CN104320930B - A kind of stacked ultrasonic module layout structure - Google Patents
A kind of stacked ultrasonic module layout structure Download PDFInfo
- Publication number
- CN104320930B CN104320930B CN201410517027.8A CN201410517027A CN104320930B CN 104320930 B CN104320930 B CN 104320930B CN 201410517027 A CN201410517027 A CN 201410517027A CN 104320930 B CN104320930 B CN 104320930B
- Authority
- CN
- China
- Prior art keywords
- plate
- heat sink
- hole
- fixed
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
A kind of stacked ultrasonic module layout structure, mainly includes order arranged stacked：Mainboard heat sink, ultrasound motherboard, fixed plate, front end-plate, front end heat sink, and the fixed side set perpendicular to the fixed plate；Ultrasound motherboard is separately positioned on the opposing sides of fixed plate with front end-plate, and fixed side is covered on the outside of the fixed plate；Mainboard heat sink, front end heat sink are individually fixed in the plate face both sides of fixed side；Ultrasonic module layout of the present invention is succinct, Stability Analysis of Structures, it is easy to disassembles and installs, and possesses more preferable heat sinking function；The space that the mainboard heat sink, the front end heat sink and the fixed side are surrounded by the fixed plate be divided into above and below two separate chambers, also provide preferable anti-interference function to be respectively placed in the ultrasound motherboard therein and the front end-plate.
Description
Technical field
The present invention relates to a kind of layout structure, more particularly to a kind of stacked ultrasonic module layout structure.
Background technology
In ultrasound products, assist the collection ultrasound data such as ultrasonic host computer control ultrasonic probe, probe, and to collecting
Data and the user instruction that receives etc. are handled, and finally export the function plate combination shown to display device, typically
It is referred to as ultrasonic module.Ultrasonic module is essential part in ultrasound products, is widely used in medical field.At present,
Most ultrasonic module is all independently to assemble each functional cards, causes ultrasonic module space-consuming big, portable performance is poor.
And the scheme that polylith functional cards are installed simultaneously, while reducing space, but there are many problems：
1. board installs close, air channel is not smooth, and radiating effect is poor；
2. connected between board using cable, when needing complete machine doing removal action when safeguarding ultrasonic module not enough just
Profit, and assembling process is also more complicated；Cabling confusion is also easily caused the problem of reliability of product, anti-interference are reduced.
3. between board, especially ultrasonic signal processing circuit and ultrasonic signal are received existing seriously between transtation mission circuit
Electromagnetic interference.When simultaneously in narrow space, it is impossible to shield the electromagnetic interference well, cause the ultrasound in circuit
Distorted signals even circuit can not normal work.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of stacked ultrasonic module layout structure, in favor of ultrasonic mould
Block is easy to disassemble and installed while space is reduced, and is easy to later stage upgrade maintenance.
While further accomplishing to improve heat dispersion, moreover it is possible to which realization reaches preferable electromagnetic compatibility in small space
Property.
A kind of stacked ultrasonic module layout structure, it is characterised in that mainly include order arranged stacked：Mainboard dissipates
Hot plate, ultrasound motherboard, fixed plate, front end-plate, front end heat sink, and the fixed side set perpendicular to the fixed plate；It is described
Ultrasound motherboard and front end-plate be separately positioned on the opposing sides of the fixed plate, the fixed side is covered in outside the fixed plate
Side；The mainboard heat sink, the front end heat sink are individually fixed on the fixed side.
Further, the fixed side is provided with least one pair of air vent；The pair of air vent mainly includes difference
The first air vent and the second air vent on the fixed side opposite face are fixed on, for forming heat dissipation channel.
Further, in addition to the ultrasound motherboard, the front end-plate, the probe fixing support spy being connected respectively
Head pinboard；The probe pinboard is provided with flexible PCB, and the probe pinboard is distinguished by the flexible PCB
It is connected with the first socket, the second socket；The first plug for connecting first socket is provided with the ultrasound motherboard；Institute
State the second plug being provided with front end-plate for connecting second socket.
Further, in addition to the mainboard heat sink, the probe fixing support shielding being respectively fixedly connected with
Upper plate；It is provided with the shielding upper plate on upper plate circular hole, the mainboard heat sink and is provided with mainboard radiating screw, screw is successively
The shielding upper plate is fixedly connected with the mainboard heat sink through the upper plate circular hole and mainboard radiating screw；
It is provided with the shielding upper plate on upper plate flanging, the probe fixing support and is provided with breach position, institute on support
Upper plate flanging is stated to be fitting to connection with breach position on the support；Breach position side is also set the probe fixing support on the bracket
It is equipped with for supporting the shielding upper plate and coordinating the fixed support upper hem for shielding upper plate with breach position on the support.
Another step, in addition under the shielding being respectively fixedly connected with the front end heat sink, the probe fixing support
Plate；It is provided with the shielding lower plate on lower plate circular hole, the front end heat sink and is provided with front end radiating screw, screw is worn successively
The lower plate circular hole and front end radiating screw is crossed to be fixedly connected with the shielding lower plate with the front end heat sink；
It is provided with the shielding lower plate on lower plate flanging, the probe fixing support and is provided with breach position, institute under support
Lower plate flanging is stated to be fitting to connection with breach position under the support；The probe fixing support is also set under the support by breach position
It is equipped with for supporting the shielding lower plate and coordinating the fixed support lower hem for shielding lower plate with breach position under the support.
Furthermore, the mainboard heat sink and the non-setting of fitting of the ultrasound motherboard, the heater element in the ultrasound motherboard
It is connected by thermal grease with the mainboard heat sink；The front end heat sink and the non-setting of fitting of the front end-plate, it is described before
Heater element on end plate is connected by thermal grease with the front end heat sink.
As an improvement, self-clinching standoff is provided with the fixed plate, the ultrasound motherboard is in the self-clinching standoff pair
Answer be provided with position be provided with main nexine through hole, the front end-plate on the self-clinching standoff correspondence position before nexine lead to
Hole, for fix the stud of ultrasound motherboard and front end-plate through after the preceding nexine through hole or the main nexine through hole with the pressure
Riveted screw pole is connected；
The mainboard heat sink is provided with main outer layer through hole, the front end heat sink on the self-clinching standoff correspondence position
Outer layer through hole before being provided with the self-clinching standoff correspondence position, the fixed side is set on self-clinching standoff correspondence position
There is side outer layer through hole, be each passed through the main outer layer for fixing the mainboard heat sink and front end radiating plate bolt and lead to
Hole, the side outer layer through hole or the preceding outer layer through hole, the side outer layer through hole and the corresponding Stud connection.
Further, in addition to the fixed plate probe fixing support being connected, for being provided for ultrasonic probe access
Support；The fixed side is additionally provided with jointing holes；The connector set in the ultrasound motherboard passes through the jointing holes and ultrasound
Module-external is connected.
Further, be provided with the mainboard heat sink in upgrading hole position, the ultrasound motherboard be provided with it is described
The corresponding upgrade interface in position for hole position of upgrading, the upgrade interface is emerging in outside the ultrasonic module through the upgrading hole position
Side, for being upgraded or data exchange in the case where not disassembling the ultrasonic module.
Further, it is provided with the fixed plate in data hole position, the ultrasound motherboard in the correspondence digit punch
Mainboard socket is provided with the position of position, the front end-plate is provided with data pin on the position of the correspondence mainboard socket；
The data pin inserts the mainboard socket after passing through the data hole position, for the ultrasound motherboard and the front end-plate
Data interaction.
A kind of stacked ultrasonic module layout structure, successively by the mainboard heat sink, ultrasound motherboard, described solid
Fixed board, the front end-plate, the front end heat sink are stacked；The ultrasound motherboard is separately fixed at the front end-plate
The fixed plate two sides；The fixed side is set perpendicular to the fixed plate, and is centered around the fixed plate outer ledge；Institute
Fixed plate is stated to be connected on the fixed side；The mainboard heat sink, the front end heat sink are individually fixed in the fixation
The plate face both sides of side plate, make ultrasonic module of the present invention occupy little space, are laid out succinct, Stability Analysis of Structures, it is easy to disassemble and install, and
Possess more preferable heat sinking function；The space that the mainboard heat sink, the front end heat sink and the fixed side are surrounded by
The fixed plate be divided into above and below two separate chambers, also carried to be respectively placed in the ultrasound motherboard therein and the front end-plate
Preferable anti-interference function is supplied.
Brief description of the drawings
For ease of explanation, the present invention is described in detail by following embodiment and accompanying drawing.
Fig. 1 is a kind of foundation structure decomposing schematic representation of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 2 is a kind of schematic elevation view of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 3 is the part section in X-X directions in a kind of embodiment Fig. 2 of stacked ultrasonic module layout structure of the present invention
Schematic diagram；
The partial enlargement signal that Fig. 4 encloses for A in a kind of embodiment Fig. 3 of stacked ultrasonic module layout structure of the present invention
Figure；
Fig. 5 is a kind of schematic side view of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 6 is a kind of improved structure decomposing schematic representation of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 7 is a kind of partial exploded view of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 8 is a kind of partial exploded view of the embodiment of stacked ultrasonic module layout structure of the present invention；
Fig. 9 is schematic perspective view after a kind of assembling of the embodiment of stacked ultrasonic module layout structure of the present invention；
Figure 10 is a kind of assembling decomposing schematic representation of the embodiment of stacked ultrasonic module layout structure of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.
As shown in accompanying drawing 1-10, a kind of stacked ultrasonic module layout structure mainly includes order arranged stacked：It is main
Plate heat sink 4, ultrasound motherboard 1, fixed plate 3, front end-plate 2, front end heat sink 5, and the fixation set perpendicular to the fixed plate 3
Side plate 6；
Ultrasound motherboard 1 is used to handle the ultrasound data collected and the user instruction received etc..
Front end-plate 2 is used for the collection for controlling ultrasonic probe, probe of access ultrasonic module etc. to carry out ultrasound data.
Fixed plate 3 is used for the ultrasound motherboard 1 and front end-plate 2 being fixedly mounted in ultrasonic module.
Mainboard heat sink 4 is used for for the circuit radiating in ultrasound motherboard.
Front end heat sink 5 is used to be radiated for the circuit on front end-plate.
The plate of affixed side 6 is used to fix mainboard heat sink 4, front end heat sink 5 and fixed plate 3, and with mainboard heat sink 4, preceding
End heat sink 5, fixed plate 3, which coordinate, is formed in the shielding space that fixed plate is isolated from each other about 3.
Ultrasound motherboard 1 is separately positioned on the opposing sides of fixed plate 3 with front end-plate 2, and fixed side is covered in the fixed plate 3
Outside；Mainboard heat sink 4, front end heat sink 5 are individually fixed on fixed side 6.
The space surrounded between mainboard heat sink 4 and front end heat sink 5 by fixed side 6 is therefrom separated by fixed plate 3
For two independent cavitys, so that physically ultrasound motherboard 1 come with the isolation of front end-plate 2, shield therebetween
Electromagnetic interference, it is ensured that the circuit in two pieces of circuit boards can normally be run.
Further, fixed side 6 is provided with least one pair of air vent；A pair of air vents mainly include being separately fixed at
The first air vent 621 and the second air vent 622 on the opposite face of fixed side 6, for forming heat dissipation channel.
Specifically, as shown in Figure 1,5, the first air vent 621 and the second air vent 622 set respectively on fixed side 6,
Ensure that air channel is smooth, reach wind energy and be blown into from one end, through ultrasound motherboard 1 and the circuit surface of front end-plate 2, from the other end by heat
Amount is taken away.
Further to meet the demand of radiating, other in the prior art dissipate can also be used on the basis of said structure
Heat pattern.
Further, in addition to ultrasound motherboard 1, front end-plate 2, probe fixing support 8 the probe pinboard being connected respectively
7；Probe pinboard 7 is provided with flexible PCB, and probe pinboard is connected to the first socket 71, the by flexible PCB
Two sockets 72；The first plug 105 is provided with ultrasound motherboard 1, for connecting the first socket 71；Second is provided with front end-plate to insert
First 23, for connecting the second socket 72.
Specifically, as shown in Fig. 3,7, probe pinboard 7 is fixed with probe fixing support 8 by screw 12, and ultrasound is main
The second plug 23 set on the first plug 105 and front end-plate 2 set on plate 1 respectively with set on probe pinboard 7 the
One socket 71 and the second socket 72 are done is provided with flexible PCB to inserting on operation, probe pinboard 7（Abbreviation FPC）73, it is used for
The first socket 71 of connection and the second socket 72 are done, and disclosure satisfy that the function of bending operation, the purpose of board signal transmission is reached,
Socket is reduced to slotting operation and connected using cable, the stability of product is guaranteed and is easy to production operation.
Further, in addition to mainboard heat sink 4, probe fixing support 8 the shielding upper plate 9 being respectively fixedly connected with；
It is provided with shielding upper plate 9 on upper plate circular hole 91, mainboard heat sink 4 and is provided with mainboard radiating screw 46, screw 11 is sequentially passed through
Upper plate circular hole 91 and mainboard radiating screw 46 are fixedly connected upper plate 9 is shielded with mainboard heat sink 4；
It is provided with shielding upper plate 9 on upper plate flanging 92, probe fixing support 8 and is provided with breach position 81, upper plate on support
Flanging 92 is fitting to connection with breach position 81 on support；Probe fixing support 8 on the bracket breach position 81 by be additionally provided with branch
Frame upper hem 82, for supporting the shielding upper plate 9 and coordinating fixed mask upper plate 9 with breach position 81 on support.
Another step, in addition to the shielding lower plate 10 being respectively fixedly connected with front end heat sink 5, probe fixing support 8；Screen
Cover and lower plate circular hole is provided with lower plate 10, radiating screw in front end is provided with the heat sink of front end, screw 12 sequentially passes through lower plate circle
Hole and front end radiating screw are fixedly connected lower plate 10 is shielded with front end heat sink 5；
It is provided with shielding lower plate 10 on lower plate flanging, probe fixing support 8 and is provided with breach position, lower plate flanging under support
It is fitting to connection with breach position under support；Probe fixing support 8 is additionally provided with support lower hem under support by breach position, for propping up
Support shielding lower plate 10 simultaneously coordinates fixed mask lower plate 10 with breach position under support.
Specifically, as shown in Fig. 3,4,8, upper plate flanging 92 is provided with shielding upper plate 9 with being set on probe fixing support part 8
Breach position 81 coordinates positioning on the support put, while the support upper hem 82 set on probe fixing support part 8 plays support screen
The effect of upper plate 9 is covered, the upper plate circular hole 91 set on the shielding upper plate 9 of ultrasonic module component is radiated by screw 12 and mainboard
The mainboard radiating screw 46 set on plate 4 is fixed, and such a structure type reduces the quantity of screw fixation, and the cooperation of flanging is gone back
The bonding strength of product is strengthened, shielding lower plate 10 is connected using identical structure type with probe fixing support part 8.
Shielding upper plate 9 will be by fixed plate 3, mainboard heat sink 4, front end with shielding lower plate 10 and the cooperation of probe fixing support 8
Two separate chamber complete seals that heat sink 5 and fixed side 6 are surrounded, preferably shield ultrasound motherboard 1 with before
Electromagnetic interference between end plate 2.
Furthermore, mainboard heat sink 4 and the non-setting of fitting of ultrasound motherboard 1, the heater element in the ultrasound motherboard 1, which passes through, to be dissipated
Hot silica gel is connected with the mainboard heat sink 4；Hair on front end heat sink 5 and the non-setting of fitting of front end-plate 2, the front end-plate 2
Thermal element is connected by thermal grease with the front end heat sink 5.
As an improvement, self-clinching standoff 32 is provided with fixed plate 3, ultrasound motherboard 1 is in the correspondence position of self-clinching standoff 32
On be provided be provided with main nexine through hole 103, front end-plate 2 on the correspondence position of self-clinching standoff 32 before nexine through hole 22, stud
11 with self-clinching standoff 32 through being connected after preceding nexine through hole 22 or main nexine through hole 103, for fixing ultrasound motherboard 1 and front end-plate
2；
Mainboard heat sink 4 is provided with main outer layer through hole 45 on the correspondence position of self-clinching standoff 32, and front end heat sink 4 is pressing
Outer layer through hole 51 before being provided with the correspondence position of stud 32, fixed side 6 is provided with outside side on the correspondence position of self-clinching standoff 32
Layer through hole 61, screw 12 be each passed through main outer layer through hole 45, the outer layer through hole 51 of side outer layer through hole 61 or preceding, side outer layer through hole 61 with
Correspondence stud 11 is connected, for fixing mainboard heat sink 4 and front end heat sink 5.
Specifically, as shown in Figure 6,7, stud 11 passes through the main nexine through hole 103 set in ultrasound motherboard 1 and fixed plate 3
The self-clinching standoff 32 of upper setting is connected, and ultrasound motherboard 1 is fixed with fixed plate 3, and stud 11 passes through what is set on front end-plate 2
Preceding nexine through hole 22 is also screwed tight with the self-clinching standoff 32 that is set in fixed plate 3, front end-plate 2 is connected with fixed plate 3.
It is each passed through the main outer layer through hole 45 set on mainboard heat sink 4 by screw 12, sets on front end heat sink 5
The side outer layer through hole 61 set on the flanging 64 of preceding outer layer through hole 51 and fixed side 6, screws tight attended operation with stud 11, makes
Board card module forms stacked structural form, and the height of self-clinching standoff 32 makes to form gap between board, reaches beneficial to radiating
General layout, and monoblock type structure type make product strength obtain maximum guarantee.
As another embodiment, foregoing stud 11 and self-clinching standoff 32 can also use be separately positioned on fixed plate 3,
Fixed support in ultrasound motherboard 1 or front end-plate 2 is replaced.
As another embodiment, ultrasound motherboard 1 or front end-plate 2 can also be directly anchored on fixed side 6.
Further, in addition to fixed plate the probe fixing support 8 being connected, for providing branch for ultrasonic probe access
Support.Fixed side 6 is additionally provided with jointing holes 63；The connector set in ultrasound motherboard 1 passes through the jointing holes 63 and ultrasonic module 1
External connection.
As shown in figure 1, the connector 104 set in ultrasound motherboard 1 passes through the jointing holes 63 set on fixed side 6, will
The signal of ultrasonic module is connected with outside, and such a structure type is supported to do to slotting operation with other parts, disclosure satisfy that letter
Clean easy-operating purpose.
Further, it is provided with upgrading hole position 41, the ultrasound motherboard 1 and is provided with and upgrading hole on mainboard heat sink 4
The corresponding upgrade interface 101 in position of position 41, upgrade interface 101 is emerging on the outside of ultrasonic module through upgrading hole position 41, is used for
Upgraded in the case where not disassembling the ultrasonic module or data exchange.
Specifically, as shown in Figure 2,6, the upgrading hole position 41 that mainboard heat sink 4 is set, for by the liter in ultrasound motherboard 1
Level interface 101 exposes, and makes product after mounting, it is not necessary to dismounting structure part, you can the software detection for carrying out the later stage updates and risen
The operation such as level, this structure type can be realized in fixed side 6, front end heat sink 5 or other positions, be not only limited to mainboard and dissipated
On hot plate 4.As shown in Figure 2,3, the fin 43 set on mainboard heat sink 4, Bao Erxi structure type increases to greatest extent
Area of dissipation, strengthens the radiating effect of product.When the thermal grease 44 set on mainboard heat sink 4 coordinates with ultrasound motherboard 1,
Compression thermal grease, without air between mainboard heat sink 4 and ultrasound motherboard 1, to strengthen heat-conducting effect, can accelerate part
Heat-transfer rate.Front end heat sink 5 can possess identical radiator structure, such as fin with mainboard heat sink 4
Further, it is provided with fixed plate 3 in data hole position 31, ultrasound motherboard 1 in the position of corresponding data hole position 31
Put and be provided with mainboard socket 102, front end-plate 2 is provided with data pin 21 on the position of correspondence mainboard socket 102；Data are inserted
Pin 21 passes through insertion mainboard socket 102, the data interaction for stating ultrasound motherboard 1 and front end-plate 2 after data hole position 31.
Specifically, as shown in figure 1, the mainboard socket 102 set in ultrasound motherboard 1 passes through the data set in fixed plate 3
Hole position 31 coordinates with the data pin 21 set on front end-plate 2, reaches the purpose of signal transmission between board, and reduction is done using cable
Connection, makes the stability of product be guaranteed and is easy to production operation.
As shown in Figure 10, when ultrasonic module is used cooperatively with notebook host, ultrasonic module uses stacked structure shape
Formula, creates the air channel environment beneficial to local device quick heat radiating, mainboard heat sink 4, front end heat sink 5, fixed side 6, spy
Head fixed support part 8, shielding upper plate 9 and the shielding assembling of lower plate 10 are completed, and form the good integral module form of a shield effectiveness,
Improve the bulk strength of product.When being assembled with notebook host, using the form of slideway, after progress that can be more succinct
Phase safeguards.
The assembling mode of the present invention：Ultrasound motherboard 1 and front end-plate 2 are assemblied in fixed plate 3 by stud 11 and screw 12,
Two boards also by component is patched to inserting operation, mainboard heat sink 4 is fixed in ultrasound motherboard 1 simultaneously, and will be solid
Determine side plate 6 and be caught in be assembled in fixed plate 3, front end heat sink 5 is fixed on fixed side 6 by screw 12, form one
Individual widgets, probe pinboard 7 is fixed on probe fixing support part 8 by screw 12, by the socket on pinboard 7 of popping one's head in
It is connected, and is connected fixed support part 8 with the component of fixed plate 3 with ultrasound motherboard 1 and front end-plate 2 by screw, finally will
Shielding upper plate 9 and shielding lower plate 10 are fixed on the component of fixed plate 3 by screw 12 respectively, and the assembling of ultrasonic module component is completed.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Interior made any modifications, equivalent substitutions and improvements of god and principle etc., should be included in the interior of protection scope of the present invention.
Claims (9)
1. a kind of stacked ultrasonic module layout structure, it is characterised in that mainly include order arranged stacked：Mainboard radiates
Plate, ultrasound motherboard, fixed plate, front end-plate, front end heat sink, and the fixed side set perpendicular to the fixed plate；Described
Ultrasound motherboard is separately positioned on the opposing sides of the fixed plate with the front end-plate, and the fixed side is covered in the fixed plate
Outside；The mainboard heat sink, the front end heat sink are individually fixed in the plate face of the fixed side；
The stacked ultrasonic module layout structure also includes the probe fixing support that be connected with the fixed plate, for surpass
Sonic probe access provides support；And also include respectively connecting with the ultrasound motherboard, the front end-plate, the probe fixing support
The probe pinboard connect；The probe pinboard is provided with flexible PCB, and the probe pinboard passes through the flexible circuit
Plate is connected to the first socket, the second socket；Be provided with the ultrasound motherboard for connect first socket first
Plug；The second plug for connecting second socket is provided with the front end-plate.
2. a kind of stacked ultrasonic module layout structure according to claim 1, it is characterised in that the fixed side is set
It is equipped with least one pair of air vent；The pair of air vent mainly includes first be separately fixed on the fixed side opposite face
Air vent and the second air vent.
3. a kind of stacked ultrasonic module layout structure according to claim 1, it is characterised in that also including with the master
The shielding upper plate that plate heat sink, the probe fixing support are respectively fixedly connected with；Upper plate circular hole is provided with the shielding upper plate,
Mainboard radiating screw is provided with the mainboard heat sink, screw sequentially passes through the upper plate circular hole and mainboard radiating screw
The shielding upper plate is fixedly connected with the mainboard heat sink；
Be provided with the shielding upper plate on upper plate flanging, the probe fixing support and be provided with support breach position, it is described on
Plate flanging is fitting to connection with breach position on the support；Breach position side is additionally provided with the probe fixing support on the bracket
For supporting the shielding upper plate and coordinating the fixed support upper hem for shielding upper plate with breach position on the support.
4. a kind of stacked ultrasonic module layout structure according to claim 3, it is characterised in that also including with it is described before
The shielding lower plate that end heat sink, the probe fixing support are respectively fixedly connected with；Lower plate circular hole is provided with the shielding lower plate,
Radiating screw in front end is provided with the front end heat sink, screw sequentially passes through the lower plate circular hole and front end radiating screw
The shielding lower plate is fixedly connected with the front end heat sink；
Be provided with the shielding lower plate on lower plate flanging, the probe fixing support and be provided with support breach position, it is described under
Plate flanging is fitting to connection with breach position under the support；The probe fixing support is additionally provided with the support by breach position
For supporting the shielding lower plate and coordinating the fixed support lower hem for shielding lower plate with breach position under the support.
5. a kind of stacked ultrasonic module layout structure according to claim 4, it is characterised in that the mainboard heat sink
With the non-setting of fitting of the ultrasound motherboard, the heater element in the ultrasound motherboard passes through thermal grease and the mainboard heat sink
Connection；Heater element on the front end heat sink and the non-setting of fitting of the front end-plate, the front end-plate passes through thermal grease
It is connected with the front end heat sink.
6. a kind of stacked ultrasonic module layout structure according to claim 5, it is characterised in that set in the fixed plate
Self-clinching standoff is equipped with, the ultrasound motherboard is provided with main nexine through hole, the front end-plate on the self-clinching standoff correspondence position
On be provided with the self-clinching standoff correspondence position before nexine through hole, the stud for fixing ultrasound motherboard and front end-plate passes through
It is connected after the preceding nexine through hole or the main nexine through hole with the self-clinching standoff；
The mainboard heat sink is provided with main outer layer through hole on the self-clinching standoff correspondence position, and the front end heat sink is in institute
Outer layer through hole before being provided with self-clinching standoff correspondence position is stated, the fixed side is provided with side on self-clinching standoff correspondence position
Outer layer through hole, for fix the screw of the mainboard heat sink and the front end heat sink be each passed through the main outer layer through hole,
The side outer layer through hole or the preceding outer layer through hole, the side outer layer through hole and the corresponding Stud connection.
7. a kind of stacked ultrasonic module layout structure according to claim 6, it is characterised in that the fixed side is also
It is provided with jointing holes；The connector set in the ultrasound motherboard is connected through the jointing holes with the equipment outside ultrasonic module.
8. a kind of stacked ultrasonic module layout structure according to claim 1, it is characterised in that the mainboard heat sink
On be provided with the corresponding upgrade interface in position being provided with upgrading hole position, the ultrasound motherboard with the upgrading hole position, it is described
Upgrade interface is emerging on the outside of the ultrasonic module through the upgrading hole position.
9. a kind of stacked ultrasonic module layout structure according to claim 8, it is characterised in that set in the fixed plate
It is equipped with data hole position, the ultrasound motherboard and is provided with mainboard socket, the front end on the position of the correspondence data hole position
Plate is provided with data pin on the position of the correspondence mainboard socket；The data pin is passed through and inserted after the data hole position
The mainboard socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410517027.8A CN104320930B (en) | 2014-09-30 | 2014-09-30 | A kind of stacked ultrasonic module layout structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410517027.8A CN104320930B (en) | 2014-09-30 | 2014-09-30 | A kind of stacked ultrasonic module layout structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104320930A CN104320930A (en) | 2015-01-28 |
| CN104320930B true CN104320930B (en) | 2017-08-08 |
Family
ID=52376073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410517027.8A Active CN104320930B (en) | 2014-09-30 | 2014-09-30 | A kind of stacked ultrasonic module layout structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104320930B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163147B (en) * | 2015-04-03 | 2021-11-12 | 宝应昆拓热控系统有限公司 | Electric installation box |
| CN109893165B (en) * | 2019-02-28 | 2022-03-18 | 李淑杰 | Wireless synchronous ultrasonic image diagnostic apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1204229A (en) * | 1997-05-28 | 1999-01-06 | 夏普公司 | Thin type cable modem and stand for mounting the same |
| CN1893041A (en) * | 2005-07-08 | 2007-01-10 | 富准精密工业(深圳)有限公司 | Thin loop type radiating apparatus |
| CN101150123A (en) * | 2007-10-31 | 2008-03-26 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure with electromagnetic shielding cover |
| CN201181436Y (en) * | 2008-04-08 | 2009-01-14 | 庆扬资讯股份有限公司 | Ultra-micro computer structure |
| CN201222217Y (en) * | 2008-05-07 | 2009-04-15 | 研祥智能科技股份有限公司 | Stack type special computer |
| TWI362909B (en) * | 2007-11-30 | 2012-04-21 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board |
| CN102655227A (en) * | 2011-03-02 | 2012-09-05 | 珠海银通新能源有限公司 | Power battery pack |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030156400A1 (en) * | 1999-07-15 | 2003-08-21 | Dibene Joseph Ted | Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management |
-
2014
- 2014-09-30 CN CN201410517027.8A patent/CN104320930B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1204229A (en) * | 1997-05-28 | 1999-01-06 | 夏普公司 | Thin type cable modem and stand for mounting the same |
| CN1893041A (en) * | 2005-07-08 | 2007-01-10 | 富准精密工业(深圳)有限公司 | Thin loop type radiating apparatus |
| CN101150123A (en) * | 2007-10-31 | 2008-03-26 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure with electromagnetic shielding cover |
| TWI362909B (en) * | 2007-11-30 | 2012-04-21 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board |
| CN201181436Y (en) * | 2008-04-08 | 2009-01-14 | 庆扬资讯股份有限公司 | Ultra-micro computer structure |
| CN201222217Y (en) * | 2008-05-07 | 2009-04-15 | 研祥智能科技股份有限公司 | Stack type special computer |
| CN102655227A (en) * | 2011-03-02 | 2012-09-05 | 珠海银通新能源有限公司 | Power battery pack |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104320930A (en) | 2015-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104306020B (en) | A kind of Portable B ultrasonic apparatus | |
| CN100561401C (en) | Electronics and Cooling Units | |
| US10338647B2 (en) | Housing assembly for a computer system and computer system | |
| CN201600628U (en) | Fan connector fixing combination | |
| CN104320930B (en) | A kind of stacked ultrasonic module layout structure | |
| CN209433362U (en) | ATX specification power supply with redundant power supply architecture | |
| CN205862284U (en) | A kind of PC cabinet being easy to heat radiation | |
| CN101720183A (en) | Heat radiating method for circuit board | |
| CN104586432B (en) | Car-type ultrasonic diagnostic equipment and its cabinet | |
| CN116113211A (en) | Monitoring instrument | |
| CN101576758A (en) | Portable DIY computer | |
| CN206136523U (en) | Nonstandard PXIe module is combined and is surveyed appearance universal machine case | |
| CN107444651A (en) | Vehicle entertainment player | |
| CN102023688A (en) | Computer case with good cooling performance | |
| CN201945915U (en) | Integrated machine | |
| CN200993758Y (en) | Adapter card extraction tray with heat dissipation structure | |
| CN111782006B (en) | Input/output (IO) module and electronic equipment | |
| CN104991610B (en) | virtual instrument platform | |
| CN206639093U (en) | Desk-top display card notebook computer | |
| CN222017057U (en) | A universal real-time simulator device chassis | |
| CN206162291U (en) | Computer mainframe box | |
| CN202077156U (en) | Communication device | |
| CN208985057U (en) | A kind of micromainframe | |
| CN219143382U (en) | Host case structure and discussion host | |
| CN103135672B (en) | Electronic system backplane wall-mounted structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |