[go: up one dir, main page]

ATE447596T1 - Wärmeleitfähige zweikomponentige klebstoffzusammensetzung - Google Patents

Wärmeleitfähige zweikomponentige klebstoffzusammensetzung

Info

Publication number
ATE447596T1
ATE447596T1 AT05725221T AT05725221T ATE447596T1 AT E447596 T1 ATE447596 T1 AT E447596T1 AT 05725221 T AT05725221 T AT 05725221T AT 05725221 T AT05725221 T AT 05725221T AT E447596 T1 ATE447596 T1 AT E447596T1
Authority
AT
Austria
Prior art keywords
component
thermally conductive
adhesive composition
filler
conductive filler
Prior art date
Application number
AT05725221T
Other languages
English (en)
Inventor
James Earle
Aisling Mary Lakes
Original Assignee
Henkel Corp
Loctite R & D Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp, Loctite R & D Ltd filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE447596T1 publication Critical patent/ATE447596T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
AT05725221T 2004-03-09 2005-03-08 Wärmeleitfähige zweikomponentige klebstoffzusammensetzung ATE447596T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55157704P 2004-03-09 2004-03-09
PCT/US2005/007915 WO2005087850A1 (en) 2004-03-09 2005-03-08 Thermally conductive two-part adhesive composition

Publications (1)

Publication Number Publication Date
ATE447596T1 true ATE447596T1 (de) 2009-11-15

Family

ID=34975549

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05725221T ATE447596T1 (de) 2004-03-09 2005-03-08 Wärmeleitfähige zweikomponentige klebstoffzusammensetzung

Country Status (8)

Country Link
US (1) US20070023165A1 (de)
EP (1) EP1723197B1 (de)
JP (1) JP2007528437A (de)
KR (1) KR20060126838A (de)
CN (1) CN1946784A (de)
AT (1) ATE447596T1 (de)
DE (1) DE602005017472D1 (de)
WO (1) WO2005087850A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006111790A (ja) * 2004-10-18 2006-04-27 Seiko Epson Corp 導電性粘着剤
CN101191041B (zh) * 2006-11-29 2010-04-14 上海康达化工有限公司 丙烯酸酯胶粘剂
DE102007026256A1 (de) * 2007-06-04 2008-12-11 Akemi Chemisch Technische Spezialfabrik Gmbh Mehrfarbkomponenten-Klebersystem
CA2689595C (en) * 2007-06-08 2015-11-03 Henkel Corporation Room temperature curing adhesive composition having high temperature properties
GB2482531B (en) * 2010-08-05 2013-11-13 Loctite R & D Ltd Adhesive composition with enhanced cure through volume
US8966758B1 (en) * 2010-09-17 2015-03-03 Jeffrey Skaggs McReynolds System and method of producing scalable heat-sink assembly
KR101192042B1 (ko) 2010-11-01 2012-10-17 삼성에스디아이 주식회사 배터리 팩
WO2013019326A2 (en) * 2011-08-03 2013-02-07 Henkel Corporation Electrically conductive structural adhesive
ES2567413T3 (es) * 2012-05-16 2016-04-22 Heraeus Medical Gmbh Cemento óseo en forma de pasta
US9991539B2 (en) * 2013-04-29 2018-06-05 Lg Chem, Ltd. Polymer electrolyte membrane, membrane electrode assembly comprising polymer electrolyte membrane and fuel cell comprising membrane electrode assembly
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
CN103725206B (zh) * 2014-01-06 2015-06-24 江苏东禾电声配件有限公司 一种扬声器组装用双组份耐高温胶黏剂及其制备方法
JP6653305B2 (ja) * 2017-11-10 2020-02-26 日本ユピカ株式会社 電気電子部品用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品成形体、及び当該電気電子部品成形体の製造方法
JP6630695B2 (ja) * 2017-03-03 2020-01-15 日本ユピカ株式会社 電気電子部品封止用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品用封止体、及び当該封止体の製造方法
WO2018159387A1 (ja) * 2017-03-03 2018-09-07 日本ユピカ株式会社 電気電子部品用結晶性ラジカル重合性組成物、当該組成物を使用した電気電子部品成形体、及び当該電気電子部品成形体の製造方法
JP6782739B2 (ja) * 2018-07-09 2020-11-11 日本ユピカ株式会社 車載用エレクトロニックコントロールユニット基板封止用熱硬化性樹脂組成物、当該組成物を使用した車載用エレクトロニックコントロールユニット基板封止体、及び当該封止体の製造方法
JP6782741B2 (ja) * 2018-07-18 2020-11-11 日本ユピカ株式会社 車載用イグニッションコイル封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用イグニッションコイル封止体、及び当該封止体の製造方法
JP6782742B2 (ja) * 2018-07-25 2020-11-11 日本ユピカ株式会社 車載用パワー半導体素子封止用結晶性ラジカル重合性組成物、当該組成物を使用した車載用パワー半導体素子封止体、及び当該封止体の製造方法
CN113913147B (zh) * 2020-07-08 2023-12-05 3M创新有限公司 双组分导热粘合剂组合物和双组分导热填缝胶
KR102338814B1 (ko) * 2021-09-09 2021-12-14 정상문 아크릴 방열 점착제
US20240384071A1 (en) 2021-10-04 2024-11-21 Tokyo Printing Ink Mfg. Co., Ltd. Resin composition for heat-dissipating gap filler, heat-dissipating gap filler, and article
CN118786158A (zh) * 2022-04-07 2024-10-15 Sika技术股份公司 用于拐角粘合的基于(甲基)丙烯酸酯的粘合剂

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3901858A (en) * 1970-12-04 1975-08-26 Matsumoto Seiyaku Kogyo Kk Two-component composition
US3994764A (en) * 1975-06-13 1976-11-30 Pratt & Lambert, Inc. Adhesive compositions
US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
JPS594667A (ja) * 1982-06-09 1984-01-11 ロクタイト・コ−ポレ−シヨン 二液性無溶剤接着剤組成物ならびにこの組成物で表面を接着する方法
US4722960A (en) * 1983-01-18 1988-02-02 Loctite Corporation Aluminum filled compositions
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4588768A (en) * 1984-10-29 1986-05-13 Sws Silicones Corporation Thermally conductive heat curable organopolysiloxane compositions
US4584336A (en) * 1984-10-29 1986-04-22 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4544696A (en) * 1984-10-29 1985-10-01 Sws Silicones Corporation Silicone elastomers having thermally conductive properties
JPS61296077A (ja) * 1985-06-25 1986-12-26 Three Bond Co Ltd 二液接触硬化型導電性接着剤
US4604424A (en) 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
US4848353A (en) * 1986-09-05 1989-07-18 Minnesota Mining And Manufacturing Company Electrically-conductive, pressure-sensitive adhesive and biomedical electrodes
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JPH0791468B2 (ja) * 1991-04-26 1995-10-04 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
US5445308A (en) 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5510174A (en) * 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
JP3127093B2 (ja) 1994-03-03 2001-01-22 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
US5430085A (en) * 1994-11-30 1995-07-04 Northrop Grumman Corporation Thermally and electrically conductive caulk
EP0942060B1 (de) * 1996-12-04 2006-01-11 Nitto Denko Corporation Wärmeleitender haftklebstoffm klebstoffschicht und verfahren zum fixieren eines elektronischen teils auf einer wärmeabstrahlenden komponente damit
JP2001139637A (ja) * 1999-11-10 2001-05-22 Denki Kagaku Kogyo Kk 硬化性樹脂組成物
US6462126B1 (en) * 2000-05-10 2002-10-08 Illinois Tool Works Inc. Structural adhesive
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
JP5059261B2 (ja) * 2001-04-09 2012-10-24 電気化学工業株式会社 ２剤型アクリル系接着剤組成物
JP4832658B2 (ja) * 2001-04-11 2011-12-07 電気化学工業株式会社 粘着性の柔軟なアクリル系樹脂
US6433091B1 (en) * 2001-05-10 2002-08-13 Henkel Loctite Corporation Adhesive composition
DE10212945A1 (de) * 2002-03-22 2003-10-02 Tesa Ag Polyacrylat-Haftklebemasse, Herstellung und Verwendung
JP4231952B2 (ja) * 2002-05-23 2009-03-04 株式会社トクヤマ 接着キット
DE10259549A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
JP2007528437A (ja) 2007-10-11
EP1723197A1 (de) 2006-11-22
CN1946784A (zh) 2007-04-11
DE602005017472D1 (de) 2009-12-17
WO2005087850A1 (en) 2005-09-22
EP1723197A4 (de) 2008-06-04
EP1723197B1 (de) 2009-11-04
US20070023165A1 (en) 2007-02-01
KR20060126838A (ko) 2006-12-08

Similar Documents

Publication Publication Date Title
ATE447596T1 (de) Wärmeleitfähige zweikomponentige klebstoffzusammensetzung
BRPI0510920A (pt) composto, composição adesiva, pasta de fixação a molde, conjunto e métodos para fixar
IL198741A0 (en) Hepatitis c virus inhibitor compounds, compositions containing the same and uses thereof
TW200420575A (en) Michael addition compositions
ATE366292T1 (de) Strahlungshärtbare klebstoffe
ATE448270T1 (de) (meth) acrylatzusammensetzung mit erhöhter lagerstabilität
EA200900676A1 (ru) Ингибиторы вируса гепатита с
WO2009009009A3 (en) Acrylic adhesives
ATE520754T1 (de) Photohärtbare elastomerzusammensetzungen
TW200505966A (en) Organosilicate resin formulation for use in microelectronic devices
DE60326878D1 (de) Metallacrylate als härter für polybutadiene, melamine und epoxyverbindungen
WO2008108273A1 (ja) 硬化性組成物、接着方法及び接合体
TW200730597A (en) Adhesive composition and adhesive film
GB2511818A (en) Curable acrylate or methacrylate compositions
ATE466903T1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
PE20090860A1 (es) Aductos amina-funcionales y composiciones curables que los contienen
DE602007005282D1 (de) Ungesättigtes polyesterharz oder vinylesterharz enthaltende zusammensetzungen
JP5697977B2 (ja) 耐熱性の嫌気的に硬化する組成物
DE602007004115D1 (de) Ungesättigtes polyesterharz oder vinylesterharz enthaltende zusammensetzungen
PH12012500582A1 (en) Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor device using the same
MX341303B (es) Aductos novedosos utiles como componentes de curado para composiciones anaerobicas curables.
JP5628909B2 (ja) 接合用途の超高速加熱／室温接着組成物
ATE365176T1 (de) Beta-ketonverbindungen enthaltende initiatorsysteme und damit hergestellte zusammensetzungen
PH12012501815A1 (en) Curable composition
BRPI0716060A2 (pt) inibidores de polimerase viral.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties