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BRPI0411163A - processo para montar um componente eletrÈnico em uma base - Google Patents

processo para montar um componente eletrÈnico em uma base

Info

Publication number
BRPI0411163A
BRPI0411163A BRPI0411163-0A BRPI0411163A BRPI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A
Authority
BR
Brazil
Prior art keywords
electronic component
substrate
conductive
component
tracks
Prior art date
Application number
BRPI0411163-0A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of BRPI0411163A publication Critical patent/BRPI0411163A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

"PROCESSO PARA MONTAR UM COMPONENTE ELETRÈNICO EM UMA BASE". O objetivo desta invenção é propor um processo de fabricação de um transponder em forma de um cartão ou de uma etiqueta capaz de resistir a flexões ou torções sem interromper as conexões dos componentes eletrónIcos. Este objetivo é alcançado através de um processo de montagem de pelo menos um componente eletrónico (1) incluindo áreas condutoras de superfície plana (3) que são conectadas às trilhas condutoras (6) localizadas na superfície de um suporte isolante geralmente plano chamado base (5) caracterizada pelas seguintes etapas: - colocar a base (5) em uma superfície de trabalho, cuja face inclui trilhas condutoras (6) que são orientadas para cima, - colocar o componente eletrónico (1) em uma cavidade (7) da base (5) situada em uma zona incluindo as trilhas condutoras (6), as áreas condutoras (3) do componente (1) para contatar-se com as trilhas correspondentes (6) da base (5), - aplicar uma camada de material isolante (8) que se estende ao mesmo tempo sobre o componente (1) e pelo menos em uma zona da base adjacente ao mencionado componente (1), de tal maneira que a conexão elétrica entre as áreas condutoras (3) e as trilhas condutoras (6) seja assegurada pela pressão da camada isolante (8) no componente (1).
BRPI0411163-0A 2003-05-13 2004-05-12 processo para montar um componente eletrÈnico em uma base BRPI0411163A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH8322003 2003-05-13
PCT/IB2004/050645 WO2004102469A1 (fr) 2003-05-13 2004-05-12 Procédé d'assemblage d'un composant électronique sur un substrat

Publications (1)

Publication Number Publication Date
BRPI0411163A true BRPI0411163A (pt) 2006-07-11

Family

ID=33438095

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0411163-0A BRPI0411163A (pt) 2003-05-13 2004-05-12 processo para montar um componente eletrÈnico em uma base

Country Status (18)

Country Link
US (1) US8127997B2 (pt)
EP (1) EP1623369B1 (pt)
JP (1) JP5042627B2 (pt)
KR (1) KR101158128B1 (pt)
CN (1) CN100468450C (pt)
AT (1) ATE353457T1 (pt)
AU (1) AU2004239501B2 (pt)
BR (1) BRPI0411163A (pt)
CA (1) CA2524673C (pt)
DE (1) DE602004004647T2 (pt)
ES (1) ES2281802T3 (pt)
MX (1) MXPA05011963A (pt)
MY (1) MY148205A (pt)
PL (1) PL1623369T3 (pt)
PT (1) PT1623369E (pt)
RU (1) RU2328840C2 (pt)
TW (1) TWI331497B (pt)
WO (1) WO2004102469A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT2036007E (pt) 2006-06-19 2013-04-11 Nagraid Sa Procedimento de fabricação de cartões compreendendo cad um módulo electrónico e produtos intermediários
AU2007263133B2 (en) 2006-06-19 2012-04-05 Nagravision S.A. Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
AU2008217056B2 (en) 2007-02-09 2012-12-20 Nagravision S.A. Method for producing electronic cards including at least one printed pattern
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9202162B2 (en) * 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
EP3259708A1 (fr) 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne

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DE3122981A1 (de) * 1981-06-10 1983-01-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zum einbau von ic-bausteinen in ausweiskarten
JPS6420197A (en) * 1987-07-16 1989-01-24 Toshiba Corp Portable medium
DE4401458A1 (de) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Verfahren und Vorrichtung zum Herstellen von Chipkarten
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
EP0786357A4 (en) 1994-09-22 2000-04-05 Rohm Co Ltd CONTACTLESS CHIP CARD AND METHOD FOR PRODUCING THE SAME
JPH091972A (ja) * 1995-06-26 1997-01-07 Hitachi Ltd Ｉｃカード
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JPH09286187A (ja) * 1996-04-22 1997-11-04 Toppan Printing Co Ltd Ｉｃカード、ｉｃカード製造用中間体およびｉｃカードの製造方法
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EP1544787A1 (en) * 2003-12-19 2005-06-22 Axalto SA Contactless card including an antenna switch

Also Published As

Publication number Publication date
PL1623369T3 (pl) 2007-07-31
JP5042627B2 (ja) 2012-10-03
TW200501859A (en) 2005-01-01
JP2007511811A (ja) 2007-05-10
RU2005134859A (ru) 2006-07-27
ATE353457T1 (de) 2007-02-15
EP1623369B1 (fr) 2007-02-07
MY148205A (en) 2013-03-15
CA2524673A1 (en) 2004-11-25
AU2004239501A1 (en) 2004-11-25
DE602004004647D1 (de) 2007-03-22
ES2281802T3 (es) 2007-10-01
AU2004239501B2 (en) 2010-06-17
RU2328840C2 (ru) 2008-07-10
MXPA05011963A (es) 2006-02-02
PT1623369E (pt) 2007-05-31
CN100468450C (zh) 2009-03-11
KR20060017779A (ko) 2006-02-27
CA2524673C (en) 2012-01-24
US20060226237A1 (en) 2006-10-12
US8127997B2 (en) 2012-03-06
EP1623369A1 (fr) 2006-02-08
TWI331497B (en) 2010-10-01
WO2004102469A1 (fr) 2004-11-25
CN1788275A (zh) 2006-06-14
DE602004004647T2 (de) 2007-11-08
KR101158128B1 (ko) 2012-06-19

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Free format text: AS CLASSIFICACOES ANTERIORES ERAM: G06K 19/077 , B23K 1/00

Ipc: G06K 19/077 (2006.01)

B25A Requested transfer of rights approved

Owner name: NAGRAVISION S.A (CH)

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM O ARTIGO 8O COMBINADO COM ARTIGO 13 E ART. 25 DA LPI

B09B Patent application refused [chapter 9.2 patent gazette]