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BR0316860A - Composição curável, e composição curável por calor - Google Patents

Composição curável, e composição curável por calor

Info

Publication number
BR0316860A
BR0316860A BR0316860-3A BR0316860A BR0316860A BR 0316860 A BR0316860 A BR 0316860A BR 0316860 A BR0316860 A BR 0316860A BR 0316860 A BR0316860 A BR 0316860A
Authority
BR
Brazil
Prior art keywords
curable composition
compounds
heat
epoxy
zdma
Prior art date
Application number
BR0316860-3A
Other languages
English (en)
Inventor
Donald W Taylor
James W Freitag
Don K Howard
Original Assignee
Denovus Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denovus Llc filed Critical Denovus Llc
Publication of BR0316860A publication Critical patent/BR0316860A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

"COMPOSIçãO CURáVEL, E COMPOSIçãO CURáVEL POR CALOR". A descrição refere-se ao uso de compostos de acrilato de metal como diacrilato de zinco (ZDA), dimetacrilato de zinco (ZDMA), dentre outros para a cura de compostos de função epóxi (e outros de reticulação), e a composições contendo estes compostos. Os compostos contendo ZDA e ZDMA podem curar o componente epóxi das composições enquanto sendo substancialmente isentos de agentes de cura de epóxi convencionais.
BR0316860-3A 2002-12-04 2003-12-04 Composição curável, e composição curável por calor BR0316860A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43088202P 2002-12-04 2002-12-04
PCT/US2003/038756 WO2004050740A1 (en) 2002-12-04 2003-12-04 Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds

Publications (1)

Publication Number Publication Date
BR0316860A true BR0316860A (pt) 2005-10-25

Family

ID=32469552

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0316860-3A BR0316860A (pt) 2002-12-04 2003-12-04 Composição curável, e composição curável por calor

Country Status (14)

Country Link
US (1) US7208538B2 (pt)
EP (1) EP1572776B1 (pt)
JP (1) JP2006509076A (pt)
KR (1) KR100713256B1 (pt)
CN (1) CN100453576C (pt)
AT (1) ATE426630T1 (pt)
AU (1) AU2003293426A1 (pt)
BR (1) BR0316860A (pt)
CA (1) CA2508576A1 (pt)
DE (1) DE60326878D1 (pt)
ES (1) ES2324607T3 (pt)
MX (1) MXPA05003611A (pt)
WO (1) WO2004050740A1 (pt)
ZA (1) ZA200504974B (pt)

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* Cited by examiner, † Cited by third party
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EP1263875A1 (en) * 2000-02-02 2002-12-11 Denovus LLC Polymeric blends and composites and laminates thereof
WO2005108344A1 (en) * 2004-05-02 2005-11-17 Ashland Licensing And Intellectual Property Llc Radiation-curable coatings for metal substrates from multifunctional acrylate oligomers
US20060062998A1 (en) * 2004-06-10 2006-03-23 Taylor Donald W Reinforcement for composite materials and method for making the reforcement
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
WO2006074394A2 (en) * 2005-01-07 2006-07-13 Denovus Llc Heat activated sealants and foamed materials
WO2008112992A2 (en) 2007-03-15 2008-09-18 Zephyros, Inc. Sealant material
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
US8748536B2 (en) * 2009-10-05 2014-06-10 Acushnet Company Multi-piece golf balls having layers made from epoxy systems
CN103153604B (zh) 2010-03-04 2016-04-13 泽菲罗斯公司 结构复合层压板
PL2558543T3 (pl) 2010-04-16 2018-01-31 Swimc Llc Kompozycja powłokowa do wyrobów opakowaniowych i sposoby powlekania
US9169347B2 (en) * 2010-04-21 2015-10-27 Mitsubishi Gas Chemical Company, Inc. Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
US20120100379A1 (en) * 2010-10-20 2012-04-26 Greene, Tweed Of Delaware, Inc. Fluoroelastomer bonding compositions suitable for high-temperature applications
JP5640770B2 (ja) * 2011-01-28 2014-12-17 三菱瓦斯化学株式会社 エポキシ樹脂硬化剤の製造方法
PL3425011T3 (pl) 2011-02-07 2021-05-17 Swimc Llc Kompozycje powłokowe do pojemników i innych wyrobów i sposoby powlekania
WO2014025410A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Stabilizer and coating compositions thereof
KR102248624B1 (ko) 2012-08-09 2021-05-06 에스더블유아이엠씨 엘엘씨 용기 및 기타 물품용 조성물 및 이의 사용 방법
KR102093405B1 (ko) 2012-08-09 2020-03-25 에스더블유아이엠씨 엘엘씨 용기 코팅 시스템
US10577523B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Relating to thermosetting adhesive films
BR112016021583B1 (pt) 2014-04-14 2021-10-26 Swimc Llc Método para produzir um polímero de poliéter de alto peso molecular, e, recipiente de embalagem de alimento e bebida
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
US10328311B2 (en) 2017-06-09 2019-06-25 Acushnet Company Golf ball incorporating at least one cast layer of thermoset polymer mixture having a centering time that is independent of cure time and is lower than the centering time of the thermoset polymer composition portion of the mixture
US10427003B2 (en) 2017-06-28 2019-10-01 Acushnet Company Golf ball having at least one layer consisting of a mixture of a thermoset or thermoplastic composition and a plurality of alkoxylated siloxane-surface treated particles and/or polyether-modified siloxane-surface treated particles
CN110591272B (zh) * 2019-09-06 2022-03-25 宜兴市兴南复合材料厂有限公司 一种高强度耐腐蚀玻璃钢冷却用树脂及其制备方法
CA3062654A1 (en) * 2019-11-26 2021-05-26 Douglas A. Whyte Nano-electronic printed circuit board precoat
CN115093675B (zh) * 2022-06-21 2024-04-26 天津大学 一种导热复合材料及其制备方法

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JPS558022B2 (pt) * 1975-02-10 1980-03-01
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Also Published As

Publication number Publication date
US20040143071A1 (en) 2004-07-22
AU2003293426A1 (en) 2004-06-23
CN100453576C (zh) 2009-01-21
DE60326878D1 (de) 2009-05-07
JP2006509076A (ja) 2006-03-16
CA2508576A1 (en) 2004-06-17
ZA200504974B (en) 2006-03-29
MXPA05003611A (es) 2005-06-03
WO2004050740A1 (en) 2004-06-17
EP1572776A1 (en) 2005-09-14
ATE426630T1 (de) 2009-04-15
CN1692133A (zh) 2005-11-02
US7208538B2 (en) 2007-04-24
EP1572776B1 (en) 2009-03-25
KR100713256B1 (ko) 2007-05-02
ES2324607T3 (es) 2009-08-11
KR20050085156A (ko) 2005-08-29

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL.