ATE211668T1 - Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung - Google Patents
Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlungInfo
- Publication number
- ATE211668T1 ATE211668T1 AT97942816T AT97942816T ATE211668T1 AT E211668 T1 ATE211668 T1 AT E211668T1 AT 97942816 T AT97942816 T AT 97942816T AT 97942816 T AT97942816 T AT 97942816T AT E211668 T1 ATE211668 T1 AT E211668T1
- Authority
- AT
- Austria
- Prior art keywords
- laser beam
- focal points
- processing
- cutting
- beam treatment
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK106796 | 1996-09-30 | ||
DK109197A DK109197A (da) | 1996-09-30 | 1997-09-23 | Fremgangsmåde til bearbejdning af et materiale ved hjælp af en laserstråle |
PCT/DK1997/000412 WO1998014302A1 (en) | 1996-09-30 | 1997-09-30 | A method of processing a material by means of a laser beam |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE211668T1 true ATE211668T1 (de) | 2002-01-15 |
Family
ID=26065164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97942816T ATE211668T1 (de) | 1996-09-30 | 1997-09-30 | Verfahren zum bearbeiten eines materiales mittels laserstrahlbehandlung |
Country Status (10)
Country | Link |
---|---|
US (1) | US6175096B1 (de) |
EP (1) | EP0929376B2 (de) |
JP (1) | JP2001501133A (de) |
AT (1) | ATE211668T1 (de) |
AU (1) | AU4451397A (de) |
DE (1) | DE69710346T3 (de) |
DK (2) | DK109197A (de) |
ES (1) | ES2171273T5 (de) |
PT (1) | PT929376E (de) |
WO (1) | WO1998014302A1 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9922082D0 (en) * | 1999-09-17 | 1999-11-17 | Isis Innovation | Laser apparatus for use in material processing |
DE19961918C2 (de) * | 1999-12-21 | 2002-01-31 | Highyag Lasertechnologie Gmbh | Variables Doppelfokusformungsmodul und Verfahren zu seiner Anwendung |
FR2803549B1 (fr) | 2000-01-10 | 2002-03-29 | Air Liquide | Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale |
FR2803550B1 (fr) * | 2000-01-10 | 2002-03-29 | Air Liquide | Procede et installation de coupage laser d'acier inoxydable ou revetu, ou d'aluminium et d'alliages avec optique bifocale |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
FR2817782B1 (fr) * | 2000-12-13 | 2003-02-28 | Air Liquide | Procede et installation de coupage laser avec tete de decoupe a double flux et double foyer |
FR2821776B1 (fr) * | 2001-03-09 | 2004-12-03 | Air Liquide | Procede et installation de coupage laser avec optique a brifocales et gaz d'assistance a base d'hydrogene |
FR2826892B1 (fr) | 2001-07-03 | 2003-09-05 | Air Liquide | Procede et installation de soudage laser avec melange gazeux ar/he a teneurs controlees en fonction de la puissance laser |
JP2003037085A (ja) | 2001-07-06 | 2003-02-07 | Data Storage Inst | レーザ照射を用いた基板切断方法および装置 |
FR2828825B1 (fr) * | 2001-08-22 | 2003-12-26 | Air Liquide | Procede et installation de coupage par faisceau laser utilisant un objectif a multifocales et une tuyere convergente/divergente |
JP3973882B2 (ja) * | 2001-11-26 | 2007-09-12 | 株式会社半導体エネルギー研究所 | レーザ照射装置およびレーザ照射方法 |
FR2834658B1 (fr) | 2002-01-11 | 2004-04-02 | Air Liquide | PROCEDE ET INSTALLATION DE SOUDAGE LASER AVEC MELANGE GAZEUX N2/He A TENEURS CONTROLEES EN FONCTION DE LA PUISSANCE LASER |
US8247731B2 (en) * | 2002-02-25 | 2012-08-21 | Board Of Regents Of The University Of Nebraska | Laser scribing and machining of materials |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
DE60313900T2 (de) | 2002-03-12 | 2008-01-17 | Hamamatsu Photonics K.K., Hamamatsu | Methode zur Trennung von Substraten |
KR100749972B1 (ko) | 2002-03-12 | 2007-08-16 | 하마마츠 포토닉스 가부시키가이샤 | 가공 대상물 절단 방법 |
FR2840835B1 (fr) | 2002-06-14 | 2004-08-27 | Air Liquide | Utilisation de melanges gazeux helium/azote en soudage laser de tubes en acier inoxydable |
FR2840832B1 (fr) | 2002-06-14 | 2004-07-23 | Air Liquide | Utilisation de melanges gazeux helium/azote en soudage laser de flancs raboutes |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) * | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
CN1758985A (zh) | 2003-03-12 | 2006-04-12 | 浜松光子学株式会社 | 激光加工方法 |
JP2006528694A (ja) * | 2003-05-13 | 2006-12-21 | スミスクライン ビーチャム コーポレーション | ナフチリジンインテグラーゼインヒビター |
FR2855084A1 (fr) * | 2003-05-22 | 2004-11-26 | Air Liquide | Optique de focalisation pour le coupage laser |
GB2402230B (en) * | 2003-05-30 | 2006-05-03 | Xsil Technology Ltd | Focusing an optical beam to two foci |
JP2005028438A (ja) * | 2003-07-11 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
JP4563097B2 (ja) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
JP2005138143A (ja) * | 2003-11-06 | 2005-06-02 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
US7060934B2 (en) * | 2003-12-04 | 2006-06-13 | Universal Laser Systems, Inc. | High resolution laser beam delivery apparatus |
JP4509578B2 (ja) | 2004-01-09 | 2010-07-21 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4601965B2 (ja) * | 2004-01-09 | 2010-12-22 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4598407B2 (ja) * | 2004-01-09 | 2010-12-15 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4716663B2 (ja) * | 2004-03-19 | 2011-07-06 | 株式会社リコー | レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体 |
JP2005324248A (ja) * | 2004-04-15 | 2005-11-24 | Denso Corp | レーザ加工方法及びレーザ加工装置 |
FR2880568B1 (fr) * | 2005-01-12 | 2007-03-30 | Air Liquide | Coupage laser avec lentille a double focale de pieces metalliques de forte epaisseur |
FR2880567B1 (fr) | 2005-01-12 | 2007-02-23 | Air Liquide | Coupage laser avec lentille a double focale de pieces metalliques de faible epaisseur |
FR2880566A1 (fr) * | 2005-01-12 | 2006-07-14 | Air Liquide | Coupage laser avec une lentille revetue de baf2 |
JP4800661B2 (ja) * | 2005-05-09 | 2011-10-26 | 株式会社ディスコ | レーザ光線を利用する加工装置 |
CN1962154A (zh) * | 2005-11-10 | 2007-05-16 | 鸿富锦精密工业(深圳)有限公司 | 模仁加工装置及加工方法 |
DE102007024701A1 (de) * | 2007-05-25 | 2008-11-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens |
DE102007024700A1 (de) * | 2007-05-25 | 2008-12-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens |
US20100072182A1 (en) * | 2008-09-25 | 2010-03-25 | Air Liquide Industrial Us Lp | Fiber Laser Cutting Process with Multiple Foci |
FR2952315B1 (fr) * | 2009-11-10 | 2012-01-20 | Inovalaser | Dispositif universel a laser pour l'usinage et/ou l'assemblage de pieces |
DE102010007323A1 (de) | 2010-02-08 | 2011-08-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Verfahren zum Bestimmen des Schneidergebnisses eines Laserschneidprozesses |
CN102230983A (zh) * | 2011-06-17 | 2011-11-02 | 山西飞虹激光科技有限公司 | 用于激光加工的光学元件及激光加工设备 |
EP2774713A1 (de) * | 2013-03-07 | 2014-09-10 | Siemens Aktiengesellschaft | Laserverfahren mit unterschiedlichen Laserstrahlbereichen innerhalb eines Strahls und Vorrichtungen |
CN103551732A (zh) * | 2013-11-13 | 2014-02-05 | 苏州德龙激光股份有限公司 | 激光切割装置及切割方法 |
CN112427812B (zh) * | 2020-09-22 | 2022-09-09 | 厦门云天半导体科技有限公司 | 一种通过间距性超微细激光通孔实现超薄工件分离的方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2713904C3 (de) * | 1977-03-29 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum Bearbeiten von Werkstucken mittels eines Laserstrahles |
JPS56122690A (en) * | 1980-02-28 | 1981-09-26 | Nec Corp | Laser welding device |
JPS63299881A (ja) * | 1987-05-30 | 1988-12-07 | Toshiba Corp | レ−ザ光集光装置 |
JPS6448692A (en) * | 1987-08-20 | 1989-02-23 | Mitsubishi Heavy Ind Ltd | Multifocusing laser beam condensing device |
JPH0767633B2 (ja) * | 1987-11-30 | 1995-07-26 | 三菱重工業株式会社 | 同軸多焦点式レーザビーム集光装置 |
US5063280A (en) * | 1989-07-24 | 1991-11-05 | Canon Kabushiki Kaisha | Method and apparatus for forming holes into printed circuit board |
DD288933A5 (de) * | 1989-10-30 | 1991-04-11 | Friedrich-Schiller-Universitaet,De | Verfahren zur lasermaterialbearbeitung mit dynamischer fokussierung |
JPH05138385A (ja) † | 1991-11-14 | 1993-06-01 | Toshiba Corp | レーザ加工方法及びその装置 |
US5521352A (en) * | 1993-09-23 | 1996-05-28 | Laser Machining, Inc. | Laser cutting apparatus |
JPH08108289A (ja) * | 1994-10-07 | 1996-04-30 | Sumitomo Electric Ind Ltd | レーザ加工用光学装置 |
-
1997
- 1997-09-23 DK DK109197A patent/DK109197A/da not_active Application Discontinuation
- 1997-09-30 EP EP97942816A patent/EP0929376B2/de not_active Expired - Lifetime
- 1997-09-30 DE DE69710346T patent/DE69710346T3/de not_active Expired - Lifetime
- 1997-09-30 AT AT97942816T patent/ATE211668T1/de active
- 1997-09-30 DK DK97942816T patent/DK0929376T4/da active
- 1997-09-30 WO PCT/DK1997/000412 patent/WO1998014302A1/en active IP Right Grant
- 1997-09-30 JP JP10516153A patent/JP2001501133A/ja active Pending
- 1997-09-30 PT PT97942816T patent/PT929376E/pt unknown
- 1997-09-30 ES ES97942816T patent/ES2171273T5/es not_active Expired - Lifetime
- 1997-09-30 AU AU44513/97A patent/AU4451397A/en not_active Abandoned
- 1997-09-30 US US09/269,197 patent/US6175096B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69710346D1 (de) | 2002-03-21 |
ES2171273T3 (es) | 2002-09-01 |
PT929376E (pt) | 2002-06-28 |
ES2171273T5 (es) | 2007-11-16 |
EP0929376B1 (de) | 2002-01-09 |
WO1998014302A1 (en) | 1998-04-09 |
EP0929376A1 (de) | 1999-07-21 |
DK0929376T4 (da) | 2007-07-23 |
DE69710346T3 (de) | 2007-10-31 |
JP2001501133A (ja) | 2001-01-30 |
US6175096B1 (en) | 2001-01-16 |
DK109197A (da) | 1998-03-31 |
AU4451397A (en) | 1998-04-24 |
DK0929376T3 (da) | 2002-04-08 |
EP0929376B2 (de) | 2007-04-04 |
DE69710346T2 (de) | 2002-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
EEFA | Change of the company name | ||
UEP | Publication of translation of european patent specification |
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