ATE500063T1 - Verfahren zur herstellung von gebundenen substraten und dazugehöriges substrat - Google Patents
Verfahren zur herstellung von gebundenen substraten und dazugehöriges substratInfo
- Publication number
- ATE500063T1 ATE500063T1 AT06006116T AT06006116T ATE500063T1 AT E500063 T1 ATE500063 T1 AT E500063T1 AT 06006116 T AT06006116 T AT 06006116T AT 06006116 T AT06006116 T AT 06006116T AT E500063 T1 ATE500063 T1 AT E500063T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- terminals
- metal core
- bonded substrates
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14217—Multi layer finger type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2002/14306—Flow passage between manifold and chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005099566A JP4501752B2 (ja) | 2005-03-30 | 2005-03-30 | 基板接合構造の製造方法及びインクジェットヘッドの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE500063T1 true ATE500063T1 (de) | 2011-03-15 |
Family
ID=36579488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06006116T ATE500063T1 (de) | 2005-03-30 | 2006-03-24 | Verfahren zur herstellung von gebundenen substraten und dazugehöriges substrat |
Country Status (6)
Country | Link |
---|---|
US (1) | US7560308B2 (de) |
EP (2) | EP1707371B1 (de) |
JP (1) | JP4501752B2 (de) |
CN (1) | CN1842252B (de) |
AT (1) | ATE500063T1 (de) |
DE (1) | DE602006020367D1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4613708B2 (ja) * | 2005-06-23 | 2011-01-19 | ブラザー工業株式会社 | 回路基板及びインクジェットヘッド |
JP4934325B2 (ja) * | 2006-02-17 | 2012-05-16 | 株式会社フジクラ | プリント配線板の接続構造及びプリント配線板の接続方法 |
JP5076520B2 (ja) * | 2007-01-31 | 2012-11-21 | ブラザー工業株式会社 | 記録装置の配線接続方法 |
JP2008307710A (ja) * | 2007-06-12 | 2008-12-25 | Canon Inc | インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッドの実装ツール |
JP4911189B2 (ja) | 2009-03-30 | 2012-04-04 | ブラザー工業株式会社 | 液体吐出装置およびその製造方法 |
JP5310516B2 (ja) * | 2009-12-08 | 2013-10-09 | ブラザー工業株式会社 | 記録ヘッド及びその製造方法 |
US8585187B2 (en) * | 2011-04-29 | 2013-11-19 | Xerox Corporation | High density electrical interconnect for printing devices using flex circuits and dielectric underfill |
US8742578B2 (en) | 2012-07-19 | 2014-06-03 | International Business Machines Corporation | Solder volume compensation with C4 process |
US8759210B2 (en) | 2012-07-19 | 2014-06-24 | International Business Machines Corporation | Control of silver in C4 metallurgy with plating process |
KR102335720B1 (ko) * | 2017-03-27 | 2021-12-07 | 삼성전자주식회사 | 표면 실장용 금속 유닛 및 이를 포함하는 전자 장치 |
KR102393219B1 (ko) * | 2017-07-03 | 2022-05-02 | 삼성전기주식회사 | 다층 인쇄회로기판 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3555638B2 (ja) * | 1996-04-05 | 2004-08-18 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
JP3515442B2 (ja) | 1998-12-10 | 2004-04-05 | サンコール株式会社 | 磁気ヘッドサスペンション |
JP2000228006A (ja) * | 1999-02-05 | 2000-08-15 | Alps Electric Co Ltd | ボンディングパットおよびバンプを用いた接合体、および磁気ヘッド装置 |
JP3666576B2 (ja) * | 2000-07-12 | 2005-06-29 | 松下電器産業株式会社 | 多層モジュールおよびその製造方法 |
JP4362996B2 (ja) * | 2001-08-22 | 2009-11-11 | 富士ゼロックス株式会社 | 格子状配列構造の圧電/電歪アクチュエータ及びその製造方法 |
US7562428B2 (en) | 2002-09-24 | 2009-07-21 | Brother Kogyo Kabushiki Kaisha | Manufacturing an ink jet head |
JP2004221567A (ja) * | 2002-12-26 | 2004-08-05 | Sumitomo Bakelite Co Ltd | 半田接合部および多層配線板 |
JP2005039136A (ja) * | 2003-07-18 | 2005-02-10 | Sumitomo Bakelite Co Ltd | 回路基板および回路基板の接続方法 |
-
2005
- 2005-03-30 JP JP2005099566A patent/JP4501752B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-24 EP EP06006116A patent/EP1707371B1/de active Active
- 2006-03-24 AT AT06006116T patent/ATE500063T1/de not_active IP Right Cessation
- 2006-03-24 EP EP08022399A patent/EP2039517B1/de active Active
- 2006-03-24 DE DE602006020367T patent/DE602006020367D1/de active Active
- 2006-03-28 US US11/390,479 patent/US7560308B2/en active Active
- 2006-03-29 CN CN2006100714986A patent/CN1842252B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1842252A (zh) | 2006-10-04 |
JP2006278964A (ja) | 2006-10-12 |
US20060226200A1 (en) | 2006-10-12 |
JP4501752B2 (ja) | 2010-07-14 |
US7560308B2 (en) | 2009-07-14 |
CN1842252B (zh) | 2012-04-04 |
EP1707371B1 (de) | 2011-03-02 |
EP2039517A1 (de) | 2009-03-25 |
EP2039517B1 (de) | 2012-08-01 |
EP1707371A1 (de) | 2006-10-04 |
DE602006020367D1 (de) | 2011-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE500063T1 (de) | Verfahren zur herstellung von gebundenen substraten und dazugehöriges substrat | |
WO2007025521A3 (de) | Verfahren zur herstellung eines halbleiterbauelements mit einer planaren kontaktierung und halbleiterbauelement | |
TWI284397B (en) | Carrier substrate for electronic components | |
EP1868241A4 (de) | Submount und verfahren zu seiner herstellung | |
WO2009035059A1 (ja) | 導電膜、導電部材および導電膜の製造方法 | |
WO2006077136A3 (de) | Elssktro-optisches element mit gesteuerter, insbesondere uniformer funktionali tätsverssilung | |
WO2009060821A1 (ja) | 回路基板及びその製造方法 | |
PL2108524T3 (pl) | Sposób wytwarzania powlekanych paneli oraz powlekany panel | |
DE60239322D1 (de) | Verfahren zur herstellung von zierplatten | |
WO2010078414A3 (en) | Method of producing a component of a device, and the resulting components and devices | |
DE69934674D1 (de) | Methode zur herstellung von multifunktionellen mikrowellen-modulen aus fluoropolymer kompositsubstraten | |
WO2007071937A3 (en) | Method of manufacturing security substrates | |
EP1835550A3 (de) | Gehäusekonstruktion für Festkörperbeleuchtungsvorrichtungen und Herstellungsverfahren dafür | |
WO2009005042A1 (ja) | 金属材料、その製造方法、及びそれを用いた電気電子部品 | |
TW200628574A (en) | Adhesion promoter, electroactive layer and electroactive device comprising same, and method | |
WO2003071596A3 (de) | Elektronisches bauteil mit klebstoffschicht und verfahren zur herstellung desselben | |
JP2009182272A5 (de) | ||
WO2003094224A8 (en) | Process for manufacturing substrates with detachment of a temporary support, and associated substrate | |
TW200741214A (en) | Method of bonding probes and method of manufacturing a probe card using the same | |
TW200629462A (en) | Supporting plate attaching method | |
TW200518249A (en) | Bonding structure with buffer layer and method of forming the same | |
ATE459968T1 (de) | Verfahren zur herstellung einer schichtelektrode für elektrochemische bauelemente und schichtelektrode | |
WO2005006432A3 (de) | Elektronisches bauelement und verfahren zur herstellung | |
ATE543209T1 (de) | Halbleitende struktur auf einem substrat mit starker rauheit | |
TW200635464A (en) | Method for producing printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |