CN100383963C - Thin loop type radiating apparatus - Google Patents
Thin loop type radiating apparatus Download PDFInfo
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- CN100383963C CN100383963C CNB200510035934XA CN200510035934A CN100383963C CN 100383963 C CN100383963 C CN 100383963C CN B200510035934X A CNB200510035934X A CN B200510035934XA CN 200510035934 A CN200510035934 A CN 200510035934A CN 100383963 C CN100383963 C CN 100383963C
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- 238000001704 evaporation Methods 0.000 claims abstract description 63
- 239000012530 fluid Substances 0.000 claims abstract description 58
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000007791 liquid phase Substances 0.000 claims abstract description 7
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- 238000009825 accumulation Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 abstract description 14
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat sink includes an evaporator, a condenser, a steam conduit, and a backflow conduit. A cavity is formed in the evaporator, and working fluid is filled to the cavity. The cavity is divided into evaporation section and channel section of micro flow in liquid phase. After absorbing quantity of heat in the evaporation section, the working fluid generates steam, which through the steam conduit reaches to the condenser, where steam is cooled to liquid state. Through the backflow conduit, the cooled liquid is returned back to the condenser so as to constitute an airtight heat exchange loop. Structure for reducing steam cumulated on channel section is setup on the evaporator in order to reduce resistance for working fluid to flow back to the evaporation section. Thus, the invention guarantees circulation in one direction, and high efficiency for transferring heat.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly about a kind of thin loop type radiating apparatus that need not additionaling power the heat generating component heat can be distributed fast.
[background technology]
Fast development along with electronics and information industry, the high-tech electronic product is just towards more frivolous small and exquisite and multi-functional, trend development fast, yet under electronic component operation frequency and the continuous lifting of speed, the heat (heat flux) that its per unit area is disengaged is more and more high, the running performance and the stability of serious threat electronic component, even Yin Gaowen and burn these expensive electronic components, to directly influence the life-span and the running quality of electronic component based on the quality of heat abstractor, for guaranteeing the normal operation of electronic component, must carry out effectively and heat radiation fast electronic component.Only existing independent forced air-cooled heat abstractor is difficult to satisfy the radiating requirements of high-frequency high-speed electronic component development, because if list can cause excessive noise and vibration problem to improve rotation speed of the fan, if list is run counter to frivolous small and exquisite market product demand again to increase area of dissipation.Desire to make the high-tech electronic product to bring into play due function, design have high efficiency, light weight, super-silent and automatically regulate the heat energy power of moving, and can make the heat abstractor of Flexible Design with the existing small space of product with electronic component different operating power, become significant challenge and chance that industry develops advanced electronic product of future generation.
The heat abstractor of at present existing many different structures and pattern can be supplied the heat radiation that is used for computer microprocessor (CPU), most typical example is to utilize heat pipe to conduct heat to promote heat-transfer effect, its operating principle is the vapour by working fluid, the latent heat of liquid two phase change transmits heat, promptly take away a large amount of heats from thermal source at the evaporation section mat evaporation latent heat of heat pipe, make steam fast by space in the former evacuated pipe, and condense into liquid and discharge heat energy at the condensation segment of heat pipe, and condensed liquid is affixed by the capillary force that capillary structure provided of inner wall of metal tube and is back to evaporation section fast, reaches to continue the effect of phase change circulation with transferring heat energy.Only existing hot pipe technique still has critical defect to be overcome, be mainly reflected in because steam and withdrawing fluid lie in same Guan Zhongzuo reverse flow, can hinder the backflow of liquid mat capillary force, and then the maximal heat transfer ability of restriction heat pipe, and when the fluid low that refluxes so that the required amount of evaporation to be provided, mummification (dry-out) phenomenon can take place and cause computer microprocessor to heat up rapidly.
So, be the exploitation that the loop-type heat pipe is arranged for avoiding above-mentioned shortcoming.The formation of loop-type heat pipe generally includes evaporator, condenser, steam lead and return-flow catheter, be provided with capillary structure in this evaporator and be filled with an amount of hydraulic fluid, this steam lead is connected this evaporator respectively with return-flow catheter and condenser passes the path to constitute loop heat, its operating principle makes the working fluid vaporization for the heat that absorbs electronic component by evaporator, the steam that produces is passed to via steam lead and is condensed into liquid after condenser is emitted heat, and continue circulation next time by the return-flow catheter Returning evaporimeter, to reach the effect that the latent heat that utilizes phase change transmits heat, it is better than traditional non-loop circuit heat pipe part and mainly is working fluid vapour, the liquid two-phase is respectively with different runner turnover evaporator, flowing of two-phase do not interfered with each other and heat is reached condenser sheds.Only the loop-type heat pipe still has the shortcoming that must overcome on practice, be embodied in hydraulic fluid in evaporator, be heated the vaporization after, pressure can force the steam of generation except that along the steam lead direction is advanced, also can be along the return-flow catheter adverse current, thereby destroy original mechanism that single direction conducts heat of following, also hinder simultaneously condensed hydraulic fluid and in time replenish the required amount of evaporation, cause evaporator mummification phenomenon easily.
[summary of the invention]
Reflux and have some setbacks and technical problem that the single direction circulation is conducted heat and destroyed by steam for solving hydraulic fluid in the loop-type heat pipe, be necessary to provide a kind of can be along the thin loop type radiating apparatus of single direction circulation and efficient heat transfer.
A kind of thin loop type radiating apparatus, comprise an evaporator, one condenser, one steam lead and a return-flow catheter, form a cavity in this evaporator and be filled with working fluid, this cavity is divided into the channel region of evaporating area and liquid phase miniflow, this working fluid produces steam and arrives this condenser via this steam lead and is cooled to liquid state after evaporating area absorbs heat, this cooling fluid is back to this evaporator via this return-flow catheter again, to constitute an airtight heat conduction loop, the cavity of described evaporator is by upper cover plate and lower cover is airtight forms, the evaporating area and the channel region of the corresponding evaporator of described lower cover form the soaking zone and the section of checking respectively, and the thickness of this soaking zone is greater than the thickness of the section of checking.
A kind of thin loop type radiating apparatus, comprise an evaporator, one condenser, one steam lead and a return-flow catheter, form a cavity in this evaporator and be filled with working fluid, this cavity is divided into the channel region of evaporating area and liquid phase miniflow, this working fluid produces steam and arrives this condenser via this steam lead and is cooled to liquid state after evaporating area absorbs heat, this cooling fluid is back to this evaporator via this return-flow catheter again, to constitute an airtight heat conduction loop, the cavity of described evaporator is by upper cover plate and lower cover is airtight forms, and the respective channel district is provided with a radiating part on the outer surface of described evaporator.
Above-mentioned thin loop type radiating apparatus reduces steam and accumulates structure in channel region by being provided with on evaporator, can reduce steam accumulating at channel region, be not destroyed and make condensed working solution physical efficiency be back to evaporating area smoothly along the mechanism that single direction circulation is conducted heat guaranteeing, reduce hydraulic fluid and be back to the resistance of evaporating area and prevent the mummification phenomenon to replenish the required amount of evaporation.Particularly, can reduce the heat that passes to channel region in the thicker soaking zone of evaporating area setting, and reduce the generation of steam indirectly at channel region; And the temperature that radiating part can reduce this district is set in channel region, and impel the vapor condensation of assembling in this district to become liquid, reduce steam by this on the whole the accumulating of channel region, guarantee along single direction circulation and efficient heat transfer.
[description of drawings]
Below with reference to accompanying drawing, in conjunction with the embodiments the present invention is further described.
Fig. 1 sees schematic perspective view outside first embodiment of thin loop type radiating apparatus of the present invention.
Fig. 2 is the profile that the evaporator among Fig. 1 is looked by the II-II cross section.
Fig. 3 is that the evaporator among Fig. 1 is removed one of upper cover plate schematic perspective view.
Fig. 4 sees schematic perspective view outside second embodiment of thin loop type radiating apparatus of the present invention.
Fig. 5 is the profile that evaporator is looked by the V-V cross section among Fig. 4.
Fig. 6 sees schematic perspective view outside the 3rd embodiment of thin loop type radiating apparatus of the present invention.
Fig. 7 is the profile that evaporator is looked by the VII-VII cross section among Fig. 6.
Fig. 8 is the schematic diagram that evaporator is looked by the bottom among Fig. 6.
Fig. 9 sees schematic perspective view outside the 4th embodiment of thin loop type radiating apparatus of the present invention.
Figure 10 sees schematic perspective view outside the 5th embodiment of thin loop type radiating apparatus of the present invention.
[embodiment]
Fig. 1 sees schematic perspective view for outside first embodiment of thin loop type radiating apparatus of the present invention, and this heat abstractor 10 comprises an evaporator 20, a steam lead 30, a condenser 40 and a return-flow catheter 50.One of this evaporator 20 sidewall is respectively equipped with outlet 201 and inlet 202 on relative position, this steam lead 30 is reelability metal or the nonmetal pipe fitting of reelability with return-flow catheter 50, be communicated with the outlet 201 and inlet 202 of this evaporator 20 respectively, and be connected with long-range condenser 40, constitute a heat conduction Mi Sixunhuanlu thereby be interconnected.This condenser 40 can be any existing radiator structure, such as radiating fin, fan, water circulation heat radiation device etc., is intended to and will is passed to steam release heat herein and is cooled to liquid state.This evaporator 20 forms tabular, in conjunction with shown in Figure 2, it is by upper cover plate 210 and the lower cover 220 airtight flat cavitys that constitute a sealing, these lower cover 220 bottoms are thin section of checking 221 and be a thicker soaking zone 223 towards steam lead 30 1 sides towards return-flow catheter 50 1 sides, and the appropriate location of this soaking zone 223 is convexly equipped with a heat-absorbent surface 225 confession heat generating component transmission of heat by contacts.This cavity can charge into a certain amount of working fluid (figure does not show) that can produce different boiling degree with the heat generating component variations in temperature by the filling pipe 203 on another sidewall, can should fill pipe 203 sealings after treating to vacuumize in the cavity and constitute this cavity, this working fluid can be refrigerant, water, ethanol, methyl alcohol, acetone, heptane, ammoniacal liquor and composition thereof.The upper and lower cover plate 210,220 of this evaporator 20 is the thin lid of being made by the good material of thermal conductivity of inner concavity, and wherein upper cover plate 210 peripheries have the face that connects (not indicating) that is easy to lower cover 220 combination seals and location.
Fig. 3 removes the schematic perspective view of upper cover plate 210 for disclosing evaporator 20, be provided with capillary structure 230 in this cavity, the capillary structure 230 that is closely coated by evaporator 20 cavitys can closely paste the upper cover plate 210 and the formed fluid channel structure of lower cover 220 inwalls of obeying in cavity for the wire netting by multilayer consolidation storehouse, this wire netting system is woven into staggered mesh by metal wire, this capillary structure 230 is except the formed fluid channel of the original mesh of each layer wire netting, also form more capillary fluid channel between each layer in the wire netting of multilayer consolidation, for withdrawing fluid provides powerful capillary force.Certainly, this capillary structure 230 also can be fibre bundle or is powder sintered structure except being the wire netting.
The cavity of this evaporator 20 is full of by capillary structure 230 over against the section of checking 221 zones of lower cover 220 and forms the channel region 231 of liquid phase miniflow, cavity then forms evaporating area 232 over against soaking zone 223 zones of lower cover 220, part capillary structure 230 protrudes in the evaporating area 232 and contains the heat-absorbent surface 225 that lower cover 220 is positioned at the center along the center, other has part capillary structure 230 to protrude in the evaporating area 232 along the both sides of evaporator 20, cause this capillary structure 230 to be striden simultaneously and be located at this channel region 231 and evaporating area 232, the capillary structure 230 that so makes evaporating area 232 just can adsorb working fluid from channel region 231 by capillary force and constantly produces vaporescence after working fluid is evaporated.In addition, this evaporating area 232 zone that capillary structure is not set forms an accumulation zone 233 that is used to hold steam.This accumulation zone 233 is connected so that the steam that produces can successfully flow out evaporator 20 with steam lead 30, and this accumulation zone 233 has the bigger flowing space, makes in the cavity not the reason vaporized expanding and produces too high saturation pressure.Reflux for more quickening condensed fluid, also capillary structure 501 can be set in the tube wall of this return-flow catheter 50, it can be made of the wire netting that curls, and perhaps is powder sintered structure or minute groove structure, so that the capillary force in withdrawing fluid admission passage district 231 to be provided.
During operation, earlier coat hot interface material (TIM) and make it closely docile between the hot surface with the heat-absorbent surface 225 of lower cover 220 and heat generating component, the soaking zone 223 of lower cover 220 absorbs heat and the evenly distribution that heat generating component produces, again heat is reached the capillary structure 230 in the evaporating area 232 that is contained by this soaking zone 223 in the cavity, to contain in working fluid wherein and produce vaporization rapidly, become the steam of rapid expansion, because this steam is very high in the flow resistance of channel region 231, the inevitable periphery that enters does not smoothly contain capillary structure 230 and spacious accumulation zone 233, then under steam pressure, enter steam lead 30 and in condenser 40 cooling after, cooling liquid is again via return-flow catheter 50 and be back to the channel region 231 of evaporator 20 by the capillary structure in the return-flow catheter 50 501, by the capillary structure 230 in this evaporating area 232 working fluid is delivered to this evaporating area 232 by this channel region 231 then, thereby form one and have vapour, liquid separates and guarantees the evaporator 20 that the liquid admission goes out, to drive one day folk prescription to the thermal cycle loop that carries out high efficiency heat radiation.
Because the part that the lower cover 220 of this evaporator 20 contacts with heat generating component is thicker soaking zone 223, and be the thin section of checking 221 away from the part of heat generating component, this soaking zone 223 has the function of soaking on the one hand, and the heat throughout of the assembly of spontaneous heating in the future also fully passes in the capillary structure of being contained by this soaking zone 223 in the cavity 230 in whole soaking zone 223; On the other hand, owing to form section difference and the section of checking 221 thinner thicknesses between soaking zone 223 and the section of checking 221, so configuration can make by soaking zone 223 and reduce to still less toward the heat of the section of checking 221 direction transmission, reduce since be passed to the heat of the section of checking 221 make on the channel region 231 the working fluid evaporation and at the too much steam of this district's formation, cause steam to accumulate at this channel region 231, even along return-flow catheter 50 adverse currents, and the steaminess excessively that accumulate in this district also can hinder condensed hydraulic fluid and in time be supplemented to evaporating area 232, causes the mummification phenomenon easily.
Cavity in the evaporator 20 of the present invention is separated the accumulation zone 233 that forms low flow resistance, the workflow physical efficiency that is back in evaporating area 232 capillary structures 230 is vaporized fast, and directly conflux from accumulation zone 233 and to enter steam lead 30, reach and reduce the effect of thermal resistance with further enhance heat efficient; And thicker soaking zone 223 is set in evaporating area 232, make the working fluid of backflow be able to fully heat absorption vaporization, and can be by the setting section of checking 221 in containing most channel region 231, gripping resistance is conducted to heat away from the section of checking 221 that contains channel region 231 by the soaking zone 223 of containing evaporating area 232 in the lower cover 220, the heat of effectively checking evaporating area 232 is directly transferred to the working fluid of this channel region 231 and makes the lateral heat conduction effect of its vaporization that heats up along lower cover 220, prevented that steaminess from accumulating at channel region 231, and effectively reduced liquid medium and flow into flow resistance in evaporating area 232 capillary structures 230.By this, working fluid not only can be sent in the capillary structure 230 of evaporating area 232 smoothly, and can bring into play the high efficiency hot merit energy that moves simultaneously, prevents that effectively mummification phenomenon and lifting from moving thermal capacity.
Because when the soaking zone 223 of evaporator 20 absorbs heat, near the working fluid in the channel region 231 of evaporating area 232, also can directly be subjected to the excessive thermal convection effect of loosing and being caused of steam expansion in contiguous high temperature evaporation district 232, cause above-mentioned the intensification to be vaporized near the working fluid in the channel region 231 of the thermal treatment zone, and then hinder the working fluid that refluxes and send to evaporating area 232 smoothly by capillary structure 230, the flow resistance that causes working fluid to enter evaporating area 232 increases, and so will cause the mummification of evaporating area 232 and heats up rapidly.In view of this, in second embodiment of the thin loop type radiating apparatus of the present invention that Fig. 4 and Fig. 5 disclosed, its on cover plate 210 on the evaporator 20a and the position in respective chamber internal channel district 231 be provided with a radiating part 250 that constitutes by some radiating fins, but cover plate 220a forms the structure of thickness homogeneous under this evaporator 20a.The setting of this radiating part 250 can reduce the temperature that contains the working fluid in channel region 231, and check working fluid simultaneously because of being subjected to the negative effect that high temperature evaporation district 232 interior steam heat convection effects cause the vaporization that heats up, reduce steam and be accumulated in channel region 231, guarantee to continue working fluid is sent to evaporating area 232 smoothly, effectively prevent the mummification phenomenon, and prevent steam along return-flow catheter 50 adverse currents, make working fluid follow single direction and carry out high efficiency heat radiation.This radiating part 250 also can adopt present existing heat abstractor, for example fan, thermoelectric cooling device etc. on the practice.Because the working fluid storage that mat capillary structure 230 contains in channel region 231 is less, the temperature of fluid only needs very little heat dissipation capacity to get final product usually so desire reduces wherein, therefore adopt the short radiating fin that need not install fan additional, only can reach by the natural circulation that increases area of dissipation, therefore, this radiating part 250 can adopt the radiating fin of a low clearance, to be suitable for the having Related product of flattening design requirement to use, as mobile computer.
And if there is not the design of this radiating part 250, then the liquid of the thermal treatment zone can vaporize and along with the increase of time its will be gradually toward around conduction come, lose the water storage effect with connecting the channel region 231 that contains capillary structure 230 at last, above channel region 231, increase radiating fin and then the part heat is removed, to keep the capillary force of whole channel region 231.The present invention has spacious space in accumulation zone 233, and that channel region 231 capillary structures design its space slight drag is big, therefore, and when liquid medium produces vaporization phenomenon because of heat absorption, its vapour volume expands, and these bulbs of pressure will force vapor stream to advance along steam lead 30.If do not have this radiating fin structure then the interface line of this steam and liquid medium will move because of the past channel region 231 of the increase of time, capillary force up to channel region 231 lost efficacy, then liquid medium can't be effectively and is got back to evaporating area 232 smoothly to provide evaporation required liquid medium amount, may cause loop failure at last.
Fig. 6 to Fig. 8 is disclosed as the 3rd embodiment of thin loop type radiating apparatus of the present invention.Wherein, the lower cover 220 of evaporator 20b forms the thickness heterogeneous texture shown in first embodiment, and outside the upper and lower cover plate 210,220 of evaporator 20b on the wall or on the outer wall of one of them in the respective chamber position of liquid medium channel region 231 also be provided with a radiating part 250.By this, the thicker soaking zone 223 of setting can effectively be checked heat is conducted to lateral heat conduction effect on the section of checking 221 on the lower cover 220, reduce soaking zone 223 and conduct to away from the heat on the section of checking 221 of evaporating area 232, the quantity of steam that causes the working fluid intensification vaporization of channel region 231 to be produced owing to this lateral heat conduction effect reduces simultaneously; And outside this upper and lower cover plate 210,220 on the wall or on the outer wall of one of them set radiating part 250 can further reduce the temperature that contains the working fluid in channel region 231, and check working fluid owing to the steam heat convection effect that is subjected in the high temperature evaporation district 232 causes the negative effect that heats up and vaporize, further reduce steam accumulating in channel region 231, guarantee that working fluid continues to be supplemented to evaporating area 232 smoothly, impel the normal operation of mechanism of loop circuit heat pipe circulation heat radiation.In addition, this be arranged at evaporator 20 upper and lower cover plate 210,220 outer walls corresponding to the radiating part 250 of channel region 231 can with upper and lower cover plate 210,220 integrally formed making, except that can reaching the purpose of simplifying the volume production processing procedure and reducing cost, more can further promote radiating efficiency, and simplify and install and promote reliability because of eliminating the interface thermal resistance.
The present invention sends to rapidly the evaporating area 232 of evaporator 20 except that reaching the working fluid that continues refluxing by the capillary structure 510 in capillary structure 230 that is arranged at evaporator 20 and the condensate liquid return-flow catheter 50, and in conjunction with being arranged on the evaporator 20, lower cover 210,220 outer walls are corresponding to the radiating part 250 of channel region 231 and thicker soaking zone 223 functions of corresponding evaporating area 232, can overcome steam heat convection effect of the prior art and lateral heat conduction effect simultaneously and hinder the difficulty that working fluid is sent to evaporating area 232 smoothly, reduce steam accumulating in channel region 231, effectively prevent the mummification phenomenon, and owing to the working fluid before the inflow evaporating area 232 is maintained at lower temperature, treat that it is able to more effective cooling heat generating component after entering evaporating area 232, also can avoid low-power when output of holding state that working fluid flash-pot 20 takes place and be pushed to the space, loop gradually, but can't make enough condensate liquids be back to the evaporating area 232 of evaporator 20, cause so-called activation problem, and because capillary structure 230 designs of channel region 231 have high capillary force absorption benefit to the liquid phase working fluid, but to vaporization and the steam of rapid expansion or boiling fluid have high flow resistance characteristic, the thin loop type radiating apparatus of all guaranteeing the present invention carries out high efficiency circulation heat radiation towards single direction.
Fig. 9 sees schematic perspective view for outside the 4th embodiment of thin loop type radiating apparatus of the present invention, present embodiment is similar to the basic comprising of aforementioned the 3rd embodiment, only, for reaching the purpose of sharing heat load, can adopt an evaporator 20b to dispose more than one heat radiation loop, so that heat load is shared to increase heat-sinking capability by two heat radiation loops.
Figure 10 sees schematic perspective view for outside the 5th embodiment of thin loop type radiating apparatus of the present invention, present embodiment is similar to the basic comprising of aforementioned the 4th embodiment, only, for reaching the heat radiation function that reduces the heat generating component surface temperature and promoting heat dissipation capacity and prevent the mummification phenomenon, must make the steam in the accumulation zone 233 smooth and easyly arrive condenser 40 heat radiations by steam lead 30, in order to avoid the obstructing problem that causes cyclic system pressure to raise and cause because of the flow resistance of steam lead 30 is excessive, therefore, on practice, can adopt the steam lead 30 of big caliber and the return-flow catheter 50 of less caliber, or be flattening, slimming is used, can adopt on each heat radiation loop corresponding to the accumulation zone 233 of the evaporator 20b steam leads 30 of configuration more than one side by side, to reduce the resistance that steam is met with when leading to condenser 40.
Claims (18)
1. thin loop type radiating apparatus, comprise an evaporator, one condenser, one steam lead and a return-flow catheter, form a cavity in this evaporator and be filled with working fluid, this cavity is divided into the channel region of evaporating area and liquid phase miniflow, this working fluid produces steam and arrives this condenser via this steam lead and is cooled to liquid state after evaporating area absorbs heat, this cooling fluid is back to this evaporator via this return-flow catheter again, to constitute an airtight heat conduction loop, it is characterized in that: the cavity of described evaporator is by upper cover plate and lower cover is airtight forms, the evaporating area and the channel region of the corresponding evaporator of described lower cover form the soaking zone and the section of checking respectively, and the thickness of this soaking zone is greater than the thickness of the section of checking.
