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AU3903000A - Semiconductor wafer cleaning apparatus and method - Google Patents

Semiconductor wafer cleaning apparatus and method

Info

Publication number
AU3903000A
AU3903000A AU39030/00A AU3903000A AU3903000A AU 3903000 A AU3903000 A AU 3903000A AU 39030/00 A AU39030/00 A AU 39030/00A AU 3903000 A AU3903000 A AU 3903000A AU 3903000 A AU3903000 A AU 3903000A
Authority
AU
Australia
Prior art keywords
semiconductor wafer
cleaning apparatus
wafer cleaning
semiconductor
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU39030/00A
Inventor
Milind G. Weling
Liming Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of AU3903000A publication Critical patent/AU3903000A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
AU39030/00A 1999-03-30 2000-03-20 Semiconductor wafer cleaning apparatus and method Abandoned AU3903000A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28161999A 1999-03-30 1999-03-30
US09281619 1999-03-30
PCT/US2000/007394 WO2000059006A1 (en) 1999-03-30 2000-03-20 Semiconductor wafer cleaning apparatus and method

Publications (1)

Publication Number Publication Date
AU3903000A true AU3903000A (en) 2000-10-16

Family

ID=23078077

Family Applications (1)

Application Number Title Priority Date Filing Date
AU39030/00A Abandoned AU3903000A (en) 1999-03-30 2000-03-20 Semiconductor wafer cleaning apparatus and method

Country Status (6)

Country Link
EP (1) EP1088337A1 (en)
JP (1) JP2002540623A (en)
KR (1) KR20010052451A (en)
CN (1) CN1310860A (en)
AU (1) AU3903000A (en)
WO (1) WO2000059006A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6904637B2 (en) 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US7287537B2 (en) * 2002-01-29 2007-10-30 Akrion Technologies, Inc. Megasonic probe energy director
US20040029494A1 (en) * 2002-08-09 2004-02-12 Souvik Banerjee Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques
US7231682B1 (en) * 2003-08-28 2007-06-19 Lam Research Corporation Method and apparatus for simultaneously cleaning the front side and back side of a wafer
US20050109371A1 (en) 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US7416370B2 (en) 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US7568490B2 (en) * 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
WO2005064652A1 (en) * 2003-12-23 2005-07-14 Lam Research Corporation Apparatuses and methods for cleaning a substrate
EP1748466B1 (en) * 2005-07-29 2008-03-19 Aya Maria Thallner Wafer surface cleaning device
US8480810B2 (en) 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
CN101540269B (en) * 2008-03-20 2012-10-10 盛美半导体设备（上海）有限公司 Method and device for cleaning semiconductor chip
JP5245701B2 (en) * 2008-10-03 2013-07-24 富士通株式会社 Ultrasonic irradiation device, cleaning device and cleaning method
US8845812B2 (en) 2009-06-12 2014-09-30 Micron Technology, Inc. Method for contamination removal using magnetic particles
CN102194653B (en) * 2010-03-11 2013-02-13 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN103659581A (en) * 2012-09-05 2014-03-26 上海华虹宏力半导体制造有限公司 Grinding fluid transfer arm
US10269756B2 (en) 2017-04-21 2019-04-23 Invensas Bonding Technologies, Inc. Die processing
US10727219B2 (en) 2018-02-15 2020-07-28 Invensas Bonding Technologies, Inc. Techniques for processing devices
US11742314B2 (en) 2020-03-31 2023-08-29 Adeia Semiconductor Bonding Technologies Inc. Reliable hybrid bonded apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919329A (en) * 1982-07-23 1984-01-31 Hitachi Ltd Cleaning method and equipment
JP3155652B2 (en) * 1993-09-16 2001-04-16 東京応化工業株式会社 Substrate cleaning device
JPH0786218A (en) * 1993-09-17 1995-03-31 Dainippon Screen Mfg Co Ltd Substrate cleaning equipment
JPH08238463A (en) * 1995-03-03 1996-09-17 Ebara Corp Cleaning method and cleaning device
JPH10189528A (en) * 1996-12-27 1998-07-21 Dainippon Screen Mfg Co Ltd Apparatus and method for cleaning of substrate

Also Published As

Publication number Publication date
JP2002540623A (en) 2002-11-26
CN1310860A (en) 2001-08-29
KR20010052451A (en) 2001-06-25
WO2000059006A1 (en) 2000-10-05
EP1088337A1 (en) 2001-04-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase