CN100407434C - 固态图像传感器 - Google Patents
固态图像传感器 Download PDFInfo
- Publication number
- CN100407434C CN100407434C CN2005100652665A CN200510065266A CN100407434C CN 100407434 C CN100407434 C CN 100407434C CN 2005100652665 A CN2005100652665 A CN 2005100652665A CN 200510065266 A CN200510065266 A CN 200510065266A CN 100407434 C CN100407434 C CN 100407434C
- Authority
- CN
- China
- Prior art keywords
- substrate
- impurity
- impurity concentration
- subsection
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
- E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
- E02B3/10—Dams; Dykes; Sluice ways or other structures for dykes, dams, or the like
- E02B3/102—Permanently installed raisable dykes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/148—Shapes of potential barriers
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Ocean & Marine Engineering (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP121849/04 | 2004-04-16 | ||
JP2004121849A JP3727639B2 (ja) | 2004-04-16 | 2004-04-16 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1684269A CN1684269A (zh) | 2005-10-19 |
CN100407434C true CN100407434C (zh) | 2008-07-30 |
Family
ID=35095397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100652665A Expired - Fee Related CN100407434C (zh) | 2004-04-16 | 2005-04-15 | 固态图像传感器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7015522B2 (zh) |
JP (1) | JP3727639B2 (zh) |
KR (1) | KR100683304B1 (zh) |
CN (1) | CN100407434C (zh) |
TW (1) | TWI263330B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7153719B2 (en) * | 2004-08-24 | 2006-12-26 | Micron Technology, Inc. | Method of fabricating a storage gate pixel design |
JP2006237415A (ja) * | 2005-02-28 | 2006-09-07 | Sanyo Electric Co Ltd | 固体撮像装置 |
JP4354931B2 (ja) * | 2005-05-19 | 2009-10-28 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
KR100699849B1 (ko) * | 2005-06-21 | 2007-03-27 | 삼성전자주식회사 | 국부적인 불순물 영역을 갖는 cmos 이미지 소자 및 그제조방법 |
JP2008277512A (ja) * | 2007-04-27 | 2008-11-13 | Fujifilm Corp | 撮像素子及び光電変換素子アレイ |
JP5063223B2 (ja) | 2007-07-02 | 2012-10-31 | キヤノン株式会社 | 光電変換装置及び撮像システム |
JP4991418B2 (ja) * | 2007-07-06 | 2012-08-01 | 株式会社東芝 | 固体撮像装置 |
KR100871798B1 (ko) * | 2007-09-07 | 2008-12-02 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
US8048708B2 (en) * | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
JP4798205B2 (ja) | 2008-10-23 | 2011-10-19 | ソニー株式会社 | 固体撮像装置とその製造方法、及び撮像装置 |
FR2955700B1 (fr) * | 2010-01-28 | 2012-08-17 | St Microelectronics Crolles 2 | Photodiode de capteur d'image |
JP5195864B2 (ja) * | 2010-10-13 | 2013-05-15 | ソニー株式会社 | 固体撮像装置とその製造方法、及び撮像装置 |
KR101867488B1 (ko) * | 2012-01-10 | 2018-06-14 | 삼성전자주식회사 | 이미지 센서 |
FR2986906B1 (fr) * | 2012-02-15 | 2015-06-19 | New Imaging Technologies Sas | Structure de pixel actif a transfert de charge ameliore |
WO2014002365A1 (ja) * | 2012-06-26 | 2014-01-03 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
JP5696713B2 (ja) * | 2012-11-06 | 2015-04-08 | 株式会社デンソー | 半導体装置及びその検査方法 |
JP2016178145A (ja) * | 2015-03-19 | 2016-10-06 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法 |
JP6668600B2 (ja) * | 2015-03-19 | 2020-03-18 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法 |
JP6609948B2 (ja) * | 2015-03-19 | 2019-11-27 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法 |
JP6780206B2 (ja) * | 2016-04-28 | 2020-11-04 | 国立大学法人静岡大学 | 絶縁ゲート型半導体素子及び固体撮像装置 |
KR102478607B1 (ko) * | 2018-03-27 | 2022-12-16 | 삼성전자주식회사 | 전자 장치 및 그 동작방법 |
CN111063702B (zh) * | 2019-11-13 | 2022-10-04 | 北京大学 | 一种utbb光电探测器像素单元、阵列和方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5977576A (en) * | 1996-02-21 | 1999-11-02 | Sony Corporation | Image sensor |
JP2000286405A (ja) * | 1999-03-31 | 2000-10-13 | Toshiba Corp | 固体撮像装置 |
JP2003188367A (ja) * | 2001-12-14 | 2003-07-04 | Toshiba Corp | 固体撮像装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2575907B2 (ja) | 1989-12-28 | 1997-01-29 | 株式会社東芝 | 固体撮像装置とその製造方法 |
-
2004
- 2004-04-16 JP JP2004121849A patent/JP3727639B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-06 US US11/099,629 patent/US7015522B2/en not_active Expired - Lifetime
- 2005-04-07 TW TW094110980A patent/TWI263330B/zh not_active IP Right Cessation
- 2005-04-14 KR KR1020050031087A patent/KR100683304B1/ko not_active Expired - Fee Related
- 2005-04-15 CN CN2005100652665A patent/CN100407434C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5977576A (en) * | 1996-02-21 | 1999-11-02 | Sony Corporation | Image sensor |
JP2000286405A (ja) * | 1999-03-31 | 2000-10-13 | Toshiba Corp | 固体撮像装置 |
JP2003188367A (ja) * | 2001-12-14 | 2003-07-04 | Toshiba Corp | 固体撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005310826A (ja) | 2005-11-04 |
TW200601556A (en) | 2006-01-01 |
TWI263330B (en) | 2006-10-01 |
KR100683304B1 (ko) | 2007-02-15 |
CN1684269A (zh) | 2005-10-19 |
US20050230720A1 (en) | 2005-10-20 |
KR20060045713A (ko) | 2006-05-17 |
JP3727639B2 (ja) | 2005-12-14 |
US7015522B2 (en) | 2006-03-21 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141203 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141203 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20160415 |