Errata

Title & Document Type: 8672A Synthesized Signal Generator

Operating and Service Manual

Manual Part Number: 08672-90058

Revision Date: March 1, 1978

HP References in this Manual

This manual may contain references to HP or Hewlett-Packard. Please note that Hewlett-
Packard's former test and measurement, semiconductor products and chemical analysis
businesses are now part of Agilent Technologies. We have made no changes to this
manual copy. The HP XXXX referred to in this document is now the Agilent XXXX.
For example, model number HP8648A is now model number Agilent 8648A.

About this Manual

We’ve added this manual to the Agilent website in an effort to help you support your
product. This manual provides the best information we could find. It may be incomplete
or contain dated information, and the scan quality may not be ideal. If we find a better
copy in the future, we will add it to the Agilent website.

Support for Your Product

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Search for the model number of this product, and the resulting product page will guide
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 r
J. +

HEWLETT PACKARD

OPERATING AND SERVICE MANUAI-

8672A
SYNTHESIZEDSIGNAL GENERATOR
(Including Options 001, 002, 003, 004, and 005)

SERIAL NUMBERS

This manual applies directly to instruments with

serial numbers prefixed 1732A and 1733A.

With the changes described in Section VU, this

manual also applies to instruments with serial num-
bers prefixed 1610A, 17,01A, 1702A, 1703A,
1704A, 1705A, 1706A, 1707A, 170&k, 1711A,
1712A, 1719A. 1725A and 1731A.

For additional important information about serial

numbers, see INSTRUMENT COVERED BY MAN-
IJAL in Section I.

FOR REFERENCE fWRPOSES ONLY

 COPYRIGHT AND DISCLAIMER NOTICE

Copyright - Agilent Technologies, Inc. Reproduced with the permission of Agilent

Technologies Inc. Agilent Technologies, Inc. makes no warranty of any kind with regard
to this material including, but not limited to, the implied warranties of merchantability
and fitness for a particular purpose. Agilent Technologies, Inc. is not liable for errors
contained herein or for incidental or consequential damages in connection with the
furnishing, performance, or use of this material or data.
 SYNTHESIZED SIGNAL GENERATOR

This supplement contains important information for correcting manual erron and for adapting the manual to
instruments containing improvemenh made after the printing of the manual.
To use this supplement:
Make all ERRATA corrections
Make all. appropriate serial number related changes indicated in the tables below.
II serja, Prefix OI NUrnbCI- ML%kC Mmual mange* - - SerialPreilv or Number - Make Manual Chn~ea -
1SOlA 1 1845A ,l through 9
1816A 1, 2 1905A 1 through 10
182lA 1, z3 1906A 1 through 11
1822A 1 through 4 1913A 1 through 12
183M 1 through 5 1914A 1 through 13
1833A 1. through, 6 1930A 1 through 14
1854A 1 through 7 1940A 1 through 15
184I.A 1 through 8 b 2002A 1 through 16

b NEWITEM

ERRATA

Page 1-3, Table 1.1 Specifications (2 of 4):

Add the following information to footnote 6:
for Option 008, +8 dBm to -120 dBm from ~15°C to +@C. The RF output level also changes ,when
options are combined. When Options 001 and 008 arc combined, the RF output level specification is
+I0 to -10 dBm. When Options 004 and 008 are combined, the RF output level specification is +7 dBm
to -120 dBm. However, when Options 005 and 008 are combined, the RF output level specification is
+9 dBm to-10 dBm.

Page 1.6, paragraph l-49:

Add: If the instrument rack mounting slide6 are to be mounted in a standard EIA rack, then an adapter
(HP Part No. 1494.0023) is needed. The elidee without the adapter can be directly mounted in the HP
system encloauras.

Page 2-3, paragraph 2.14 continuation:

Change a portion of the fourth line to 23 (binary 10 011;

Page 3”10, Table 3-4:

Change step 4 under Using an External Standard. The last sentence in step 4 should read, “The external
reference must be within k200 Hz of 10 MHz OFHO0 He of 5 MHz for reliable locking to occur.”

Page 3.14, Table 3-5 (NOTE):

15 January 1980
28 Pages HEWLETT PACKARD
 ..,,

Model 8672~ contents

CONTENTS

Section page Section Page

I GENERAL INFORMATION ...... 1-l 3.28. Data Messages ................... 3”14

1.1. Introduction ................. l-l 3-30. Receiving Data Messages ............ 3"14
1.7. Specifications ................ 1.1 3.40. Sending Data Messages .............. 3-19
1.9. SaKetyConviderations ........... 1.1 3.42. Receiving the Trigger Message ......... 3.19
I.-IX Instruments Covered by Manual .... l-l 3-44. Receiving the Clear Message .......... 3.19
1.17. Manual Change Supplements. ...... 1.1 3.46. Receiving the Remote Message ........ 8-19
1.20. Description .................. 1.5 3.48. Receiving the Local Message .......... 3-19
l”22. Frequency ................. 1-5 3-50. Receiving the Local Lockout Message .... 3.19
1.25. output Level ............... l-5 3-52. Receiving the Clear Lockout/Set Local
1.28. Modulation Modes ........... l-5 Message ..................... 3.19
1.32. Miscellaneous Outputs and 3.54. Receiving the PassControl Message ..... 8.19
Indicators ............... 1-6 3.56. Sending the Require Service Message .... 3.19
1.37. Remote Operation ........... l-6 3-58. Sending the Status Byte Message ....... 3.19
1.40. Options .................... l-6 3-62. Sending the Status Bit Message ........ 3.20
1.41. Electrical Options ............ l-6 3-64. Receiving the Abort Message .......... 3.20
l-47. Mechanical Options. .......... 1.6 3.66. Programming Quick Reference Guide .... 3-20
1.53. Compatibility ................ 1.6 3.68. Programming Examples ............. 3.20
1..56. Selecting the HP-Ii3 Addrws 1.6
1.58. Accessories supplied ............ 1-7 IV PERFORMANCE TESTS .............. 4.1
I..60. Equipment Required but Not Supplied l-7 4.1. Introduction ...................... 4-l
l-64. Equipment Available ............ 1.7 4.3. Equipment Required ................. 4-l
1.69. Recommended Test Equipment ..... 1-l 4.5. Test Record. ...................... 4.1
4.7. Calibration Cycle ................... 4-l
II INSTALLATION .............. 2.1
4.9. Abbreviated Performance Testing ........ 4-l
2.1. Intxoductlon ................. 2-l 4.2
4-11 Operational Verification Checks .........
2.3. Initial lnNxction .............. 2-l
4.12. Output Level Flatness ................ 4.4
2.5. Preparation for IJse ............. 2"l
4.13. Harmonics and Subharmonics ........... 4-5
2-6. Power Requirements .......... 2-l
4.14. SWR ........................... 4-l
2.8. Line Voltage and Fuse Selection 2.1
4.15. FM Accuracy ...................... '4.10
2.10. Power Cable ............... 2.2
4-16. AM Distortion ..................... 4-11
2.12. HP.IB Address and Parallel Poll
411. Amplitude Modulation Depth, Meter Accuracy
Response Selection ......... 2.2
and Input Accuracy ............... 4-15
2.15. Interconnections ............ 2.3
4.18. Non-HaxmonicaXly Related Spurious
2.17. Mating Connecton ........... 2.3 4.19
(CW and AM Modes) ...............
2.20. Operating Environment ........ 2-3
4.19. Power Line Related Spurious (CW and
2.22. Bench Operation ............ 2.3
AM Modes) ..................... 4-20
2.24. Rack Mounting ............. 2.5 4.22
4-20. SingleSideband Phase Noise Ratio ........
2.26. Storage and Shipment ........... 2-5 4.25
4.21. FM Frequency Response ..............
2"27. Environment ............... 2.5
4.22, FM Harmonic and Non.Harmonic Distortion 4.27
2”29. Packaging ................. 2-6 4.28
4.23. Residual FM In FM and CW Modes .......
111 OPERATION ................. 3-l 4.24. RF Output Level and Accuracy .......... 4.31
3.1. Introduction ................. 3.1 4.25. Incidental Phase and FrequencyModulation 4.35
3.4.. Pane1 Features ................ 3.1 4.26. Frequency Switching Time ............. 4.37
3.6. Operator’s Maintenance 3-l 4.21. Output Level Switching Time ........... 4.39
3.6. Mechanical Meter Zeroing ...... 3.1 4.28. AM Rates ........................ 4.42
3.10. Local Operation ............... 3-l 4.29. Incidental AM ..................... 4-43
F&12. Local Operator’s Check .......... 3-l 4.30. Internal Time Base Aging Rate .......... 4.44
3.14. Local Operating Instructions 3.1
3~16. Remote (HP-IB) Operation ........ 3-14 V ADJUSTMENT 5.1
3.20. Compatibility .............. 3.14 5.1. Introduction . 5"l
3~23. Local/Remote and Remote/Local 5.5. Safety Considerations 5-l
,
Mode Lhanges ............ 5.1. Equipment Requited. 5-l
111
Contents Model 8672A

CONTENTS (Co&d)

Section Page Section Page

5.11. Factory Selected Components. 5-l 6.3. Exchange Assemblies. .................. 6-l
5.13. Related Adjustments 5.1 6.5. Abbreviations ....................... 6.1
5.16. Adjustment Locations 5.2 6.7. Replaceable Parts List .................. 6-l
5.20. AS RF Source Assembly Adjustments. 5-6 6.11. Ordering Information .................. 6.1
5~21. Power Supply Adjustments, 5.6 6.14. Spare Parts Kit ....................... 6.1
5-22. 10 MHz Reference Oscillator Adjustment 5-l
5.23. Digital”to”Analog Converter Adjustment 5-8
5.24. YTV Driver Adjustment 5.9 VII MANUAL CHANGES .................. 7-l
5.25. Voltage Controlled Crystal Oscillator 7.1, Introduction ........................ 7.1
(VCXO) Adjustment 5-10 1.3. Manual Changes ...................... 7-l
5-26. M/N Loop Adjustments 5.12
5.21. YTO Loop Sampler Adjustments 5-14
5.28. YTO Loop Offset and FM Overmodulation VIII SERVICE .......................... 8-l
Adjustments 5.11 8.1. Introduction ........................ 8.1
5.29. YTO Loop Phase Detector Adjustment 5.19 8.5. Safety Considerations .................. 8.1
5”30. FM Wriver Adjustment. 5.21 8.11. Principles of Operation ................. 8-l
5.31. A2 Controller Assembly Adjustments 5~22 8-13. Troubleshooting ...................... 8~1
5.32. 160-240 MHz (20130 MHz or LFS Loop) 8.14. Arrangement in Manual ............... 8-l
VCO Pretune Adjustments 5.22 8.16. Supplemental Troubleshooting Aids ....... 8-l
5.33. 20/30 MI% (LFS) Loop Divider Bias 8.20. Recommended Test Equipment. ........... 8-5
Adjustments 5-23 8.22. Service Aids. ........................ 8.5
5-34. A2A4 Assembly Notch Filter Adjustment 5.24 8.27. Repair ............................ 8.5
5-35. Al. RF Output Assembly Adjustments 5.25 8.29. Factory Selected Cumponents. .......... 8.5
5-36. YTM Adjustments 5.25 8.31. Non-Field Repairable Assemblies ........ 8-5
5-31. ALC Adjustments. 5.29 8.33. Module Exchange Program ............. 8.6
5-38. External Leveling Adjustments 5.32 8.35. After Service Product Safety Checks ...... 8.6
5-39. AM Bandwidth Adjustment 5.34 8.41. Disassembly and Reassembly Procedures .... 8.6
5.40. AM Meter Adjustment 5.35 8.59. Logic Symbols ...................... 8.14
5.41. AM Meter Adjustment -Alternate 8.61. Qualifiers ....................... S-14
Proccdurc 5-36 8.63. Indicator Symbols ................. 8-14
5.42. FM Adjustments. 5.37 8.65. Contiguous Blocks ................. 8.15
8.67. Dependency Notation ............... 8-15
VI REPLACEABLEPARTS ,,.,, ,, ,.,, ,, 6-l 8.69. Common Control Block .............. 8.18
6.1. Introduction 6.1 8.71. Complex Devices .................. 8.18

SERVICE SHEETS

Service Sheet Page Service Sheet Page

1 Overall Functional Block Diagram 8”33 S-AI RF Output Level Control (AlAlO, AlATl) 8-50
2 A3 RF Swrce Assembly Troubleshooting 8.94 &Al Digital Control (AlAll) 8.52
3 A2 Controller Troubleshooting 8-38 7.~1 Front Pm c0ntm and misplays (~1~1,
4 Al RF Output Assembly Troubleshooting 8.40 AlA2) 8-54
l.Al ‘RF Preamplifier and P/O ALC Loop S-AI Metering Control (AlAg) 8.56
(AlA5,AlA13,AlAT3) 8.42 1.A2 20130 MHz Divider (A2A5) 8-58
Z-AI YTM Control (AlA8, AlAS, AlA12, .!-A2 Phase Detector (A2A4) 8.60
AlATP,AlFLI) 8.44 3~A2 VCO 160-240 MHz (A2A3) 8.62
3.Al SRD Control (AlA7) 8.46 4.A2 HP.IB Address (A2A9) 8.64
4.Al P/O ALC Loop (AlA6, AlCRl, AlDCl) 8-48 s-A2 P/O HP.IB Interface (P/O AZA’I) 8-66

iv
Model 8672A

SERVICE SHEETS (cont’d)

Service Sheet Page Service Sheet Page

&A2 P/O HP”IB Interface (P/O A2A7) 8-68 IO-A3 FM Driver (A3A7, A3A9A1, A3A9A3,
TA2 ltegistex I (A2AlO) 8.70 A3A9A6,A8A9A7) 8-102
B-A2 P/O Timing and Control (P/O A2All) 8.72 II-A3 Rectifier Board (A3A2, A3All) 8.104
9.A2 P/O Timing and Control (P/O A2All) 8.74 12.A3 Positive Regulator Board (A3A3) 8-106
IO-A2 P/O Output Register (P/O A2A8) 8-76 13.A3 Negative Regulator Board (A3A4) 8-108
11.A2 P/O Output Register (P/O A2A8) 8.78 Al RT Output Assembly Interconnections,
127A2 P/O Front Panel (P/O 42Al) 8.80 and AlA Motherboard 8.IlO
13.A2 P/O Front Panel (P/O A2A1, A2A2) 8.82 A2 Controller Assembly Kntcrconnections
1.A3 Reference Phase Lock (ABAlAl, A3A8) 8-84 and A2A12 Motherboard 8.113
Z-A3 1,OO MH7, VCXO (A3AlA2) 8”86 A3AlO Mother Board Interconnections,
3.A3 M/N Phase Detector (A3AlA9) 8.88 A3AlA6 Reference and M/N Mother
4.A3 M/N VCO (A3AlA4) 8”90 Board, and A8 Plug-in Circuit Board 8.115
5.A3 M/N Output (A3AlA5) 8.92 A3A9 Assembly and Cable Locations,
6.A3 Digital-to-Analog Converter (A3A5) 8.94 8672A Bottom View 8”116
T-A3 YTO Main Coil Driver (A3A6) 8.96 8672ATopViews.................. 8”llY
8.A3 YTO Sampler (A3A9A5, A3A9lJl) 8.98 Al, A2, and A3 Top Views of Adjustments
9.A3 YTO Phase Detector (A3A9A2, A3A9A4). 8-100 and ,rest Pant Locstwx 8-121

LIST OF ILLUSTRATIONS

Figure Figure Page

1-l. HP ,Model 8612A and Accessories Supplied 1.0 4-E. Power Line Related Spurious Test Setup 4-21
1,.2. 15 kl-lz LOW Pass Filter 1.10 4.1. SingleSideband Phase Noise Ratio
1.3. Special lnterconnnct Cable I”10 Test Setup. 4.23
4.8. FM Frequency Response Test Setup. 4.25
Line Voltage and Fuse Selection 2-l 4-9. FM nistortion Test Setup 4-21
Power Cable and Mains Plug Part Number6 2.2 4”lO. Residual FM in FM and CW Modes
Localion UC HP-IB Address and Parallel Poll Test Setup. 4-29
Swilches 2.3 4.11. RF Output Level and Accuracy
2-4. flewlell-Packard Interface Bus Connection 2.4 Test Setup. 4-32
4.12. Incidental Phase and Frequency Modulation
3-l. Front Panel Connectors, Controls, Switches, Test Setup. 4.35
and Displays 3.2 4.13. Frequency Switching Time Test Setup 4-37
3.2. Il,car Panel Connectors, Switches, and 4.14. Output Level Switching Time Test
Displays 3.4 Setup 4-40
3-3. Operator’s Frequency and Modulation 4.15. AM Rate Test Setup 4-42
Checks Test Setup 3-6 4.16. Incidental AM ‘Test Sftuo 4.43
3.4. Operxtur’s External ALC Checks Test Setup 3.8 4-11 Xntcrnal Time Base Aging Rate Test Setup 4-44
3-5. Frequency Programming 3.16
3.6. Typical frequency switching time showing 5.1. 10 MHz Reference Oscillator Adjustment
WORST CASI? lock and settling times 3.18 Test Setup. 5-7
3-l. Programming Examples 3-22 5~2. VCXO Adjustment Test Setup 5.10
5-3. M/N Loop Adjustment Test Setup 5-13
4-l. Typical Maximum Power Available on the 5-4. YTO Loop Sampler Adjustment Test
+10 dHm Range (over-range) 4-2 setup 5.15
4.2. SWR Test Setup 4-I 5.5. Typical Swept Frequency Response at
4-3. FM Accuwacy Test Setup 4.10 A3A9A5TPl (frequency span per division
4.4. AM llistnrtion ‘Test Setup 4-11 20 MIh) 5.16
4.5. Amplitude Modulation Depth Meter Accuracy 5-6. YTO Loop Offset and FM Overmodulation
rind Input Accuracy Test Selup .4.15 Test setup. 5-17
Contents Model 86,72A

ILLUSTRATIONS (Cont’d)

Figure Page Figure Page

5.7. YTO Loop Offset Adjustment Waveforms 6.18 8.21. RF Preamplifier and P/O ALC Loop
5.8. YTO Loop Phase Detector Adjustment Scbematie 843
Test Setup. . . . . 5.19 8.28. AlA3Al YTM Assembly Component,
5.9. Spectrum Analyzer Display of Phase Adjustment, and Test Point Locations 844
Lock&Loop Gain 5-20 8.29. AM8 YTM Driver Assembly Component
5.10. FM Driver Adjustment Test Setup 5-21 Adjustment, and Test Point Locations 8-44
5.11. ZOj30 MHz Loop Divider Bias Adjustment 8.30. YTM Control Block Diagrams S-45
Test Setup, 5.23 8.31. YTM Control Schematic Diagram . . . 8-45
5.12. A2A4 Assembly Notch Filter Adjustment S-32. AlA SRD Bias Assembly Component,
Test Setup, . . . . 5.24 Adjustment, and Test Point Locations . . 8-46
5.13. YTM Adjustment Test Setup 5-26 S-33. SRD Control Block Diagrams 84.7
5.14. Typical YTM Response 5-28 8.34. SRD Control Schematic Diagram 8-47
5-15. AM Mster Adjustment Test Setup . . 5-35 8.35. AlA ALC Detector Assembly Component,
5.16. FM Adjustment Test Setup . . . t 5-37 Adjustment, and Test Point Locations . , 8.48
8.36. P/O ALC Loop Block Diagrams . . . 8-49
6-l. Al and A2 Assembly Front Panel 8.37. P/O ALC Loop Schematic . . 8-49
Mechanical Parts. ................... 6-18 8.38. AlAlO Level Control Assembly Component,
6-2. Synthesizer Cabinet Parts ............... 6~61 Adjustment, and Test Point Locations 8-50
8.39. RF Output Level Control Block Diagrams 8-51
8-l. Schematic Diagram Notes ................ 8-2 8.40. RF Output Level Control Schematic
8.2. Rear Panel of the Synthesizer ............. 8.7 Diagram 8-51
8-3. Al and A2 Assembly Front Panel Fully 8.41. AlAll Digital Processor Assembly Component,
Extended ......................... 8.8 Adjustment, and Test Point Locations 8.52
8.4. Bottom of the Synthesizer .............. 8-10 8.42. Digital Control Block Diagrams . 8-53
8-5. A3A9 Assembly in Service Position ........ 8-11 8-43. Digital Control Schematic Diagram . . . 8-53
8-6. Qualifiers ......................... 8~14 8.44. AlA Display Driver Assembly Component
8-7. Contiguous Blocks ................... 8.15 Locations . . . 8-54
8”8. Indicator Symbols ................... 8.16 8.45. AlA Front Panel Assembly Component,
8.9, AND Dependency Notation ............. 8-17 Switches, and Test Point Locations 8.54
8.10. OR and Free Dependency Notation 8-17 8.46. Front Panel Controls and Displays Block
8.11. AND Dependency Notation, Coder Diagrams. 8.55
Example IJsing Letters 8-17 8.47. Front Panel Controls and Displays
8.12. Common Control Bldck . 8.18 Schematic Diagram 8-55
8.13. Quad D~Type Latch (Individual) . 8-18 8.48. AlA Metering Assembly Component,
8.14. Quad D-Type Latch (Combined) 8.18 Adjustment, and Test Point Locations 8-56
8.15. Quad D-Type Latch Example . . 8.18 8.49. Metering Control Block Diagrams 8-57
8-16. Multiplexer (AND-OR Selected) Example 8-19 8.50. Metering Control Schematic Diagram . 8-57
8.17. Shift Register Example 8.19 8-51. A2A5 20130 MHz Divider Assembly
8.18. Up-Down Counter Example 8.19 Component, Adjustment, and Test
8.19. Synthesizer’s Simplified Block Diagram 8-29 Point Locations . . . . . 8-68
8.20. Major Assembly Locations 8.29 S-52. 20/30 MHz Divider Block Diagrams 8-59
8-21. Overall Functional Block Diagram 8-33 8.53. 2OjSO MHz Divider Assembly Schematic
8.22. A3 RF Source Assembly Troubleshooting Diagram . . 8.59
Block Diagram . 8.37 8.54. A2A4 20130 Phase Detector Assembly
8-23. A2 Controller Troubleshooting Block Component, Adjustment, and Test Point
Diagram 8-39 Locations . . 8-60
8~24. Al RF Output Assembly Troub@shooting 8.55. 20/30 MHz Phase Detector Block
Block Diagram . 8~41 Diagrams. . . 8-61
8-25. AIA5 ALC Assembly Component, Adjustment 8-56. 20/30 MHz Phase Detector Assembly
and Test Point Locations 8.42 Schematic 8.61
8.26. RF Preamplifier and P/O ALC Loop 8.57, A2A3 160-240 MUz Assembly Component
Block Diagrams 843 Locations 8-62
Model 8672~ contents

ILLUSTRAflONS (Cont’d)

Page Figure Page

VCO 160-240 MHz Block Diagrams 8.63 8.90. ABAlAl Reference Phase Lock Board
VCO 160-240 MHz Awmbly Schematic Assembly Component and Test Point
Diagram 8-68 Locations 8-84
8-60. A2A9 HP-lB Address Assembly Component 8-91. Reference Phase Lock Block Diagrams .%85
Locations 8.64 8.92. Reference Phase Lock Assembly Schematic
8.61. HP.IB Address Block Diagrams 8-65 Diagram 8-85
8-62. IIP.IB Address Assembly Schematic 3.93, A3AlA2 100 MHz VCXO Assembly
Diagram 8-65 Component, Adjustment, and Test
E-63. P/C A2Al Interface Assembly Component Point Locations 8-86
and Test Point Locations 8.66 8.94. 100 MHz VCXO Block Diagrams 8.87
8.64. P/O Inler~ace Block Diagrams 8.67 8.95. 100 MHz VCXO Assemlby Schematic
8.65. P/O HP-IB Interface Assembly Schematic Diagram 8.87
Diagram 8.67 8-96. A3AlA3 M/N Phase Detector Assembly
8”66. P/O A2A7 Interface Assembly Component Component and Test Point Locations 8-88
Locations ‘. . 8.68 8.97. M/N Phase Detector Block Diagrams 8-89
8-61. P/O Interface Block Diagrams 8-69 8.98. M/N Phase Detector Assembly Schematic
8.68. P/O Interface Assembly Schematic Diagram 8.69 Diagram 8.89
B-69. A21210 Register 1 Assembly Component 8.99. 43AlA4A2 M/N VCO Board Assembly
Locations 8”70 Component, Adjustment, and Test Point
8-70. Register 1 Block Diagrams 8-71 Locations 8”90
8-71. Register 1 Assembly Schematic Diagram 8-71 8.100. M/N VCO Block Diagrams 8.91
8-72. P/O AZAll Timing and Control Assembly 8.101. M/N VCO Assembly Schematic Diagram 8-91
Component, Adjustment, and Test Point 8.102. A3AlA5 M/N Output Assembly
Locations 8.72 Component Locations 8-92
6.73. P/O Timing and Control Block Diagrams 8.73 8.103. M/N Output Block Diagrams. 8.93
8.74. P/O Timing and Control Schematic Diagram 8-73 8.104. M/N Output Assembly Schematic Diagram 8.93
8.15. P/O A2All Timing and Control Assembly 8.105. A3A5 DAC Assembly Component,
Component and Test Point Locations 8.74 Adjustment, and Test Point Locations 8.94
8.76, P/O Timing and Control Block Diagrams 8.75 8-106. Digital-to-Analog Converter Block
8.77. P/O Timing and Control Assembly Diagrams. 8.95
Schematic Diagram 8.75 8.107. Digital-to-Analog Converter Schematic
8.‘78. Y/O h2A8 Output Register Aswmbly Diagram 8.95
Component and Test Point Locations 8-76 8”108. A3A6 YTO Main Coil Driver Assembly
8.19. P/O Output Register Block Diagrams 8.17 Component, Adjustment, and Test Point
8.60. P/O Output Register Assembly Schematic Locations 8.96
Diagram 8-77 8.109. YTO Main Coil Driver Block Diagrams 8-97
8.81. P/C 42A8 Output Register Assembly 8.110. YTO Main Coil Driver Schematic Diagram 8-97
Component and Test Point Locations 8-18 8.111. A3A9A5 YTO Sampler Assembly
8.82. P/O Output Register Block Diagrams 8.79 Component, Adjustment, and ‘Test
E-83. U/O Output Register Assembly Schematic Point Locations 8-98
Diagram 8.79 8.112. YTO Sampler Block Diagrams 8.99
8-84. P/O A2Al Front Panel Assembly Component 8.113. YTO Sampler Assembly Schematic
Locations 8-80 Diagrams. 8-99
8.85. P/O Front Panel Block Diagrams 8.81 8.114. A3A9A4 YTO Phase Detector Assembly
8.86. P/O Front Panel Assembly Schematic Component, Adjustment, and Test
Diagram 8-81 Point Locations 8-100
8.87. P/O 42Al Front Panel Assembly Component 8.115. YTO Phase Detector Block Diagrama 8.101
Locations 8.82 8-116. YTO Phase Detector Schematic Diagram 8.101
8.88. P/O Front Panel Block Diagrams 8.83 8.117. A3Al FM Driver Assembly Component
8.89. P/O Front Panel Assembly Schematic Adjustment, and Test Point Locations 8-102
Diagram 8.83 8”118. FM Driver Block Diagrams S-103

vii
Contents Model 8672A

ILLUSTRATIONS (Cont’d)

Figure Page Figure Page

8.119. FM Driver Assembly Schematic Diagram S-103 8.133. Major Assembly Locations ............ S-118
8.120. A3A2 Rectifier Assembly Component, 8.134. A2A12 Mother Board Assembly Component
Adjustment and Test Point Locations 8-104 Locations ...................... 8.113
8.121. Rectifier Block Diagrams . S-105 8~135. ASAlO RF Source Mother Board
8”122. Rectifier Board Assembly Schematic Component Locations .............. 8.115
Diagram 8.105 8.136. A3AlA6 Reference and M/N Mother Board
8.123. A3A3 Positive Regulator Assembly Assembly Component and Connector
Component, Adjustment, and Test Locations ...................... 8J1.5
Point Locations 8.106 8~137. A3 Plug-in Circuit Board Adjustment and
8.124. Positive Regulator Block Diagrams 8-107 Test Point Locations ............... 8-115
8.125. Positive Regulator Board Assembly 8.138. A3A9 Assembly Locations ............ 8-117
Schematic Diagram . S-107 8.139. A3A9 Cable Connections ............. 8-117
8.126. A3A4 Negative Regulator Assembly 8.140. Major Assembly Locations ............ 8-117
Component and Test Point Locations 8-108 8.141. Bottom View AssembXyLocations ....... 8-117
8.127. Negative Regulator Block Diagrams 8-109 8.142. Major Assembly Locations ............ 8-119
8.128. Negative Regulator Board Assembly 8.148. Top View Assembly Locations ......... 8-119
Schematic Diagram 8.109 8”144. Top View ChassisMounted Parts,
8.129. Remote Operator’s Checks Test Assembly Locations ............... 8.119
S&up 8-110 8.145. Major Assembly Locations ............ 8.121
8.130. Major Assembly Locations . 8-111 8.146. Top View A2 and A3 Assemblies Adjust-
8.131. Al to A2 Interconnections 8-111 ments and Test Point Locations ........ 8.121
8.132. AlA Mother Board Assembly Connector 8.147. Top View Al Assembly Adjustment
Locations S-111 Locations ...................... 8-121

TABLES

Table Page Table Page

1.1. Specifications l-2 5.2. Performance Test Failure and Required

1.2. Recommended Test Equipment l-8 Action 5.3
5.3. Related Adjustments 5-4
2.1. USA Standard Code for Information
Interchange (ASCII) 2.5 6-l. Part Numbers fox Exchange AssembXies 6-2
3-l. Front Panel Features 3-2 6-2. Reference Designations and Abbreviations. 6.3
3”2. Rear Panel Features 3-4 6.3. Replaceable Parts 6.5
3-3. Lrmd Operator’s Checks 3.5 6-4. Code List of Manufacturers 6-63
3.4. Local Operating Instructions 3.9
3.5. Message Reference Table 3.14 l-l. Manual Changes by Serial Number Prefix l-l
3-6. Frequency Program Codes and Arguments 3.15 7.2. Summaxy of Changes by Component 7-2
3.7. output Level 8-17
3-8. Modulation 3-17 8.1. HP”IB Diagnostic Program 8.20
3-9. ALC Arguments (with RF ON) 3.17 8-2. Front Panel Status Annunciatoxs 8-30
3.10 Programming Quick Reference Guide 3.21 8.3. Overall ,1
Iroubleshooting 8.31
8.4. Listing of all M and N Numbers and
4-l. Record of Operational Verification Checks 4.4 Resulting Frequencies 8-35
4.2. Harmonic Level versus Percentage Distortion 4.14 8.5. Remote Operator’s Check 8.110
4-3. Modulation Index 4”16 8-6. RF Output Assembly (Al) Inteconnections 8-111
4.4. Performance Test Record 4.46 8.7. Controller Assembly (A2) Interconnections 8-113
8-8. Motherboard Assembly (A8AlO)
5.1. Factory Selected Components, 5.2 Interconnections 8.115

.-.
!I3111
Model 8672A Safety Considerations

SAFETY C~NS~DEIUIT~~NS

GENERAL SAFETY EARTH GROUND

This product and related documentation must be This is a Safety Class I product (provided with a
reviewed for familiarization with safety markings protective earthing terminal). An uninterruptible
and instructions before operation. This product has safety earth ground must be provided from the
been designed and tested in accordancewith inter. main power wurce to the product input wiring ter-
national standards. minals, power cord, or supplied power cord set.
Whenever it is likely that the protection has been
impaired, the product must be made inoperative
SAFETY SYMBOLS
and be secured against any unintended operation.
Instruction manual symbol: the
A product will be marked with this
symbol when it is necessary for
the user to refer to the instruc- BEFORE APPLVING POWER
tion manual (refer to Table of Verify that the product is configured to match the
Contents). available main power source per the input power
configuration instructions provided in this manual.
Indicates hazardousvoltages. If this product is to be energizedvia an auto-trans-
f former make sure the common terminal is con-
nected to the neutral (grounded side of mains
+ Indicates earth (ground) terminal. SUPPlY).

SERVICING

The WARNING sign denotes a (WARNINGS1

hazard. It calls attention to a
procedure, practice, or the like,
which, if not correctly performed Any servicing. adjustment, main tmanca.
or adhered to, could result in or repair of this product musl be per-
personal injury Do not proceed formed only by qualifkd .mrsoonel.
beyond a WARNlNG sign until
the indicated conditions are fully Adjustments described in this manual
understood and met. mtry be performed with power supplied
to the product while protective couers
are rernoued. Energy available at many
The CAUTION sign denotes a points may, if contacted. result in per-
hazard. It calls attention to an sonal injury.
operating procedure, practice, or
the like, which, if not correctly Capacitors inside this product may sfill
performed or adhered to, could be charged even tohm disconnected from
result in damage to or destruc- its power soume.
tion of part or all of the product.
Do not proceed beyond a CAU- To avoid a fire hazard, only fuses with
TION sign until the indicated the required current rating and of the
conditions are fully understood specified type (normal blow, time delay,
and met. etc.) are to be used for replacement.

ix
 Model 8672A

MODEL 8672A

LINE POWER CABLE

EXTENDER BOARDS

FUSE

NOTE: See ACCESORIES SUPPLIEU in Section I for more details.

Figure l-l. HP Model 8672A and Accessories Supplied.

Model 8672~ General Information

SECTION I
GENERAL INFORMATION
l-l. INTRODUCTION the beginning of this manual for a summary of the
1-2. This manual contains information pertinent to safety information.
installation, operation, testing, adjusting, and l-12. Safety information pertinent to the task at
servicing the Hewlett-Packard Model 8672A hand (installation, operation, performance testing,
Synthesized Signal Generator. The Model 8672A adjustments, or service) is found throughout this
will generally be referred to as the Synthesizer manual.
throughout this manual.
X-3. Information pertaining to the Hewlett-Packard l-13. INSTRUMENTS COVERED BY MANUAL
Interface Bus (HP-IB) as it relates to the Synthe- I-14. Options. Electrical options 001, 002, 003,
sizer is found in various sections of this manual. 004, 005 and various mechanical options are docu-
Section VIII contains a diagnostic program for mented In this manual. The differences are noted
checkout of HP-IB functions. A remote operator’s under the appropriate paragraphsuch as Options in
check is also found in Section VIII. Section I,‘the Replaceable Parts List and the sche-
1-4. Figure 1-1 shows the Synthesizer with all sup- matic diagrams.
plied accessories.
‘l-15. Serial Numbers. Attached to this instrument
1-5. Packaged with this manual is an Operating is a serial number plate. The serial number is in the
Information Supplement. This is simply a copy of form 1234A00123. The first four digits and the
the first three sections of this manual. This supple- letter comprise the serial prefix. The last five digits
ment should stay with the instrument for use by form the sequential suffix that is unique to each
the operator. Additional copies may be ordered instrument. The contents of this manual apply
separately through your nearest Hewlett-Packard directly to instruments having the sameserial num-
office. ‘I’hc part number is listed on the title page ber prefix(es) as listed under SERIAL NI,JMBERS
of this manual. on the title page.
I-6. On the title page of this manual, below the
manual part number, is a “Microfiche” part num- l-16. For information concerning a serial number
ber. This number may be used to order 100 x prefix not listed on the title pageor in the Manual
150 mm (4 x 6.inch) microfilm transparenciesof Changessupplement, contact your nearestHewlett-
the manual. Each microfiche contains up to 96 Packard office.
photo.duplicatcs of the manual pages.The micro-
fiche package also includes the latest Manual 1-17. MANUAL CHANGE SUPPLEMENTS
Changessupplement as well as all pertinent Service l-18. An instrument manufactured after the print-
Notes. ing of this manual may have a serial prefix that is
not listed on the title page.This unlisted serial pre-
1.7. SPECIFICATIONS
fix indicates that the instrument is different from
l-8. Instrument specifications are listed in Table those documented in this manual. The manual for
I-1. These specifications are the performance this instrument is supplied with a yellow Manual
standards, or limits against which the instrument Change supplement that contains “change infor-
may be tested. mation” that documents the differences.
1-9. SAFETY CONSIDERATIONS l-19. In addition to change information, the sup-
1-10. This product is a Safety Class i instrument plement may contain information for correcting
(provided with a protective earth terminal). The in- errors in the manual. To keep this manual as cux-
strument and manual should be reviewed for safety rent and accurate as possible, Hewlett-Packard
markings and instntctiohs before operation. recommends that you periodically request the
latest Manual Changes supplement. The supple-
I-11. The Synthesizer and all related documenta- ment for this manual is keyed to this manual’s
tion must be reviewed for familiarization with print date and part number, both of which appear
safety markings and instructions before operation. on the title page. Complimentary copies of the
Refer to the Safety Considerations page found at supplement are available from Hewlett-Packard.
1-l