IPC-5262

Design, Critical Process

and Acceptance
Requirements for
Polymeric Applications

Developed by 5-24g Polymerics Standard Task Group

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC

Tel 847 615.7100

Fax 847 615.7105
IPC-5262 July 2022

Table of Contents
1 GENERAL REQUIREMENTS . . . . . . . . . . . . . . . . . . . 1 2.7 National Aeronautics and Space Administration
1.1 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 (NASA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2 Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.8 National Conference of Standards Laboratories

(NCSL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 Applicability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.9 SAE International . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.4 Performance/Product Classification . . . . . . . . . . . . 2
2.10 U.S. Office of the Federal Register –
1.5 Definition of Requirements . . . . . . . . . . . . . . . . . . 2 Code of Federal Regulations (CFR) . . . . . . . . . . . . 7
1.5.1 Requirement Format (N/A/D) . . . . . . . . . . . . . . . . 2 2.11 United States Department of Defense (US DoD) . . 7
1.5.2 Requirements Flowdown . . . . . . . . . . . . . . . . . . . . 3 2.12 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . 7
1.5.3 Commercial Off-The-Shelf (COTS) . . . . . . . . . . . . 3 2.13 Guidance on Use of “Inactive for New Design”
1.5.4 Existing or Previously Approved Designs . . . . . . 3 Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.6 Measurement Units and Applications . . . . . . . . . . 3 2.14 Documentation References . . . . . . . . . . . . . . . . . . . 7
1.6.1 Use of Measurement Units . . . . . . . . . . . . . . . . . . 4 3 GENERAL ASSEMBLY REQUIREMENTS . . . . . . . . . 8
1.6.2 Verification of Dimensions . . . . . . . . . . . . . . . . . . 4 3.1 Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.7 Definition of Terms . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1.1 Changes in Materials, Processes,
1.8 Engineering Documentation . . . . . . . . . . . . . . . . . . 4 or Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.9 Order of Precedence . . . . . . . . . . . . . . . . . . . . . . . . 4 3.1.2 Nonstandard/Special Processes, Materials
or Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.10 Conflict . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1.3 Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.11 Clause References . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Rework and Repair . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.12 Line Drawings and Illustrations . . . . . . . . . . . . . . . 4
3.2.1 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.13 Appendices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.2 Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.14 Approval of Departures from Standards
and Requirements . . . . . . . . . . . . . . . . . . . . . . . . . 4 3.3 Electrostatic Discharge Requirements . . . . . . . . . . 8
1.15 Personnel Proficiency . . . . . . . . . . . . . . . . . . . . . . . 4 3.4 Selection Requirements for Polymeric Materials . . 8
1.16 Acceptance Requirements . . . . . . . . . . . . . . . . . . . 4 3.5 Qualification and Acceptance of
Polymeric Materials . . . . . . . . . . . . . . . . . . . . . . . 9
1.17 Facilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.5.1 Special Design Elements for Staking . . . . . . . . . . . 9
1.18 Health and Safety . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.5.2 Special Design Elements for
1.19 Packaging, Handling, Shipping and
Conformal Coating . . . . . . . . . . . . . . . . . . . . . . . . . 9
Transportation (PHS&T) . . . . . . . . . . . . . . . . . . . . 5
3.5.3 Special Design Elements for Bonding . . . . . . . . . . 9
1.20 Documentation Requirements . . . . . . . . . . . . . . . . 5
3.5.4 Special Design Elements for Encapsulation . . . . . 10
1.21 Intellectual Property (IP) Control Requirements . . 5
3.5.5 Special Design Elements for Underfill . . . . . . . . . 10
1.22 Supply Chain Traceability . . . . . . . . . . . . . . . . . . . 5
1.23 Trusted Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 FACILITIES, TOOLS AND MATERIALS . . . . . . . . . . 11

1.24 Materials and Substances Declaration . . . . . . . . . . 5 4.1 Health and Safety . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.2 Facility Cleanliness . . . . . . . . . . . . . . . . . . . . . . . 11
2 APPLICABLE DOCUMENTS . . . . . . . . . . . . . . . . . . . 5
4.3 Environmental Conditions . . . . . . . . . . . . . . . . . . 11
2.1 IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.3.1 Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2 Joint Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3.2 Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3 American Society of Mechanical Engineers
(ASME) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.3.3 Special Environmental Requirements . . . . . . . . . 11
2.4 ASTM International . . . . . . . . . . . . . . . . . . . . . . . . 6 4.3.4 Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.5 International Electrotechnical Commission 4.3.5 Field Operations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
(IEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.4 Foreign Object Debris (FOD) Control Plan . . . . 12
2.6 EOS/ESD Association, Inc. . . . . . . . . . . . . . . . . . . 6 4.5 Lighting Requirements . . . . . . . . . . . . . . . . . . . . 12

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4.5.1 Lighting Requirements – Visible/White Light . . . 12 6 QUALITY ASSURANCE . . . . . . . . . . . . . . . . . . . . . . 38

4.5.2 Lighting Requirements – 6.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Short-Wave Black Light/Ultraviolet (UV) . . . . . 12 6.2 General Inspection Requirements . . . . . . . . . . . . . 38
4.6 Inspection Optics . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.2.1 Verification of Cure – Tackiness
4.7 Silicone Operations . . . . . . . . . . . . . . . . . . . . . . . 13 and Adhesion . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.8 Tool and Equipment Control . . . . . . . . . . . . . . . . 13 6.2.2 Verification of Cure – Hardness . . . . . . . . . . . . . . 39
4.9 Material Storage and Records Retention . . . . . . . 13 6.2.3 Acceptance/Rejection Criteria for Bonding
4.9.1 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 (Mechanical/Thermal) . . . . . . . . . . . . . . . . . . . . . 39

4.9.2 Records . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2.4 Acceptance/Rejection Criteria for Underfill . . . . 39

4.10 In-Process Storage and Handling . . . . . . . . . . . . 14 6.2.5 Acceptance/Rejection Criteria for Staking . . . . . . 40

4.11 Solvents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.2.6 Acceptance/Rejection Criteria for

Fastener Staking . . . . . . . . . . . . . . . . . . . . . . . . . 44
5 PROCESS REQUIREMENTS . . . . . . . . . . . . . . . . . . 15 6.2.7 Acceptance/Rejection Criteria for
5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Torque Striping . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.2 Process Requirements . . . . . . . . . . . . . . . . . . . . . . 16 6.2.8 Acceptance/Rejection Criteria for
Conformal Coating . . . . . . . . . . . . . . . . . . . . . . . . 44
5.3 Processing Sequence . . . . . . . . . . . . . . . . . . . . . . 16
6.2.9 Acceptance/Rejection Criteria f
5.3.1 Sequential Processing – Staking and
or Encapsulation . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Conformal Coating . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.10 Connector Backshell Potting
5.4 Cleaning and Demoisturization . . . . . . . . . . . . . . 16
Acceptance/Rejection Criteria . . . . . . . . . . . . . . . 46
5.5 Surface Preparation . . . . . . . . . . . . . . . . . . . . . . . 17
7 DEFINITIONS AND ACRONYMS . . . . . . . . . . . . . . 46
5.5.1 Priming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.5.2 Masking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 APPENDICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

5.5.3 Spillage/Residue Film . . . . . . . . . . . . . . . . . . . . . 18 Appendix A – Military/Space/ Hazardous Applications

Requirements . . . . . . . . . . . . . . . . . . . . . . 52
5.5.4 Material Condition(s) . . . . . . . . . . . . . . . . . . . . . . 18
Appendix B – Conformal Coating Issues . . . . . . . . . . . . 56
5.5.5 Material Preparation . . . . . . . . . . . . . . . . . . . . . . . 19
Appendix C – Verification & Validation Matrix . . . . . . . 57
5.5.6 Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.5.7 Staking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.5.8 Conformal Coating . . . . . . . . . . . . . . . . . . . . . . . . 28
5.5.9 Encapsulation/Potting . . . . . . . . . . . . . . . . . . . . . . 35

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Tables Figure 5-11 Axial-Leaded Component (Unsleeved) . . . . 24

Table 4-1 Solvent and Cleaner Specification . . . . . . . . 15 Figure 5-12 Axial-Leaded Comp. (Sleeving Applied) . . . . . . . 24
Table 5-1 Demoisturizing Schedule . . . . . . . . . . . . . . . 17 Figure 5-13 Axial-Leaded Component (Pre-sleeved) . . . . . . . . 24
Table 5-2 Conformal Coating Thickness . . . . . . . . . . . 30 Figure 5-14 Axial-Leaded Component (Glass Body) . . . . . . . . 25
Table 5-3 Preferred Conformal Coating Figure 5-15 TO-Type Package . . . . . . . . . . . . . . . . . . . . 25
Removal Methods . . . . . . . . . . . . . . . . . . . . 34 Figure 5-16 Radial Leaded – Component (1X) . . . . . . . . 25
Table 5-4 Repair/Rework Compatibility . . . . . . . . . . . 35 Figure 5-17 Radial-Leaded Component (1X Tall) . . . . . 25
Table A.1 Military/Space/Hazardous Applications Figure 5-18 Radial-Leaded Component – (2X-4X) . . . . 26
Requirements . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 5-19 Radial-Leaded Component (+4X) . . . . . . . . 26
Figures Figure 5-20 Wiring/ Wire Bundles . . . . . . . . . . . . . . . . . 26
Figure 1-1 Printed wire Assembly With Staking . . . . . . . 1 Figure 5-21 Example – Thread-Locking Compound . . . 27
Figure 3-1 Example – Underfill . . . . . . . . . . . . . . . . . . 10 Figure 5-22 Example – Fastener Staking . . . . . . . . . . . . 28
Figure 5-1 Example of Masking . . . . . . . . . . . . . . . . . . 17 Figure 5-23 Example – Fastener Staking (Alt) . . . . . . . . 28
Figure 5-2 Example of Minor Spillage . . . . . . . . . . . . . 18 Figure 5-24 Example – Torque Striping . . . . . . . . . . . . . 28
Figure 5-3 Example of a Shelf-Life Sticker . . . . . . . . . 18 Figure 5-25 Example – Conformal Coating . . . . . . . . . . 29
Figure 5-4 Example - Test/Sample Specimen . . . . . . . . 20 Figure 5-26 Example – Encapsulation/Potting . . . . . . . . 35
Figure 5-5 Example of Bonding (Thermal) . . . . . . . . . . 21 Figure 5-27 Spillage - Acceptable . . . . . . . . . . . . . . . . . . 36
Figure 5-6 Example of a Stress-Sensitive Sensor . . . . . 22 Figure 5-28 Spillage - Unacceptable . . . . . . . . . . . . . . . . 36
Figure 5-7 Excess Squeeze-out . . . . . . . . . . . . . . . . . . . 22 Figure 5-29 Example – Potted Backshell . . . . . . . . . . . . 37
Figure 5-8 Example - Staking . . . . . . . . . . . . . . . . . . . . 22 Figure 5-30 Acceptable – Underfill . . . . . . . . . . . . . . . . . 38
Figure 5-9 Jumper Wires . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 5-31 Acceptable - Stringing . . . . . . . . . . . . . . . . . 38
Figure 5-10 Axial-Leaded Tantalum Capacitor . . . . . . . . 24 Figure 5-32 Unacceptable – Incomplete Underfill . . . . . 38

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Design, Critical Process and Acceptance Requirements

for Polymeric Applications
1 GENERAL REQUIREMENTS

1.1 Scope This document prescribes the minimum design, critical process and acceptance requirements for the application of
polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof.
IPC-AJ-820, IPC-HDBK-001, IPC-HDBK-830 and IPC-HDBK-850 are companion documents to this specification. They contain
valuable explanatory and tutorial information compiled by IPC Technical Committees that is relevant to this specification.
Although the handbooks are not a part of this specification, when
there is confusion over the specification verbiage, the reader is
encouraged to refer to the handbooks for assistance.
Reference materials listed in this text are recommended reading.
The User is encouraged to obtain all relevant referenced materials
as this document cannot (nor can any single document) cover every
material, process, environment, performance or safety aspect that
affects a given design.

1.2 Purpose The intent of this document is to establish a baseline

of requirements, procedures, practices and process attributes based
on Lessons Learned and Best Practices that have been demonstrated
through use and experience, to result in a robust design and
high reliability.
Figure 1-1 Printed wire Assembly With Staking
This document is intended for use by the design engineer, Image Courtesy: NASA/Johnson Space Center (JSC) Quality & Flight
manufacturing engineer, quality engineer or other individual Equipment Division Group
responsible for implementation and compliance with requirements of this document to the applicable performance class.
a. In-Service Criteria. This document defines design requirements and acceptability criteria for “New/Beginning of Life” hardware.
It is not the intent of this document to establish or define “In Service” acceptance criteria to address performance or reliability
issues caused by aging or use. However, the acceptability criteria and limits that are currently detailed in this document may
be considered to be wide enough to be applicable to the more common hardware degradation caused by aging/use. Use of
these criteria for acceptance of “In Service” hardware conditions shall [N1D2D3] be as agreed between the Manufacturer and
the User.
b. Metallic Whisker Control. It is not the intent of this document to be used as a stand-alone document for the control and
mitigation of performance and/or reliability concerns related to metallic whiskers.
Note: Users of this document are encouraged to review GEIA-STD-0005-1, GEIA-STD-0005-2 or IPC-AJ-820 for additional
information pertaining to control of metallic whiskers.
c. Alternate/Proprietary Documents or Processes. It is not the intent of this document to exclude any alternate or manufacturer-
proprietary documents or processes that meet or exceed the baseline of requirements established by this document. Use of
alternate or manufacturer-proprietary documents or processes that tailor (e.g., change, increase, reduce, delete) any of the
mandatory requirements of this document shall [N1D2D3] require review and prior approval of the User.
d. For purposes of this document:
1) The Designer is the design agent for the User.
2) The User is the individual, organization, company, contractually designated authority or agency responsible for the
procurement or design of electrical/electronic/electromechanical (EEE) hardware and having the authority to define the
class of equipment and any variation or restrictions to the requirements of this document (e.g., the originator/custodian of
the contract detailing these requirements).
3) The Supplier is considered the individual, organization or company which provides the Manufacturer (Assembler)
components (e.g., electrical, electronic, electromechanical, mechanical, printed boards) and/or materials (e.g., solder, flux,
cleaning agents).
4) The Manufacturer is considered the entity that provides a service or product to the User.
e. The acceptability of the use of polymerics with no-clean flux chemistries shall [N1D2D3] be as agreed between the Manufacturer
and the User.

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IPC-5262 July 2022

1.3 Applicability This document is applicable to manufacturers involved in the application of polymeric processes (e.g., bonding,
staking, conformal coating, encapsulation) to electrical/electronic components, including printed board assemblies, optical and
metallic cable and wiring harness assemblies, mechanical items (e.g., tin-plated chassis, brackets, fasteners), and elements thereof,
and wherever invoked contractually. The User is responsible for determining whether the use of polymeric materials may be
required to ensure performance or reliability of the hardware.

1.4 Performance/Product Classification This document recognizes that electrical and electronic assemblies are subject to
classifications by intended end-item use. Three general end-product classes have been established to reflect differences in functional
performance requirements, and verification (inspection/test) frequency.
a. It should be recognized that there may be overlaps of equipment between classes.
b. The User is responsible for defining the product class.
c. The contract should specify the performance class required, whether compliance to any of the Appendices is required, and
indicate any exceptions to specific parameters where appropriate. If the performance Class is not specified, Class 3 requirements
are applicable.
CLASS 1 – General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed assembly.
CLASS 2 – Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but
not critical. Typically, the end-use environment would not cause failures.
CLASS 3 – High Performance Electronic Products
Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support
or other critical systems.
MILITARY/SPACE
Includes products from Performance Class 3 – High Performance/Harsh Environment Electronic Products, with additional
considerations for unique materials requirements and more extreme operational environments, such as vibration and thermal
cycling. Space/military classification deviations to IPC-A-5262 requirements are defined and listed in Appendix A.
When the [M/S] symbol appears next to a paragraph, it indicates that Appendix A contains requirements to be used in
addition to, and in some cases in place of, those published in that paragraph. The criteria in Appendix A are not binding,
unless separately and specifically included by the applicable contract, approved drawing(s), or purchase order. Appendices do not
apply unless separately invoked per 1.13.

1.5 Definition of Requirements The imperative form of action verbs are used throughout this document to identify acceptance
requirements that may require compliance, depending upon the Performance Classification of the hardware.
SHALL/SHALL NOT. The words shall or shall not are used whenever a requirement is intended to express a provision that is
mandatory. Deviation from a shall or shall not requirement for a particular Performance Class may be considered if sufficient
technical rationale/objective evidence (OE) is supplied to the User to justify the exception.
d. SHOULD/SHOULD NOT. The words should or should not are used whenever a requirement is intended to express a
provision that is non-mandatory, and which reflects general industry practice and/or procedure.
e. MAY. The word may is intended to express an action or provision that is to be considered non-mandatory, and which is
provided as a “recommendation”.

1.5.1 Requirement Format (N/A/D) To assist the User, each requirement is identified by its Performance Classification (x1x2x3)
and applicability, where “x” represents:
N = No requirement has been established for this Class
A = Acceptable
D = Defect
Examples:
• [N1N2D3] is Requirement Not Established Class 1 or 2, Defect Class 3
• [N1D2D3] is Requirement Not Established Class 1, Defect Classes 2 and 3
• [N1A2D3] is Requirement Not Established Class 1, Acceptable Class 2, Defect Class 3
• [A1A2D3] is Acceptable Classes 1 and 2, Defect Class 3
• [D1D2D3] is Defect for all Classes.
2