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BE583030A - Improvements in cooling of semiconductor devices - Google Patents

Improvements in cooling of semiconductor devices

Info

Publication number
BE583030A
BE583030A BE583030A BE583030A BE583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A
Authority
BE
Belgium
Prior art keywords
cooling
semiconductor devices
semiconductor
devices
Prior art date
Application number
BE583030A
Other languages
French (fr)
Original Assignee
Stone J & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stone J & Co Ltd filed Critical Stone J & Co Ltd
Publication of BE583030A publication Critical patent/BE583030A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031Packaged discrete devices, e.g. to-3 housings, diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BE583030A 1958-09-25 1959-09-25 Improvements in cooling of semiconductor devices BE583030A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
BE583030A true BE583030A (en) 1960-01-18

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
BE583030A BE583030A (en) 1958-09-25 1959-09-25 Improvements in cooling of semiconductor devices

Country Status (6)

Country Link
BE (1) BE583030A (en)
DE (1) DE1205196B (en)
ES (1) ES251880A1 (en)
FR (1) FR1236322A (en)
GB (1) GB881571A (en)
NL (2) NL293350A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2423070A1 (en) * 1973-07-06 1975-01-23 Siemens Ag ARRANGEMENT OF A POWER SEMICONDUCTOR
FR2495846A1 (en) * 1980-12-05 1982-06-11 Cii Honeywell Bull ELECTRICAL CONNECTION DEVICE HAVING HIGH DENSITY OF CONTACTS
FR2495838A1 (en) * 1980-12-05 1982-06-11 Cii Honeywell Bull REMOVABLE COOLING DEVICE FOR INTEGRATED CIRCUIT CARRIERS
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (en) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Blower control unit for a vehicle

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (en) * 1957-03-08
DE1751741U (en) * 1957-05-17 1957-09-05 Telefunken Gmbh HOUSING FOR THE COOLING OF POWER CRYSTAL LODES.
DE1768720U (en) * 1957-12-16 1958-06-19 Licentia Gmbh DEVICE FOR COOLING TRANSISTORS.

Also Published As

Publication number Publication date
FR1236322A (en) 1960-07-15
DE1205196B (en) 1965-11-18
NL243350A (en)
ES251880A1 (en) 1960-03-16
NL293350A (en)
GB881571A (en) 1961-11-08

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