ATE506704T1 - Verfahren zur herstellung einer mikroelektromechanischen einrichtung mit piezoelektrischen blöcken - Google Patents
Verfahren zur herstellung einer mikroelektromechanischen einrichtung mit piezoelektrischen blöckenInfo
- Publication number
- ATE506704T1 ATE506704T1 AT05811999T AT05811999T ATE506704T1 AT E506704 T1 ATE506704 T1 AT E506704T1 AT 05811999 T AT05811999 T AT 05811999T AT 05811999 T AT05811999 T AT 05811999T AT E506704 T1 ATE506704 T1 AT E506704T1
- Authority
- AT
- Austria
- Prior art keywords
- piezoelectric
- producing
- islands
- layer
- microelectromechanical device
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/967,073 US7420317B2 (en) | 2004-10-15 | 2004-10-15 | Forming piezoelectric actuators |
PCT/US2005/036926 WO2006044592A1 (en) | 2004-10-15 | 2005-10-12 | Microelectromechanical device having piezoelectric blocks and method of fabrication same |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE506704T1 true ATE506704T1 (de) | 2011-05-15 |
Family
ID=35632644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05811999T ATE506704T1 (de) | 2004-10-15 | 2005-10-12 | Verfahren zur herstellung einer mikroelektromechanischen einrichtung mit piezoelektrischen blöcken |
Country Status (10)
Country | Link |
---|---|
US (3) | US7420317B2 (de) |
EP (1) | EP1815538B1 (de) |
JP (1) | JP2008516787A (de) |
KR (1) | KR101184060B1 (de) |
CN (1) | CN100533800C (de) |
AT (1) | ATE506704T1 (de) |
DE (1) | DE602005027601D1 (de) |
HK (1) | HK1107872A1 (de) |
TW (1) | TWI390779B (de) |
WO (1) | WO2006044592A1 (de) |
Families Citing this family (39)
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US7420317B2 (en) * | 2004-10-15 | 2008-09-02 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
US7388319B2 (en) * | 2004-10-15 | 2008-06-17 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
US7779522B2 (en) * | 2006-05-05 | 2010-08-24 | Fujifilm Dimatix, Inc. | Method for forming a MEMS |
US20070257580A1 (en) * | 2006-05-05 | 2007-11-08 | Fujifilm Dimatix, Inc. | Polishing Piezoelectric Material |
US7554666B2 (en) * | 2006-05-25 | 2009-06-30 | Ric Investments, Llc. | Sensor with optical pressure transducer and method of manufacturing a sensor component |
EP1997635B1 (de) * | 2007-05-30 | 2011-07-27 | Océ-Technologies B.V. | Piezoelektrischer Aktuator und Herstellungsverfahren dafür |
EP1997638B1 (de) * | 2007-05-30 | 2012-11-21 | Océ-Technologies B.V. | Verfahren zur Erzeugung eines Arrays piezoelektrischer Aktuatoren auf einer Membran |
US7586239B1 (en) * | 2007-06-06 | 2009-09-08 | Rf Micro Devices, Inc. | MEMS vibrating structure using a single-crystal piezoelectric thin film layer |
US9369105B1 (en) | 2007-08-31 | 2016-06-14 | Rf Micro Devices, Inc. | Method for manufacturing a vibrating MEMS circuit |
US9385685B2 (en) | 2007-08-31 | 2016-07-05 | Rf Micro Devices, Inc. | MEMS vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer |
US9391588B2 (en) | 2007-08-31 | 2016-07-12 | Rf Micro Devices, Inc. | MEMS vibrating structure using an orientation dependent single-crystal piezoelectric thin film layer |
US20100187667A1 (en) | 2009-01-28 | 2010-07-29 | Fujifilm Dimatix, Inc. | Bonded Microelectromechanical Assemblies |
JP5241017B2 (ja) * | 2009-02-10 | 2013-07-17 | 富士フイルム株式会社 | 液体吐出ヘッド及び液体吐出装置並びに画像形成装置 |
US8061820B2 (en) * | 2009-02-19 | 2011-11-22 | Fujifilm Corporation | Ring electrode for fluid ejection |
KR20110014037A (ko) * | 2009-08-04 | 2011-02-10 | 삼성전자주식회사 | 잉크젯 헤드 |
US8264129B2 (en) * | 2010-07-21 | 2012-09-11 | General Electric Company | Device and system for measuring material thickness |
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TWI477387B (zh) * | 2010-12-15 | 2015-03-21 | Univ Nat Cheng Kung | Composite film |
KR101725115B1 (ko) * | 2010-12-16 | 2017-04-26 | 한국전자통신연구원 | 플렉시블 기판을 이용한 자급자족형 전원 공급 장치 및 센서 노드 |
CN102794989A (zh) * | 2011-05-27 | 2012-11-28 | 研能科技股份有限公司 | 压电式喷墨头结构 |
US8348396B2 (en) | 2011-06-09 | 2013-01-08 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
US8939556B2 (en) * | 2011-06-09 | 2015-01-27 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
TWI574439B (zh) * | 2011-12-30 | 2017-03-11 | 晶緻材料科技私人有限公司 | 多樁式致動器及其製造方法及使用該多樁式致動器的衍生設備、壓電式馬達、微型馬達 |
WO2014018028A1 (en) * | 2012-07-25 | 2014-01-30 | Hewlett-Packard Development Company, L.P. | Piezoelectric actuator and method of making a piezoelectric actuator |
US9406314B1 (en) | 2012-10-04 | 2016-08-02 | Magnecomp Corporation | Assembly of DSA suspensions using microactuators with partially cured adhesive, and DSA suspensions having PZTs with wrap-around electrodes |
US9466430B2 (en) | 2012-11-02 | 2016-10-11 | Qorvo Us, Inc. | Variable capacitor and switch structures in single crystal piezoelectric MEMS devices using bimorphs |
JP6133655B2 (ja) * | 2013-03-29 | 2017-05-24 | 日本碍子株式会社 | 圧電/電歪素子とその製造方法 |
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US9991872B2 (en) | 2014-04-04 | 2018-06-05 | Qorvo Us, Inc. | MEMS resonator with functional layers |
US9998088B2 (en) | 2014-05-02 | 2018-06-12 | Qorvo Us, Inc. | Enhanced MEMS vibrating device |
JP5817905B1 (ja) * | 2014-12-15 | 2015-11-18 | 富士ゼロックス株式会社 | 半導体片の製造方法 |
GB2552555B (en) * | 2016-07-28 | 2019-11-20 | Cirrus Logic Int Semiconductor Ltd | MEMS device and process |
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US10626010B2 (en) | 2017-11-29 | 2020-04-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bonding process for forming semiconductor device structure |
DE102019101325A1 (de) * | 2019-01-17 | 2020-07-23 | USound GmbH | Herstellungsverfahren für mehrere MEMS-Schallwandler |
JP7217354B2 (ja) | 2019-04-29 | 2023-02-02 | ヒューレット-パッカード デベロップメント カンパニー エル.ピー. | カバー層に中断部を備えた流体吐出デバイス |
CN111016432A (zh) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | 一种压电式打印头及其制作方法 |
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US20250054798A1 (en) * | 2023-08-08 | 2025-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonding system and method |
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-
2004
- 2004-10-15 US US10/967,073 patent/US7420317B2/en active Active
-
2005
- 2005-10-12 CN CNB2005800404822A patent/CN100533800C/zh active Active
- 2005-10-12 WO PCT/US2005/036926 patent/WO2006044592A1/en active Application Filing
- 2005-10-12 DE DE602005027601T patent/DE602005027601D1/de active Active
- 2005-10-12 AT AT05811999T patent/ATE506704T1/de not_active IP Right Cessation
- 2005-10-12 KR KR1020077009260A patent/KR101184060B1/ko active IP Right Grant
- 2005-10-12 JP JP2007536908A patent/JP2008516787A/ja active Pending
- 2005-10-12 EP EP05811999A patent/EP1815538B1/de active Active
- 2005-10-17 TW TW094136235A patent/TWI390779B/zh active
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- 2007-09-06 US US11/851,293 patent/US7526846B2/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
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US20080000059A1 (en) | 2008-01-03 |
DE602005027601D1 (de) | 2011-06-01 |
EP1815538A1 (de) | 2007-08-08 |
CN101065855A (zh) | 2007-10-31 |
HK1107872A1 (en) | 2008-04-18 |
CN100533800C (zh) | 2009-08-26 |
US8053956B2 (en) | 2011-11-08 |
KR101184060B1 (ko) | 2012-09-18 |
US7526846B2 (en) | 2009-05-05 |
EP1815538B1 (de) | 2011-04-20 |
US7420317B2 (en) | 2008-09-02 |
US20060082256A1 (en) | 2006-04-20 |
TWI390779B (zh) | 2013-03-21 |
KR20070085285A (ko) | 2007-08-27 |
JP2008516787A (ja) | 2008-05-22 |
WO2006044592A1 (en) | 2006-04-27 |
TW200620726A (en) | 2006-06-16 |
US20090322187A1 (en) | 2009-12-31 |
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