LTC2850/LTC2851/LTC2852

3.3V 20Mbps RS485/RS422

Transceivers

FEATURES DESCRIPTION
n 3.3V Supply Voltage The LTC®2850, LTC2851 and LTC2852 are low power,
n 20Mbps Maximum Data Rate 20Mbps RS485/RS422 transceivers operating on 3.3V
n No Damage or Latchup Up to ±15kV HBM supplies. The receiver has a one-eighth unit load supporting
n High Input Impedance Supports 256 Nodes up to 256 nodes per bus (C-, I-grade), and a failsafe feature
(C-, I‑Grade) that guarantees a high output state under conditions of
n Operation Up to 125°C (H-Grade) floating or shorted inputs.
n Guaranteed Failsafe Receiver Operation Over the
The driver maintains a high output impedance over the
Entire Common Mode Range
entire common mode range when disabled or when the
n Current Limited Drivers and Thermal Shutdown
supply is removed. Excessive power dissipation caused by
n Delayed Micropower Shutdown: 5µA Maximum
bus contention or a fault is prevented by current limiting
(C-, I-Grade)
all outputs and by thermal shutdown.
n Power Up/Down Glitch-Free Driver Outputs
n Low Operating Current: 370µA Typical in Enhanced ESD protection allows these parts to withstand
Receive Mode up to ±15kV (human body model) on the transceiver
n Compatible with TIA/EIA-485-A Specifications interface pins without latchup or damage.
n Available in 8-Pin and 10-Pin 3mm × 3mm DFN, PART NUMBER DUPLEX PACKAGE
8-Pin and 10-Pin MSOP, and 8-Pin and 14-Pin
LTC2850 Half SO-8, MSOP-8, DFN-8
SO Packages
LTC2851 Full SO-8, MSOP-8, DFN-8
LTC2852 Full SO-14, MSOP-10, DFN-10
APPLICATIONS
L, LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of
n Low Power RS485/RS422 Transceiver Linear Technology Corporation. All other trademarks are the property of their respective owners.

n Level Translator
n Backplane Transceiver

TYPICAL APPLICATION
LTC2850 LTC2850 at 20Mbps Into 54Ω
RO1 VCC1
R
RE1 DI
RT
DE1 A

DI1 D GND1
2V/DIV B

A-B
LTC2850
RT
RO2 VCC2
R
RE2
285012 TA01b
DE2 20ns/DIV

DI2 D GND2
285012 TA01a

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LTC2850/LTC2851/LTC2852
ABSOLUTE MAXIMUM RATINGS (Note 1)

Supply Voltage (VCC).................................... –0.3V to 7V Operating Temperature (Note 4)

Logic Input Voltages (RE, DE, DI)................. –0.3V to 7V LTC285xC................................................. 0°C to 70°C
Interface I/O: LTC285xI..............................................–40°C to 85°C
A, B, Y, Z........................................ (VCC – 15V) to 15V LTC285xH........................................... –40°C to 125°C
Receiver Output Voltage (RO)........–0.3V to (VCC + 0.3V) LTC285xMP........................................ –55°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSOP................................................................ 300°C

PIN CONFIGURATION
LTC2850
TOP VIEW
TOP VIEW

RO 1 8 VCC TOP VIEW

RO 1 8 VCC
RE 2 7 B RO 1 8 VCC
RE 2 7 B RE 2 7 B
9
DE 3 6 A DE 3 6 A DE 3 6 A
DI 4 5 GND DI 4 5 GND
DI 4 5 GND
MS8 PACKAGE
8-LEAD PLASTIC MSOP S8 PACKAGE
DD PACKAGE
TJMAX = 150°C, θJA = 200°C/W, θJC = 40°C/W 8-LEAD PLASTIC SO
8-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W TJMAX = 150°C, θJA = 150°C/W, θJC = 39°C/W
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB

LTC2851
TOP VIEW
TOP VIEW
VCC 1 8 A TOP VIEW
VCC 1 8 A
RO 2 7 B VCC 1 8 A
9 RO 2 7 B RO 2 7 B
DI 3 6 Z DI 3 6 Z
GND 4 5 Y DI 3 6 Z
GND 4 5 Y
MS8 PACKAGE GND 4 5 Y
8-LEAD PLASTIC MSOP
DD PACKAGE S8 PACKAGE
8-LEAD (3mm × 3mm) PLASTIC DFN TJMAX = 150°C, θJA = 200°C/W, θJC = 40°C/W
8-LEAD PLASTIC SO
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W TJMAX = 150°C, θJA = 150°C/W, θJC = 39°C/W
EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB

LTC2852 TOP VIEW

TOP VIEW
NC 1 14 VCC
RO 1 10 VCC TOP VIEW RO 2 13 NC
RE 2 9 A RO 1 10 VCC
RE 3 12 A
DE 3 11 8 B RE 2 9 A
DE 3 8 B DE 4 11 B
DI 4 7 Z DI 4 7 Z
GND 5 6 Y GND 5 6 Y DI 5 10 Z

MS PACKAGE GND 6 9 Y
DD PACKAGE 10-LEAD PLASTIC MSOP 8
GND 7 NC
10-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJA = 120°C/W, θJC = 45°C/W
TJMAX = 150°C, θJA = 43°C/W, θJC = 3°C/W S PACKAGE
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB 14-LEAD PLASTIC SO
TJMAX = 150°C, θJA = 88°C/W, θJC = 37°C/W

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 LTC2850/LTC2851/LTC2852
ORDER INFORMATION
LTC2850 C DD #TR PBF

LEAD FREE DESIGNATOR

PBF = Lead Free

TAPE AND REEL

TR = Tape and Reel

PACKAGE TYPE
DD = 8-Lead Plastic DFN
DD = 10-Lead Plastic DFN
MS8 = 8-Lead Plastic MSOP
MS = 10-Lead Plastic MSOP
S8 = 8-Lead Plastic SO
S = 14-Lead Plastic SO

TEMPERATURE GRADE
C = Commercial Temperature Range (0°C to 70°C)
I = Industrial Temperature Range (–40°C to 85°C)
H = Automotive Temperature Range (–40°C to 125°C)
MP = Military Temperature Range (–55°C to 125°C)

PRODUCT PART NUMBER

LTC2850 = Half Duplex, with Enables
LTC2851 = Full Duplex, No Enables
LTC2852 = Full Duplex, with Enables
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/

PRODUCT SELECTION GUIDE

PART NUMBER PART MARKING DUPLEX LOW POWER SHUTDOWN MODE PACKAGE
LTC2850 2850/I/H, LTCQD, LCQC Half Yes SO-8, MSOP-8, DFN-8
LTC2851 2851/I/H, LTCWF, LCWD Full No SO-8, MSOP-8, DFN-8
LTC2852 2852CS/IS/HS, LTCRX, LCRY Full Yes SO-14, MSOP-10, DFN-10
LTC2850MP 2850MP, LTFYD, LFYC Half Yes SO-8, MSOP-8, DFN-8
LTC2851MP 2851MP, LTFYG, LFYF Full No SO-8, MSOP-8, DFN-8
LTC2852MP 2852MPS, LTFYH, LFYJ Full Yes SO-14, MSOP-10, DFN-10

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LTC2850/LTC2851/LTC2852
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 3.3V, unless otherwise noted. (Note 2)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Driver
|VOD| Differential Driver Output Voltage R = ∞, VCC = 3V (Figure 1) l VCC V
R = 27Ω, VCC = 3V (Figure 1) l 1.5 VCC V
R = 50Ω, VCC = 3.13V (Figure 1) l 2 VCC V
Δ|VOD| Difference in Magnitude of Driver Differential R = 27Ω or 50Ω (Figure 1) l 0.2 V
Output Voltage for Complementary Output
States
VOC Driver Common Mode Output Voltage R = 27Ω or 50Ω (Figure 1) l 3 V
Δ|VOC| Difference in Magnitude of Driver Common R = 27Ω or 50Ω (Figure 1) l 0.2 V
Mode Output Voltage for Complementary
Output States
IOZD Driver Three-State (High Impedance) Output DE = 0V, (Y or Z) = –7V, 12V (LTC2852) l ±10 µA
Current on Y and Z H-Grade l ±50 µA

IOSD Maximum Driver Short-Circuit Current –7V ≤ (Y or Z) ≤ 12V (Figure 2) ±180 ±250 mA
l –250 300 mA
Receiver
IIN Receiver Input Current (A, B) DE = TE = 0V, VCC = 0V or 3.3V, VIN = 12V l 125 µA
(Figure 3) (C, I-Grade)
DE = TE = 0V, VCC = 0V or 3.3V, VIN = –7V, l –100 µA
(Figure 3) (C, I-Grade)
DE = TE = 0V, VCC = 0V or 3.3V, VIN = 12V l 250 µA
(Figure 3) (H-Grade)
DE = TE = 0V, VCC = 0V or 3.3V, VIN = –7V, l –145 µA
(Figure 3) (H-Grade)
RIN Receiver Input Resistance RE = VCC or 0V, DE = TE = 0V, l 96 125 kW
VIN = –7V, –3V, 3V, 7V, 12V (Figure 3)
(C, I-Grade)
RE = VCC or 0V, DE = TE = 0V, l 48 125 kW
VIN = –7V, –3V, 3V, 7V, 12V (Figure 3)
(H-Grade)
VTH Receiver Differential Input Threshold Voltage –7V ≤ B ≤ 12V l ±0.2 V
ΔVTH Receiver Input Hysteresis B = 0V 25 mV
VOH Receiver Output High Voltage I(RO) = –4mA, A-B = 200mV, VCC = 3V l 2.4 V
VOL Receiver Output Low Voltage I(RO) = 4mA, A-B = –200mV, VCC = 3V l 0.4 V
IOZR Receiver Three-State (High Impedance) RE = VCC, 0V ≤ RO ≤ VCC (LTC2850, LTC2852) l ±1 µA
Output Current on RO
IOSR Receiver Short-Circuit Current 0V ≤ RO ≤ VCC l ±85 mA
Logic
VIH Logic Input High Voltage VCC = 3.6V l 2 V
VIL Logic Input Low Voltage VCC = 3V l 0.8 V
IINL Logic Input Current l 0 ±10 µA

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 LTC2850/LTC2851/LTC2852
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 3.3V, unless otherwise noted. (Note 2)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Supplies
ICCS Supply Current in Shutdown Mode DE = 0V, RE = VCC, l 0 5 µA
LTC2850, LTC2852 (C and I-Grade)
LTC2850, LTC2852 (H-Grade) l 0 15 µA
ICCR Supply Current in Receive Mode DE = 0V, RE = 0V (LTC2850, LTC2852) l 370 900 µA
ICCT Supply Current in Transmit Mode No Load, DE = VCC, RE = VCC (LTC2850, l 450 1000 µA
LTC2852)
ICCTR Supply Current with Both Driver and No Load, DE = VCC, RE = 0V l 450 1000 µA
Receiver Enabled

SWITCHING CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 3.3V, unless otherwise noted. (Note 2)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Driver
fMAX Maximum Data Rate (Note 3) l 20 Mbps
tPLHD, tPHLD Driver Input to Output RDIFF = 54Ω, CL = 100pF (Figure 4) l 10 50 ns
ΔtPD Driver Input to Output Difference RDIFF = 54Ω, CL = 100pF (Figure 4) l 1 6 ns
|tPLHD – tPHLD|
tSKEWD Driver Output Y to Output Z RDIFF = 54Ω, CL = 100pF (Figure 4) l 1 ±6 ns
tRD, tFD Driver Rise or Fall Time RDIFF = 54Ω, CL = 100pF (Figure 4) l 4 12.5 ns
tZLD, tZHD, Driver Enable or Disable Time RL = 500Ω, CL = 50pF, RE = 0V (Figure 5) l 70 ns
tLZD, tHZD (LTC2850, LTC2852)
tZHSD, tZLSD Driver Enable from Shutdown RL = 500Ω, CL = 50pF, RE = VCC (Figure 5) l 8 µs
(LTC2850, LTC2852)
tSHDN Time to Shutdown RL = 500Ω, CL = 50pF, (DE = ↓, RE = VCC) l 100 ns
or (DE = 0V, RE = ↑) (Figure 5) (LTC2850,
LTC2852)
Receiver
tPLHR, tPHLR Receiver Input to Output CL = 15pF, VCM = 1.5V, |VAB| = 1.5V, l 50 70 ns
tR and tF < 4ns (Figure 6)
tSKEWR Differential Receiver Skew CL = 15pF (Figure 6) l 1 6 ns
|tPLHR – tPHLR|
tRR, tFR Receiver Output Rise or Fall Time CL = 15pF (Figure 6) l 3 12.5 ns
tZLR, tZHR, Receiver Enable/Disable RL =1k, CL =15pF, DE = VCC (Figure 7) l 50 ns
tLZR, tHZR (LTC2850, LTC2852)
tZHSR, tZLSR Receiver Enable from Shutdown RL = 1k, CL = 15pF, DE = 0V (Figure 7) l 8 µs
(LTC2850, LTC2852)
Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 3: Maximum data rate is guaranteed by other measured parameters
may cause permanent damage to the device. Exposure to any Absolute and is not tested directly.
Maximum Rating condition for extended periods may affect device Note 4: This IC includes overtemperature protection that is intended
reliability and lifetime. High temperatures degrade operating lifetimes. to protect the device during momentary overload conditions.
Operating lifetime is derated at temperatures greater than 105°C. Overtemperature protection activates at a junction temperature exceeding
Note 2: All currents into device pins are positive; all currents out of device 150°C. Continuous operation above the specified maximum operating
pins are negative. All voltages are referenced to device ground unless junction temperature may result in device degradation or failure.
otherwise specified.
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LTC2850/LTC2851/LTC2852
TEST CIRCUITS
Y Y

R IOSD
GND DI + GND DI
OR DRIVER VOD OR DRIVER
VCC – VCC
R
+ +
VOC –7V TO 12V
Z – Z
–

285012 F01 285012 F02

Figure 1. Driver DC Characteristics Figure 2. Driver Output Short-Circuit Current

IIN
A OR B

+ RECEIVER
VIN
– B OR A

285012 F03

V
RIN = IN
IIN

Figure 3. Receiver Input Current and Input Resistance

VCC
DI tPLHD tPHLD
Y 0V

CL tSKEWD
DI
DRIVER RDIFF Y, Z VO 1/2 VO

CL
90% 90%
Z 285012 F04a
0 0
(Y-Z) 10% 10%
285012 F04b
tRD tFD

Figure 4. Driver Timing Measurement

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 LTC2850/LTC2851/LTC2852
TEST CIRCUITS

VCC
RL GND DE 1/2 VCC
Y
OR 0V
VCC tZLD,
CL tZLSD tLZD
VCC DI VCC
OR DRIVER VO
Y OR Z 1/2 VCC
GND 0.5V
VOL
RL VCC
DE OR
Z GND VOH 0.5V
CL 285012 F05a Z OR Y 1/2 VCC
0V
285012 F05b
tZHD, tHZD,
tZHSD tSHDN

Figure 5. Driver Enable and Disable Timing Measurements

tR tF

VAB 90% 90%

A A-B 0
±VAB/2 10% 10%
–VAB
RO tPLHR tPHLR
VCM RECEIVER
B VCC 90%
CL 90%
±VAB/2 RO VO 1/2 VCC 1/2 VCC
10% 10%
285012 F06a 0 285012 F06b
tRR tFR
tSKEWR = |tPLHR – tPHLR|

Figure 6. Receiver Propagation Delay Measurements

VCC
RE 1/2 VCC
0V
A tZLR,
0V OR VCC tZLSR tLZR
RO RL VCC VCC
RECEIVER OR VO
RO 1/2 VCC
B GND 0.5V
VCC OR 0V CL VOL
RE
VOH 0.5V
DI = 0V OR VCC RO 1/2 VCC
285012 F07a 0V
285012 F07b
tZHR,
tZHSR tHZR

Figure 7. Receiver Enable/Disable Time Measurements

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LTC2850/LTC2851/LTC2852
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C. VCC = 3.3V, unless otherwise noted.

Driver Propagation Delay

Receiver Skew vs Temperature Driver Skew vs Temperature vs Temperature
2 1.5 18
VAB = 1.5V RDIFF = 54Ω RDIFF = 54Ω
CL = 15pF CL = 100pF CL = 100pF
1.0 16

14
RECEIVER SKEW (ns)

DRIVER SKEW (ns)

1 0.5

PROP DELAY (ns)

12
0
10
0 –0.5
8

–1.0 6

–1 –1.5 4
–40 –20 0 20 40 60 80 100 120 –40 –20 0 20 40 60 80 100 120 –40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
285012 G01 285012 G02 285012 G03

Driver Output Short-Circuit Driver Output Low/High Voltage Driver Differential Output Voltage
Current vs Temperature vs Output Current vs Temperature
150 3.5 3.5
RDIFF = ∞
OUTPUT SHORT-CIRCUIT CURRENT (mA)

140 3.0 3.0

VOH
130 2.5 2.5 RDIFF = 100Ω
SINK
OUTPUT VOLTAGE (V)

OUTPUT VOLTAGE (V)

VOUT = 3.3V
120 2.0 2.0
RDIFF = 54Ω
110 1.5 1.5
VOL
100 1.0 1.0
SOURCE
90 VOUT = 0V 0.5 0.5

80 0 0
–40 –20 0 20 40 60 80 100 120 0 10 20 30 40 50 60 70 –40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C) OUTPUT CURRENT (mA) TEMPERATURE (°C)
285012 G04 285012 G05 285012 G06

Receiver Output Voltage vs Receiver Propagation Delay

Output Current (Source and Sink) vs Temperature Supply Current vs Data Rate
3.5 70 60
CL = 100pF

3.0 65 50
SOURCE
RDIFF = 54Ω
SUPPLY CURRENT (mA)

2.5 60
OUTPUT VOLTAGE (V)

40
PROP DELAY (ns)

2.0 55
30 RDIFF = 100Ω
1.5 50
20
1.0 45
RDIFF = ∞

0.5 40 10
SINK
0 35 0
0 1 2 3 4 5 6 –40 –20 0 20 40 60 80 100 120 0.1 1 10 100
OUTPUT CURRENT (mA) TEMPERATURE (°C) DATA RATE (Mbps)
285012 G07 285012 G08 285012 G09

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 LTC2850/LTC2851/LTC2852
PIN FUNCTIONS
RO: Receiver Output. If the receiver output is enabled (RE Y: Noninverting Driver Output for LTC2851 and LTC2852.
low) and A > B by 200mV, then RO will be high. If A < B High impedance when driver disabled or unpowered.
by 200mV, then RO will be low. If the receiver inputs are
Z: Inverting Driver Output for LTC2851 and LTC2852. High
open, shorted, or terminated without a valid signal, RO
impedance when driver disabled or unpowered.
will be high.
A: Noninverting Receiver Input (and Noninverting Driver
RE: Receiver Enable. A low enables the receiver. A high
Output for LTC2850). Impedance is >96kΩ in receive
input forces the receiver output into a high impedance state. mode or unpowered.
DE: Driver Enable. A high on DE enables the driver. A low
B: Inverting Receiver Input (and Inverting Driver Output
input will force the driver outputs into a high impedance.
for LTC2850). Impedance is >96kΩ in receive mode or
If RE is high with DE low, the part will enter a low power
unpowered.
shutdown state.
VCC: Positive Supply. 3V ≤ VCC ≤ 3.6V. Bypass with 0.1µF
DI: Driver Input. If the driver outputs are enabled (DE ceramic capacitor.
high), then a low on DI forces the driver positive output
low and negative output high. A high on DI, with the driver Exposed Pad: Ground. The exposed pads on the DFN
outputs enabled, forces the driver positive output high and packages must be soldered to ground.
negative output low. NC: Not connected internally for LTC2852 in SO-14
GND: Ground. package.

FUNCTION TABLES
LTC2850
Logic Inputs
Mode A, B RO
DE RE
0 0 Receive RIN Driven
0 1 Shutdown RIN Hi-Z
1 0 Transceive Driven Driven
1 1 Transmit Driven Hi-Z

LTC2852
Logic Inputs
Mode A, B Y, Z RO
DE RE
0 0 Receive RIN Hi-Z Driven
0 1 Shutdown RIN Hi-Z Hi-Z
1 0 Transceive RIN Driven Driven
1 1 Transmit RIN Driven Hi-Z

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LTC2850/LTC2851/LTC2852
BLOCK DIAGRAM
LTC2850 LTC2851

VCC VCC

A
(15kV)
RO RECEIVER RO RECEIVER
B
(15kV)
A
RE (15kV)
SLEEP/SHUTDOWN
LOGIC AND DELAY
DE B
(15kV)
Z
(15kV)

DI DRIVER DI DRIVER

Y
(15kV)

285012 BDa 285012 BDb

GND GND

LTC2852

VCC

A
(15kV)
RO RECEIVER
B
(15kV)

RE
SLEEP/SHUTDOWN
LOGIC AND DELAY
DE

Z
(15kV)
DI DRIVER

Y
(15kV)

285012 BDc

GND

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 LTC2850/LTC2851/LTC2852
APPLICATIONS INFORMATION
Driver are either shorted, left open, or terminated but not driven.
The driver provides full RS485/RS422 compatibility. When This failsafe feature is guaranteed to work for inputs
enabled, if DI is high, Y-Z is positive for the full-duplex spanning the entire common mode range of –7V to 12V.
devices (LTC2851, LTC2852) and A-B is positive for the The receiver output is internally driven high (to VCC) or
half-duplex device (LTC2850). low (to ground) with no external pull-up needed. When the
When the driver is disabled, both outputs are high im- receiver is disabled the RO pin becomes Hi-Z with leakage
pedance. For the full-duplex devices, the leakage on the of less than ±1µA for voltages within the supply range.
driver output pins is guaranteed to be less than 10µA
over the entire common mode range of –7V to 12V. On Receiver Input Resistance
the half-duplex LTC2850, the impedance is dominated by The receiver input resistance from A or B to ground is
the receiver input resistance, RIN. guaranteed to be greater than 96k (C-, I-grade). This is 8x
higher than the requirements for the RS485 standard and
Driver Overvoltage and Overcurrent Protection thus this receiver represents a one-eighth unit load. This,
The driver outputs are protected from short-circuits in turn, means that 8x the standard number of receivers,
to any voltage within the Absolute Maximum range of or 256 total, can be connected to a line without loading
(VCC – 15V) to 15V. The typical peak current in this con- it beyond what is specified in the RS485 standard. The
dition does not exceed 180mA. receiver input resistance from A or B to ground on high
temperature H-grade parts is greater than 48k providing
If a high driver output is shorted to a voltage just above
a one-quarter unit load. The high input resistance of the
VCC, a reverse current will flow into the supply. When
receiver is maintained whether it is enabled or disabled,
this voltage exceeds VCC by about 1.4V, the reverse
powered or unpowered.
current turns off. Preventing the driver from turning off
with outputs shorted to output voltages just above VCC Supply Current
keeps the driver active even for receiver loads that have
a positive common mode with respect to the driver— The unloaded static supply currents in these devices are
a valid condition. very low, typically under 500µA for all modes of opera-
tion. In applications with resistively terminated cables,
The worst-case peak reverse short-circuit current can be as the supply current is dominated by the driver load. For
high as 300mA in extreme cold conditions. If this current example, when using two 120Ω terminators with a dif-
can not be absorbed by the supply, a 3.6V Zener diode can ferential driver output voltage of 2V, the DC load current
be added in parallel with the supply to sink this current. is 33mA, which is sourced by the positive voltage supply.
All devices also feature thermal shutdown protection that Power supply current increases with toggling data due to
disables the driver and receiver in case of excessive power capacitive loading and this term can increase significantly
dissipation (see Note 4 in the Electrical Characteristics at high data rates. Figure 13 shows supply current vs
section). data rate for two different capacitive loads for the circuit
configuration of Figure 4.
Receiver and Failsafe
High Speed Considerations
With the receiver enabled, when the absolute value of
the differential voltage between the A and B pins is A ground plane layout is recommended. A 0.1µF bypass
greater than 200mV, the state of RO will reflect the capacitor less than one-quarter inch away from the VCC pin
polarity of (A-B) is also recommended. The PC board traces connected to
signals A/B and Z/Y should be symmetrical and as short
These parts have a failsafe feature that guarantees the
as possible to maintain good differential signal integrity.
receiver output to be in a logic-high state when the inputs
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LTC2850/LTC2851/LTC2852
APPLICATIONS INFORMATION
80
RDIFF = 54Ω
Cable Length vs Data Rate
70 For a given data rate, the maximum transmission distance
is bounded by the cable properties. A curve of cable length
SUPPLY CURRENT (mA)

60 CL = 1000pF
vs data rate compliant with the RS485/RS422 standards
50 is shown in Figure 14. Three regions of this curve reflect
different performance limiting factors in data transmis-
40
CL = 100pF sion. In the flat region of the curve, maximum distance
30
is determined by resistive losses in the cable. The down-
ward sloping region represents limits in distance and
20
0.1 1 10 100
data rate due to AC losses in the cable. The solid vertical
DATA RATE (Mbps)
285012 F13
line represents the specified maximum data rate in the
RS485/RS422 standards. The dashed lines at 20Mbps
Figure 13. Supply Current vs Data Rate show the maximum data rates of the LTC2850, LTC2851
and LTC2852.
To minimize capacitive effects, the differential signals
should be separated by more than the width of a trace 10k
and should not be routed on top of each other if they are
on different signal planes.
Care should be taken to route outputs away from any
CABLE LENGTH (FT)

1k
LTC2850/
sensitive inputs to reduce feedback effects that might LTC2851/LTC2852
MAX DATA RATE
cause noise, jitter, or even oscillations. For example, in
the full-duplex devices, DI and A/B should not be routed 100
near the driver or receiver outputs.
RS485/RS422
The logic inputs have 150mV of hysteresis to provide noise MAX DATA RATE

immunity. Fast edges on the outputs can cause glitches in 10

10k 100k 1M 10M 100M
the ground and power supplies which are exacerbated by DATA RATE (bps)
285012 F14

capacitive loading. If a logic input is held near its threshold

(typically 1.5V), a noise glitch from a driver transition may Figure 14. Cable Length vs Data Rate
(RS485/RS422 Standard Shown in Solid Line)
exceed the hysteresis levels on the logic and data input
pins causing an unintended state change. This can be
avoided by maintaining normal logic levels on the pins
and by slewing inputs through their thresholds by faster
than 1V/µs when transitioning. Good supply decoupling
and proper driver termination also reduce glitches caused
by driver transitions.

285012fe

12 For more information www.linear.com/LTC2850

 LTC2850/LTC2851/LTC2852
TYPICAL APPLICATIONS
Failsafe “0” Application (Idle State = Logic “0”)

VCC

100k

RO I1 R B
“A”

A
“B”
DI I2 D

LTC2850 285012 TA02

Multinode Network with End Termination Using the LTC2850 and LTC2854

R D R D

LTC2850 LTC2850

R R

TE = 3.3V TE = 3.3V

D D

LTC2854 LTC2854
285012 TA03

285012fe

For more information www.linear.com/LTC2850 13

LTC2850/LTC2851/LTC2852
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)

0.70 ±0.05

3.5 ±0.05 1.65 ±0.05

2.10 ±0.05 (2 SIDES)

PACKAGE
OUTLINE

0.25 ± 0.05
0.50
BSC
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.125 0.40 ± 0.10
TYP
5 8

3.00 ±0.10 1.65 ± 0.10

(4 SIDES) (2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
(DD8) DFN 0509 REV C

4 1
0.200 REF 0.75 ±0.05 0.25 ± 0.05
0.50 BSC
2.38 ±0.10
0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD

NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE

DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
R = 0.125 0.40 ± 0.10
TYP
6 10
0.70 ±0.05

3.55 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10

2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 NOTCH
PIN 1 R = 0.20 OR
PACKAGE TOP MARK 0.35 × 45°
OUTLINE (SEE NOTE 6) CHAMFER
(DD) DFN REV C 0310

5 1
0.25 ± 0.05 0.200 REF 0.75 ±0.05 0.25 ± 0.05
0.50 0.50 BSC
BSC 2.38 ±0.10
2.38 ±0.05 (2 SIDES)
0.00 – 0.05
(2 SIDES) BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
2. DRAWING NOT TO SCALE 5. EXPOSED PAD SHALL BE SOLDER PLATED
3. ALL DIMENSIONS ARE IN MILLIMETERS 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
285012fe

14 For more information www.linear.com/LTC2850

 LTC2850/LTC2851/LTC2852
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev G)

3.00 ±0.102
(.118 ±.004) 0.52
(NOTE 3) 8 7 6 5 (.0205)
REF

0.889 ±0.127 3.00 ±0.102

4.90 ±0.152
(.035 ±.005) DETAIL “A” (.118 ±.004)
0.254 (.193 ±.006)
(NOTE 4)
(.010)
0° – 6° TYP
GAUGE PLANE
5.10
(.201) 3.20 – 3.45 1 2 3 4
MIN (.126 – .136) 0.53 ±0.152
(.021 ±.006) 1.10 0.86
(.043) (.034)
DETAIL “A” MAX REF
0.42 ± 0.038 0.65 0.18
(.0165 ±.0015) (.0256) (.007)
TYP BSC SEATING
RECOMMENDED SOLDER PAD LAYOUT PLANE 0.22 – 0.38 0.1016 ±0.0508
NOTE: (.009 – .015) (.004 ±.002)
1. DIMENSIONS IN MILLIMETER/(INCH) TYP 0.65 MSOP (MS8) 0213 REV G
2. DRAWING NOT TO SCALE (.0256)
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. BSC
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev F)
3.00 ±0.102
(.118 ±.004) 0.497 ±0.076
(NOTE 3) (.0196 ±.003)
10 9 8 7 6
REF

4.90 ±0.152 3.00 ±0.102

0.889 ±0.127 DETAIL “A” (.193 ±.006) (.118 ±.004)
(.035 ±.005) 0.254 (NOTE 4)
(.010)
0° – 6° TYP
GAUGE PLANE
5.10 1 2 3 4 5
(.201) 3.20 – 3.45
(.126 – .136) 0.53 ±0.152
MIN (.021 ±.006) 1.10 0.86
(.043) (.034)
DETAIL “A” REF
MAX
0.18
0.305 ±0.038 0.50
(.0120 ±.0015) (.0197) (.007)
TYP BSC SEATING
RECOMMENDED SOLDER PAD LAYOUT PLANE 0.17 – 0.27 0.1016 ±0.0508
NOTE: (.007 – .011) (.004 ±.002)
0.50
1. DIMENSIONS IN MILLIMETER/(INCH) TYP MSOP (MS) 0213 REV F
(.0197)
2. DRAWING NOT TO SCALE BSC
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
285012fe

For more information www.linear.com/LTC2850 15

LTC2850/LTC2851/LTC2852
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)

.189 – .197
.045 ±.005 (4.801 – 5.004)
.050 BSC NOTE 3
8 7 6 5

.245
MIN .160 ±.005
.150 – .157
.228 – .244
(3.810 – 3.988)
(5.791 – 6.197)
NOTE 3

.030 ±.005
TYP
1 2 3 4
RECOMMENDED SOLDER PAD LAYOUT

.010 – .020
× 45° .053 – .069
(0.254 – 0.508)
(1.346 – 1.752)
.004 – .010
.008 – .010
0°– 8° TYP (0.101 – 0.254)
(0.203 – 0.254)

.016 – .050
.014 – .019 .050
(0.406 – 1.270)
(0.355 – 0.483) (1.270)
NOTE: TYP BSC
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 REV G 0212

4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE

S Package
14-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)

.337 – .344
.045 ±.005 (8.560 – 8.738)
.050 BSC NOTE 3
14 13 12 11 10 9 8
N

N
.245
MIN .160 ±.005
.228 – .244 .150 – .157
(5.791 – 6.197) (3.810 – 3.988)
NOTE 3
1 2 3 N/2 N/2

.030 ±.005
TYP RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7

.010 – .020
× 45 .053 – .069
(0.254 – 0.508)
(1.346 – 1.752)
.008 – .010 .004 – .010
(0.203 – 0.254) 0° – 8° TYP (0.101 – 0.254)

.016 – .050 .014 – .019 .050

(0.406 – 1.270) (0.355 – 0.483) (1.270)
TYP BSC
NOTE: S14 REV G 0212
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
285012fe

16 For more information www.linear.com/LTC2850

 LTC2850/LTC2851/LTC2852
REVISION HISTORY (Revision history begins at Rev D)

REV DATE DESCRIPTION PAGE NUMBER

D 05/10 Added military grade parts 2, 3
E 06/15 Added IOZD parameter for H-grade 4
Updated Package descriptions 14 to 16

285012fe

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
Forof more
that the interconnection information
its circuits www.linear.com/LTC2850
as described herein will not infringe on existing patent rights. 17
LTC2850/LTC2851/LTC2852
TYPICAL APPLICATION
SLAVE SLAVE
LTC2852 LTC2852

R D R D

MASTER SLAVE
120Ω

R D

TE = 3.3V

TE = 3.3V

D R

LTC2855 LTC2855
285012 TA04

Full Duplex Network Using the LTC2852 and LTC2855

RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTC485 Low Power RS485 Interface Transceiver ICC = 300µA (Typ)
LTC491 Differential Driver and Receiver Pair ICC = 300µA
LTC1480 3.3V Ultralow Power RS485 Transceiver 3.3V Operation
LTC1483 Ultralow Power RS485 Low EMI Transceiver Controlled Driver Slew Rate
LTC1485 Differential Bus Transceiver 10Mbps Operation
LTC1487 Ultralow Power RS485 with Low EMI, Shutdown and High Input Up to 256 Transceiver on the Bus
Impedance
LTC1520 50Mbps Precision Quad Line Receiver Channel-to-Channel Skew 400ps (Typ)
LTC1535 Isolated RS485 Full-Duplex Transceiver 2500VRMS Isolation in Surface Mount Package
LTC1685 52Mbps RS485 Transceiver with Precision Delay Propagation Delay Skew 500ps (Typ)
LT1785 60V Fault Protected RS485 Transceiver 60V Tolerant, 15kV ESD
LTC2854/LTC2855 3.3V 20Mbps RS485/RS422 Transceivers with Integrated Switchable 3.3V Operation, Integrated, Switchable, 120Ω Termination
Termination Resistor, 25kV ESD (LTC2854), 15kV ESD (LTC2855)
LTC2856-1 20Mbps and Slew Rate-Limited, 15kV RS485/RS422 Transceiver 15kV ESD
LTC2859/LTC2861 20Mbps RS485/RS422 Transceiver with Integrated Switchable Integrated, Switchable, 120Ω Termination Resistor, 15kV ESD
Termination
LTC2862/LTC2865 ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceivers 20Mbps, Protected from Overvoltage Line Faults to ±60V,
15kV ESD
LTM 2881
®
Complete Isolated RS485/RS422 µModule Transceiver + Power
®
2500VRMS Isolation in Surface Mount BGA or LGA

285012fe

18 Linear Technology Corporation

LT 0615 REV E • PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417

For more information www.linear.com/LTC2850
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC2850  LINEAR TECHNOLOGY CORPORATION 2007
Mouser Electronics

Authorized Distributor

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LTC2852CS#PBF LTC2852HDD#TRPBF LTC2852IDD#PBF LTC2852HMS#TRPBF