2. thin loop type radiating apparatus as claimed in claim 1 is characterized in that: be provided with capillary structure in the cavity of described evaporator, this capillary structure extends to evaporating area from the channel region of evaporator.
3. thin loop type radiating apparatus as claimed in claim 2 is characterized in that: described capillary structure is full of the whole channel region of evaporator and the remainder of this capillary structure stretches in the evaporating area.
4. thin loop type radiating apparatus as claimed in claim 2 is characterized in that: the accumulation zone of steam is held in the subregion formation one of the corresponding evaporating area of the cavity of described evaporator.
5. thin loop type radiating apparatus as claimed in claim 1 is characterized in that: described steam lead and return-flow catheter are disturbing property metal or the nonmetal pipe fitting of disturbing property.
6. thin loop type radiating apparatus as claimed in claim 1 is characterized in that: be provided with capillary structure in the described return-flow catheter.
7. thin loop type radiating apparatus as claimed in claim 1 is characterized in that: be connected with two described heat conduction loops on the described evaporator.
8. thin loop type radiating apparatus as claimed in claim 1 is characterized in that: be provided with many steam leads side by side in the described heat conduction loop.
9. thin loop type radiating apparatus, comprise an evaporator, one condenser, one steam lead and a return-flow catheter, form a cavity in this evaporator and be filled with working fluid, this cavity is divided into the channel region of evaporating area and liquid phase miniflow, this working fluid produces steam and arrives this condenser via this steam lead and is cooled to liquid state after evaporating area absorbs heat, this cooling fluid is back to this evaporator via this return-flow catheter again, to constitute an airtight heat conduction loop, it is characterized in that: the cavity of described evaporator is by upper cover plate and lower cover is airtight forms, and the respective channel district is provided with a radiating part on the outer surface of described evaporator.
10. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: described radiating part is some radiating fins.
11. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: described radiating part is arranged on one of them cover plate of upper and lower cover plate.
12. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: be provided with capillary structure in the cavity of described evaporator, this capillary structure extends to evaporating area from the channel region of evaporator.
13. thin loop type radiating apparatus as claimed in claim 12 is characterized in that: described capillary structure is full of the whole channel region of evaporator and the remainder of this capillary structure stretches in the evaporating area.
14. thin loop type radiating apparatus as claimed in claim 12 is characterized in that: the accumulation zone of steam is held in the subregion formation one of the corresponding evaporating area of the cavity of described evaporator.
15. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: described steam lead and return-flow catheter are disturbing property metal or the nonmetal pipe fitting of disturbing property.
16. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: be provided with capillary structure in the described return-flow catheter.
17. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: be connected with two described heat conduction loops on the described evaporator.
18. thin loop type radiating apparatus as claimed in claim 9 is characterized in that: be provided with many steam leads side by side in the described heat conduction loop.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510035934XA CN100383963C (en) | 2005-07-08 | 2005-07-08 | Thin loop type radiating apparatus |
| US11/306,455 US20070006994A1 (en) | 2005-07-08 | 2005-12-29 | Loop-type heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510035934XA CN100383963C (en) | 2005-07-08 | 2005-07-08 | Thin loop type radiating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1893041A CN1893041A (en) | 2007-01-10 |
| CN100383963C true CN100383963C (en) | 2008-04-23 |
Family
ID=37597716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510035934XA Expired - Fee Related CN100383963C (en) | 2005-07-08 | 2005-07-08 | Thin loop type radiating apparatus |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20070006994A1 (en) |
| CN (1) | CN100383963C (en) |
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| RU196690U1 (en) * | 2019-12-27 | 2020-03-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский авиационный институт (национальный исследовательский университет") | Transceiver module of the active phased antenna array of the Ka-band with a two-stage cooling system |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20070006994A1 (en) | 2007-01-11 |
| CN1893041A (en) | 2007-01-10 |
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