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ATE211668T1 - Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung - Google Patents

Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung

Info

Publication number
ATE211668T1
ATE211668T1 AT97942816T AT97942816T ATE211668T1 AT E211668 T1 ATE211668 T1 AT E211668T1 AT 97942816 T AT97942816 T AT 97942816T AT 97942816 T AT97942816 T AT 97942816T AT E211668 T1 ATE211668 T1 AT E211668T1
Authority
AT
Austria
Prior art keywords
laser beam
focal points
processing
cutting
beam treatment
Prior art date
Application number
AT97942816T
Other languages
English (en)
Inventor
Steen Erik Nielsen
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26065164&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE211668(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Air Liquide filed Critical Air Liquide
Application granted granted Critical
Publication of ATE211668T1 publication Critical patent/ATE211668T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
AT97942816T 1996-09-30 1997-09-30 Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung ATE211668T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DK106796 1996-09-30
DK109197A DK109197A (da) 1996-09-30 1997-09-23 Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle
PCT/DK1997/000412 WO1998014302A1 (en) 1996-09-30 1997-09-30 A method of processing a material by means of a laser beam

Publications (1)

Publication Number Publication Date
ATE211668T1 true ATE211668T1 (de) 2002-01-15

Family

ID=26065164

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97942816T ATE211668T1 (de) 1996-09-30 1997-09-30 Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung

Country Status (10)

Country Link
US (1) US6175096B1 (de)
EP (1) EP0929376B2 (de)
JP (1) JP2001501133A (de)
AT (1) ATE211668T1 (de)
AU (1) AU4451397A (de)
DE (1) DE69710346T3 (de)
DK (2) DK109197A (de)
ES (1) ES2171273T5 (de)
PT (1) PT929376E (de)
WO (1) WO1998014302A1 (de)

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FR2803550B1 (fr) * 2000-01-10 2002-03-29 Air Liquide Procede et installation de coupage laser d'acier inoxydable ou revetu, ou d'aluminium et d'alliages avec optique bifocale
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
FR2817782B1 (fr) * 2000-12-13 2003-02-28 Air Liquide Procede et installation de coupage laser avec tete de decoupe a double flux et double foyer
FR2821776B1 (fr) * 2001-03-09 2004-12-03 Air Liquide Procede et installation de coupage laser avec optique a brifocales et gaz d'assistance a base d'hydrogene
FR2826892B1 (fr) 2001-07-03 2003-09-05 Air Liquide Procede et installation de soudage laser avec melange gazeux ar/he a teneurs controlees en fonction de la puissance laser
JP2003037085A (ja) 2001-07-06 2003-02-07 Data Storage Inst レーザ照射を用いた基板切断方法および装置
FR2828825B1 (fr) * 2001-08-22 2003-12-26 Air Liquide Procede et installation de coupage par faisceau laser utilisant un objectif a multifocales et une tuyere convergente/divergente
JP3973882B2 (ja) * 2001-11-26 2007-09-12 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
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US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
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FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
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JP2005028438A (ja) * 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
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JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
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JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4716663B2 (ja) * 2004-03-19 2011-07-06 株式会社リコー レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体
JP2005324248A (ja) * 2004-04-15 2005-11-24 Denso Corp レーザ加工方法及びレーザ加工装置
FR2880568B1 (fr) * 2005-01-12 2007-03-30 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur
FR2880567B1 (fr) 2005-01-12 2007-02-23 Air Liquide Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur
FR2880566A1 (fr) * 2005-01-12 2006-07-14 Air Liquide Coupage laser avec une lentille revetue de baf2
JP4800661B2 (ja) * 2005-05-09 2011-10-26 株式会社ディスコ レーザ光線を利用する加工装置
CN1962154A (zh) * 2005-11-10 2007-05-16 鸿富锦精密工业(深圳)有限公司 模仁加工装置及加工方法
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DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
US20100072182A1 (en) * 2008-09-25 2010-03-25 Air Liquide Industrial Us Lp Fiber Laser Cutting Process with Multiple Foci
FR2952315B1 (fr) * 2009-11-10 2012-01-20 Inovalaser Dispositif universel a laser pour l'usinage et/ou l'assemblage de pieces
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Also Published As

Publication number Publication date
DE69710346D1 (de) 2002-03-21
ES2171273T3 (es) 2002-09-01
PT929376E (pt) 2002-06-28
ES2171273T5 (es) 2007-11-16
EP0929376B1 (de) 2002-01-09
WO1998014302A1 (en) 1998-04-09
EP0929376A1 (de) 1999-07-21
DK0929376T4 (da) 2007-07-23
DE69710346T3 (de) 2007-10-31
JP2001501133A (ja) 2001-01-30
US6175096B1 (en) 2001-01-16
DK109197A (da) 1998-03-31
AU4451397A (en) 1998-04-24
DK0929376T3 (da) 2002-04-08
EP0929376B2 (de) 2007-04-04
DE69710346T2 (de) 2002-10-24

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