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S1
216 ADS1216
www.ti.com SBAS171D – NOVEMBER 2000 – REVISED SEPTEMBER 2006
8-Channel, 24-Bit
ANALOG-TO-DIGITAL CONVERTER
FEATURES DESCRIPTION
• 24 BITS, NO MISSING CODES The ADS1216 is a precision, wide dynamic range,
• 0.0015% INL delta-sigma, Analog-to-Digital (A/D) converter with
• 22 BITS EFFECTIVE RESOLUTION 24-bit resolution operating from 2.7V to 5.25V
supplies. The delta-sigma A/D converter provides up
(PGA = 1), 19 BITS (PGA = 128)
to 24 bits of no-missing-code performance and an
• PGA FROM 1 TO 128 effective resolution of 22 bits.
• SINGLE-CYCLE SETTLING MODE The eight input channels are multiplexed. Internal
• PROGRAMMABLE DATA OUTPUT RATES: buffering can be selected to provide a very high input
up to 1kHz impedance for direct connection to transducers or
• ON-CHIP 1.25V/2.5V REFERENCE low-level voltage signals. Burnout current sources
are provided that allow for the detection of an open
• EXTERNAL DIFFERENTIAL REFERENCE: or shorted sensor. An 8-bit Digital-to-Analog
0.1V to 2.5V Converter (DAC) provides an offset correction with a
• ON-CHIP CALIBRATION range of 50% of the FSR (Full-Scale Range).
• SPI™-COMPATIBLE The PGA (Programmable Gain Amplifier) provides
• 2.7V TO 5.25V selectable gains of 1 to 128 with an effective
• < 1mW POWER CONSUMPTION resolution of 19 bits at a gain of 128. The A/D
conversion is accomplished with a second-order
delta-sigma modulator and programmable sinc filter.
APPLICATIONS The reference input is differential and can be used
• INDUSTRIAL PROCESS CONTROL for ratiometric cancellation. The onboard current
• LIQUID/GAS CHROMATOGRAPHY DACs operate independently with the maximum
• BLOOD ANALYSIS current set by an external resistor.
• SMART TRANSMITTERS The serial interface is SPI-compatible. Eight bits of
• PORTABLE INSTRUMENTATION digital I/O are also provided that can be used for
• WEIGHT SCALES input or output. The ADS1216 is designed for
high-resolution measurement applications in smart
• PRESSURE TRANSDUCERS
transmitters, industrial process control, weight
scales, chromatography, and portable
instrumentation.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ADS1216
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SBAS171D – NOVEMBER 2000 – REVISED SEPTEMBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)

ADS1216 UNIT
AVDD to AGND –0.3 to +6 V
DVDD to DGND –0.3 to +6 V
Input Current 100, Momentary mA
Input Current 10, Continuous mA
AIN GND – 0.5 to AVDD + 0.5 V
AVDD to DVDD –6 to +6 V
AGND to DGND –0.3 to +0.3 V
Digital Input Voltage to GND –0.3 to DVDD + 0.3 V
Digital Output Voltage to GND –0.3 to DVDD + 0.3 V
Maximum Junction Temperature +150 °C
Operating Temperature Range –40 to +85 °C
Storage Temperature Range –60 to +100 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
2 Submit Documentation Feedback

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ELECTRICAL CHARACTERISTICS: AVDD = +5V

All specifications at TMIN to TMAX, AVDD = +5V, DVDD = +2.7V to +5.25V, fMOD = 19.2kHz, PGA = 1, Buffer ON, RDAC = 150kΩ,
fDATA = 10Hz, and VREF = +2.5V, unless otherwise specified.
ADS1216
PARAMETER CONDITIONS MIN TYP MAX UNIT
ANALOG INPUT (AIN0 – AIN7, AINCOM)
Analog input range Buffer OFF AGND – 0.1 AVDD + 0.1 V
Buffer ON AGND + 0.05 AVDD – 1.5 V
Full-scale input voltage range (In+) – (In–); see Functional Block ±VREF/PGA V
Diagram
Differential input impedance Buffer OFF 5/PGA MΩ
Input current Buffer ON 0.5 nA
Bandwidth
Fast-settling filter –3dB 0.469 × fDATA Hz
Sinc2 filter –3dB 0.318 × fDATA Hz

Programmable gain amplifier User-selectable gain ranges 1 128
Input capacitance 9 pF
Input leakage current Modulator OFF, TA = +25°C 5 pA
Burnout current sources 2 µA
OFFSET DAC
Offset DAC range ±VREF /(2 × PGA) V
Offset DAC monotonicity 8 Bits
Offset DAC gain error ±10 %
Offset DAC gain error drift 1 ppm/°C
SYSTEM PERFORMANCE
Resolution 24 Bits
No missing codes Sinc3 filter 24 Bits
Integral nonlinearity End-point fit ±0.0015 % of FS
Offset error (1) 7.5 ppm of FS
Offset drift (1) 0.02 ppm of FS/°C
Gain error (1) 0.005 %
Gain error drift (1) 0.5 ppm/°C
Common-mode rejection At DC 100 dB
fCM = 60Hz, fDATA = 10Hz 130 dB
Normal-mode rejection fSIG = 50Hz, fDATA = 50Hz 100 dB
fSIG = 60Hz, fDATA = 60Hz 100 dB
Output noise See Typical Characteristics
Power-supply rejection At DC, dB = –20 log(∆VOUT/∆VDD) (2) 80 95 dB
VOLTAGE REFERENCE INPUT
Reference input range REF IN+, REF IN– AGND AVDD V
VREF VREF ≡ (REF IN+) – (REF IN–) 0.1 2.5 2.6 V
Common-mode rejection at DC 120 dB
Common-mode rejection fVREFCM = 60Hz, fDATA = 60Hz 120 dB
Bias current (3) VREF = 2.5V 1.3 µA
(1) Calibration can minimize these errors.

(2) ∆ VOUT is change in digital result.
(3) 12pF switched capacitor at fSAMP clock frequency.
Submit Documentation Feedback 3

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ELECTRICAL CHARACTERISTICS: AVDD = +5V (continued)

ADS1216
ON-CHIP VOLTAGE REFERENCE
Output voltage REF HI = 1 2.4 2.5 2.6 V
REF HI = 0 1.25 V
Short-circuit current source 8 mA
Short-circuit current sink 50 µA
Short-circuit duration Sink or source Indefinite
Drift 15 ppm/°C
Noise VRCAP = 0.1µF, BW = 0.1Hz to 100Hz 10 µVPP
Output impedance Sourcing 100µA 3 Ω
Startup time 50 µs
IDAC
Full-scale output current RDAC = 150kΩ, range = 1 0.5 mA
RDAC = 150kΩ, range = 2 1 mA
Maximum short-circuit current duration RDAC = 10kΩ Indefinite
RDAC = 0kΩ 10 Minute
Monotonicity RDAC = 150kΩ 8 Bits
Compliance voltage 0 AVDD – 1 V
Output impedance See Typical Characteristics
Power-supply rejection ratio VOUT = AVDD/2 400 ppm/V
Absolute error Individual IDAC 5 %
Absolute drift Individual IDAC 75 ppm/°C
Mismatch error Between IDACs, same range and code 0.25 %
Mismatch drift Between IDACs, same range and code 15 ppm/°C
POWER-SUPPLY REQUIREMENTS
Power-supply voltage AVDD 4.75 5.25 V
Analog current (IADC + IVREF + IDAC) PDWN = 0 or SLEEP 1 nA
ADC current (IADC) PGA = 1, buffer OFF 140 225 µA
PGA = 128, buffer OFF 430 650 µA
PGA = 1, buffer ON 180 275 µA
VREF current (IVREF) 250 375 µA
IDAC current (IDAC) Excludes load current 480 675 µA
Digital current Normal mode, DVDD = 5V 180 275 µA
SLEEP mode, DVDD = 5V 150 µA
Read data continuous mode, DVDD = 5V 230 µA
PDWN 1 nA
PGA = 1, buffer OFF, REFEN = 0,
Power dissipation 1.6 2.5 mW
IDACS OFF, DVDD = 5V
TEMPERATURE RANGE
Operating –40 +85 °C
Storage –60 +100 °C

ADS1216
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ELECTRICAL CHARACTERISTICS: AVDD = +3V

ADS1216
ANALOG INPUT (AIN0 – AIN7, AINCOM)
Analog input range Buffer OFF AGND – 0.1 AVDD + 0.1 V
Buffer ON AGND + 0.05 AVDD – 1.5 V
Full-scale input voltage range (In+) – (In–); see Functional Block ±VREF/PGA V
Diagram
Input impedance Buffer OFF 5/PGA MΩ
Input current Buffer ON 0.5 nA
Bandwidth
Fast-settling filter –3dB 0.469 × fDATA Hz

Programmable gain amplifier User-selectable gain ranges 1 128
Input capacitance 9 pF
Input leakage current Modulator OFF, TA = +25°C 5 pA
Burnout current sources 2 µA
OFFSET DAC
Offset DAC range ±VREF /(2 × PGA) V
Offset DAC monotonicity 8 Bits
Offset DAC gain error ±10 %
Offset DAC gain error drift 2 ppm/°C
SYSTEM PERFORMANCE
Resolution 24 Bits
No missing codes Sinc3 filter 24 Bits
Integral nonlinearity End-point fit ±0.0015 % of FS
Offset error (1) 15 ppm of FS
Offset drift (1) 0.04 ppm of FS/°C
Gain error (1) 0.010 %
Gain error drift (1) 1.0 ppm/°C
Common-mode rejection At DC 100 dB
Normal-mode rejection fSIG = 50Hz, fDATA = 50Hz 100 dB
fSIG = 60Hz, fDATA = 60Hz 100 dB
Output noise See Typical Characteristics
Power-supply rejection At DC, dB = –20 log(∆VOUT/∆VDD) (2) 75 90 dB
VOLTAGE REFERENCE INPUT
Reference input range REF IN+, REF IN– 0 AVDD V
VREF VREF ≡ (REF IN+) – (REF IN–) 0.1 1.25 1.3 V
Common-mode rejection at DC 120 dB
Common-mode rejection fVREFCM = 60Hz, fDATA = 60Hz 120 dB
Bias current (3) VREF = 1.25V 0.65 µA
(1) Calibration can minimize these errors.

(2) ∆ VOUT is change in digital result.
(3) 12pF switched capacitor at fSAMP clock frequency.

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ELECTRICAL CHARACTERISTICS: AVDD = +3V (continued)

ADS1216
ON-CHIP VOLTAGE REFERENCE
Output voltage REF HI = 0 1.2 1.25 1.3 V
Short-circuit current source 3 mA
Short-circuit current sink 50 µA
Short-circuit duration Sink or source Indefinite
Drift 15 ppm/°C
Noise VRCAP = 0.1µF, BW = 0.1Hz to 100Hz 10 µVPP
Output impedance Sourcing 100µA 3 Ω
Startup time 50 µs
IDAC
Full-scale output current RDAC = 75kΩ, range = 1 0.5 mA
Maximum short-circuit current duration RDAC = 10kΩ Indefinite
RDAC = 0kΩ 10 Minute
Monotonicity RDAC = 75kΩ 8 Bits
Compliance voltage 0 AVDD – 1 V
Output impedance See Typical Characteristics
Power-supply rejection ratio VOUT = AVDD/2 600 ppm/V
Absolute error Individual IDAC 5 %
Absolute drift Individual IDAC 75 ppm/°C
Mismatch error Between IDACs, same range and code 0.25 %
Mismatch drift Between IDACs, same range and code 15 ppm/°C
POWER-SUPPLY REQUIREMENTS
Power-supply voltage AVDD 2.7 3.3 V
Analog current (IADC + IVREF + IDAC) PDWN = 0 or SLEEP 1 nA
ADC current (IADC) PGA = 1, buffer OFF 120 200 µA
PGA = 128, buffer OFF 370 600 µA
VREF current (IVREF) 250 375 µA
IDAC current (IDAC) Excludes load current 480 675 µA
Digital current Normal mode, DVDD = 3V 90 200 µA
SLEEP mode, DVDD = 3V 75 µA
Read data continuous mode, DVDD = 3V 113 µA
PDWN = 0 1 nA
PGA = 1, buffer OFF, REFEN = 0,
Power dissipation 0.6 1.2 mW
IDACS OFF, DVDD = 3V
TEMPERATURE RANGE
Operating –40 +85 °C
Storage –60 +100 °C

ADS1216
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DIGITAL CHARACTERISTICS: TMIN to TMAX, DVDD +2.7V to +5.25V

ADS1216
Digital input/output
Logic family CMOS
Logic level: VIH 0.8 × DVDD DVDD V
Logic level: VIL DGND 0.2 × DVDD V
Logic level: VOH IOH = 1mA DVDD – 0.4 V
Logic level: VOL IOL = 1mA DGND DGND + 0.4 V
Input leakage: IIH VI = DVDD 10 µA
Input leakage: IIL VI = 0 –10 µA
Master clock rate: fOSC 1 5 MHz
Master clock period: tOSC 1/fOSC 200 1000 ns
FUNCTIONAL BLOCK DIAGRAM
AGND AVDD RDAC VREFOUT VRCAP VREF+ VREF- XIN XOUT
8-Bit
IDAC2
IDAC
Clock Generator
1.25V or
2.5V
8-Bit
IDAC1 Reference
AVDD IDAC
2m A
Offset
DAC
AIN0
AIN1 A = 1:128
IN+ Registers
AIN2
Programmable
AIN3 2nd-Order
MUX BUF + PGA Digital Controller
IN- Modulator
AIN4 Filter
AIN5 RAM
AIN6
AIN7
AINCOM
POL
SCLK
2m A Serial Interface
Digital I/O DIN
Interface DOUT
AGND CS
DVDD DGND BUFEN D0 ... D7 PDWN DSYNC RESET DRDY

ADS1216
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TIMING CHARACTERISTICS
CS
t3 t1 t2 t10
SCLK
(POL = 0)
SCLK
(POL = 1)
t4 t5 t6 t2
t11
DIN MSB LSB
t7 t8 t9
(Command or Command and Data)
DOUT (1) (1)
MSB LSB
NOTE: (1) Bit Order = 0.
SPEC DESCRIPTION MIN MAX UNITS

SCLK period 4 tOSC periods
t1
3 DRDY periods
t2 SCLK pulse width, HIGH and LOW 200 ns
t3 CS LOW to first SCLK edge; setup time 0 ns
t4 DIN valid to SCLK edge; setup time 50 ns
t5 Valid DIN to SCLK edge; hold time 50 ns
Delay between last SCLK edge for DIN and first SCLK edge for DOUT:
RDATA, RDATAC, RREG, WREG, RRAM, WRAM 50 tOSC periods
t6
CSREG, CSRAMX, CSRAM 200 tOSC periods
CSARAM, CSARAMX 1100 tOSC periods
t7 SCLK edge to valid new DOUT 50 ns
t8 SCLK edge to DOUT, hold time 0 ns
Last SCLK edge to DOUT tri-state
t9 6 10 tOSC periods
NOTE: DOUT goes tri-state immediately when CS goes HIGH.
t10 CS LOW time after final SCLK edge 16 tOSC periods
Final SCLK edge of one op code until first edge SCLK of next command:
RREG, WREG, RRAM, WRAM, CSRAMX, CSARAMX, CSRAM,
4 tOSC periods
CSARAM, CSREG, SLEEP, RDATA, RDATAC, STOPC
CREG, CRAM 220 tOSC periods
t11
CREGA 1600 tOSC periods
SELFGCAL, SELFOCAL, SYSOCAL, SYSGCAL 7 DRDY periods
SELFCAL 14 DRDY periods
RESET (Command, SCLK or Pin), DSYNC 16 tOSC periods

ADS1216
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ADS1216
SCLK Reset Waveform
Resets On
Falling Edge
t13 t13
SCLK
t12 t14 t15
t16
t17A
RESET, DSYNC, PDWN
DRDY
t17B
SPEC DESCRIPTION MIN MAX UNITS

t13 5 tOSC periods
t16 Pulse width 4 tOSC periods
t17A DOR data not valid during this update period 4 tOSC periods
t17B DOR data not valid during this update period 12 tOSC periods
DEVICE INFORMATION
DSYNC
PDWN
DGND
DRDY
DVDD
SCLK
DOUT
XOUT
POL
DIN
XIN
CS
36 35 34 33 32 31 30 29 28 27 26 25
D0 37 24 RESET
D1 38 23 BUFEN
D2 39 22 DGND
D3 40 21 DGND
D4 41 20 DGND
D5 42 19 DGND
ADS1216
D6 43 18 DGND
D7 44 17 RDAC
AGND 45 16 IDAC2
VREFOUT 46 15 IDAC1
VREF+ 47 14 VRCAP
VREF- 48 13 AVDD
1 2 3 4 5 6 7 8 9 10 11 12
AIN1
AGND
AGND
AIN2
AIN3
AIN5
AIN7
AIN4
AIN6
AIN0
AVDD
AINCOM

ADS1216
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DEVICE INFORMATION (continued)

TERMINAL FUNCTIONS
PIN NUMBER NAME DESCRIPTION
1, 13 AVDD Analog power supply
2, 12, 45 AGND Analog ground
3–10 AIN0–7 Analog input 0–7
11 AINCOM Analog input common
14 VRCAP VREF bypass capcitor
15 IDAC1 Current DAC1 output
16 IDAC2 Current DAC2 output
17 RDAC Current DAC resistor
18–22, 30 DGND Digital ground
23 BUFEN Buffer enable
24 RESET Active LOW; resets the entire chip.
25 XIN Clock input
26 XOUT Clock output, used with crystal or resonator.
27 PDWN Active LOW; power down. The power-down function shuts down the analog and digital circuits.
28 POL Serial clock polarity
29 DSYNC Active LOW; synchronization control
31 DVDD Digital power supply
32 DRDY Active LOW; data ready
33 CS Active LOW; chip select
34 SCLK Serial clock, Schmitt trigger
35 DIN Serial data input, Schmitt trigger
36 DOUT Serial data output
37–44 D0–D7 Digital I/O 0–7
46 VREFOUT Voltage reference output
47 VREF+ Positive differential reference input
48 VREF– Negative differential reference input

ADS1216
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TYPICAL CHARACTERISTICS
At AVDD = +5V, DVDD = +5V, fOSC = 2.4576MHz, PGA = 1, RDAC = 150kΩ, fDATA = 10Hz, and VREF = +2.5V, unless otherwise specified.
EFFECTIVE NUMBER OF BITS EFFECTIVE NUMBER OF BITS

vs DECIMATION RATIO vs DECIMATION RATIO
22 PGA8
22 PGA8
PGA1 PGA2 PGA4 PGA2 PGA4
21 21 PGA1
20 20
19 19
ENOB (rms)
ENOB (rms)
18 18
PGA32 PGA64 PGA128
PGA16
17 17
PGA32 PGA64 PGA128
16 16
PGA16
15 15
14 3 14
Sinc Filter
13 13 3
Sinc Filter, Buffer ON
12 12
0 500 1000 1500 2000 0 500 1000 1500 2000
Decimation Ratio = fMOD/fDATA Decimation Ratio = fMOD/fDATA
Figure 1. Figure 2.
EFFECTIVE NUMBER OF BITS EFFECTIVE NUMBER OF BITS

vs DECIMATION RATIO vs DECIMATION RATIO
22 PGA8
22
PGA1 PGA2 PGA4 PGA2 PGA4 PGA8
21 21 PGA1
20 20
19 19
ENOB (rms)
ENOB (rms)
18 18
17 PGA32
17
PGA16 PGA64 PGA128
16 16
PGA32 PGA64 PGA128
PGA16
15 15
14 14
13 3 13 3
Sinc Filter, VREF = 1.25V, BUFFER OFF Sinc Filter, VREF = 1.25, BUFFER ON
12 12
0 500 1000 1500 2000 0 500 1000 1500 2000
Decimation Ratio = fMOD/fDATA Decimation Ratio
Figure 3. Figure 4.
EFFECTIVE NUMBER OF BITS FAST-SETTLING FILTER

vs DECIMATION RATIO EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO
22 22
PGA2 PGA4 PGA8
21 PGA1
21
20 20
19 19
ENOB (rms)
ENOB (rms)
18 18
17 17
PGA32 PGA16 PGA64
PGA128
16 16
15 15
14 2 14
Sinc Filter
13 13
Fast-Settling Filter
12 12
0 500 1000 1500 2000 0 500 1000 1500 2000
Decimation Ratio = fMOD/fDATA Decimation Ratio = fMOD/fDATA
Figure 5. Figure 6.

ADS1216
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TYPICAL CHARACTERISTICS (continued)

NOISE vs INPUT SIGNAL CMRR vs FREQUENCY

0.8 130
120
0.7
110
Noise (rms, ppm of FS)
0.6 100
90
0.5
CMRR (dB)
80
70
0.4
60
0.3 50
40
0.2
30
0.1 20
10
0 0
-2.5 -1.5 -0.5 0.5 1.5 2.5 1 10 100 1k 10k 100k
VIN (V) Frequency of CM Signal (Hz)
Figure 7. Figure 8.
PSRR vs FREQUENCY OFFSET vs TEMPERATURE

120 50
110 PGA1 PGA16
100
0
90
Offset (ppm of FS)
80
PSRR (dB)
70 -50
60
50 PGA64
-100
40
30 PGA128
-150
20
10
0 -200
1 10 100 1k 10k 100k -50 -30 -10 10 30 50 70 90
Frequency of Power Supply (Hz) Temperature (°C)
Figure 9. Figure 10.
GAIN vs TEMPERATURE INTEGRAL NONLINEARITY vs INPUT SIGNAL

1.00010 10
8
1.00006 -40°C
6
Gain (Normalized)
4
INL (ppm of FS)
1.00002 +85°C
2
0.99998 0
-2
0.99994
-4
+25°C
-6
0.99990
-8
0.99986 -10
-50 -30 -10 10 30 50 70 90 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5
Temperature (°C) VIN (V)

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CURRENT vs TEMPERATURE ADC CURRENT vs PGA

250 900
IDIGITAL AVDD = 5V, Buffer = ON
800
200 Buffer = OFF
700
600
Current (mA)
150
IADC (mA)
500
AVDD = 3V, Buffer = ON
IANALOG 400
100 Buffer = OFF
300
50 200
100
0 0
-50 -30 -10 10 30 50 70 90 0 1 2 4 8 16 32 64 128
Temperature (°C) PGA Setting
DIGITAL CURRENT HISTOGRAM OF OUTPUT DATA

400 4500
Normal
350 4.91MHz 4000
3500
Number of Occurrences
300
SLEEP
4.91MHz 3000
Current (mA)
250 Normal
2.45MHz 2500
200
2000
150
1500
100
1000
SLEEP
50 2.45MHz 500
Power-Down
0 0
3.0 4.0 5.0 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0
VDD (V) ppm of FS
VREFOUT vs LOAD CURRENT OFFSET DAC – OFFSET vs TEMPERATURE

2.55 200
170
140
Offset (ppm of FSR)
110
VREFOUT (V)
80
2.50 50
20
-10
-40
-70
2.45 -100
-0.5 0 0.5 1.0 1.5 2.0 2.5 -50 -30 -10 10 30 50 70 90
VREFOUT Current Load (mA) Temperature (°C)

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OFFSET DAC – GAIN vs TEMPERATURE IDAC ROUT vs VOUT

1.00020 1.000
1.00016
1.00012 +85°C
1.00008 1.000
IOUT (Normalized)
+25°C
Normalized Gain
1.00004
1.00000
0.999
0.99996
0.99992
0.99988 0.999
0.99984
-40°C
0.99980
0.99976 0.998
-50 -30 -10 10 30 50 70 90 0 1 2 3 4 5
Temperature (°C) VDD - VOUT (V)
IDAC NORMALIZED vs TEMPERATURE IDAC MATCHING vs TEMPERATURE

1.010 3000
2000
1.005 1000
IDAC Match (ppm)
IOUT (Normalized)
0
1.000
-1000
-2000
0.995
-3000
0.990 -4000
-5000
0.985 -6000
-50 -30 -10 10 30 50 70 90 -50 -30 -10 10 30 50 70 90
Temperature (°C) Temperature (°C)
IDAC DIFFERENTIAL NONLINEARITY IDAC INTEGRAL NONLINEARITY

(Range = 1, RDAC = 150kΩ, VREF = 2.5V) (Range = 1, RDAC = 150kΩ, VREF = 2.5V)
0.5 0.5
0.4 0.4
0.3 0.3
0.2 0.2
DNL (LSB)
0.1 0.1
INL (LSB)
0 0
-0.1 -0.1
-0.2 -0.2
-0.3 -0.3
-0.4 -0.4
-0.5 -0.5
0 32 64 96 128 160 192 224 255 0 32 64 96 128 160 192 224 255
IDAC Code IDAC Code

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OVERVIEW
of the diode is connected to the negative input of the
INPUT MULTIPLEXER A/D converter. The output of IDAC1 is connected to
the anode to bias the diode and the cathode of the
The input multiplexer provides for any combination of diode is also connected to ground to complete the
differential inputs to be selected on any of the input circuit.
channels, as shown in Figure 25. If channel 1 is
selected as the positive differential input channel, In this mode, the output of IDAC1 is also connected
any other channel can be selected as the negative to the output pin, so some current may flow into an
differential input channel. With this method, it is external load from IDAC1, rather than the diode. See
possible to have up to eight fully-differential input Application Report Measuring Temperature with the
channels. ADS1216, ADS1217, or ADS1216 (SBAA073),
available for download at www.ti.com, for more
In addition, current sources are supplied that will information.
source or sink current to detect open or short circuits
on the pins. BURNOUT CURRENT SOURCES
When the Burnout bit is set in the ACR Configuration
Register (see the Register Map section), two current
AIN0 sources are enabled. The current source on the
positive input channel sources approximately 2µA of
current. The current source on the negative input
AIN1
AVDD
channel sinks approximately 2µA. This sinking allows
for the detection of an open circuit (full-scale
Burnout Current
reading) or short circuit (0V differential reading) on
AIN2 Source On the selected input differential pair.
INPUT BUFFER
AIN3
The input impedance of the ADS1216 without the
buffer is 5MΩ/PGA. With the buffer enabled, the
input voltage range is reduced and the analog
AIN4 power-supply current is higher. The buffer is
controlled by ANDing the state of the buffer pin with
the state of the BUFFER bit in the ACR Register
AIN5 (see the Register Map section). See Application
Report Input Currents for High-Resolution ADCs
Burnout Current (SBAA080), available for download at www.ti.com,
Source On
AIN6 for more information.
AGND
IDAC1 IDAC1 AND IDAC2
AIN7
The ADS1216 has two 8-bit current output DACs that
can be controlled independently. The output current
is set with RDAC, the range select bits in the ACR
AINCOM
register, and the 8-bit digital value in the IDAC
register. The output current equals VREF/(8 ×
RDAC)(2RANGE – 1)(DAC CODE). With VREFOUT = 2.5V
and RDAC = 150kΩ, the full-scale output can be
Figure 25. Input Multiplexer Configuration
selected to be 0.5, 1, or 2mA. The compliance
voltage range is 0 to within 1V of AVDD. When the
TEMPERATURE SENSOR internal voltage reference of the ADS1216 is used, it
is the reference for the IDAC. An external reference
An on-chip diode provides temperature sensing may be used for the IDACs by disabling the internal
capability. When the configuration register for the reference and tying the external reference input to
input MUX is set to all 1s, the diode is connected to the VREFOUT pin.
the input of the A/D converter. All other channels are
open. The anode of the diode is connected to the
positive input of the A/D converter, and the cathode

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PROGRAMMABLE GAIN AMPLIFIER (PGA) ON-CHIP VOLTAGE REFERENCE

The PGA can be set to gains of 1, 2, 4, 8, 16, 32, 64, A selectable voltage reference (1.25V or 2.5V) is
or 128. Using the PGA can improve the effective available for supplying the voltage reference input.
resolution of the A/D converter. For instance, with a To use, connect VREF– to AGND and VREF+ to
PGA of 1 on a 5V full-scale range, the A/D converter VREFOUT. The enabling and voltage selection are
can resolve to 1µV. With a PGA of 128 on a 40mV controlled through bits REF EN and REF HI in the
full-scale range, the A/D converter can resolve to Setup Register (see the Register Map section). The
75nV. 2.5V reference requires AVDD = +5V. When using the
on-chip voltage reference, the VREFOUT pin should be
PGA OFFSET DAC bypassed with a 0.1µF capacitor to AGND.
The input to the PGA can be shifted by half the VRCAP PIN
full-scale input range of the PGA by using the ODAC
(Offset DAC) Register; see the Register Map section. This pin provides a bypass cap for noise filtering on
The ODAC register is an 8-bit value; the MSB is the internal VREF circuitry only. This pin is a sensitive pin;
sign and the seven LSBs provide the magnitude of therefore place the capacitor as close as possible
the offset. Using the ODAC does not reduce the and avoid any resistive loading. The recommended
performance of the A/D converter. See Application capacitor is a 1000pF ceramic cap. If an external
Report The Offset DAC (SBAA077), available for VREF is used, this pin can be left unconnected.
download at www.ti.com, for more information.
CLOCK GENERATOR
MODULATOR
The clock source for the ADS1216 can be provided
The modulator is a single-loop, second-order system. from a crystal, oscillator, or external clock. When the
The modulator runs at a clock speed (fMOD) that is clock source is a crystal, external capacitors must be
derived from the external clock (fOSC), as shown in provided to ensure startup and a stable clock
Table 1. The frequency division is determined by the frequency; this configuration is shown in Figure 26
SPEED bit in the Setup Register (see the Register and Table 2.
Map section).
XIN
C1
Table 1. Modulator Speed
Crystal
SPEED BIT fMOD
XOUT
0 fOSC/128 C2
1 fOSC/256
VOLTAGE REFERENCE INPUT Figure 26. Crystal Connection
The ADS1216 uses a differential voltage reference

input. The input signal is measured against the Table 2. Typical Clock Sources
differential voltage VREF ≡ (VREF+) – (VREF–). For AVDD CLOCK
= +5V, VREF is typically +2.5V. For AVDD = +3V, VREF SOURCE FREQUENCY C1 C2 PART NUMBER
is typically +1.25V. As a result of the sampling nature Crystal 2.4576 0–20pF 0–20pF ECS, ECSD 2.45 – 32
of the modulator, the reference input current Crystal 4.9152 0–20pF 0–20pF ECS, ECSL 4.91
increases with higher modulator clock frequency Crystal 4.9152 0–20pF 0–20pF ECS, ECSD 4.91
(fMOD) and higher PGA settings.
Crystal 4.9152 0–20pF 0–20pF CTS, MP 042 4M9182

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CALIBRATION At the completion of calibration, the DRDY signal

goes low, which indicates the calibration is finished
The offset and gain errors in the ADS1216, or the and valid data is available. See Application Report
complete system, can be reduced with calibration. Calibration Routine and Register Value Generation
Internal calibration of the ADS1216 is called for the ADS121x Series (SBAA099), available for
self-calibration. Self-calibration is handled with three download at www.ti.com, for more information.
commands. One command does both offset and gain
calibration. There is also a gain calibration command
and an offset calibration command. Each calibration DIGITAL FILTER
process takes seven tDATA periods to complete. It The Digital Filter can use either the Fast-Settling,
takes 14 tDATA periods to complete both an offset and Sinc2, or Sinc3 filter, as shown in Figure 27. In
gain calibration. Self-gain calibration is optimized for addition, the Auto mode changes the sinc filter after
PGA gains less than 8. When using higher gains, the input channel or PGA is changed. When
system gain calibration is recommended. switching to a new channel, it will use the
Fast-Settling filter for the next two conversions, the
For system calibration, the appropriate signal must
first of which should be discarded. It will then use the
be applied to the inputs. The system offset command
Sinc2 followed by the Sinc3 filter. This architecture
requires a zero differential input signal. It then
combines the low-noise advantage of the Sinc3 filter
computes an offset that will nullify offset in the
with the quick response of the Fast-Settling time
system. The system gain command requires a
filter. See Figure 28 for the frequency response of
positive full-scale differential input signal. It then
each filter.
computes a value to nullify gain errors in the system.
Each of these calibrations will take seven tDATA When using the Fast-Settling filter, select a
periods to complete. decimation value set by the DEC0 and M/DEC1
registers that is evenly divisible by four for the best
Calibration must be performed after power on, a
gain accuracy. For example, choose 260 rather than
change in decimation ratio, or a change of the PGA.
261.
For operation with a reference voltage greater than
(AVDD – 1.5V), the buffer must also be turned off
during calibration.
Adjustable Digital Filter
3
Sinc
Modulator 2
Sinc Data Out
Output
Fast-Settling
FILTER SETTLING TIME AUTO MODE FILTER SELECTION

SETTLING TIME CONVERSION CYCLE
FILTER (Conversion Cycles) 1 2 3 4
3 (1) 2 3
Sinc 3 Discard Fast Sinc Sinc
2 (1)
Sinc 2
(1)
Fast 1
NOTE: (1) With Synchronized Channel Changes.
Figure 27. Filter Step Responses

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3 (1) 2 (1)
SINC FILTER RESPONSE SINC FILTER RESPONSE
(-3dB = 0.262 ´ fDATA = 15.76Hz) (-3dB = 0.318 ´ fDATA = 19.11Hz)
0 0
-20 -20
-40 -40
Gain (dB)
Gain (dB)
-60 -60
-80 -80
-100 -100
-120 -120
0 30 60 90 120 150 180 210 240 270 300 0 30 60 90 120 150 180 210 240 270 300
Frequency (Hz) Frequency (Hz)
(1)
FAST SETTLING FILTER RESPONSE
(-3dB = 0.469 ´ fDATA = 28.125Hz)
0
-20
-40
Gain (dB)
-60
-80
-100
-120
0 30 60 90 120 150 180 210 240 270 300
Frequency (Hz)
NOTE: (1) fDATA = 60Hz.
Figure 28. Filter Frequency Responses
DIGITAL I/O INTERFACE Chip Select (CS)
The ADS1216 has eight pins dedicated for digital The chip select (CS) input of the ADS1216 must be
I/O. The default power-up condition for the digital I/O externally asserted before a master device can
pins are as inputs. All of the digital I/O pins are exchange data with the ADS1216. CS must be low
individually configurable as inputs or outputs. They for the duration of the transaction. CS can be tied
are configured through the DIR control register. The low.
DIR register defines whether the pin is an input or
output, and the DIO register defines the state of the Serial Clock (SCLK)
digital output. When the digital I/O are configured as SCLK, a Schmitt-Trigger input, clocks data transfer
inputs, DIO is used to read the state of the pin. If the on the DIN input and DOUT output. When transferring
digital I/O are not used, either 1) configure as data to or from the ADS1216, multiple bits of data
outputs; or 2) leave as inputs and tie to ground; this may be transferred back-to-back with no delay in
configuration prevents excess power dissipation. SCLKs or toggling of CS. Make sure to avoid glitches
on SCLK because they can cause extra shifting of
SERIAL PERIPHERAL INTERFACE (SPI) the data.
The SPI allows a controller to communicate
synchronously with the ADS1216. The ADS1216
operates in slave-only mode.

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Polarity (POL)
The serial clock polarity is specified by the POL
input. When SCLK is active high, set POL high.
Configuration
When SCLK is active low, set POL low. Registers RAM
16 bytes 128 Bytes
DATA READY SETUP
MUX
The DRDY output is used as a status signal to ACR
IDAC1
indicate when data is ready to be read from the IDAC2
ODAC
ADS1216. DRDY goes low when new data is DIO
DIR Bank 0
available. It is reset high when a read operation from DEC0
16 bytes
M/DEC1
the data register is complete. It also goes high prior OCR0
OCR1
to the updating of the output register to indicate OCR2
when not to read from the device to ensure that a FSR0
FSR1
data read is not attempted while the register is being FSR2
updated.
DSYNC OPERATION
Bank 2
DSYNC is used to provide for synchronization of the 16 bytes
A/D conversion with an external event.
Synchronization can be achieved either through the
DSYNC pin or the DSYNC command. When the
DSYNC pin is used, the filter counter is reset on the
falling edge of DSYNC. The modulator is held in
reset until DSYNC is taken high. Synchronization
occurs on the next rising edge of the system clock
after DSYNC is taken high.
MEMORY Bank 7
16 bytes
Two types of memory are used on the ADS1216:
registers and RAM. 16 registers directly control the
various functions (PGA, DAC value, Decimation
Ratio, etc.) and can be directly read or written to.
Collectively, the registers contain all the information
needed to configure the part, such as data format,
mux settings, calibration settings, decimation ratio,
etc. Additional registers, such as conversion data,
Figure 29. Memory Organization
are accessed through dedicated instructions.
REGISTER BANK
The operation of the device is set up through
individual registers. The set of the 16 registers
required to configure the device is referred to as a
Register Bank, as shown in Figure 29.

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RAM The RAM address space is linear; therefore,

accessing RAM is done using an auto-incrementing
Reads and Writes to Registers and RAM occur on a pointer. Access to RAM in the entire memory map
byte basis. However, copies between registers and can be done consecutively without having to address
RAM occur on a bank basis. The RAM is each bank individually. For example, if you were
independent of the Registers; for example, the RAM currently accessing bank 0 at offset 0xF (the last
can be used as general-purpose RAM. location of bank 0), the next access would be bank 1
The ADS1216 supports any combination of eight and offset 0x0. Any access after bank 7 and offset
analog inputs. With this flexibility, the device can 0xF will wrap around to bank 0 and Offset 0x0.
easily support eight unique configurations—one per Although the Register Bank memory is linear, the
input channel. In order to facilitate this type of usage, concept of addressing the device can also be
eight separate register banks are available. thought of in terms of bank and offset addressing.
Therefore, each configuration could be written once Looking at linear and bank addressing syntax, we
and recalled as needed without having to serially have the following comparison: in the linear memory
retransmit all the configuration data. Checksum map, the address 0x14 is equivalent to bank 1 and
commands are also included, which can be used to offset 0x4. Simply stated, the most significant four
verify the integrity of RAM. bits represent the bank, and the least significant four
The RAM provides eight banks, with a bank bits represent the offset. The offset is equivalent to
consisting of 16 bytes. The total size of the RAM is the register address for that bank of memory.
128 bytes. Copies between the registers and RAM
are performed on a bank basis. Also, the RAM can
be directly read or written through the serial interface
on power-up. The banks allow separate storage of
settings for each input.

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REGISTER MAP
Table 3. Registers
ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
00h SETUP ID ID ID SPEED REF EN REF HI BUF EN BIT ORDER
01h MUX PSEL3 PSEL2 PSEL1 PSEL0 NSEL3 NSEL2 NSEL1 NSEL0
02h ACR BOCS IDAC2R1 IDAC2R0 IDAC1R1 IDAC1R0 PGA2 PGA1 PGA0
03h IDAC1 IDAC1_7 IDAC1_6 IDAC1_5 IDAC1_4 IDAC1_3 IDAC1_2 IDAC1_1 IDAC1_0
04h IDAC2 IDAC2_7 IDAC2_6 IDAC2_5 IDAC2_4 IDAC2_3 IDAC2_2 IDAC2_1 IDAC2_0
05h ODAC SIGN OSET_6 OSET_5 OSET_4 OSET_3 OSET_2 OSET_1 OSET_0
06h DIO DIO_7 DIO_6 DIO_5 DIO_4 DIO_3 DIO_2 DIO_1 DIO_0
07h DIR DIR_7 DIR_6 DIR_5 DIR_4 DIR_3 DIR_2 DIR_1 DIR_0
08h DEC0 DEC07 DEC06 DEC05 DEC04 DEC03 DEC02 DEC01 DEC00
09h M/DEC1 DRDY U/B SMODE1 SMODE0 Reserved DEC10 DEC9 DEC8
0Ah OCR0 OCR07 OCR06 OCR05 OCR04 OCR03 OCR02 OCR01 OCR00
0Bh OCR1 OCR15 OCR14 OCR13 OCR12 OCR11 OCR10 OCR09 OCR08
0Ch OCR2 OCR23 OCR22 OCR21 OCR20 OCR19 OCR18 OCR17 OCR16
0Dh FSR0 FSR07 FSR06 FSR05 FSR04 FSR03 FSR02 FSR01 FSR00
0Eh FSR1 FSR15 FSR14 FSR13 FSR12 FSR11 FSR10 FSR09 FSR08
0Fh FSR2 FSR23 FSR22 FSR21 FSR20 FSR19 FSR18 FSR17 FSR16
DETAILED REGISTER DEFINITIONS

SETUP (Address 00h) Setup Register
Reset value = iii01110.
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
ID ID ID SPEED REF EN REF HI BUF EN BIT ORDER
bits 7-5 Factory programmed bits

bit 4 SPEED: modulator clock speed
0 : fMOD = fOSC/128
1 : fMOD = fOSC/256
bit 3 REF EN: Internal voltage reference enable
0 = Internal voltage reference disabled
1 = Internal voltage reference enabled
bit 2 REF HI: internal reference voltage select
0 = Internal reference voltage = 1.25V
1 = Internal reference voltage = 2.5V
bit 1 BUF EN: buffer enable
0 = Buffer disabled
1 = Buffer enabled
bit 0 BIT ORDER: set order bits are transmitted
0 = Most significant bit transmitted first
1 = Least significant bit transmitted first data is always shifted into the part most significant bit first.
Data is always shifted out of the part most significant byte first. This configuration bit only controls the
bit order within the byte of data that is shifted out.

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MUX (Address 01h) Multiplexer Control Register

Reset value = 01h.
PSEL3 PSEL2 PSEL1 PSEL0 NSEL3 NSEL2 NSEL1 NSEL0
bits 7-4 PSEL3: PSEL2: PSEL1: PSEL0: Positive channel select

0000 = AIN0 0100 = AIN4
0001 = AIN1 0101 = AIN5
0010 = AIN2 0110 = AIN6
0011 = AIN3 0111 = AIN7
1xxx = AINCOM (except when all bits are 1s)
1111 = Temperature sensor diode
bits 3-0 NSEL3: NSEL2: NSEL1: NSEL0: Negative channel select
0000 = AIN0 0100 = AIN4
0001 = AIN1 0101 = AIN5
0010 = AIN2 0110 = AIN6
0011 = AIN3 0111 = AIN7
1xxx = AINCOM (except when all bits are 1s)
1111 = Temperature sensor diode
ACR (Address 02h) Analog Control Register

Reset value = 00h.
BOCS IDAC2R1 IDAC2R0 IDAC1R1 IDAC1R0 PGA2 PGA1 PGA0
bit 7 BOCS: Burnout current source

0 = Disabled
1 = Enabled
IDAC Current + ǒ8RV Ǔǒ2

REF
DAC
RANGE*1 Ǔ(DAC CODE)
bits 6-5 IDAC2R1: IDAC2R0: Full-scale range select for IDAC2

00 = Off
01 = Range 1
10 = Range 2
11 = Range 3
bits 4-3 IDAC1R1: IDAC1R0: Full-scale range select for IDAC1
00 = Off
01 = Range 1
10 = Range 2
11 = Range 3
bits 2-0 PGA2: PGA1: PGA0: Programmable gain amplifier gain selection
000 = 1 100 = 16
001 = 2 101 = 32
010 = 4 110 = 64
011 = 8 111 = 128

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IDAC1 (Address 03h) Current DAC 1

Reset value = 00h.
IDAC1_7 IDAC1_6 IDAC1_5 IDAC1_4 IDAC1_3 IDAC1_2 IDAC1_1 IDAC1_0
The DAC code bits set the output of DAC1 from 0 to full-scale. The value of the full-scale current is set by this byte, VREF, RDAC, and the
DAC1 range bits in the ACR register.
IDAC2 (Address 04h) Current DAC 2

Reset value = 00h.
IDAC2_7 IDAC2_6 IDAC2_5 IDAC2_4 IDAC2_3 IDAC2_2 IDAC2_1 IDAC2_0
The DAC code bits set the output of DAC2 from 0 to full-scale. The value of the full-scale current is set by this byte, VREF, RDAC, and the
DAC2 range bits in the ACR register.
ODAC (Address 05h) Offset DAC Setting

Reset value = 00h.
SIGN OSET6 OSET5 OSET4 OSET3 OSET2 OSET1 OSET0
bit 7 Offset sign

0 = Positive
1 = Negative
bits 6-0
Offset +
V REF
2PGA
ǒCode
127
Ǔ
NOTE: The offset must be used after calibration or the calibration will nullify the effects.
DIO (Address 06h) Digital I/O

Reset value = 00h.
DIO7 DIO6 DIO5 DIO4 DIO3 DIO2 DIO1 DIO0
A value written to this register will appear on the digital I/O pins if the pin is configured as an output in the DIR register. Reading this
register will return the value of the digital I/O pins.
DIR (Address 07h) Direction control for digital I/O

Reset value = FFh.
DIR7 DIR6 DIR5 DIR4 DIR3 DIR2 DIR1 DIR0
Each bit controls whether the Digital I/O pin is an output (= 0) or input (= 1). The default power-up state is as
inputs.

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DEC0 (Address 08h) Decimation Register (least significant 8 bits)

Reset value = 80h.
DEC07 DEC06 DEC05 DEC04 DEC03 DEC02 DEC01 DEC00
The decimation value is defined with 11 bits for a range of 20 to 2047. This register is the least significant eight bits. The three most
significant bits are contained in the M/DEC1 register.
M/DEC1 (Address 09h) Mode and Decimation Register

Reset value = 07h.
DRDY U/B SMODE1 SMODE0 Reserved DEC10 DEC09 DEC08
bit 7 DRDY: Data ready (read-only)

This bit duplicates the state of the DRDY pin.
bit 6 U/B: Data format
0 = Bipolar
1 = Unipolar
U/B ANALOG INPUT DIGITAL OUTPUT
0 +FS 0x7FFFFF
Zero 0x000000
–FS 0x800000
1 +FS 0xFFFFFF
Zero 0x000000
–FS 0x000000
bits 5-4 SMODE1: SMODE0: Settling mode

00 = Auto
01 = Fast-Settling filter
10 = Sinc2 filter
11 = Sinc3 filter
bit 3 Reserved
This bit is not used in the ADS1216 and it is recommended that it be set to 0.
bits 2-0 DEC10: DEC09: DEC08: Most significant bits of the decimation value

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OCR0 (Address 0Ah) Offset Calibration Coefficient (least significant byte)

Reset value = 00h.
OCR07 OCR06 OCR05 OCR04 OCR03 OCR02 OCR01 OCR00
OCR1 (Address 0Bh) Offset Calibration Coefficient (middle byte)

Reset value = 00h.
OCR2 (Address 0Ch) Offset Calibration Coefficient (most significant byte)

Reset value = 00h.
FSR0 (Address 0Dh) Full-Scale Register (least significant byte)

Reset value = 24h.
FSR07 FSR06 FSR05 FSR04 FSR03 FSR02 FSR01 FSR00
FSR1 (Address 0Eh) Full-Scale Register (middle byte)

Reset value = 90h.
FSR2 (Address 0Fh) Full-Scale Register (most significant byte)

Reset value = 67h.

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COMMAND DEFINITIONS
The commands summarized in Table 4 control the operation of the ADS1216. All of the commands are
stand-alone except for the register reads and writes (RREG, WREG) which require a second command byte
plus data. Additional command and data bytes may be shifted in without delay after the first command byte. The
ORDER bit in the STATUS register (see the Register map section) sets the order of the bits within the output
data. CS must stay low during the entire command sequence.
Table 4. Command Definitions (1)

COMMAND DESCRIPTION 1ST COMMAND BYTE 2ND COMMAND BYTE
WAKEUP Completes SYNC and exits standby mode 0000 0000 (00h)
RDATA Read data 0000 0001 (01h)
RDATAC Read data continuously 0000 0011 (03h)
SDATAC Stop read data continuously 0000 1111 (0Fh)
RREG Read from REG rrr 0001 rrrr (1xh) 0000 nnnn
RRAM Read from RAM bank aaa 0010 0aaa (2xh) xnnn nnnn (number of bytes – 1)
CREG Copy REG to RAM bank aaa 0100 0aaa (4xh)
CREGA Copy REG to all RAM banks 0100 1000 (48h)
WREG Write to REG rrr 0101 rrrr (5xh) 0000 nnnn
WRAM Write to RAM bank aaa 0110 0aaa (6xh) xnnn nnnn (number of bytes – 1)
CRAM Copy RAM bank aaa to REG 1100 0aaa (Cxh)
CSRAMX Calculate RAM bank aaa checksum 1101 0aaa (Dxh)
CSARAMX Calculate all RAM banks checksum 1101 1000 (D8h)
CSREG Calculate REG checksum 1101 1111 (DFh)
CSRAM Calculate RAM bank aaa checksum 1110 0aaa (Exh)
CSARAM Calculate all RAM banks checksum 1110 1000 (E8h)
SELFCAL Offset and gain self-calibration 1111 0000 (F0h)
SELFOCAL Offset self-calibration 1111 0001 (F1h)
SELFGCAL Gain self-calibration 1111 0010 (F2h)
SYSOCAL System offset calibration 1111 0011 (F3h)
SYSGCAL System gain calibration 1111 0100 (F4h)
DSYNC Synchronize the A/D conversion 1111 1100 (FCh)
SLEEP Begin sleep mode 1111 1101 (FDh)
RESET Reset to power-up values 1111 1110 (FEh)
WAKEUP Completes SYNC and exits standby mode 1111 1111 (FFh)
(1) n = number of registers to be read/written – 1. For example, to read/write three registers, set nnnn = 2 (0010). r = starting register
address for read/write commands.

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RDATA Read Data
Description: Issue this command after DRDY goes low to read a single conversion result. After all 24 bits have
been shifted out on DOUT, DRDY goes high. It is not necessary to read back all 24 bits, but DRDY will then not
return high until new data is being updated. See the Timing Characteristics for the required delay between the
end of the RDATA command and the beginning of shifting data on DOUT: t6.
DRDY
DIN 0000 0001
DOUT MSB Mid-Byte LSB
t6
SCLK ··· ···
Figure 30. RDATA Command Sequence
RDATAC Read Data Continuous
Description: Issue command after DRDY goes low to enter the Read Data Continuous mode. This mode
enables the continuous output of new data on each DRDY without the need to issue subsequent read
commands. After all 24 bits have been read, DRDY goes high. It is not necessary to read back all 24 bits, but
DRDY will then not return high until new data is being updated. This mode may be terminated by the Stop Read
Data Continuous command (STOPC). Because DIN is constantly being monitored during the Read Data
Continuous mode for the STOPC or RESET command, do not use this mode if DIN and DOUT are connected
together. See the Timing Characteristics for the required delay between the end of the RDATAC command and
the beginning of shifting data on DOUT: t6.
DRDY
DIN 0000 0011
t6
DOUT 24 Bits 24 Bits
Figure 31. RDATAC Command Sequence
On the following DRDY, shift out data by applying SCLKs. The Read Data Continuous mode terminates if
input_data equals the STOPC or RESET command in any of the three bytes on DIN.
DRDY
DIN input_data input_data input_data
DOUT MSB Mid-Byte LSB
Figure 32. DIN and DOUT Command Sequence During Read Continuous mode

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STOPC Stop Read Data Continuous
Description: Ends the continuous data output mode; refer to RDATAC in the Command Definitions section. The
command must be issued after DRDY goes low and completed before DRDY goes high.
DRDY
DIN 000 1111
Figure 33. STOPC Command Sequence
RREG Read from Registers
Description: Output the data from up to 16 registers starting with the register address specified as part of the
command. The number of registers read will be one plus the second byte of the command. If the count exceeds
the remaining registers, the addresses will wrap back to the beginning.
1st Command Byte: 0001 rrrr where rrrr is the address of the first register to read.
2nd Command Byte: 0000 nnnn where nnnn is the number of bytes to read – 1. See the Timing Characteristics
for the required delay between the end of the RREG command and the beginning of shifting data on DOUT: t6.
DIN 0001 0001 0000 0001
1st Command 2nd Command

t6
Byte Byte
DOUT MUX ADCON
Data Data
Byte Byte
Figure 34. RREG Command Example: Read Two Registers Starting from Regiater 01h (multiplexer)
RRAM Read from RAM
Description:This command allows for the direct reading of the RAM contents. All reads begin at the specified
starting RAM bank. More than one bank can be read out in a single read operation. The reads will wrap around
to the first bank if there is more data to be retrieved when the last bank is completely read. See the Timing
Characteristics for the required delay between the end of the RRAM command and the beginning of shifting data
on DOUT: t6.
1st Command Byte: 0010 0aaa where aaa is the starting RAM bank for the read.
2nd Command Byte: 0nnn nnnn where nnn nnnn is the number of bytes to be read – 1.
DIN 0010 0001 0000 1111
t6
Bank 1, Bank 1,
DOUT
Byte 0 Byte 1
RAM Data
Figure 35. RRAM Command Example: Read 16 Bytes Starting from Bank 1

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CREG Copy Registers to RAM Bank
Description: This command copies the registers to the selected RAM bank. Do not issue additional commands
while the copy operation is underway.
1st Command byte: 0100 0aaa where aaa is the RAM bank that will be updated with a copy of the registers.
CREGA Copy Registers to All RAM Banks
Description: This command copies the registers to all RAM banks. Do not issue additional commands while the
copy operation is underway.
WREG Write to Register
Description: Write to the registers starting with the register specified as part of the command. The number of
registers that will be written is one plus the value of the second byte in the command.
1st Command Byte: 0101 rrrr where rrrr is the address to the first register to be written.
2nd Command Byte: 0000 nnnn where nnnn is the number of bytes to be written – 1.
Data Byte(s): data to be written to the registers.
DIN 0101 0011 0000 0001 DRATE Data IO Data
1st Command 2nd Command Data Data

Byte Byte Byte Byte
Figure 36. WREG Command Example: Write Two Registers Starting from 03h (DRATE)
WRAM Write to RAM
Description: This command allows for direct writing to the RAM. All writes begin at the specified starting RAM
bank. More than one bank can be written in a single write operation. The writes will wrap around to the first bank
if there is more data to be written when the last bank is completely written. See the Timing Characteristics for
the required delay between the end of the RRAM command and the beginning of shifting data on DOUT: t6.
1st Command Byte: 0010 0aaa where aaa is the starting RAM bank for the write.
2nd Command Byte: 0nnn nnnn where nnn nnnn is the number of bytes to be written – 1.
DIN Bank 1, Bank 1,

0110 0001 0000 1111
Byte 0 Byte 1
tx
RAM Data
Figure 37. WRAM Command Example: Write 16 Bytes Starting at Bank 1
CRAM Copy Selected RAM Bank to Registers
Description: This command copies the selected RAM bank to the registers. This action will overwrite all
previous register settings. Do not issue additional commands while this copy operation is underway.
1st Command Byte: 1100 0aaa where aaa is the selected RAM bank.

ADS1216
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CSRAM Calculate Checksum for Selected RAM Bank
Description: This command calculates the checksum for the selected RAM bank. The checksum is calculated
as the sum of all the bytes in the registers with the carry ignored. Do not issue any additional commands while
the checksum is being calculated.
CSRAMX Calculate Checksum for Selected RAM Bank,

Ignoring Certain Bits
Description: This command calculates the checksum of the selected RAM bank. The checksum is calculated as
a sum of all the bytes in the RAM bank with the carry ignored. The ID, DRDY, and DIO bits are masked and are
not included in the checksum calculation. Do not issue any additional commands while the checksum is being
calculated.
CSARAM Calculate Checksum for all RAM Banks
Description: This command calculates the checksum for all RAM banks. The checksum is calculated as a sum
of all the bytes in the RAM bank with the carry ignored. Do not issue any additional commands while the
checksum is being calculated.
Calculate Checksum for all RAM Banks, Ignoring

CSARAMX Certain Bits
Description: This command calculates the checksum for all RAM banks. The checksum is calculated as a sum
of all the bytes in the RAM bank with the carry ignored. The ID, DRDY, and DIO bits are masked and are not
included in the checksum calculation. Do not issue any additional commands while the checksum is being
calculated.
CSREG Calculate Checksum for the Registers
Description: This command calculates the checksum for the registers. The checksum is calculated as a sum of
all the bytes in the registers with the carry ignored. The ID, DRDY, and DIO bits are masked and are not
included in the checksum calculation. Do not issue any additional commands while the checksum is being
calculated.
See the Timing Characteristics for the required delay between the end of the checksum commands and the
beginning of shifting data on DOUT: t6. Note that this time is dependent on the specific checksum command used.
DIN 0000 0011
t6
DOUT 24 Bits
Figure 38. Checksum Command Sequence
SYSOCAL System Offset Calibration
Description: Performs a system offset calibration. The Offset Calibration Register (OFC) is updated after this
operation. DRDY goes high at the beginning of the calibration. It goes low after the calibration completes and
settled data is ready. Do not send additional commands after issuing this command until DRDY goes low
indicating that the calibration is complete.

ADS1216
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SYSGCAL System Gain Calibration
Description: Performs a system gain calibration. The Full-Scale Calibration Register (FSC) is updated after this
operation. DRDY goes high at the beginning of the calibration. It goes low after the calibration completes and
settled data is ready. Do not send additional commands after issuing this command until DRDY goes low
indicating that the calibration is complete.
DSYNC Synchronize the A/D Conversion
Description: This command synchronizes the A/D conversion. To use, first shift in the command. Then shift in
the WAKEUP command. Synchronization occurs on the first CLKIN rising edge after the first SCLK used to shift
in the WAKEUP command.
DIN 1111 1100 0000 0000

(SYNC) (WAKEUP)
SCLK ··· ···
CLKIN ··· ···
Synchronization Occurs Here
Figure 39. DSYNC Command Sequence
SLEEP Sleep Mode
Description: This command puts the ADS1216 into a Sleep mode. After issuing the SLEEP command, make
sure there is no more activity on SCLK while CS is low because this will interrupt Sleep mode. If CS is high,
SCLK activity is allowed during Sleep mode. To exit Sleep mode, issue the WAKEUP command.
DIN 1111 1101 0000 0000

(SLEEP) (WAKEUP)
SCLK
Normal Mode Sleep Mode Normal Mode
Figure 40. SLEEP Command Sequence
WAKEUP Complete Synchronization or Exit Sleep Mode
Description: Used in conjunction with the SYNC and STANDBY commands. Two values (all zeros or all ones)
are available for this command.
RESET Reset Registers to Default Values
Description: Returns all registers to their default values. This command will also stop the Read Data
Continuous mode. While in the Read Data Continuous mode, the RESET command must be issued after DRDY
goes low and complete before DRDY returns high.

ADS1216
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DEFINITIONS
Analog Input Voltage—the voltage at any one
The data from the A/D converter is output as codes,
analog input relative to AGND.
which then can be easily converted to other units,
Analog Input Differential Voltage—given by the such as ppm or volts. The equations and table below
following equation: (AIN+) – (AIN–). Thus, a positive show the relationship between bits or codes, ppm,
digital output is produced whenever the analog input and volts.
differential voltage is positive, while a negative digital −20 log(ppm)
output is produced whenever the differential is ENOB +
6.02
negative.
BITS rms BIPOLAR VRMS UNIPOLAR VRMS
For example, when the converter is configured with a
2.5V reference and placed in a gain setting of 1, the
positive full-scale output is produced when the
ǒ 2V REF
PGA
Ǔ ǒ Ǔ V REF
PGA
analog input differential is 2.5V. The negative 10ǒ 6.02ER Ǔ 10ǒ6.02ERǓ

20 20
full-scale output is produced when the differential is
–2.5V. In each case, the actual input voltages must 24 298nV 149nV
remain within the AGND to AVDD range. 22 1.19µV 597nV
Conversion Cycle—the term conversion cycle 20 4.77µV 2.39µV
usually refers to a discrete A/D conversion operation, 18 19.1µV 9.55µV
such as that performed by a successive 16 76.4µV 38.2µV
approximation converter. As used here, a conversion 14 505µV 152.7µV
cycle refers to the tDATA time period. However, each
12 1.22mV 610µV
digital output is actually based on the modulator
results from several tDATA time periods.
fDATA—the frequency of the digital output data
FILTER SETTING MODULATOR RESULTS produced by the ADS1216. fDATA is also referred to
Fast Settling 1 tDATA Time Period as the data rate.
Sinc2
Sinc3
2 tDATA Time Period
3 tDATA Time Period
f DATA + ǒDecimation
f MOD
Ratio
Ǔ + ǒmfactor Decimation
f
Ratio
Ǔ
OSC
Data Rate—the rate at which conversions are fMOD—the frequency or speed at which the modulator
completed. See definition for fDATA. of the ADS1216 is running. This rate depends on the
SPEED bit as shown below:
Decimation Ratio—defines the ratio between the
output of the modulator and the output Data Rate. SPEED BIT fMOD
Valid values for the Decimation Ratio are from 20 to 0 fOSC/128
2047. Larger Decimation Ratios will have lower 1 fOSC/256
noise.
fOSC—the frequency of the crystal input signal at the
Effective Resolution—the effective resolution of the
XIN input of the ADS1216.
ADS1216 in a particular configuration can be
expressed in two different units: bits rms (referenced fSAMP—the frequency, or switching speed, of the
to output) and VRMS (referenced to input). Computed input sampling capacitor. The value is given by one
directly from the converter output data, each is a of the following equations:
statistical calculation. The conversion from one to the PGA SETTING SAMPLING FREQUENCY
other is shown below.
f OSC
Effective number of bits (ENOB) or effective 1, 2, 4, 8 f SAMP +
mfactor
resolution is commonly used to define the usable
2f OSC
resolution of the A/D converter. It is calculated from 8 f SAMP +
mfactor
empirical data taken directly from the device. It is
typically determined by applying a fixed known signal 16 f SAMP +
8f OSC
source to the analog input and computing the mfactor
standard deviation of the data sample set. The rms 16f OSC
noise defines the ±σ interval about the sample mean. 32 f SAMP +
mfactor
16f OSC
64, 128 f SAMP +
mfactor

ADS1216
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Filter Selection—the ADS1216 uses a (sinx/x) filter For example, when the converter is configured with a
or sinc filter. There are three different sinc filters that 2.5V reference and is placed in a gain setting of 2,
can be selected. A Fast-Settling filter will settle in the full-scale range is: [1.25V (positive full-scale) –
one tDATA cycle. The Sinc2 filter will settle in two (–1.25V (negative full-scale))] = 2.5V.
cycles and have lower noise. The Sinc3 will achieve
Least Significant Bit (LSB) Weight—this is the
lowest noise and higher number of effective bits, but
theoretical amount of voltage that the differential
requires three cycles to settle. The ADS1216 will
voltage at the analog input would have to change in
operate with any one of these filters, or it can
order to observe a change in the output data of one
operate in an auto mode, where it will first select the
least significant bit. It is computed as shown in
Fast-Settling filter after a new channel is selected for
Equation 1:
two readings and will then switch to Sinc2 for one
reading, followed by Sinc3 from then on. Full−Scale Range
LSB Weight +
2N (1)
Full-Scale Range (FSR)—as with most A/D
converters, the full-scale range of the ADS1216 is where N is the number of bits in the digital output.
defined as the input, which produces the positive
tDATA—the inverse of fDATA, or the period between
full-scale digital output minus the input, which
each data output.
produces the negative full-scale digital output. The
full-scale range changes with gain setting; see
Table 5.
Table 5. Full-Scale Range vs PGA Setting

5V SUPPLY ANALOG INPUT (1) GENERAL EQUATIONS
DIFFERENTIAL DIFFERENTIAL
GAIN FULL-SCALE INPUT PGA OFFSET FULL-SCALE INPUT PGA SHIFT
SETTING RANGE VOLTAGES (2) RANGE RANGE VOLTAGES (2) RANGE
1 5V ±2.5V ±1.25V
2 2.5V ±1.25V ±0.625V
4 1.25V ±0.625V ±312.5mV
8 0.625V ±312.5mV ±156.25mV 2V REF " VREF " VREF
16 312.5mV ±156.25mV ±78.125mV PGA PGA 2PGA
34 156.25mV ±78.125mV ±39.0625mV
64 78.125mV ±39.0625mV ±19.531mV
128 39.0625mV ±19.531mV ±9.766mV
(1) With a 2.5V reference.

(2) The ADS1216 allows common-mode voltage as long as the absolute input voltage on AIN+ or AIN– does not go below AGND or above
AVDD.

ADS1216
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Changes from C Revision (May 2006) to D Revision ..................................................................................................... Page
• Added title for Table 1......................................................................................................................................................... 16

• Changed 11 registers to 16 registers in Description text of RREG section in Command Definitions. ............................... 28

PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
ADS1216Y/250 ACTIVE TQFP PFB 48 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS1216Y Samples
ADS1216Y/2K ACTIVE TQFP PFB 48 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS1216Y Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Sep-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ADS1216Y/2K TQFP PFB 48 2000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Sep-2021
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADS1216Y/2K TQFP PFB 48 2000 350.0 350.0 43.0
Pack Materials-Page 2
PACKAGE OUTLINE
PFB0048A SCALE 1.900
TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
7.2
B
6.8
NOTE 3
48 37
PIN 1 ID
1 36
7.2 9.2
TYP
6.8 8.8
NOTE 3
12
25
13 24
A
0.27
44X 0.5 48X
0.17
0.08 C A B
4X 5.5
1.2 MAX
SEATING PLANE
(0.13) SEE DETAIL A 0.08

TYP
0.25
GAGE PLANE (1)
0.75
0.45 0.05 MIN
0 -7
DETAIL A
A 16
TYPICAL
4215157/A 03/2024
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MS-026.
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EXAMPLE BOARD LAYOUT
PFB0048A TQFP - 1.2 mm max height
SYMM
48 37 SEE DETAILS
48X (1.35)
1
36
48X (0.25)
SYMM
(8.5)
44X (0.5)
12 25
(R0.05) TYP
13 24
(8.5)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
METAL SOLDER MASK
EXPOSED METAL OPENING
EXPOSED METAL
METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4215157/A 03/2024
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PFB0048A TQFP - 1.2 mm max height
SYMM
48 37
48X (1.35)
1
36
48X (0.25)
SYMM
(8.5)
44X (0.5)
12 25
(R0.05) TYP
13 24
(8.5)
SOLDER PASTE EXAMPLE

SCALE:8X
4215157/A 03/2024
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated

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ABSOLUTE MAXIMUM RATINGS (1)

2 Submit Documentation Feedback

ELECTRICAL CHARACTERISTICS: AVDD = +5V

Sinc3 filter –3dB 0.262 × fDATA Hz

(1) Calibration can minimize these errors.

Submit Documentation Feedback 3

ELECTRICAL CHARACTERISTICS: AVDD = +5V (continued)

4 Submit Documentation Feedback

ELECTRICAL CHARACTERISTICS: AVDD = +3V

Sinc3 filter –3dB 0.262 × fDATA Hz

(1) Calibration can minimize these errors.

Submit Documentation Feedback 5

ELECTRICAL CHARACTERISTICS: AVDD = +3V (continued)

6 Submit Documentation Feedback

DIGITAL CHARACTERISTICS: TMIN to TMAX, DVDD +2.7V to +5.25V

FUNCTIONAL BLOCK DIAGRAM

AGND AVDD RDAC VREFOUT VRCAP VREF+ VREF- XIN XOUT

DVDD DGND BUFEN D0 ... D7 PDWN DSYNC RESET DRDY

Submit Documentation Feedback 7

NOTE: (1) Bit Order = 0.

SPEC DESCRIPTION MIN MAX UNITS

8 Submit Documentation Feedback

SPEC DESCRIPTION MIN MAX UNITS

Submit Documentation Feedback 9

DEVICE INFORMATION (continued)

10 Submit Documentation Feedback

EFFECTIVE NUMBER OF BITS EFFECTIVE NUMBER OF BITS

EFFECTIVE NUMBER OF BITS EFFECTIVE NUMBER OF BITS

EFFECTIVE NUMBER OF BITS FAST-SETTLING FILTER

Submit Documentation Feedback 11

TYPICAL CHARACTERISTICS (continued)

NOISE vs INPUT SIGNAL CMRR vs FREQUENCY

PSRR vs FREQUENCY OFFSET vs TEMPERATURE

Figure 9. Figure 10.

GAIN vs TEMPERATURE INTEGRAL NONLINEARITY vs INPUT SIGNAL

Figure 11. Figure 12.

12 Submit Documentation Feedback

TYPICAL CHARACTERISTICS (continued)

CURRENT vs TEMPERATURE ADC CURRENT vs PGA

Figure 13. Figure 14.

DIGITAL CURRENT HISTOGRAM OF OUTPUT DATA

Figure 15. Figure 16.

VREFOUT vs LOAD CURRENT OFFSET DAC – OFFSET vs TEMPERATURE

Figure 17. Figure 18.

Submit Documentation Feedback 13

TYPICAL CHARACTERISTICS (continued)

OFFSET DAC – GAIN vs TEMPERATURE IDAC ROUT vs VOUT

Figure 19. Figure 20.

IDAC NORMALIZED vs TEMPERATURE IDAC MATCHING vs TEMPERATURE

Figure 21. Figure 22.

IDAC DIFFERENTIAL NONLINEARITY IDAC INTEGRAL NONLINEARITY

Figure 23. Figure 24.

14 Submit Documentation Feedback

Submit Documentation Feedback 15

PROGRAMMABLE GAIN AMPLIFIER (PGA) ON-CHIP VOLTAGE REFERENCE

VOLTAGE REFERENCE INPUT Figure 26. Crystal Connection

The ADS1216 uses a differential voltage reference