising a pickup head that picks up the object and places it on the adhesive. 7. An electronic component mounting method for applying an adhesive to a protruding electrode of an electronic component having a plurality of protruding electrodes on a surface on which a protruding electrode is formed, and mounting the electronic component on a work. A liquid leveling step of extending an object to flatten the liquid level, and an arranging step of arranging an electronic component on the pressure-sensitive adhesive material with the protruding electrodes in contact with the adhesive material And a taking-out step of adsorbing and taking out the electronic component arranged on the adhesive by a mounting nozzle of a mounting head, and taking an image of the electronic component held by the mounting nozzle with a camera, An electronic unit comprising: a component recognizing step of recognizing the position of the component; and a mounting step of moving the mounting head based on the recognition result of the component recognizing step to align the electronic component with the work and then mounting the electronic component. Mounting method. 8. The electronic component mounting method according to claim 7, wherein in the liquid leveling step, an adhesive is spread on the stage by a squeegee to flatten the liquid level. 9. In the arranging step, a holding head that adsorbs the back surface of the electronic component is turned upside down with respect to the stage while the protruding electrode formation surface of the electronic component is facing upward, and is held by the holding head. 8. The electronic component mounting method according to claim 7, wherein the electronic component is arranged on a flattened liquid surface of the adhesive material. 10. A transfer step of picking up an electronic component by the mounting head and delivering it to the holding head from an electronic component supply section that supplies the electronic component with the surface on which the protruding electrodes are formed facing upward. The electronic component mounting method according to claim 9. 11. A transfer step of picking up an electronic component from an electronic component supply section for supplying the electronic component with a surface on which a protruding electrode is formed facing up and picking up the electronic component by a pickup nozzle of a pickup head and delivering it to the holding head. The electronic component mounting method according to claim 9, wherein 12. In the arranging step, the back surface of the electronic component is adsorbed and held by a pickup head from an electronic component supply section which supplies the electronic component with the surface on which the protruding electrodes are formed facing downward, and is held by the pickup head. 8. The electronic component mounting method according to claim 7, wherein the electronic component is arranged on a flattened liquid surface of the adhesive material.