CN101307996B - Flat-plate evaporator structure and loop type heat pipe with same - Google Patents

Abstract

The present invention discloses a flat plate evaporator structure and a loop heat pipe with the flat plate evaporator structure. The loop heat pipe is a heat source on which an evaporation section is arranged and a condensation section is connected with a conduction section. The evaporation section includes a closed containing structure and a capillary structure, and a channel structure is arranged on the bottom surface. A liquid inlet and a gas outlet are arranged on the side edge of the box body, which are respectively connected to a gas flow channel and a liquid flow channel. When the working fluid is evaporated into steam by the heat source, the steam is led out from the gas outlet and introduced into the condensation device of the condensation section through the gas flow channel. Then, the working fluid that is cooled and restored to its original form is led back to the closed containing structure through the liquid flow channel, and repeated circulation actions are performed.

Description

Flat evaporator structure and loop heat pipe with flat evaporator structure

technical field

The invention relates to a loop heat pipe, in particular to a loop heat pipe with a flat plate evaporator structure.

Background technique

Due to the progress of the semiconductor process, the number of wires on the chip has been increasing. In order to accommodate these wires, the packaged area is often several times the die area. Therefore, the heat on the surface of the package is not evenly distributed, and it is easy to form hot spots (Hotspot) and then cause chip damage due to uneven thermal stress. The role of the heat pipe is to quickly guide the heat to other heat sinks, and then remove the heat through the heat dissipation module. The current heat pipe design is mostly used in the heat dissipation of notebook computers, including the following methods:

(1) Forced air cooling;

(2) Forced liquid cooling;

(3) heat pipe phase change heat dissipation;

(4) Refrigerator heat dissipation;

(5) Freezing heat dissipation.

Among them, refrigeration heat dissipation can be divided into Micro Channel Heat Sink, Micro Heat Exchanger, Micro Miniature Refrigerators, Micro Heat Pipes, Micro Jet ( Micro Jets), droplet cooling (Droplet Cooling), although the high unit price heat dissipation mode has high heat dissipation efficiency, it is not suitable for the current low-cost and high-power computers. Therefore, the development of low-cost, high-efficiency, and low-wear heat dissipation devices is the future. the trend of.

FIG. 1 is a schematic diagram showing a traditional heat pipe structure. The traditional heat pipe structure 100 is composed of an airtight container 1, a capillary structure 2, and a working fluid 3 (see FIG. 1). The airtight container 1 is injected with an appropriate amount after vacuuming The working fluid3. When the evaporating end 1a (Evaporator) of the container 1 is heated, the working fluid 3 absorbs heat and vaporizes, and the generated vapor 31 (Vapor) flows to the condensing end 1b (Condenser) to release heat. Different saturated vapor pressures drive the fluid, and the condensate 32 will flow back to the original heating position evaporator 1a through the capillary action of the capillary structure 2. Its working principle is to use the principle that a large amount of heat will be absorbed during the two-phase change process. Since the working fluid 3 in the heat pipe structure 100 transfers heat through the two-phase change, it can obtain extremely high thermal conductivity, achieve the purpose of rapid heat conduction, and create a super thermally conductive environment.

Generally, heat pipes used for heat dissipation of electronic components have a limited contact area with the heat source, and their tubular shape is also limited in shape. Flattening and bending corners will greatly reduce the performance of the heat pipe, and the heat pipe will lose its effectiveness. Therefore, the industry uses the two-phase change in the flat plate to reduce the thickness and remove the splash limit of the heat pipe itself. This technology is called "Plate Heat Pipe (Plate Heat Pipe)", and the same technology is applied to solar energy In the field of technology, it is called a loop heat pipe 200 (shown in FIG. 2 ), which is heated by an evaporating end 1a, and the working fluid 3 absorbs heat and is vaporized, and the generated steam 31 is guided through a steam pipeline 11a to A condensing end 1b releases heat, and then flows back to the evaporating end 1a through a liquid pipeline 11b.

However, the semiconductor industry is one of my country's globally competitive industries. As the functions of electronic products continue to increase, internal electronic components must have good heat dissipation devices to cool down the high temperature phenomenon caused by high power. The existing fin-fan-based heat dissipation mechanism will inevitably fail to meet the heat dissipation needs of future microelectronic components. Moreover, the water cooling heat dissipation mode will easily cause water molecules to overflow, which will affect the short circuit crisis of electronic components.

For example, the heat dissipation of modern microelectronic products (3C: Computer, Communication, Consumer Electron Products), semiconductor components (high-power LED, laser, LED array) and large-size TV backlight modules, and high-tech products can be used in consumer products. It has become a high-tech that everyone can have. While the heat pipe is actively developing, the heat output of electronic products is also increasing day by day. With the miniaturization of components and the increase in computing speed, the problem of heat has come to the fore. Manufacturers of electronic semiconductors have set up research and development departments for system or component heat dissipation to solve the heat dissipation problem.

Contents of the invention

The technical problem to be solved by the present invention is to provide a flat plate evaporator and a loop heat pipe, which is used to fill a closed area with a working fluid that can change the liquid and gas phases with temperature changes, and use this phase change to Transfer heat quickly.

Another technical problem to be solved by the present invention is to provide a mini flat heat pipe, which can improve the operating performance and have higher heat dissipation efficiency as a whole, so as to meet the heat dissipation requirements of high-density electronic components in the future.

The technical solution of the present invention is: a loop-type heat pipe with a flat plate evaporator structure. An evaporation section is arranged on a heat source, and a conduction section is connected to a condensation section to form the evaporator. The evaporation section The segment includes an airtight accommodating structure arranged on the heat source, and the airtight accommodating structure is composed of a cover body and a box body to form an airtight accommodating space, and includes a channel structure, a capillary structure, a A liquid inlet provided on the side edge of the box is used to inject a working fluid, and a gas outlet arranged on the side edge of the box corresponding to the liquid inlet is used to lead out the vapor generated by the working fluid evaporated by the heat source, wherein the The channel structure is on the bottom surface of the airtight accommodating space, and a plurality of groove channels are arranged equidistantly and parallel to each other, and the capillary structure is arranged horizontally above, and the liquid inlet at the side edge of the box is connected with the capillary structure , and the gas outlet on the side edge of the corresponding box body is connected to the groove channel of the channel structure, and is connected to a gas flow channel and a liquid flow channel respectively, so that the working fluid is evaporated by the heat source into In case of steam, the steam is led out from the gas outlet, and introduced into the condensing device of the condensation section through the gas flow channel, and then the cooled working fluid returned to the original form is guided back to the closed storage structure through the liquid flow channel , and perform repeated cyclic actions.

The present invention also proposes a flat plate evaporator structure of a loop-type heat pipe. The loop-type heat pipe is formed by setting an evaporation section on a heat source and connecting a condensation section with a conduction section. The evaporator includes:

An airtight accommodation structure is arranged on the heat source, and a lid body and a box body are combined to form an airtight accommodation space. The airtight accommodation structure includes:

a capillary structure arranged horizontally with the bottom surface of the airtight accommodating structure, and arranged in the airtight accommodating space;

A liquid inlet is arranged on the side edge of the box body for injecting a working fluid and communicated with the capillary structure;

A gas outlet is arranged on the side edge of the box body corresponding to the liquid inlet, and is used for leading out the vapor generated by the working fluid evaporated by the heat source.

The features and advantages of the present invention are: the present invention mainly researches and manufactures small-sized flat heat pipes, so as to be applied in the heat dissipation of notebook computers. Guiding to a fixed condensation area is a very important issue. Furthermore, the heat pipe can be regarded as a passive heat transfer element with high thermal conductivity. Due to the internal two-phase flow heat transfer mechanism, the heat transfer capacity of the heat pipe is hundreds of times that of copper metal of the same size. Superconductors, when using heat pipes as heat transfer objects, have the advantages of rapid response and small thermal resistance. Therefore, with the use of heat pipes or their derivatives, various types of high-performance heat dissipation modules have been developed, which are suitable for solving various electronic products due to performance improvements. The resulting heat dissipation problem.

The flat-type small heat pipe developed by the present invention for the heat dissipation function in a limited space can be used in notebook computers, etc., which improves the traditional defect of heat pipe bending and performance reduction, and also improves the carrying restriction caused by the small size of the heat pipe. (Entertainment Limit), adopting a bendable design of the runner in a limited space can increase the use of space. And through the high efficiency of the loop heat pipe, all electronic components that need heat dissipation, machinery industry, biochemical medical treatment, large-size TV heat dissipation, indoor and outdoor LED lighting equipment, etc., can use the principle of "liquid-gas two-phase change" to make the tiny liquid The droplets absorb a large amount of heat energy and then vaporize, quickly take the heat source away from a considerable distance, eliminate hot spots so that the electronic components can work normally, and avoid the short circuit of the electronic components caused by the overflow of water molecules, providing a new way for electronic heat dissipation and improving The development and research of cooling technology can also improve the overall operating performance and heat dissipation efficiency through the mini flat heat pipe.

Description of drawings

1 is a schematic diagram showing a conventional heat pipe structure;

2 is a block diagram showing a conventional heat pipe structure;

Figure 3 is a perspective view showing the loop heat pipe of the present invention with a flat plate evaporator structure;

Fig. 4 is the 4-4 sectional view that shows the circuit type heat pipe that the present invention has plate evaporator structure;

Fig. 5 is a 5-5 sectional view showing the loop heat pipe with flat plate evaporator structure of the present invention;

6 is an enlarged view showing the loop heat pipe of the present invention with a flat plate evaporator structure;

7 is a cross-sectional view showing the configuration of the capillary structure of the porous material of the circuit heat pipe with a flat plate evaporator structure of the present invention;

FIG. 8 is a schematic diagram showing a second embodiment of a loop heat pipe with a flat plate evaporator structure according to the present invention;

FIG. 9 is a schematic diagram showing a third embodiment of a loop heat pipe having a flat plate evaporator structure according to the present invention;

FIG. 10 is a top view showing the channel structure of the fourth embodiment of the loop heat pipe with flat plate evaporator structure according to the present invention.

[Description of main component symbols]

100 heat pipe structure 523 box side edge

200 loop heat pipe 53 channel structure

300 evaporator 531 groove channel

300a, 300b, 300c evaporator 531a protruding section

1 airtight container 54 liquid inlet

1a evaporating end 541 liquid channel

1b condensation end 55 gas outlet

11a steam pipeline 551 gas flow channel

11b liquid pipeline 6 capillary structure

2 Capillary structure 6a Capillary structure of porous materials

3 working fluid 61 capillary structure front opening

31 Steam 62 Partition

32 Condensate 7 Condensing device

4 heat source 7a, 7b condensing device

5 airtight accommodation structure 71 cooling fin module

51 cover body L1 evaporation section

52 boxes L2 condensation section

521 closed storage space L3 conduction section

522 L4 compensation channel at the bottom of the accommodation space

Detailed ways

The specific embodiments adopted by the present invention will be further described through the following embodiments and accompanying drawings.

Referring to FIG. 3 , it is a perspective view showing the circuit heat pipe with flat plate evaporator structure of the present invention, FIG. 4 is a sectional view showing 4-4 in FIG. 3 , and FIG. 5 is a sectional view showing 5-5 in FIG. 3 . The evaporator 300 of the present invention is composed of an evaporating section L1 disposed on a heat source 4, and a conducting section L3 connected to a condensing section L2.

The evaporation section L1 includes an airtight accommodation structure 5 arranged on the heat source 4. The airtight accommodation structure 5 is composed of a cover body 51 and a box body 52 to form an airtight accommodation space 521, and includes There is a capillary structure 6 , a liquid inlet 54 and a corresponding gas outlet 55 .

The capillary structure 6 is arranged horizontally with the bottom surface 522 of the airtight accommodating structure 5, and is arranged in the airtight accommodating space 521, and a liquid inlet 54 is provided on the side edge 523 of the box body 52 for injecting a working fluid 3, and It is connected to the capillary structure 6 , and a gas outlet 55 is provided on the side edge 523 of the box body 52 corresponding to the liquid inlet 54 for leading out a vapor generated by the working fluid 3 evaporated by the heat source 4 .

Preferably, the airtight accommodating structure 5 also includes a channel structure 53 which is arranged horizontally with the bottom surface 522 of the airtight accommodating structure 5, and includes several groove channels 531 arranged parallel to each other and equidistantly spaced, and the The capillary structure 6 is arranged horizontally on the channel structure 53 , wherein the liquid inlet 54 communicates with the front opening 61 of the capillary structure 6 , and the gas outlet 55 communicates with the groove channel 531 of the channel structure 53 .

The conduction section L3 is composed of a gas channel 551 and a liquid channel 541, wherein the gas channel 551 is connected to the gas outlet 55 of the airtight accommodation structure 5, and the liquid channel 541 is connected to the airtight The liquid inlet 54 of the accommodation structure 5 .

The condensing section L2 is provided with a condensing device 7, and the condensing device 7 is respectively connected to the gas outlet 55 and the liquid inlet 54 of the airtight accommodation structure through the gas channel 551 and the liquid channel 541 of the conduction section L3. The gas channel 551 introduces the steam 31 to the condensing device 7 to cool the steam 31 generated from the evaporation section L1, so that the steam 31 cools and returns to the working fluid 3 in its original form, and then guides it back to the sealed air through the liquid channel 541. In the airtight accommodating space of the accommodating structure 5.

Preferably, the condensing device 7 of the condensing section L2 is provided with a cooling fin module 71 to provide a better heat dissipation function, so that the condensing device 7 can cool the vapor introduced by the gas channel 551 more rapidly. 31.

In summary, when a working fluid 3 is injected into the airtight accommodation space 521, the working fluid 3 is evenly guided from the liquid inlet 54 to the airtight accommodation structure 5 by using the capillary guiding force of the capillary structure 6 The working fluid 3 is evaporated into steam 31 through the heat source 4 of the evaporation section L1, and then the steam 31 is led out by the gas outlet 55, and the steam 31 is introduced into the condensation device of the condensation section L2 through the gas flow channel 551 7. The vapor 31 is cooled by the condensing device 7 to return to the working fluid 3 in its original form, and then returned to the closed storage space 521 of the closed storage structure 5 through the liquid flow channel 541, and the cycle is repeated .

Referring to FIG. 6 , it is an enlarged view showing the loop heat pipe with flat plate evaporator structure of the present invention. Wherein, the capillary structure 6 is horizontally arranged on the channel structure 53 to guide the cooled working fluid 3 returned by the condensation section L2, and the returning working fluid is guided by the capillary force of the capillary structure 6 3 can evenly flow into the groove channel 531 of the airtight accommodating space 521, when the working fluid 3 is evaporated into vapor 31 by the heat source 4, it will not flow back from the channel structure 53 to the liquid channel 541 in.

Wherein, the channel structure 53 may not be provided with several grooved channels 531 to form a flat channel structure 53 , which also enables the capillary structure 6 to generate high capillary driving force. Similarly, the capillary structure 6 can also provide corresponding or staggered grooves (not shown) on each groove channel 531, or provide several grooves on the flat channel structure 53, all of which can achieve The effect of high capillary drive.

Refer to FIG. 7 , which is a cross-sectional view showing the capillary structure of the porous material of the circuit heat pipe with the flat plate evaporator structure of the present invention. The capillary structure 6 is a porous material capillary structure 6a, which is also arranged on the channel structure 53. When the cooled working fluid 3 is introduced, the working fluid 3 is attracted by the capillary attraction of the porous material capillary structure 6a. It can evenly flow into the groove channel 531 of the channel structure 53 , and the evaporated vapor 31 will not flow back to the liquid flow channel 541 from the capillary structure 6 on the channel structure 53 . Moreover, the capillary structure 6 can be made of various materials with strong capillary force, such as metal mesh stacking, non-metal mesh stacking, metal mesh diffusion bonding, metal powder sintering, non-metal powder sintering, cotton wool weaving, etc., titanium , copper mesh, metal mesh structure metal materials, or non-metallic materials such as ceramic materials, plastics, epoxy resin, fibers, porous heat-resistant bricks, using a special capillary structure 6 to form a high capillary driving force, its Not only firmly hold the moisture but also prevent the steam 31 from flowing back, so that the steam 31 can enter the gas flow channel 551 in a single direction.

Preferably, a partition 62 is arranged between the capillary structure 6 and the airtight accommodation space 521, and is located between the top surface of the capillary structure 6 and the cover body 51 of the airtight accommodation structure 5, which is close to and perpendicular to the The liquid inlet 54 on the side edge 523 of the box body 52 is used to prevent the evaporated vapor 31 in the airtight accommodating space 521 from flowing back into the liquid channel 541 .

The present invention arranges several groove channels 531 in the airtight accommodating space 521, so that the working fluid 3 can quickly leave the evaporation section L1 and be introduced into the conduction section L3 after the heat source 4 evaporates into steam 31, and The design of the plurality of groove channels 531 can balance the pressure of the steam 31 when it is introduced into the gas flow channel 551 , so that the steam 31 can enter the gas flow channel 551 smoothly with a relatively uniform pressure difference. Preferably, the channel structure 53 of the airtight accommodation structure 5 divides the groove channel 531 into several sections at a predetermined distance level, and through the design of the channel structure 53, the working fluid in the capillary structure 6 3 can evaporate quickly, providing a relatively uniform pressure difference to enter the gas flow channel 551. Furthermore, there may also be a height difference between each segment of the channel structure 53 to form a stepped channel.

Wherein, a compensation channel L4 is provided in the airtight accommodating space 521, located between the liquid inlet 54 and the channel structure 53, when the working fluid 3 in the channel structure 53 is evaporated by the heat source 4, the The compensation channel L4 can replenish the working fluid 3 in the channel structure 53 , and when the evaporator is in a state without the heat source 4 , the compensation channel L4 can provide a storage space for the working fluid 3 .

Referring to FIG. 8 , it is a schematic view showing the second embodiment of the loop heat pipe with a flat plate evaporator structure in the present invention, and FIG. 9 is a schematic view showing a third embodiment of the loop heat pipe with a flat plate evaporator structure in the present invention. It is composed of several evaporators 300a, 300b, 300c, and the several evaporators 300a, 300b, 300c are connected to the condensation device 7, and the several evaporators 300a, 300b, 300c can be arranged on different heat sources 4 On, for multiple cooling effects. Furthermore, the evaporator 300 can also be equipped with more than two condensing devices 7a, 7b. When the temperature of the heat source 4 is too high and the condensing device 7 is not enough to provide sufficient cooling effect, more than two condensing devices can be installed. Condensing device 7a, 7b, in order to achieve sufficient cooling effect.

Referring to FIG. 10 , it is a top view showing the channel structure of the fourth embodiment of the circuit heat pipe with flat plate evaporator structure according to the present invention. Wherein, the channel structure 53 is a plurality of protruding sections 531a, equidistantly spaced and horizontally staggered, and perpendicular to the liquid inlet 54. When a working fluid 3 is injected into the airtight accommodation space 521, the working fluid 3 The several protruding sections 531a staggered horizontally can achieve the purpose of uniform distribution of the working fluid 3 , uniform heating area, and quick evaporation of the working fluid 3 .

Anyone who is familiar with the art can easily know that the material of the closed accommodation structure 5 of the flat plate evaporator structure of the present invention can be any heat-conducting material, including various metals such as copper, aluminum, stainless steel, titanium, or non-conductive heat-conducting materials. For metals, such as diamonds, the metals used for manufacturing need to be matched with different working fluids 3 so that they do not undergo chemical reactions and can operate normally. The flow channel for transmission in the conduction section L3 can be metal or non-metallic. Metal heat-resistant materials, such as copper tubes, aluminum tubes, stainless steel tubes, plastic or other bendable metal or non-metallic tubes, condensation section L2 is a variety of devices that can remove heat, which can be any kind of heat dissipation device.

The above description is only a description of the preferred embodiments of the present invention, and those who are proficient in this art can make other various improvements according to the above description, but these changes still belong to the spirit of the invention and the defined patent scope of the present invention middle.

Claims (15)

1. A loop-type heat pipe with a flat plate evaporator structure, which is composed of an evaporation section on a heat source, and a conduction section connected to a condensation section, wherein: The evaporation section includes: An airtight accommodation structure is arranged on the heat source, and a lid body and a box body are combined to form an airtight accommodation space. The airtight accommodation structure includes: A channel structure, the channel structure is arranged horizontally with the bottom surface of the airtight accommodating structure, and several groove channels are arranged at equidistant intervals and parallel to each other, and the channel structure is divided into several sections of channels by a predetermined distance , and there is a height difference between each section of the channel; a capillary structure, arranged horizontally on the channel structure, and set in the airtight accommodation space; A liquid inlet is arranged on the side edge of the box body for injecting a working fluid and communicated with the capillary structure; A gas outlet is arranged on the side edge of the box body corresponding to the liquid inlet, and is used to lead out the vapor generated by the working fluid evaporated by the heat source; the conduction section includes: a gas channel connected to the gas outlet of the airtight accommodation structure; a liquid channel connected to the liquid inlet of the airtight accommodation structure; The condensation section includes: A condensing device, respectively connected to the gas outlet and the liquid inlet of the airtight accommodation structure through the gas flow channel and the liquid flow channel of the conduction section, and the gas flow channel is arranged opposite to the liquid flow channel in the condensing device a selected location of When a working fluid is injected into the closed accommodating space, the working fluid is evaporated into steam by the heat source, and is introduced into the condensation device of the condensation section through the gas outlet connected to the gas flow channel, and the steam returns to the original form after cooling After the fluid is drained, it is guided back into the airtight accommodating space through the liquid flow channel, and repeated circulation is performed. 2. The loop heat pipe with flat plate evaporator structure according to claim 1, characterized in that, the channel structure of the airtight accommodation structure is horizontally interlaced with several protruding sections at equal intervals, and is connected to the The liquid inlet is arranged vertically. 3. The loop heat pipe with a flat plate evaporator structure according to claim 1, wherein the channel structure of the airtight accommodation structure includes a compensation channel, and the compensation channel is located between the liquid inlet and the channel structure between. 4. The loop heat pipe with flat plate evaporator structure according to claim 1, characterized in that, the capillary structure of the airtight accommodation structure is metal mesh stacking, non-metal mesh stacking, metal mesh diffusion bonding, metal powder sintering, One of non-metallic powder sintering and cotton wool weaving. 5 . The loop heat pipe with a flat plate evaporator structure according to claim 4 , wherein the capillary structure of the airtight accommodation structure is one of titanium, copper and metal mesh structure metal materials. 6. The loop heat pipe with flat plate evaporator structure as claimed in claim 4, characterized in that, the capillary structure of the airtight accommodation structure is a non-metallic material such as ceramic material, plastic, epoxy resin, fiber, porous heat-resistant brick one of the materials. 7 . The loop heat pipe with a flat plate evaporator structure according to claim 1 , wherein a cooling fin module is arranged on the condensing device in the condensing section. 8 . 8 . The loop heat pipe with a flat plate evaporator structure as claimed in claim 1 , wherein there is a gap between the capillary structure and the cover of the airtight accommodating structure for a baffle. 9. A flat plate evaporator structure of a loop heat pipe, the loop heat pipe is formed by setting an evaporation section on a heat source and connecting a condensation section with a conduction section, characterized in that the evaporator includes have: An airtight accommodation structure is arranged on the heat source, and a lid body and a box body are combined to form an airtight accommodation space. The airtight accommodation structure includes: A channel structure, the channel structure is arranged horizontally with the bottom surface of the airtight accommodating structure, and several groove channels are arranged at equidistant intervals and parallel to each other, and the channel structure is divided into several sections of channels by a predetermined distance , and there is a height difference between each section of the channel; a capillary structure arranged horizontally with the bottom surface of the airtight accommodating structure, and arranged in the airtight accommodating space; A liquid inlet is arranged on the side edge of the box body for injecting a working fluid and communicated with the capillary structure; A gas outlet is arranged on the side edge of the box body corresponding to the liquid inlet, and is used for leading out the vapor generated by the working fluid evaporated by the heat source. 10. The flat plate evaporator structure of the loop heat pipe as claimed in claim 9, wherein the channel structure of the airtight accommodation structure is horizontally interlaced with several protruding sections equidistant from the liquid inlet. set vertically. 11 . The flat plate evaporator structure of a loop heat pipe according to claim 9 , wherein the channel structure of the airtight accommodating structure includes a compensating channel located between the liquid inlet and the channel structure. 12. The flat plate evaporator structure of the loop heat pipe according to claim 9, characterized in that, the capillary structure of the airtight accommodation structure is metal mesh stacking, non-metal mesh stacking, metal mesh diffusion bonding, metal powder sintering, non-metallic mesh One of metal powder sintering and cotton wool weaving. 13 . The flat plate evaporator structure of a loop heat pipe according to claim 12 , wherein the capillary structure of the airtight accommodation structure is one of titanium, copper and metal mesh structure metal materials. 14 . 14. The flat plate evaporator structure of the loop heat pipe as claimed in claim 12, wherein the capillary structure of the airtight accommodation structure is a non-metallic material such as ceramic material, plastic, epoxy resin, fiber, or porous heat-resistant brick one. 15 . The flat plate evaporator structure of the loop heat pipe according to claim 9 , wherein there is a gap between the capillary structure and the cover of the airtight accommodating structure for setting a baffle. 15 .

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